Abstract: A carrier element for an IC module for incorporation into data carriers, in which the IC module is connectd with contact surfaces by means of leads, and the contact surfaces are designed for direct contacting.In order to protect the Integrated Circuit against destruction due to static charges, measures are provided to dissipate outside the circuit any portions of charge that may occur. In one embodiment, all terminals of the circuit have a low resistance connection with each other. The connection is suspended during each operational phase and is then restored. In a further embodiment, the terminals are bridged by spark gaps. This protective step is advantageous in that it is not necessary to remove and then restore the bridging.

Abstract: An electronic device with densely packed components includes a bipartite housing, a film circuit guided meander-like in said housing, at least one reinforcement plate for reinforcing said film circuit over part of the length of said film circuit, means integral with at least one part of said housing for fixing said reinforcement plate in position, an illuminated display disposed in said housing for viewing said film circuit, and a calibration potentiometer disposed in said housing for contacting said film circuit.

Abstract: A printed card with impressions comprising several rows of conducting holes spaced apart by a multiple of a constant pitch and disposed in a repetitive pattern, each conducting hole being connected to a wiring stud provided on the wiring face within the pattern. Furthermore, the holes of some adjacent rows are connected to wiring tracks provided on the component face of the card and the holes of other adjacent rows are connected together and connected to the same wiring stud.

Abstract: The invention concerns a front plate mounting group for a printed circuit board with a carrier, having connector elements for connecting the carrier to the printed circuit board which connector elements are arranged in a first predetermined raster, as well as with housings for receiving functional parts, whose housing contacts are arranged according to a second predetermined raster and which are in releasable assembly with the connector elements.

Abstract: An electronic equipment comprises key input means having a plurality of key input areas, a frame member for sandwiching a metal plate therein, and printed circuit means having a key input circuit adapted to be closed by a depression force from the key input area and having an electronic part connected thereto. The key input means covers an upper surface of the frame member. The frame member has convey means for conveying the depression force from the key input area to the printed circuit means.

Abstract: In a board holding device for a board (1) provided with a circuit, in which the board (1) is inserted in the groove (3, 3') of an elongate frame part (2, 2'), the mechanical and electrical connection between the board (1) and the frame part (2, 2') is produced by a solder connection which is carried out by means of solder ducts (4, 4') filled with a solder. The board holding device can be supplemented in a simple manner by cover plates to give a complete screening or resonance casing which has good electrical and mechanical properties. The holding device is very suitable for automated manufacture.

Abstract: A solder fillet control pattern provides a predictable solder quality control for the components mounted on printed circuit boards. The pattern can include a plurality of solder fillet control boxes, which define the individual component locations. The pattern allows for a greatly increased component packing density on the boards without increasing soldering defects.

Abstract: A ceramic structural body having electronic components thereon comprises a ceramic package of a ceramic layer having substantially uniform thickness. The package comprises a ceramic element of dish-shaped or box-shaped configuration including a base portion, a sidewall portion extending from the base portion substantially at right angles thereto and a flange portion extending from the free end of the sidewall portion substantially at right angles thereto. The ceramic package is formed by press-forming a ceramic green sheet having substantially uniform thickness. A plurality of metal layers are provided on the surface of desired portions of the ceramic element.

Abstract: A ceramic multilayer wiring board is provided in which ceramic insulating layers and wiring patterns provided thereon are connected by conductors filling through-holes formed in the ceramic insulating layers. The through-holes are so formed that the superficial portions of each through-hole of the ceramic multilayer wiring board is smaller in diameter than the inside portion of the through-hole between the superficial portion. This can prevent the board from being cracked around the through-holes.

Abstract: Insulated electrical conductor for telecommunications cable in which two layers of insulation are provided. The inner of the two layers is a solid non-cellular construction and the outer layer is cellular. The nominal mutual capacitance between the conductor and an identical conductor is at a desired nominal value of 83 nanofarads/mile value between conductors above a desired minimum value while having an outside diameter across the insulation which is less than for a conductor of the same gauge which provides the same mutual capacitance and has a solid insulation of the same material as the inner layer.

Abstract: An improved circuit board having electrically conductive traces connected to respective terminals of a number of electrically current components mounted on a substrate. The substrate has cavities for mounting the components, and a plurality of grooves extend into one or both of a pair of opposed surfaces of the substrate. The grooves are filled by plating with an electrically conductive material to form the traces. Thus, the traces not only extend in the plane of a surface of the substrate but also extend perpendicular to such plane and into the substrate itself whereby a high packing density of traces can be achieved while maintaining essentially electrical paths between the components. The depth of each trace is a number of times greater than the width of the trace, a typical ratio being 10:1. The substrate can be molded from a plateable plastic or ceramic material and the grooves can be machined by a laser beam.

Abstract: Substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-determined pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby.

Abstract: An electronic circuit board of very thin construction for a wristwatch employs a printed circuit board of insulating material with punched apertures for receiving and locating circuit components, such as capacitors, transistors and integrated circuits, which are of substantially the same thickness as the printed circuit board. A thin metallic conductive backplate is also provided with apertures and with bridging portions supporting the circuit components. Tabs on the backplate or on similar conductive clips for supporting circuit elements may be bent upward and extended through the circuit board apertures for making solder connections to discrete components or to conductive pads on the upper side of the printed circuit board. The backplate includes tabs for other purposes such as holding the backplate to the printed circuit board, making battery connections, providing switch terminals, and retaining the module under spring tension in the case.

Abstract: An insulating housing has a circuit board mounted on its interior with separate conductive tab end portions of the board protruding outwardly through apertures in the housing. The tab portions have printed thereon conductive parts which connect with selected printed points or components on the board within the housing. Each tab has a hole for a screw in its conductive part so that when a wire is wound around the screw and the screw is tightened, good low-ohmic contact with a designated part of the board is made and the tab is positionally fixed to the housing. Slots between the tabs permit each screw binding post to be electrically insulated from its adjacent post by the interposition of integrally molded perpendicular barriers in the slots.

Abstract: A composite printed circuit board structure including multiple layers of graphite interleaved with layers of a dielectric material, such as a polytetrafluoroethylene (PTFE) and woven glass laminate. Some of the dielectric layers are copper clad, and at least some of the graphite layers are positioned in close proximity to the copper cladding layers, to provide good heat dissipation properties. The PTFE provides a desirably low dielectric constant and the graphite also provides good mechanical strength and a low or negative coefficient of thermal expansion, to permit matching of the coefficient with that of chip carriers used to mount components on the circuit board.

Abstract: A mounting arrangement for a circuit board on the neck of a cathode ray tube includes a guide member formed in the cathode ray tube base. The guide member is formed to have a surface extending perpendicular to the tube longitudinal axis. The circuit board incorporates a socket having a channel for receiving the guide member for aligning the socket on the tube base. A portion of a locking piece is inserted through a hole in the socket wall in order to abut the perpendicular surface of the guide member to prevent removal of the socket from the tube base. A second portion of the locking piece forms a hook which cooperates with the socket to prevent inadvertent removal of the locking piece.

Abstract: A high density mother/daughter circuit board connector utilizes a multi-layer flat flexible circuit, each layer of which contains a plurality of patterned arrays of circuit paths extending between spaced contact points, at least some of which are exposed through apertures in overlying layers. The multi-layered circuitry is wrapped around a housing from a mother circuit board face to extend into one side of a daughter board receiving recess. Camming means arranged in the opposite side of the recess drive a daughter circuit board inserted therein transversely of the recess into loaded engagement with the multi-layer circuitry thereby establishing electrical interconnection between the circuitry of the mother and daughter circuit boards.

Abstract: A circuit board capable of accommodating a condensed number of integrated circuit components by being divided into sections to permit the mounting of devices of assorted pin spacings. In another embodiment, a leadless, integrated circuit device may be mounted on the board with increased grounding elements to increase electrical isolation of the leadless chip carrier for better operative results. The circuit board herein disclosed is also arranged to provide a dual voltage plane to accommodate different electrical requirements presented by using a number of integrated circuit packages.

Abstract: A packaging construction for electronic circuit package elements, such as printed circuit boards and integrated-circuit chip packages, to obviate the need for connector cables, back-panel wiring and similar techniques. Circuit packaging elements are interconnected through an interconnection medium that includes an insulated board with opening through it, and a number of connector elements in the form of compressible wads of conductive wire. The connector elements are disposed in selected openings in the insulated board and compressed into contact with contact areas formed on the circuit package elements. Shorter lead lengths and improved circuit operating speed are the principal results of the approach. In a three-dimensional construction employing the principles of the invention, chip packages are arranged in modules, and interconnections may be made between chip packages within each module, tranversely between modules, and in a third direction between layers of modules.

Abstract: A leadless ceramic chip carrier for surface mounting on an epoxy printed circuit board is shown featuring an arrangement for relieving the thermally induced stress by progressively lengthening the attaching solder pillars as the distance from the center line of the ceramic chip increases to avoid exceeding the elastic limits of the solder.