Abstract: Plug-in circuit packs, as used in telecommunications systems are planar assemblies which slide into position in a support frame, with electrical connections usually made at the inner or rear end. Assistance in withdrawal, and latching when in position are provided by a latching and withdrawing assembly at the front end of the circuit pack, having an integrally molded spring cantilever, free at its forward end and having an outwardly extending projection at its free end, the cantilever defining a channel in which slides an actuator. The actuator has spaced side members joined at an inner end by a cylindrical member which slides in the channel. Flange members are formed on the inner end of each side member. Rotation of the actuator at its outermost position causes the flange members to bear on the free end of the cantilever to deflect it. This disengages the outwardly extending projection at the free end of the cantilever from a detent in the support frame.

Abstract: An assembly for a pager having a main housing that is generic to a family of papers having different outputs. A subassembly housing contains the output circuitry for each member of the family of pagers. A generic circuit is mounted on a circuit board that is slideable within the main housing between a first and second position. The circuit board, in a first position, allows the subassembly housing to mate with the main housing. The subassembly housing is locked into mated engagement with the main housing when the circuit board is slid from its first position to its second position. The locking engagement is provided by a tongue-like projection mounted on the circuit board which is received by a cavity in the subassembly housing when the circuit board slides to its second position. In conjunction with this flange mounted on the subassembly housing engages a first end of the circuit board.

Abstract: A backpanel assembly has printed circuit board (PCB) connectors aligned in parallel with one another and opposite one another on both sides of the backpanel, pins of opposite connectors passing through the backpanel. Each connector includes first and second groups of pins, conveniently in separate rows where each connector includes two rows of pins, which serve to provide a variable bus system between the connectors. To this end, pins of the first group of one PCB connector are connected via the backpanel to pins of the second group of an adjacent PCB connector on the same face of the backpanel. PCBs inserted into the connectors connect to the first group, but not the second group, of pins, except for bus extender PCBs which serve to interconnect the first and second groups of pins of a PCB connector and thereby extend the bus system across the connector.

Abstract: A cage apparatus for receiving printed circuit boards which permits an electrical potential to be directed across the printed circuit boards and a method for preventing the development of sharp spikes in the circuit signal applied to said printed circuit boards are provided. A first and second array of mounting guides are mounted in the cage apparatus to receive the printed circuit boards. The second array of mounting guides is electrically conductive and an electrical potential is directed across said second array. The printed circuit board is inserted in the cage apparatus and contacts the second array of mounting guides before a circuit signal is applied. Thus an electrical potential is directed across the printed circuit board which prevents the development of sharp spikes when the circuit signal is thereafter applied to said printed circuit board.

Abstract: A packaging construction for electronic circuit package elements, such as printed circuit boards and integrated-circuit chip packages, to obviate the need for connector cables, back-panel wiring and similar techniques. Circuit packaging elements are interconnected through an interconnection medium that includes an insulated board with opening through it, and a number of connector elements in the form of compressible wads of conductive wire. The connector elements are disposed in selected openings in the insulated board and compressed into contact with contact areas formed on the circuit package elements. Shorter lead lengths and improved circuit operating speed are the principal results of the approach. In a three-dimensional construction employing the principles of the invention, chip packages are arranged in modules, and interconnections may be made between chip packages within each module, transversely between modules, and in a third direction between layers of modules.

Abstract: In a method for manufacturing a stranded conductor for an electrical power cable comprising a process for forming cupric oxide films of from 0.3 .mu.m to 3 .mu.m in thickness by passing an uninsulated stranded conductor constituted by a plurality of stranded copper strands through oxidizing liquid, the stranded conductor passing through the liquid is curved in a wave to form gaps between the strands, and the oxidizing liquid is caused to penetrate between the strands through the gaps to form cupric oxide films of from 0.3 .mu.m to 3 .mu.m in thickness on the surfaces of the strands. Also disclosed is a stranded conductor for an electrical power cable constituted by a plurality of stranded copper strands, at least one of the copper strands being covered with a cupric oxide film free from exfoliation.

Abstract: The present invention concerns a housing carrier for an integrated circuit.It comprises at least two rows of output conductors disposed at regular intervals on the periphery of a housing along a given pitch, these conductors presenting end parts extending from the housing with a view to electrically connecting the housing on an utilization circuit, and wherein the rows are staggered with respect to one another.

Abstract: A mounting for line cards on circuit boards, as used in telecommunications systems comprises a molded plastic frame having a plurality of mounting positions for ceramic circuit members. Each position comprises two parallel, spaced guide and support members having upper and lower guide formations spaced along each guide and support member. There is a plurality of substrate holders, a holder for each position, each holder having a flat support surface with upstanding projecting members at front and rear ends, with undercuts for reception of a ceramic circuit member or substrate. Each holder has a front member extending normal to the support surface and has a latching and ejecting member at the front end. The frame also has support and guide formations at a rear end for attachment of a circuit board.

Abstract: Disclosed is a mounting structure for electric elements in circuit blocks of an electric circuit, particularly suitable for an ultrahigh-frequency circuit, allowing such elements to be automatically mounted as well as soldered, by such a way that holding parts with configurations and dimensions compatible with terminal parts of the elements are provided at portions of metal pieces as wiring conductors respectively, which are embedded in a frame made of an insulator at a proper distance, and the elements are mounted and secured so that the terminals thereof are positioned on the holding parts of the metal pieces.

Abstract: An electrical assembly incorporates a multilayer printed circuit board comprising a flexible electrically insulating circuit board laminate with electrical conductors for connecting to terminals on rigid slab-like heat-dissipating components such as circuit or component packages or carriers. A separate rigid metallic heat-sinking or spreading plate is applied, having protruding thermally conducting pillars passing through holes in the circuit board laminate to contact the components. A further rigid plate overlies the components and is clamped by clips or bolts to the plate. Compliant means such as springs of deformable and elastic rubber or plastics material is provided intermediate the further plate and the top of the components to accommodate difference in height or thickness between the components while transmitting pressure from the further plate to the top of the component to ensure contact between the components and the pillars on the heat sinking or spreading plate.

Abstract: A process for forming a high density solder pad and fan-out metallurgy system in a ceramic substrate wherein a pattern of indented lines is formed in the surface of a green ceramic substrate, the lines filled with a conductive metal paste, a layer of dielectric green ceramic material deposited over at least a portion of the area of the pattern of indented lines, and sintering the resultant substrate.

Abstract: An inside cable having a core of conductors with conductor insulation formed from polyvinylchloride and in which interstices between conductors contains a fire resistant powder to resist burning of the core. The core is surrounded by a fire resistant jacket and the cable is devoid of a tubular metal shield or sheath surrounding the core.

Abstract: A storage cabinet for printed circuit boards is provided with a housing having a pair of substantially parallel and opposed flat surfaced support members on each of which is secured a plurality of printed circuit board retaining plates arranged in edge to edge relationship. The retaining plates are removably secured and held to the support members by inter-engagement means comprising a plurality of locking bars and at least one locking ridge integrally formed and projecting from the rear surface of each of the retaining plate. The locking bars have in cross section a portion overlying the plate and form therewith a lateral channel. The abutting surface of the support member is provided with a plurality of flexible first and second fingers integrally formed with the supporting member and projecting out of the plane of the supporting member. The first fingers are bent downwardly in a lateral direction opposite the second fingers to engage the locking ridge.

Abstract: A display device for electrical equipment includes a casing for the equipment, a transparent plate mounted in the casing, a display panel positioned in the casing inwardly of the transparent plate, a single resilient connector received in a recess formed in the casing, and a printed board securedly held in the casing by means of fastening members. The display panel is disposed adjacent an end of the printed board and extends in the direction perpendicular to the plane of the printed board. The resilient connector serves to electrically connect the printed board to the display panel and has an elongated rod shape and a channel-shaped cross-section.

Abstract: A supporting plate having a network of conductors, on which supporting plate a number of circuit components are placed which are interconnected in the network of conductors in an electric circuit. In a place of the circuit which is sensitive to moisture, a board opening is provided in which a member of a minimum moisture-absorbing material is fitted. The connections of the surrounding circuit components extend in an aperture of the member and are electrically interconnected there. The stability of the circuit is considerably improved thereby in particular in the case in which the circuit is an oscillator circuit.

Abstract: A high density dimensionally stable encapsulated circuit board and a method of making such a board is described. A curable adhesive is utilized to bond insulated wires to a substrate, the dimensional stability of which is maintained by a sheet of relatively thick copper foil. Since the adhesive is cured and since the copper foil returns to the same dimensions when thermally, mechanically or chemically cycled, the entire composite is dimensionally stable.At each location where a connection is to be made to a wire, the wire has a non-linear geometrical portion. The increased dimensional stability plus non-linear shaped portion of the wires allows connections to be made to the board utilizing a very small drill. The result is a high density stable circuit board.

Abstract: A high power circuit package 2 is disclosed for power conditioning electronic circuits. In one embodiment, a plurality of separate ceramic substrates 3-8 are provided, with a common lead frame stamping 12 bonded to all of the substrates. Means are disclosed for aligning the lead frame, preventing the substrates from sliding together during bonding, and for enabling epoxy encapsulation after bonding. In other embodiments, lead frame structure and jumper posts 65-68 and buses 70, 72 are disclosed for selective interconnection of designated circuit sections. In other embodiments, power terminal extension structure 44 is disclosed.

Abstract: This invention concerns a ceramic substrate for mounting semiconductor integrated circuits. The substrates include at least a first and second patterned metallization layer which respectively form conducting planes that are parallel to each other but separated by a thickness of insulation. The pattern metallization of at least the first plane includes signal conductors for joining the contacts of the integrated circuit chip to pins provided in the substrate for connecting the substrate and chip to a circuit board. In accordance with the invention, the metallization of the second plane includes shorted conductor loops that follow the contour of the signal conductors. The shorted loops of the second plane metallization includes branches which extend parallel to both lateral sides of a respective signal conductor. In accordance with the invention, the branches of the loops are joined at their ends.

Abstract: A multi-chip carrier array in which the individual carriers are defined by two perpendicular sets of parallel scribe lines which bisect the major axes of a plurality of equally-spaced oblong perforations. At the point of intersection of any two perpendicular scribe lines, the major axes of two such perforations intersect and bisect the right angles formed by said two perpendicular scribe lines. All other oblong perforations have their major axes perpendicular to the scribe lines. On the bottom surface of the array, metallic solder pads are located at opposite ends of each oblong perforation, and conductive material from each pad extends to the top surface of the array. Trace conductors on the top surface can be connected to these pad extensions. The trace conductors, in turn, will be connected to various connection points on an IC chip mounted in the center of the top surface of an individual carrier.

Abstract: A mechanical locking device including a rotatable stem-shaped locking member for latching together a first part having a locking opening therein and a second part, by cooperation of the locking member with the opening during a rotation of the locking member, the locking member being shaped so as to be able to be pushed axially through a resilient locking hole in the second part and so as to be thereafter unable to move axially either in a forward or rearward direction, in which the first part is a rack for mounting electrical equipment is described.