Abstract: A magnetic random access memory (MRAM) cell including a magnetic tunnel junction containing: a storage layer including at least one storage ferromagnetic layer, each storage ferromagnetic layer having a storage magnetization; an antiferromagnetic storage layer pinning the storage magnetization at a low threshold temperature and freeing them at a high temperature threshold; a reference layer; and a tunnel barrier layer between the reference layer and the storage layer. The magnetic tunnel junction also includes a free ferromagnetic layer having a free magnetization adapted to induce a magnetic stray field magnetically coupling the free ferromagnetic layer with the storage layer; such that the storage magnetization can be switched by the magnetic stray field when the magnetic tunnel junction is at the high temperature threshold. The disclosed MRAM cell has low power consumption.

Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.

Abstract: Provided is a semiconductor device including: a memory cell array including a plurality of memory cells disposed in a matrix; and a peripheral circuit adjacent to the memory cell array. Each of the memory cells includes: a capacitive element including a lower electrode having a cylinder shape extending in a direction perpendicular to a principal surface of a substrate; and a switch transistor provided between the capacitive element and a bit line, turning on/off of the switch transistor being controlled based on a potential of a word line. The peripheral circuit includes a signal line that is adjacent to the lower electrode in a horizontal direction parallel to the principal surface and is supplied with a fixed potential, or a pair of signal lines respectively supplied with complementary potentials.

Abstract: A fine grained negative wordline scheme for SRAM memories is disclosed. The scheme includes a circuit having a static random access memory (SRAM) cell including at least a wordline coupled to a plurality of NFETs of a transistor array. The circuit further includes a wordline driver including a plurality of inverters coupled between a wordline group decode node, a power supply and the wordline. Overvoltage on the wordline driver and NFETs of the SRAM cell are eliminated by applying a power gating mode and lowering the power supply voltage.

Abstract: A nonvolatile memory storage device includes a ferroelectric (FE) material coupled with a piezoresistive (PR) material through an inherent piezoelectric response of the FE material, wherein an electrical resistance of the PR material is dependent on a compressive stress applied thereto, the compressive stress caused by a remanent strain of the FE material resulting from a polarization of the FE material, such that a polarized state of the FE material results in a first resistance value of the PR material, and a depolarized state of the FE material results in a second resistance value of the PR material.

Abstract: A method, executed by a memory controller, for estimating read levels of a nonvolatile memory includes reading voltages stored by memory cells of a page space within the nonvolatile memory to which pilot signals of a predetermined symbol are programmed. The number of memory cells are identified whose voltages, read from the page space, are less-than/greater-than a read-voltage applied in reading the voltages stored by the memory cells. A voltage to be applied for reading data stored in the page space is estimated based upon the identified number of memory cells.

Abstract: A memory device includes a volatile memory cell and a non-volatile memory cell. The non-volatile memory cell includes a first resistive element having a first terminal and a second terminal and a second resistive element having a first terminal and a second terminal. The first terminal of the first resistive element is coupled to the first terminal of the second resistive element at a first node. The second terminal of the first resistive element is coupled to a first source line voltage. The second terminal of the second resistive element is coupled to a second source line voltage. A first transistor includes a first current electrode coupled to a first data storage node of the volatile memory cell, a second current electrode coupled to a supply voltage, and a control gate coupled to the first node.

Abstract: A semiconductor package may include a first die, a second die disposed adjacent to the first die, and configured to share an address with the first die. The semiconductor package may include a first address pin included with the first die, and configured for receiving the address. The semiconductor package may include a second address pin included with the second die, and configured for receiving the address. The first die and the second die may output data corresponding to the address. Timings of the address in the first die and the second die may be aligned according to delay signals applied from a controller.

Abstract: A memory including an array of nvSRAM cells and method of operating the same are provided. Each nvSRAM cell includes a volatile charge storage circuit, and a non-volatile charge storage circuit including exactly one non-volatile memory (NVM) element, a first transistor coupled to the NVM element through which data true is coupled to the volatile charge storage circuit, a second transistor coupled to the NVM element through which a complement of the data is coupled to the volatile charge storage circuit and a third transistor through which the NVM element is coupled to a positive voltage supply line (VCCT). In one embodiment, the first transistor is coupled to a first node of the NVM element, the second transistor is coupled to a second node of the NVM element and the third transistor is coupled between the first node and VCCT. Other embodiments are also disclosed.

Abstract: A memory device includes first through fourth active regions arranged sequentially along a first direction, and which extend along a second direction different from the first direction; a first gate electrode formed on the first through fourth active regions to intersect the first through fourth active regions, and extending along the first direction; a second gate electrode formed on the first through fourth active regions to intersect the first through fourth active regions, extending along the second direction, and arranged so that no other gate electrodes are between the first gate electrode and the second gate electrode in the second direction; the first gate electrode extending between a first end and a second end; a first wiring line which is formed on the first gate electrode; a first strap contact, which connects the first wiring line and the first gate electrode between the first active region and the second active region; and a second strap contact, which connects the first wiring line and the firs

Abstract: A method of operation of a non-volatile memory system includes: providing a resistive storage element having a high resistance state and a low resistance state; coupling an analog multiplexer to the resistive storage element for applying a bias voltage; and switching between a verification bias and a read bias through the analog multiplexer for increasing a read margin between the high resistance state and the low resistance state.

Abstract: Methods and systems to refresh a nonvolatile memory device, such as a phase change memory. In an embodiment, as a function of system state, a memory device performs either a first refresh of memory cells using a margined read reference level or a second refresh of error-corrected memory cells using a non-margined read reference level.

Abstract: A semiconductor device includes a memory block including a plurality of memory cells coupled with a plurality of corresponding word lines, and a peripheral circuit suitable for performing a first erase verify operation for the plurality of word lines, and a second erase verify operation for one or more weak word lines among the plurality of word lines based on a result of the first erase verify operation.

Abstract: To provide a semiconductor device including a volatile memory which achieves high speed operation and lower power consumption. For example, the semiconductor device includes an SRAM provided with first and second data holding portions and a non-volatile memory provided with third and fourth second data holding portions. The first data holding portion is electrically connected to the fourth data holding portion through a transistor. The second data holding portion is electrically connected to the third data holding portion through a transistor. While the SRAM holds data, the transistor is on so that both the SRAM and the non-volatile memory hold the data. Then, the transistor is turned off before supply of power is stopped, so that the data becomes non-volatile.

Abstract: To provide a semiconductor device having large memory capacity and high reliability of data or a small-size semiconductor device having a small circuit area. A memory cell includes first and second data retention portions capable of storing multilevel data. A data voltage is written to the first data retention portion from a first wiring through a transistor and a second wiring, and a data voltage is written to the second data retention portion from the second wiring through a transistor and the first wiring. With the configuration, data voltages reduced by the threshold voltages of the transistors can be retained in the first and second data retention portions. The written data voltages where the threshold voltages of the transistors are canceled can be read by precharging and then discharging the first wiring.

Abstract: An operating method of a storage device includes reading data from a nonvolatile memory using first read parameters and second read parameters and collecting read histories associated with a plurality of read operations. First histories and second histories are determined from the collected read histories. The second read parameters are adjusted according to the first histories, and the first read parameters are adjusted according to the second histories. The read histories include information on read voltages used to perform the read operations, and the first histories and the second histories are determined from the collected read histories according to the number of read voltages having the same level.

Abstract: It is an object of the present invention to provide a device which can be easily manufactured and obtain a ground state of an arbitrary Ising model. A semiconductor device includes a first memory cell and a second memory cell that interacts with the first memory cell, in which storage content of the first memory cell and the second memory cell is stochastically inverted. The storage content is stochastically inverted by dropping threshold voltages of the first memory cell and the second memory cell. The threshold voltages of the first and second memory cells are dropping by controlling substrate biases, power voltages, or trip points of the first and second memory cells.

Abstract: A system and method for efficient data eye training reduces the time and resources spent calibrating one or more memory devices. A temporal calibration mechanism reduces the time and resources for calibration by reducing the number tests needed to sufficiently determine the boundaries of the data eye of the memory device. For one or more values of the voltage reference, the temporal calibration mechanism performs a minimal number of tests to find the edges of the data eye for the hold and setup times.

Abstract: A semiconductor device for reducing an instantaneous voltage drop is provided. The semiconductor device includes a first power line configured to provide a first power supply voltage and a first power transistor connected between the first power line and a first logic transistor. The first power transistor includes a first source or drain connected to the first power line, a gate receiving a power gating control signal, and a second source or drain connected to a first source or drain of the first logic transistor using a shared semiconductor junction.

Abstract: CPUs are not effective for search processing for information on a memory. Content-addressable memories (CAMs) are effective for information searches, but it is difficult to build a large-capacity memory usable for big data using the CAMs. A large-capacity memory may be turned into an active memory having an information search capability comparable to that of a content-addressable memory (CAM) by incorporating an extremely small, single-bit-based parallel logical operation unit into a common memory. With this memory, a super fast in-memory database capable of fully parallel searches may be realized.