Abstract: NVM arrays include rows and columns of NVM cells comprising a floating gate, a programming element, and a logic storage element. During a programming or erase mode, the floating gate of each cell is charged to a predetermined level. At the beginning of a read mode, all storage elements are pre-charged to a high supply voltage level. Following the pre-charge, selected cells are read to determine stored bit values. A charge status of the floating gate of each cell determines whether the storage element is turned on and the pre-charge voltage is pulled down corresponding to a bit value.

Abstract: A memory cell array on a region of a substrate, the cell array having word lines, bit lines and memory cells at crossings between the word and bit lines, drain and source of each memory cell coupled to a bit line and source line, respectively; and a sense amplifier circuit reading data of selected memory cells. The device has a data read mode detecting whether cell current flows from a bit line to the source line in accordance with data of a memory cell under the condition the well region is set at a base potential; a selected word line is applied with a read voltage, which turns on or off the memory cell in accordance with data thereof; the source line is applied with a first voltage higher than the base potential; and the selected bit line is applied with a second voltage higher than the first voltage.

Abstract: Memory devices include a memory cell array, a column selection circuit electrically coupled to the memory cell array and a data line driver circuit. The data line driver circuit is configured to drive an output port of the memory device with read data received from the column selection circuit during a read cycle time interval. The data line driver circuit is further configured to support an extended read cycle time interval by switching from a non-latching mode of operation during a leading portion of the read cycle time interval to a latching mode of operation during a trailing portion of the read cycle time interval. The data line driver circuit may include a drive inverter having an output electrically connected to one of a plurality of output pins associated with an output port and a feedback inverter having an input electrically connected to the output of the drive inverter.

Abstract: A method is provided which includes erasing a first plurality of non-volatile memory bit cells in a memory block comprising a third plurality of memory bit cells during an erase procedure, such that upon completion of the erase procedure, the first plurality of non-volatile memory bit cells are at an erased state. The method also includes programming a second plurality of non-volatile memory bit cells in the memory block during the erase procedure, such that the second plurality of non-volatile memory bit cells is a subset of the third plurality of non-volatile memory bit cells and upon completion of the erase procedure, the second plurality of non-volatile memory bit cells are at a programmed state.

Abstract: Circuits and methods are provided to implement low voltage, higher performance semiconductor memory devices such as CMOS static random access memory (SRAM) or multi-port register files. For example, circuits and methods are provided for dynamically adjusting power supply and/or ground line voltages that are applied to the memory cells during different modes of memory operation to enable low voltage, high performance operation of the memory devices.

Abstract: A semiconductor memory device includes a memory cell array with electrically rewritable and non-volatile memory cells arranged therein, and a bit line control circuit connected to a bit line of the memory cell array to control and detect the bit line voltage in accordance with operation modes, wherein the bit line control circuit comprises a first transistor and a second transistor with a breakdown voltage higher than that of the first transistor, the second transistor being disposed between the first transistor and a bit line in the memory cell array to be serially connected to the first transistor, and wherein a connection node between the first and second transistors is fixed in potential at a data erase time.

Abstract: A NAND-type flash memory device has a multi-plane structure. Page buffers are divided into even page buffers and odd page buffers and are driven at the same time. Cells connected to even bit lines within one page and cell connected to odd bit lines within one page are programmed, read and copyback programmed at the same time.

Abstract: A method of writing data to a semiconductor memory device with memory cells, each of which stores data defined by threshold voltage thereof in a non-volatile manner, the device having first and second memory cells disposed adjacent to each other to be sequentially written in this order, the method including: performing a first data write operation for writing data defined by a threshold voltage lower than a desired threshold voltage into the first memory cell; performing a second data write operation for writing data into the second memory cell; and performing a third data writing operation for writing data defined by the desired threshold voltage into the first memory cell.

Abstract: A burst mode compatible semiconductor memory device having a redundancy memory adapted to repair a normal memory is disclosed. Response margin for a redundancy flag signal and redundancy driving method is improved by sensing generation of an internal address corresponding to an embedded address, and generating a redundancy flag signal, such that the embedded address is an address preceding the address of the memory cell of the normal cell array to be repaired by at least one clock.

Abstract: An internal voltage generator for use in a semiconductor memory device, includes: an internal voltage generation unit for generating an internal voltage by performing a charge pumping operation to a power supply voltage based on a result of comparing the internal voltage with a reference voltage; and an initial internal voltage generation unit for supplying the power supply voltage as the internal voltage based on a result of comparing the internal voltage with the power supply voltage when an operating voltage supplied to the semiconductor memory device is lower than a predetermined voltage level.

Abstract: The present invention provides a method for accessing a memory. The memory contains M one-time programmable memory blocks, and each has a first memory sector and a second memory sector. The method includes: selecting a first target memory block and reading the first target memory block. The step of selecting a first target memory block is performed by comparing the second memory sectors of N one-time programmable memory blocks from M one-time programmable memory blocks by following a search rule to select the first target memory block.

Abstract: An apparatus a counter, storage units for storing count values interrupted by a row address whose refresh period is subject to change; comparator circuits for comparing the counter outputs and the contents of the storage units to each other as to whether or not the counter outputs coincide with the contents of the storage units; a holding circuit for setting an output hit signal to an active state when a coincidence signal is output from the comparator circuits and for resetting the hit signal to an inactive state in the next following clock cycle; a circuit performing control for not propagating a refresh clock signal to the counter when the hit signal is in an active state and for propagating the refresh clock signal to the counter when the hit signal is in an inactive state; a circuit for replacing an output of the counter by a row address which changes part of the counter output when the hit signal is in an activate state to replace the counter output with the row address whose refresh period is subject t

Abstract: A semiconductor memory device includes a memory cell array in which a plurality of memory cells are arranged in a matrix form, a plurality of word lines connected to the memory cells, a row decoder including a plurality of decode sections and configured to receive first and second address signals for selecting the word lines, each of the decode sections which is provided for a respective one of the word lines, and includes first and second MOS transistors connected in series, the first MOS transistor having its gate electrode connected to receive the first address signal, the second MOS transistor having its gate electrode connected to receive the second address signal, the row decoder outputting a first signal for controlling the word lines, and a control circuit which delays the second address signal in time with respect to the first address signal.

Abstract: Data not stored in the DRAM array of a SDRAM module is read from the SDRAM module in a synchronous data transfer. The data transfer, referred to as register read command/operation, resembles a read command/operation directed to data stored in the DRAM array in timing and operation. The register read command is distinguished by a unique encoding of the SDRAM control signals and bank address bits. In one embodiment, the register read command comprises the same control signal states as a MSR or EMSR command, with the bank address set to a unique value, such as 2?b10. The register read command may read only a single datum, or may utilize the address bus to address a plurality of data not stored in the DRAM array. The register read operation may be a burst read, and the burst length may be defined in a variety of ways.

Abstract: A semiconductor device that initializes memory cells of an activated wordline group is provided. The device includes: a control signal generation circuit, which generates first and second control signals based on an activated setting signal and an initial data value during an initial value setting operation; a first power supply circuit, which supplies power to bitlines in response to the first control signal; a second power supply circuit, which supplies power to complementary bitlines in response to the second control signal; a plurality of wordlines connected to respective memory cells; and a row decoder, which selects a group of wordlines from among the plurality of wordlines based on the setting signal and a selection address and simultaneously activates the selected group of wordlines.

Abstract: A nonvolatile semiconductor memory circuit includes a selection line, a first bit line, a second bit line, a first MIS transistor having a first gate coupled to the selection line, a first drain coupled to the first bit line via a first node, and a first source coupled to a predetermined potential, a second MIS transistor having a second gate coupled to the selection line, a second drain coupled to the second bit line via a second node, and a second source coupled to the predetermined potential, and a latch circuit coupled to the first node and the second node to store data responsive to a signal difference between the first node and the second node, wherein the selection line is operative to supply a write potential that creates a lingering change in a threshold voltage of one of the first MIS transistor and the second MIS transistor.

Abstract: A data processing device which selects either emission of electrons from a nonvolatile memory cell or injection of electrons into it for each bit. A memory array includes a plurality of nonvolatile memory cells each having a pair of a first MOS transistor and a second MOS transistor where the first transistor has a charge retention layer and a memory gate and is used for data storage and the second transistor has a control gate and selectively connects the first transistor to a bit line. When negative voltage is applied to a memory gate, electrons held by a charge retention layer are emitted through hot carriers generated in a nonvolatile memory cell channel region for erasing; and when positive voltage is applied to the memory gate, electrons are injected into the charge retention layer through hot carriers generated in the nonvolatile memory cell channel region for writing and controls the generation and suppression of hot carriers by means of bit line voltage on each bit line.

Abstract: A semiconductor memory and a method for operating the latter in order are provided, at least in testwise fashion, to deactivate a word line segment (12) of a segmented word line not via a first line (21) otherwise used for deactivation, but rather via a second line (22) via that the word line segment (12) is otherwise activated. The second line (22) can optionally be biased with a second potential (Vpp) provided for activation or with a third potential (Vgnd). If the third potential (Vgnd) is used for at least temporarily deactivating the word line segment (12), the word line segment can be driven via a switching element (17), which couples the word line segment to the second line (22), without the complementary switching element (16) of the driver segment (20) having to be used for deactivation.

Abstract: A memory device having an open bit line cell structure uses a wafer burn-in testing scheme and a method for testing the same. The memory device includes a sense amplifier having first and second input terminals; a bit line connected to the first input terminal of the sense amplifier and extended in a first direction; an inverted bit line connected to the second input terminal of the sense amplifier and extended in a second direction; and a voltage supply means for applying the same voltage to the bit line and the inverted bit line in a precharge operation mode and applying a different level voltage to the bit line and the inverted bit line in a burn-in test operation mode. It is possible to efficiently screen defects of memory cells and between bit lines by performing a wafer burn-in test using a wafer burn-in scheme on a memory device having an open bit line cell structure.

Abstract: A programmable capacitor array does not require separate switching transistors because the capacitors themselves have a switchable capacitance, which capacitors are made in the manner of regular N channel transistors with their source/drains connected to each other. When a logic low is applied to the gate, the capacitance is relatively low and the capacitance is what is commonly called parasitic capacitance. The capacitance increases significantly when a logic high is applied to the gate because the logic high has the effect of inverting the channel. Thus, the capacitor array is made of transistors that themselves have switchable capacitance operated so that no separate switching transistors are required. This allows for construction of an array of unit capacitors to achieve monotonic operation and good linearity using conventional manufacturing of N channel transistors while achieving significant area savings and reduced power consumption.