Abstract: A monitoring system capable of monitoring utilization of a processing device in a computer. The monitoring system includes a power supply voltage for supplying a core voltage to the processing device, and a comparator for comparing a voltage proportional to the core voltage to a reference voltage and producing a sense voltage. The resulting sense voltage is used to control a processing device management process, or alternatively may be used to control a variety of other processes including cooling fan operation.

Abstract: The present invention relates to a memory cell arrangement comprising a multiplicity of DRAM memory cells which are arranged in cell rows and cell columns and the selection transistor of which comprises in each case a first gate electrode and also a rear side electrode. The memory cell arrangement contains word lines and also rear side electrode lines which are arranged in each case alternately between adjacent cell columns. The invention provides for in each case the first gate electrodes of adjacent cell columns to be connected to the word line lying between the cell columns and in each case the rear side electrodes of adjacent cell columns to be connected to the rear side line lying between the cell columns. All the rear side lines are held at a constant potential, while for reading from a memory cell that word line is addressed to which the first gate electrode of the memory cell to be read is connected.

Abstract: A sense amplifier circuit for a non-volatile semiconductor memory device is used to output data written in a selected non-volatile memory cell and is constructed as a current mirror circuit including a first mirror transistor and a second mirror transistor of a mirror circuit. A selection gate transistor and a detection transistor of the selected non-volatile memory cell are included as part of a load circuit connected to a drain electrode of the second mirror transistor. The detection transistor has a drain electrode linked to a source electrode of the selection gate transistor. An operating current of the selection gate transistor is smaller than an operating current of the detection transistor, and an electric current output from the second mirror transistor is determined by the operating current of the selection gate transistor. This arrangement enables determination of the stable operating current of the memory cell irrespective of the state of a floating gate of the detection transistor.

Abstract: A non-volatile content addressable memory cell comprises: a first phase change material element, the first phase change material element having one end connected to a match-line; a first transistor, the first transistor having a gate connected to a word-line, a source connected to a true bit-read-write-search-line, and a drain connected to another end of the first phase change material element; a second phase change material element, the second phase change material element having one end connected to the match-line; and a second transistor, the second transistor having a gate connected to the word-line, a source connected to a complementary bit-read-write-search-line, and a drain connected to another end of the second phase change material element.

Abstract: A system and method to operate an electronic device, such as a memory chip, with a data driver circuit that is configured to reduce data pin (DQ) capacitance. In a driver circuit that is comprised of a set of ODT (On-Die Termination) legs and a set of non-ODT legs, a method according to the present disclosure allows selective activation and deactivation of tuning transistors in the ODT and non-ODT legs. During a default operational state of the electronic device (e.g., when no data read operation is taking place), the tuning transistors in the non-ODT legs may be maintained “turned off” or “disabled” to reduce DQ pin capacitance contributed by these tuning transistors had they been active during this default state. These non-ODT leg tuning transistors may be turned on, for example, when a data read operation is to be performed. Similarly, the tuning transistors in the ODT legs also may be selectively enabled/disabled to further control or reduce DQ pin capacitance as desired.

Abstract: A partial area for retaining data during low power consumption mode is composed of a single first memory cell out of a plurality of memory cells connected to a bit line. An operation control circuit operates any of the memory cells selected in accordance with an address signal during normal operation mode for performing a read operation and a write operation. The operation control circuit keeps latching data retained by the first memory cell in the partial area into a sense amplifier during the low power consumption mode. This eliminates the need for a refresh operation for retaining the data in the first memory cell during the low power consumption mode. Since the data can be retained without a refresh operation, it is possible to reduce the power consumption during the low power consumption mode.

Abstract: The present invention relates to a magnetoresistive hybrid memory cell comprising a first stacked structure comprising a magnetic tunnel junction including first and second magnetic regions stacked in a parallel, overlying relationship separated by a layer of non-magnetic material, wherein said first magnetic region being provided with a fixed first magnetic moment vector and said second magnetic region being provided with a free second magnetic moment vector which is free to be switched between the same and opposite directions with respect to said fixed first magnetic moment vector of said first magnetic region, a second stacked structure being at least partly arranged in a lateral relationship as to said first stacked structure and comprising a third magnetic region being provided with a fixed third magnetic moment vector and said second magnetic region; wherein said first and second structures being arranged in between at least two electrodes in electrical contact therewith.

Abstract: The present invention that partitions a memory array in N segments by switchably partitioning the bit lines in the array. In the exemplary embodiment, a top set of sense amps control the even bit lines and a bottom set of sense amps control the odd bit lines. The segmentation transistors turn on or off depending on the selected word line location in the array. Since bit line capacitance is mainly from the metal bit line to bit line coupling to their immediate neighbors, the bit line neighbors in the partitioned array are floating in some segments of the bit lines. The overall bit line capacitance is significantly reduced with a negligible increase in die size, resulting in reduced sensing times and enhanced read and write performance.

Abstract: This invention pertains to methods assembly of organic molecules and electrolytes in hybrid electronic. In one embodiment, a method is provided that involves contacting a surface/electrode with a compound of formula: R-L2-M-L1-Z1 where Z1 is a surface attachment group; L1 and L2 are independently linker or covalent bonds; M is an information storage molecule; and R is a protected or unprotected reactive site or group; where the contacting results in attachment of the redox-active moiety to the surface via the surface attachment group; and ii) contacting the surface-attached information storage molecule with an electrolyte having the formula: J-Q where J is a charged moiety (e.g., an electrolyte); and Q is a reactive group that is reactive with the reactive group (R) and attaches J to the information storage molecule thereby patterning the electrolyte on the surface.

Abstract: A method and circuit for preventing the overprogramming of a memory cell. A fuse circuit is operable to be blown. A combinational logic circuit receives a signal from the fuse circuit, indicating whether or not the fuse has been blown, and controls the programming of the memory cell. The programming of the memory cell is prevented if the fuse circuit has been blown.

Abstract: In programming a non-volatile memory involving alternately applying a programming pulse and verifying the programming, time is saved in the program verify portion when, depending on the states of the memory cells, a portion of the verify operation is recognized to be superfluous and skipped. Preferably, in a program verify operation relative to a demarcation threshold level for demarcating between two memory states, the verify operation includes a sequence of two verify sub-cycles, the first sub-cycle performing a verify relative to a first threshold level at a predetermined margin below the demarcation threshold level and the second sub-cycle performing a verify relative to a second threshold level which is identical to the demarcation threshold level. Unlike conventional cases, the second sub-cycle is not performed until any one memory cell of the group has been verified to pass the first threshold.

Abstract: An operation clock controller for preventing a semiconductor memory device from operating when an operation frequency of an external clock is higher than a predetermined frequency. The operation clock controller includes a clock buffer for buffering an external clock to output an internal clock; a unit delaying set for sequentially delaying the internal clock to output a plurality of delayed clocks; a phase detecting block for detecting logic levels of the delayed clocks at a rising edge of the internal clock to output phase detecting signals; a sampling pulse generator for outputting a sampling signal generated at a predetermined point of the internal clock; a latching block for outputting a phase detection latch signal by sampling and latching the phase detection signal at a point of the sampling signal being inputted; and a frequency detection block for outputting the frequency detection signal by logically combining the phase detection latch signal.

Abstract: Temporary lock-out is provided while programming a group of non-volatile memory cells to more accurately program the memory cells. After successfully verifying that the threshold voltage of a memory cell has reached the level for its intended state, it is possible that the threshold voltage will subsequently decrease to below the verify level during additional iterations of the programming process needed to complete programming of other memory cells of the group. Memory cells are monitored (e.g., after each iteration) to determine if they fall below the verify level after previously verifying that the target threshold voltage has been reached. Cells that pass verification and then subsequently fail verification can be subjected to further programming. For example, the bit line voltage for the memory cell of interest may be set to a moderately high voltage to slow down or reduce the amount of programming accomplished by each subsequent programming pulse.

Abstract: Asymmetric SRAM cell designs exploiting data storage patterns found in ordinary software programs wherein most of the bits stored are zeroes for data and instruction streams. The asymmetric SRAM cell designs offer lower leakage power with little impact on latency. In asymmetric SRAM cells, selected transistors are “weakened” to reduce leakage current when the cell is storing a zero. Transistor weakening may be achieved by using higher voltage threshold transistors, by varying transistor geometries, or other means. In addition, a novel sense amplifier design is provided that leverages the asymmetric nature of the asymmetric SRAM cells to offer cell read times that are comparable with conventional symmetric SRAM cells. Lastly, cache memory designs are provided that are based on asymmetric SRAM cells offering leakage power reduction while maintaining high performance, comparable noise margins, and stability with respect to conventional cache memories.

Abstract: An autonomous antifuse cell providing protection against intruders includes an antifuse, sense circuitry, feedback circuitry, program circuitry, and blocking circuitry. The blocking circuitry blocks access of any programming voltage input signals to the antifuse device if the antifuse is previously blown and when power is applied to the cell. In an exemplary embodiment, the antifuse cell uses only a single external access pin. Once the antifuse device is blown and during subsequent power-up operations, intrusion is prevented.

Abstract: A byte select circuit of a memory cell array wherein each column of the memory cell array has two byte select lines. A first byte select line is coupled to the even numbered rows in the column and a second byte select line is coupled to the odd numbered rows in the column. The second byte select line is configured to be driven to a low voltage level when the first byte select line is driven to a high voltage level, thereby minimizing or eliminating any parasitic voltage coupling between adjacent rows of memory cells.

Abstract: A method for simultaneously programming a pre-established number of memory cells includes setting an initial number of memory cells to be simultaneously programmed equal to the pre-established number, and subdividing the initial number of memory cells to be programmed into subsets of memory cells. A program operation for simultaneously programming all the memory cells of each subset of memory cells is executed by forcing a current through all the memory cells of each subset of memory cells. The current has a program voltage associated therewith. The program voltage is compared to a threshold voltage during execution of the program operation. The method further includes stopping execution of the program operation if the threshold voltage is surpassed, reducing the initial number of memory cells to be simultaneously programmed, and restarting from the subdividing.

Abstract: A memory device includes a first layer of MRAM memory cells arranged in accordance with an MRAM architecture, a second layer of MRAM memory cells that is fabricated over the first layer of MRAM memory cells, and a common connection associated with the first layer of MRAM memory cells and the second layer of MRAM memory cells that facilitates operation of the memory device. The method of fabricating the memory device includes fabricating a first layer of MRAM memory cells arranged in accordance with an MRAM architecture, fabricating a second layer of MRAM memory cells over the first layer of MRAM memory cells, and fabricating a common connection associated with the first layer of MRAM memory cells and the second layer of MRAM memory cells that facilitates operation of the memory device.

Abstract: A super-paramagnetic cladding layer formed on from 1 to 3 sides of a conductive line in a magnetic device is disclosed. The cladding layer is made of “x” ML/SL stacks in which x is between 5 and 50, SL is an amorphous AlOx seed layer, and ML is a composite with a soft magnetic layer comprised of discontinuous particles less than 2 nm in size on the seed layer and a capping layer of Ru, Ta, or Cu on the soft magnetic layer. Fringing fields and hysteresis effects from continuous ferromagnetic cladding layers associated with switching the magnetic state of an adjacent MTJ are totally eliminated because of the super-paramagnetic character of the soft magnetic layer at room temperature. The soft magnetic layer has near zero magnetostriction, very high susceptibility, and may be made of Ni˜80Fe˜20, Ni˜30Fe˜70, Co˜90Fe˜10, or CoNiFe.

Abstract: A cost efficient nonvolatile memory cell may include an inverter, an access gate coupled to the inverter for controlling access to the memory cell, and a control gate. The inverter may include a floating gate at an input of the inverter, the floating gate formed in a first polysilicon layer, and a tunnel window formed in a tunnel oxide area, wherein the tunnel oxide area is covered by at least a portion of the floating gate. The control gate may control charge on the floating gate, and may be formed in a second polysilicon layer, wherein the second polysilicon layer is above the first polysilicon layer.