Abstract: A duplexer includes a reception filter that is connected between a reception terminal and an antenna terminal and includes one or a plurality of series resonators that are acoustic wave resonators, and a transmission filter that is connected between a transmission terminal and the antenna terminal and includes one or a plurality of acoustic wave resonators, a resonance frequency of a first series resonator that is one of the one or the plurality of series resonators and is closest to the antenna terminal in the reception filter being higher than an upper limit frequency of a reception band of the reception filter.

Abstract: An artificial microstructure made of conductive wires includes a split resonant ring with a split, and two curves. The two curves respectively start from first end and the second end of the split resonant ring and curvedly extend inside the split resonant ring, where the two curves do not intersect with each other, and do not intersect with the split resonant ring.

Abstract: In an example embodiment, a waveguide device comprises: a first common waveguide; a polarizer section, the polarizer section including a conductive septum dividing the first common waveguide into a first divided waveguide portion and a second waveguide divided portion; a second waveguide coupled to the first divided waveguide portion of the polarizer section; a third waveguide coupled to the second divided waveguide portion of the polarizer section; and a dielectric insert. The dielectric insert includes a first dielectric portion partially filling the polarizer section. The conductive septum and the dielectric portion convert a signal between a polarized state in the first common waveguide and a first polarization component in the second waveguide and a second polarization component in the third waveguide.

Abstract: In accordance with an embodiment, a radio frequency integrated circuit (RFIC) includes an adjustable capacitance coupled to an input terminal of the RFIC, and a first single-pole multiple-throw (SPMT) radio frequency (RF) switch having an input coupled to the adjustable capacitance and a plurality of output nodes coupled to a corresponding plurality of second output terminals of the RFIC.

Abstract: A waveguide structure or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes first and second conductive planes which are disposed in parallel with each other, a transmission line having an open end which is formed in a layer different from the first and second conductive planes and positioned to face the second conductive plane, and a conductive via electrically connecting the transmission line to the first conductive plane.

Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.

Abstract: Apparatus is provided which allows for the receipt and/or transmission of data signals, and, for the received signals, for the subsequent separation of the same into at least two sets of data signals which are orthogonal and provide these sets of data signals to subsequent processing components, whilst maintaining the isolation between the first and second data signal sets. For the transmission of the data signals the first and second sets of data signals are initially separate and then combined into one data set to allow the same to be transmitted.

Abstract: A waveguide structure or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes first and second conductive planes which are disposed in parallel with each other, a transmission line having an open end which is formed in a layer different from the first and second conductive planes and positioned to face the second conductive plane, and a conductive via electrically connecting the transmission line to the first conductive plane.

Abstract: An electronic device includes: a first substrate, a first function part in its first surface, an adhesive layer on the first surface so as to surround the first function part, a second substrate bonded to the first substrate by the adhesive layer to form a gap between the first and second substrates, a first via interconnection piercing the first substrate to connect the first surface and an opposite second surface, a second via interconnection piercing the second substrate to connect a third surface of the second substrate opposite to the first substrate and a fourth surface opposite to the third surface, a first terminal provided on the second surface and connected to the first via interconnection, a second terminal provided on the fourth surface and connected to the second via interconnection. The first function part is connected to at least one of the first and second via interconnections.

Abstract: A device is disclosed that includes a transmission plate, a conductive plate, and a capacitive unit. The transmission plate includes a winding structure and is configured to be electrically coupled between an input source and a load. The conductive plate is configured to be electrically coupled to ground. The capacitive unit is electrically coupled between the conductive plate and the transmission plate.

Abstract: The embodiments described herein provide compensation for mutual inductance in a multi-path device. In one embodiment, a device includes a multi-path integrated device. The multi-path integrated device includes a first output and a second output. The first output is configured to be coupled to a first output lead through a first bonding wire, and the second output is configured to be coupled to a second output lead through a second bonding wire. Due to their proximity, the second bonding wire has a first mutual inductance with the first bonding wire. A first compensation network is coupled to the first output, and a second compensation network is coupled to the second output. The second compensation network is configured to have a second mutual inductance with the first compensation network. The second mutual inductance at least partially cancels the effects of the first mutual inductance.

Abstract: In a filter device, a transversal elastic wave filter, which defines a delay element, is connected in parallel with a band pass filter. The transversal elastic wave filter has the same amplitude characteristic as and the opposite phase to the band pass filter at a desired frequency inside an attenuation range of the band pass filter. When a wavelength determined by an electrode finger period of IDTs and is denoted by ?, the distance between the first IDT and the second IDT of the elastic wave filter is about 12? or less.

Abstract: An acoustic resonator device includes a temperature compensation structure disposed beneath the first electrode and above the substrate.

Abstract: Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g.

Abstract: A reactance filter includes a series branch that includes a number of series impedance elements that are coupled in series and a number of parallel branches each having a parallel impedance element coupled to a respective node of the series branch. Each impedance element includes a resonator that works with acoustic waves. The resonators in the series branch include a first piezoelectric material and the resonators in the parallel branches include a second piezoelectric material that is different than the first piezoelectric material.

Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

Abstract: The present invention relates generally to digital elliptic filters, and more particularly, but not exclusively to multi-layer digital elliptic filters and methods for their fabrication.

Abstract: A filter device with a ladder circuit configuration includes series arm resonators and parallel arm resonators, a filter component mounted on a mounting substrate and including a chip substrate and an elastic wave filter chip, a circuit configuration in which a plurality of series arm resonators and parallel arm resonators are defined by the elastic wave filter chip, and inductances are connected between ground-potential-side end portions of the plurality of parallel arm resonators and a ground potential, and in which at least one of the plurality of inductances is provided in the chip substrate and a remaining at least one inductance is provided in the mounting substrate.

Abstract: Described embodiments include a surface acoustic wave device, method, and apparatus. The device includes a piezoelectric substrate and a configurable electrode assembly. The configurable electrode assembly includes a plurality of spaced-apart elongated electrode elements electromechanically coupled with the piezoelectric substrate. The assembly includes a first signal bus crossing each of the plurality of electrode elements and electrically isolated therefrom. The assembly includes a first matrix of addressable switches. Each addressable switch of the first matrix configured to electrically couple a respective electrode element of the plurality of electrode elements with the first signal bus. The assembly includes a second signal bus crossing each of the plurality of electrode elements and electrically isolated therefrom. The assembly includes a second matrix of addressable switches.

Abstract: A high-frequency module includes a filter unit and first and second external connection terminals. The filter unit includes first and second terminals and a plurality of SAW resonators. The plurality of SAW resonators are connected to one another by connection conductors. A matching element is connected between the first terminal and the first external connection terminal, and a matching element is connected between the second terminal and the second external connection terminal. At least one of the matching elements is inductively coupled or capacitively coupled to at least one of the connection conductors located at a position such that at least one of the SAW resonators is interposed between the matching element and the connection conductor.