Patents Examined by Robert Pascal
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Patent number: 9515631Abstract: Apparatus and methods for high voltage variable capacitors are provided herein. In certain configurations, an integrated circuit (IC) includes a variable capacitor array and a bias voltage generation circuit that biases the variable capacitor array to control the array's capacitance. The variable capacitor array includes a plurality of variable capacitor cells electrically connected in parallel between a radio frequency (RF) input and an RF output of the IC. Additionally, each of the variable capacitor cells can include a cascade of two or more pairs of anti-series metal oxide semiconductor (MOS) capacitors between the RF input and the RF output. The pairs of anti-series MOS capacitors include a first MOS capacitor and a second MOS capacitor electrically connected in anti-series. The bias voltage generation circuit generates bias voltages for biasing the MOS capacitors of the variable capacitor cells.Type: GrantFiled: May 6, 2015Date of Patent: December 6, 2016Assignee: TDK CorporationInventors: Anuj Madan, Dev V. Gupta, Zhiguo Lai
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Patent number: 9509278Abstract: An apparatus includes a microelectromechanical system (MEMS) device. The MEMS device includes a resonator suspended from a substrate, an anchor disposed at a center of the resonator, a plurality of suspended beams radiating between the anchor and the resonator, a plurality of first electrodes disposed about the anchor, and a plurality of second electrodes disposed about the anchor. The plurality of first electrodes and the resonator form a first electrostatic transducer. The plurality of second electrodes and the resonator form a second electrostatic transducer. The first electrostatic transducer and the second electrostatic transducer are configured to sustain rotational vibrations of the resonator at a predetermined frequency about an axis through the center of the resonator and orthogonal to a plane of the substrate in response to a signal on the first electrode.Type: GrantFiled: March 14, 2013Date of Patent: November 29, 2016Assignee: Silicon Laboratories Inc.Inventors: Aaron J. Caffee, Jeffrey L. Sonntag, Brian G. Drost, Mehrnaz Motiee
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Patent number: 9509034Abstract: A low loss and compact power divider/combiner is provided for high power efficiency. The power divider/combiner can be an N-way coaxial-waveguide cavity power divider/combiner with good characteristics of low loss and compact size. The power divider/combiner can be comprised of a coaxial common port, a radial-waveguide cavity, and N-way probe outputs. In various embodiments, the power divider/combiner can have a plurality of probe outputs that are equally spaced radially around an axis on which the coaxial common port is located. The radial-waveguide cavity and N-way probe outputs can be fabricated on a substrate board using printed circuit technology. In addition, the power divider/combiner can have reversed probe outputs which provide for 180 degree out of phase outputs between the probe outputs.Type: GrantFiled: November 17, 2014Date of Patent: November 29, 2016Assignee: CITY UNIVERSITY OF HONG KONGInventors: Quan Xue, Peng Wu
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Patent number: 9509271Abstract: Apparatus and method for a radially attachable RF trap attached from a side to a shielded RF cable. In some embodiments, the RF trap creates a high impedance on the outer shield of the RF cable at a frequency of RF signals carried on at least one inner conductor of the cable. In some embodiments, an RF-trap apparatus for blocking stray signals on a shielded RF cable that has a peripheral shield conductor and a inner conductor for carrying RF signals includes: a case; an LC circuit having a resonance frequency equal to RF signals carried on the inner conductor; projections that pierce and connect the LC circuit to the shield conductor; and an attachment device that holds the case to the cable with the LC circuit electrically connected to the shield conductor of the shielded RF cable.Type: GrantFiled: January 19, 2016Date of Patent: November 29, 2016Assignee: Life Services, LLCInventors: Matthew T. Waks, Scott M. Schillak, Charles A. Lemaire
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Patent number: 9509281Abstract: Embodiments relate to peaking inductor array for a peaking control unit of a transceiver. An aspect includes the peaking inductor array comprising a plurality of cells connected in parallel, each cell comprising a respective active inductor. Another aspect includes each of the plurality of cells further comprising a decoupling capacitor.Type: GrantFiled: March 28, 2016Date of Patent: November 29, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Pier A. Francese, Mangal Prasad, Hung H. Tran, Xiaobin Yuan
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Patent number: 9503043Abstract: A duplexer is provided, which includes a first, a second and a third signal ports; a first filter and a second filter. The first filter has first, second, and third resonant circuits that have first, second and third inductors, respectively. The first, second and third inductors are mutually inductive. The first and third resonant circuits are electrically connected to the first and second signal ports, respectively. The second filter has fourth, fifth and sixth resonant circuits that have fourth, fifth and sixth inductors, respectively. The fourth resonant circuit is connected in series with the first resonant circuit. The fifth inductor and the fourth inductor are mutually inductive. The sixth resonant circuit is electrically connected to the third signal port. The second filter further has a main capacitor connected in series with the fifth and sixth resonant circuits respectively and located therebetween.Type: GrantFiled: May 2, 2013Date of Patent: November 22, 2016Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Min-Han Chuang, Chia-Chu Lai, Bo-Shiang Fang, Ho-Chuan Lin, Yen-Yu Chen
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Patent number: 9496845Abstract: The present invention discloses a common mode filter and a method for manufacturing the common mode filter. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a first coil electrode formed on the magnetic substrate; a first lead electrode formed on the magnetic substrate; a first dielectric layer formed on the magnetic substrate; a height compensation electrode formed on the upper surface of the first lead electrode; a second coil electrode formed on the first dielectric layer; a second lead electrode formed on the first dielectric layer; a second dielectric layer formed on the first dielectric layer; and an external electrode formed on the second dielectric layer.Type: GrantFiled: August 4, 2014Date of Patent: November 15, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Geon-Se Chang, Jin-Hyuck Yang, Jeong-Min Cho
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Patent number: 9496592Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.Type: GrantFiled: March 27, 2014Date of Patent: November 15, 2016Assignee: Intel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
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Patent number: 9490767Abstract: A network signal coupling circuit installed in a circuit board and coupled between a network-on-chip and a network connector is disclosed to include a coupling module including a first capacitor connected in series to each wire of one respective two-wire channel of the signal coupling circuit thereof for coupling network signals and removing noises. Subject to the capacitance reactance characteristic that the signal attenuation is reduced when the frequency rises and the capacitive coupling characteristic that the signal coupling performance is enhanced when the frequency rises, the network signal coupling circuit assembly is practical for high frequency network applications to enhance signal coupling and transmission performance.Type: GrantFiled: July 1, 2015Date of Patent: November 8, 2016Assignee: AJOHO ENTERPRISE CO., LTD.Inventors: Chia-Ping Mo, You-Chi Liu
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Patent number: 9490766Abstract: Electromagnetic interference (EMI) noise filter embodiments and methods for filtering are provided herein. EMI noise filters include multiple signal exclusion enclosures. The multiple signal exclusion enclosures contain filter circuit stages. The signal exclusion enclosures can attenuate noise generated external to the enclosures and/or isolate noise currents generated by the corresponding filter circuits within the enclosures. In certain embodiments, an output of one filter circuit stage is connected to an input of the next filter circuit stage. The multiple signal exclusion enclosures can be chambers formed using conductive partitions to divide an outer signal exclusion enclosure. EMI noise filters can also include mechanisms to maintain the components of the filter circuit stages at a consistent temperature. For example, a metal base plate can distribute heat among filter components, and an insulating material can be positioned inside signal exclusion enclosures.Type: GrantFiled: February 13, 2014Date of Patent: November 8, 2016Assignee: UT-Battelle, LLCInventors: Roger Allen Kisner, David Lee Fugate
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Patent number: 9490517Abstract: Radio frequency (RF) power amplifiers are provided which may include high power, wideband, microwave or millimeter-wave solid state power amplifiers based on waveguide power combiner/dividers.Type: GrantFiled: June 17, 2015Date of Patent: November 8, 2016Assignee: Nuvotronics, Inc.Inventors: Donald X. Wu, David Sherrer, Jean-Marc Rollin
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Patent number: 9484613Abstract: One or more embodiments of the present invention describe an apparatus and method to combine unequal powers. The apparatus includes a first input port, a second input port, and a combiner. The first input port is operably connected to a first power amplifier and is configured to receive a first power from the first power amplifier. The second input port is operably connected to a second power amplifier and is configured to receive a second power from the second power amplifier. The combiner is configured to simultaneously receive the first power from the first input port and the second power from the second input port. The combiner is also configured to combine the first power and second power to produce a maximized power. The first power and second power are unequal.Type: GrantFiled: September 10, 2010Date of Patent: November 1, 2016Assignee: United States of America as Represented by the Administrator of National Aeronautics and Space AdministrationInventors: Rainee N Simons, Christine T Chevalier, Edwin G Wintucky, Jon C Freeman
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Patent number: 9484609Abstract: A transmission line structure having a pair of separated coplanar waveguide transmissions line section. A coupling circuit is coupled between the pair of coplanar waveguide transmissions line sections, the coupling circuit suppresses common mode signals therein and passes, substantially unsuppressed, differential mode signal transmission between the pair of coplanar waveguide transmissions line sections.Type: GrantFiled: March 4, 2014Date of Patent: November 1, 2016Assignee: RAYTHEON COMPANYInventors: Shahed Reza, Michael F. Parkes, Kenneth A. Wilson
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Patent number: 9485869Abstract: A printed circuit board includes a plurality of sub-circuits that form at least one circuit channel. The printed circuit board further includes a first surface, a second surface opposite the first surface, and at least one layer interposed between the first and second surfaces. A plurality of surface portions are formed on the first surface. The printed circuit board further includes at least one embedded sub-circuit of the at least one circuit channel. The embedded sub-circuit is embedded in the at least one layer and is electromagnetically isolated from the plurality of surface portions.Type: GrantFiled: October 16, 2014Date of Patent: November 1, 2016Assignee: RAYTHEON COMPANYInventor: Gary P. Schuster
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Patent number: 9477851Abstract: A combiner includes N coaxial cables each configured to connect to a respective output of N radio frequency power amplifiers, where N is an integer greater than one. Each of the N coaxial cables is configured to receive an amplified radio frequency signal from a respective one of the N radio frequency power amplifiers. A board includes capacitances and is configured to connect to each of the N coaxial cables and combine the radio frequency signals. The N coaxial cables and the capacitances provide N inductance and capacitance combinations. A connector is configured to connect an output of the board to a load.Type: GrantFiled: July 28, 2014Date of Patent: October 25, 2016Assignee: MKS Instruments, Inc.Inventor: Christopher Michael Owen
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Patent number: 9479136Abstract: In an electronic component, first through n-th LC parallel resonators respectively include first through n-th inductors disposed in a device body such that they are sequentially arranged in a first direction in an order from the first inductor to the n-th inductor. The first and the n-th inductors are wound around respective winding axes extending along the first direction. At least one predetermined inductor among the second through the (n?1)-th inductors is wound around a winding axis extending in a second direction which is perpendicular or substantially perpendicular to the first direction. A center of the predetermined inductor in the second direction is positioned toward one side of the second direction with respect to the winding axes of the first and the n-th inductors, as viewed from a plane of the device body in a third direction which is perpendicular or substantially perpendicular to the first and second directions.Type: GrantFiled: August 15, 2014Date of Patent: October 25, 2016Assignee: Murata Manufacturing Co., Ltd.Inventor: Hiroshi Masuda
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Patent number: 9478843Abstract: A system, method, device, and apparatus provide a dielectric waveguide splitter/bi-directional link. A dielectric substrate fabricated into a first Y-junction waveguide with a first port splitting into a first branch leading to a second port and a second branch leading to a third port. An angle between the first branch and the second branch is below ninety degrees (90°). The dielectric waveguide splitter enables millimeter-wave (mmWave) transmission between the first port and the second port while reducing feedback of the mmWave between the second and third port. Two Y-junction waveguides may be fabricated back-to-back to provide simultaneous bidirectional mmWave transmission at a single frequency.Type: GrantFiled: February 19, 2015Date of Patent: October 25, 2016Assignee: California Institute of TechnologyInventors: Adrian Joseph Tang, Goutam Chattopadhyay, Nacer E. Chahat, Emmanuel Decrossas
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Patent number: 9479137Abstract: A filter device includes a single terminal and first and second balanced terminals. A balanced filter is connected between the single terminal and the first and second balanced terminals. The filter device includes a compensation circuit including at least one of a first compensation circuit portion connected between the single terminal and the first balanced terminal and a second compensation circuit portion connected between the single terminal and the second balanced terminal. The compensation circuit includes a resonant circuit that increases attenuation in a specified frequency band within a stop band of the balanced filter, compared with a case in which the compensation circuit is not connected.Type: GrantFiled: March 9, 2015Date of Patent: October 25, 2016Assignee: Murata Manufacturing Co., Ltd.Inventor: Soichi Nakamura
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Patent number: 9473103Abstract: A high frequency component includes transverse inductors each including a first end and a second end and capacitors including planar conductors connected to the first ends of the transverse inductors, planar conductors connected to the second ends of the transverse inductors, and insulating layers disposed between the planar conductors. Each of the transverse inductors is helical and wound at least more than one turn.Type: GrantFiled: July 23, 2014Date of Patent: October 18, 2016Assignee: Murata Manufacturing Co., Ltd.Inventor: Mitsutoshi Imamura
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Patent number: 9472835Abstract: A filtering apparatus includes a passband of a first-level unit which is formed by at least three coaxial filters covers a passband of a second-level unit which is formed by at least three dielectric filters, and a bandwidth of the first-level unit is twice the bandwidth of the second-level unit, so that when the coaxial filters are coupled to the dielectric filters, insertion loss of the coaxial filters is reduced, thereby reducing overall insertion loss of the filtering apparatus. By making a transmission zero of the first-level unit be located at a second harmonic frequency point of the second-level unit, the filtering apparatus can have high suppression on a second harmonic, thereby obtaining relatively desirable far-end suppression performance.Type: GrantFiled: October 14, 2014Date of Patent: October 18, 2016Assignee: Huawei Technologies Co., Ltd.Inventor: Yanzhao Zhou