Abstract: Toughened thermosetting resins comprising thermosetting resins and rubber particles having an average particle size in the range of 20 to 500nm. The toughened resins are obtained by mixing a fully vulcanized powdery rubber having an average particle size in the range of 20 to 500nm with thermosetting resin prepolymers and then curing them. The toughened thermosetting resins comprise rubber phases having a small, uniform and stable particle size, which results in a very significant toughening effect, especially when crazes rapidly grow (as in a standard Izod impact test). The toughened thermosetting resins are excellent in impact resistance, strength, modulus and heat resistance, and when appropriately toughened, the thermosetting resins can be enhanced in terms of impact strength, glass transition temperature and heat distortion temperature.

Abstract: An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.

Abstract: Polymer foams comprising macropores, the macropores having average cross sections of above 500 nm, are obtainable by reacting one or more epoxy resins with one or more amphiphilic epoxy resin hardeners in water in a phase inversion polymerization, where, during the phase inversion polymerization, but after phase inversion has taken place, a volume increase of the internal voids which form initially, and which are present predominantly as micropores having average cross sections of below 500 nm, is induced such that the fraction of the macropores—relative to the entirety of micropores and macropores present in the polymer foam—at the end of the phase inversion polymerization is above 50% by volume. Polymer foams of the present invention are suitable for use as acoustic insulation materials in means of transport and in industrial and plant construction.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.

Abstract: Compositions and methods for forming surfactants, aqueous dispersions, and curing agents are provided. In one aspect, the invention relates to improved epoxy functional surfactants prepared by reaction of an epoxy composition and an amidoamine composition formed from a blend of acid-terminated polyoxyalkylene polyols. The improved epoxy functional surfactants may be reacted with an excess of epoxy composition and water to result in an aqueous dispersion. The amidoamone composition may be a reaction mixture of a diamine compound and an acid terminated polyoxyalkylene composition formed from two or more polyoxyalkylene polyol compounds. The epoxy functional surfactant may be reacted with amine compounds to form a compound suitable as a curing agent.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Compositions and methods for forming surfactants, aqueous dispersions, and curing agents are provided. In one aspect, the invention relates to improved epoxy functional surfactants prepared by reaction of an epoxy composition and an amidoamine composition formed from a blend of acid-terminated polyoxyalkylene polyols. The improved epoxy functional surfactants may be reacted with an excess of epoxy composition and water to result in an aqueous dispersion. The amidoamone composition may be a reaction mixture of a diamine compound and an acid terminated polyoxyalkylene composition formed from two or more polyoxyalkylene polyol compounds. The epoxy functional surfactant may be reacted with amine compounds to form a compound suitable as a curing agent.

Abstract: The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodephenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at last one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to- a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.

Abstract: A hydrogenation process for hydrogenating bisphenol-A-based epoxy resin under low-temperature, low-pressure conditions includes using a hydrogenation reactor that has a gas-distributing agitator functional to introduce and exhaust hydrogen gas and stir liquid reactant, so that hydrogen gas introduced into the hydrogenation reactor can be evenly distributed into a liquid reactant placed into the hydrogenation reactor to make the liquid reactant contain a high level of dissolved hydrogen, which not only enhances activity of an involved hydrogenation catalyst and accelerates hydrogenation reaction, but also allows hydrogenation reaction to be performed in a low-temperature, low-pressure environment. The hydrogenation process improve yield of the hydrogenated bisphenol-A-based epoxy resin to 99.0-99.9%, while significantly reducing building and maintaining costs for the hydrogenation reactor, thus being an economic process.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The present invention provides an aqueous two-package type clear coating composition comprising: (A) an aqueous dispersion of a hydroxyl group- and acid group-containing acrylic resin having a hydroxyl value of 30 to 200 mg KOH/g, an acid value of 5 to 50 mg KOH/g, a weight average molecular weight of 3,000 to 30,000, and a glass transition temperature of ?30 to +40° C. obtained by radical polymerization of 10 to 50 mass % of a secondary hydroxyl group-containing monomer (a) and 50 to 90 mass % of at least one other unsaturated monomer (b); and (B) a polyisocyanate curing agent obtained by mixing (c) a polyisocyanate compound and (d) a compound containing an anionic functional group, a polyoxyethylene group, and a hydrocarbon group, and a process for forming a multilayer topcoat film using the same.

Abstract: The present invention provides a simple, non-destructive and versatile method that enables layer-by-layer (LbL) assembly to be performed on virtually any substrate. A novel catechol-functionalized polymer which adsorbs to virtually all surfaces and can serve as a platform for LbL assembly in a surface-independent fashion is also provided.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The present invention provides N,N?-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions comprising N,N?-dimethyl secondary diamine polymers are also disclosed.

Abstract: Disclosed is a photosensitive resin composition which has excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electrical characteristics, while exhibiting good developability and storage stability. Specifically disclosed is a photosensitive resin composition which contains the following components (A), (B) and (C). (A) a copolymer which contains (a1) hydroxyphenyl (meth)acrylate and (a2) an unsaturated epoxy compound as copolymerization components (B) a novolac resin which contains one or more phenols selected from among dimethylphenol, trimethylphenol, methylpropylphenol, dipropylphenol, butylphenol, methylbutylphenol, dibutylphenol, and 4,4?-dihydroxy-2,2?-diphenylpropane (C) a quinonediazide group-containing compound.

Abstract: A varnish composition includes (1) a benzoxazine resin having highly symmetric molecular structure; (2) at least one of naphthol novolac resins, aniline novolac resins and phenolic novolac resins; (3) fillers. The benzoxazine resin having highly symmetric molecular structure, and the at least one of naphthol novolac resins, aniline novolac resins and phenolic novolac resins contribute to increase the glass transition temperature of the varnish composition, while decrease the coefficient of thermal expansion and moisture absorbability due to their small and highly symmetric molecular structures. A copper substrate can meet the requirement of high glass transition temperature (TMA?200° C.) and low coefficient of thermal expansion (?1/??30/135 (?m/m° C.). Therefore, the composition of the invention can be widely used as high-performance electronic material.

Abstract: A photochromic cured product exhibiting favorable photochromic properties such as a high color density and a large fading rate, and excellent base member properties such as a high hardness, a high heat resistance and a high impact resistance. A curable composition contains a polymerizable monomer which exhibits the L-scale Rockwell hardness of not larger than 40, a bifunctional polymerizable monomer which exhibits the L-scale Rockwell hardness of not smaller than 60, a polyfunctional polymerizable monomer which exhibits the L-scale Rockwell hardness of not smaller than 60, and a photochromic compound.

Abstract: A polymer includes a reaction product of an epoxy resin, a first crosslinking agent, and a second crosslinking agent. The first crosslinking agent is reactive with the epoxy resin and has a first molecular weight. The second crosslinking agent is reactive with the epoxy resin and has a second molecular weight of at least ten times greater than the first molecular weight. The polymer has a first phase having a first glass transition temperature and a second phase having a second glass transition temperature that is lower than the first glass transition temperature. The polymer is transformable between a first shape and a second shape at the first glass transition temperature.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.