Abstract: A problem to be solved by the invention is to provide a novel epoxy resin exhibiting excellent performance with respect to heat resistance and low thermal expansibility of a cured product, a curable composition using the same, and a cured product having excellent heat resistance and low thermal expansibility. The curable composition contains an epoxy compound and a curing agent as essential components, a calixarene-type novel epoxy compound being used as the epoxy compound. The novel epoxy compound has a resin structure represented by structural formula 1 below (in the formula, R1s each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeat unit and an integer of 2 to 10).

Abstract: The present invention discloses both amine compositions and amine-epoxy compositions containing N,N?-dimethyl-meta-xylylenediamine. A novel process for producing amines such as N,N?-dimethyl-meta-xylylenediamine, and structurally similar amines, is also disclosed.

Abstract: The present invention relates to a transparent resin composition which comprises (a) a (meth)acrylate based resin comprising one or more (meth)acrylate based derivatives; and (b) an aromatic based resin having a chain having the hydroxy group containing portion and an aromatic moiety.

Abstract: The present invention relates to a process for preparing a water absorbent resin, particularly to a process for preparing a water absorbent resin which can resolve the uneven size of the fine pulverized gel-type resin and long pulverizing time those are the problems of prior process for preparing the water absorbent resin, by carrying out the pulverizing process of the gel-type resin divided into the coarse pulverizing process which is carried out with the internal cross-linking polymerization, and the fine pulverizing process. According to the preparation process, it is possible to mass-produce the water absorbent resin showing excellent absorption under pressure and low extractable content.

Abstract: Composition comprising (A) 50-99.5 wt %, based on the total weight, of A, B and C of a reaction resin or reaction resin mixture that is processed into thermosetting materials, said resin or resin mixture being liquid at temperatures in the range of 15 to 100° C. and having an average molecular weight of 200 to 500,000 and with a sufficient number of suitable reactive groups for a curing process and (B) 0.5-50 wt %, relative to the total weight of A, B and C of one or more dispersed polyorganosiloxanes that are contained in the reaction resin or reaction resin mixture homogeneously in finely distributed form as polyorganosiloxane droplets with a diameter of 0.001 to 4 ?m, wherein the organopolysiloxane particle is a polymer of the general formula (R3SiO1/2)W(R2SiO2/2)X—(RSiO3/2)Y—(SiO4/2)Z, where w=0 to 20 Mol %, x=80 to 99.9 Mol %, y=0.5 to 10 Mol %, z=0 to 10 Mol %, (C) 0.

Abstract: The invention relates to a glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator and at least two resins. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. Another resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. The invention also relates to the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.

Abstract: The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.

Abstract: Disclosed are golf balls comprising cores or intermediate layers prepared from thermoplastic compositions having coefficients of restitution equal to or greater than 0.83 and PGA compressions greater than 100. Also disclosed is a composition comprising or prepared from (a) at least one aliphatic, mono-functional organic acid having from 16 to 20 carbon atoms, wherein the organic acid is unsaturated and linear; (b) an ethylene acid copolymer consisting essentially of copolymerized comonomers of ethylene and from 18 to 24 weight % of copolymerized comonomers of at least one C3 to C8 ?,? ethylenically unsaturated carboxylic acid, based on the total weight of the ethylene acid copolymer, having a melt index from about 200 to about 600 g/10 minutes; wherein the combined acid moieties of (a) and (b) are nominally neutralized to a level from about 120% to about 200%; and optionally (c) filler.

Abstract: The invention relates to a liquid rubber acrylic block copolymer, and its use in modifying a thermoset composition. The liquid rubber acrylic block copolymer adds toughness and flexibility to a thermoset composition. The acrylic block copolymers are especially useful for modifying epoxy compositions.

Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.

Abstract: A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.

Abstract: A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.

Abstract: The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.

Abstract: A golf ball including an inner core layer formed from a thermoset rubber composition and having a first surface hardness; a thermoplastic outer core layer having a second surface hardness, an inner surface hardness, and being formed from a copolymer of ethylene and an ?,?-unsaturated carboxylic acid, an organic acid or salt thereof, and sufficient cation source to fully-neutralize the acid groups of the copolymer; an inner cover layer; and an outer cover layer; wherein the first surface hardness is substantially the same as the second surface hardness and the inner surface hardness.

Abstract: Compounds having the formula (I) wherein L is a linking group, at least one of R1 to R10 comprises the group C?N, at least one of R1 to R5 and at least one of R6 to R10 comprise the group NH2 for use as curing agents in an epoxy resin, together with a process for their synthesis and composites comprising the curing agents.

Abstract: Copper plating baths containing a leveling agent that is a reaction product of one or more of certain pyridine compounds with one or more epoxide-containing compounds, that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

Abstract: An epoxy and rubber microcomposite is formed by adding a carboxy-terminated or amine-terminated rubber component having a glass transition temperature less than zero degrees centigrade to a bisphenol A based epoxy resin component; heating the mixture to 150 degrees centigrade; cooling and curing with a suitable curing agent. A phase segregation occurs between the epoxy resin component and the rubber component to form discrete, spherical rubbery domains with the epoxy compound. Because the glass transition temperature of the rubbery domains is below zero degrees centigrade; the rubbery domains act as acoustic windows within the high-modulus epoxy compound.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer to which may or may not be crosslinked upon heating.

Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.