Abstract: Wiper blade materials and methods for forming the same. The wiper blade materials are graphene-polymer composites that have a low coefficient of friction. In forming the grapheme-polymer composites, a relatively small amount of graphene filler is well-dispersed within the polymer and the graphene filler and the polymer favorably interact with one another.

Abstract: The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The present invention provides a liquid crystal alignment agent and a liquid crystal alignment film formed therefrom, as well as a liquid crystal display element provided with the liquid crystal alignment film. More specifically, the present invention provides a liquid crystal alignment agent and liquid crystal alignment film formed therefrom, as well as a liquid crystal display element provided with the liquid crystal alignment film without image sticking problems and having superior voltage holding ratio. The liquid crystal alignment agent includes: a polymer (A) obtained from a reaction between tetracarboxylic dianhydride compound and diamine compounds, an epoxy compound (B), and an organic solvent (C). Wherein the liquid crystal alignment agent is coated on a glass substrate, and heated for 15 minutes at 220° C. to forth a hard coating film. The hard coating film is extracted for 72 hours by using acetone at 60° C.

Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.

Abstract: An epoxy resin composition containing an epoxy resin and a thermal cationic polymerization initiator not only can reduce the amount of fluorine ions generated during thermal cationic polymerization to improve electrolytic corrosion resistance but also is excellent in low-temperature rapid curability. The epoxy resin composition uses a sulfonium borate complex represented by the formula (1) as the thermal cationic polymerization initiator. In the formula (1), R1 is an aralkyl group, and R2 is a lower alkyl group, provided that when R2 is a methyl group, R1 is not a benzyl group. X is a halogen atom, and n is an integer of 1 to 3.

Abstract: The coating agent of the invention is a coating agent to be used between conductor members, comprising a thermosetting resin, a white pigment, a curing agent and a curing catalyst, the coating agent to be used between conductor members having a white pigment content of 10-85 vol % based on the total solid volume of the coating agent, and a whiteness of at least 75 when the cured product of the coating agent has been allowed to stand at 200° C. for 24 hours.

Abstract: A hydroxyphenyl or alkoxyphenyl phosphine oxide composition comprising (i) a first mixture of mono-(hydroxyphenyl) or (alkoxyphenyl) phosphine oxide isomers, (ii) a second mixture of bis-(hydroxyphenyl) or (alkoxyphenyl) phosphine oxide isomers, (iii) a third mixture of tris-(hydroxyphenyl) or (alkoxyphenyl) phosphine oxide isomers, and optionally iv) a minority amount of non-hydroxy or non-alkoxy tris-phenyl phosphine oxides is provided. Also provided are epoxy resins compositions with excellent flame retardancy and physical properties, which resins comprise the phosphine oxide composition.

Abstract: Prepreg that contains epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4?-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.

Abstract: A curable epoxy resin composition including at least an epoxy resin component and a hardener component, and optionally further additives, wherein: (a) the epoxy resin component is an epoxy resin compound or a mixture of such compounds; (b) the hardener component includes (b1) an aliphatic and cycloaliphatic or aromatic polycarbonic acid anhydride; and (b2) a polyether-amine of the general formula (I), H2N—(CnH2n—O)m—CnH2n—NH2, wherein n is an integer from 2 to 8; and m is from about 3 to about 100; (c) the polycarbonic acid anhydride [component (b1)] is present in the curable epoxy resin composition in a concentration of 0.60 Mol to 0.93 Mol; and (d) the polyether-amine of the general formula (I) [component (b2)] is present in the curable epoxy resin composition in a concentration of about 0.02 Mol to about 0.1 Mol.

Abstract: The present invention provides a thermoplastic resin composition that can have excellent impact resistance, chemical resistance, fluidity and high gloss, which comprises about 1 to about 80 parts by weight of a styrene-acrylonitrile resin (A) including one or more functional groups capable of reacting with polyester; about 1 to about 98 parts by weight of an acrylonitrile-butadiene-styrene resin (B) including about 5 to about 40% by weight of a graft polymerized acrylonitrile-butadiene-styrene resin (B1) and about 60 to about 95% by weight of a styrene-acrylonitrile resin (B2) and including about 20% by weight or less of acrylonitrile; and about 1 to about 98 parts by weight of a polyester resin (C), wherein the resin composition comprises acrylonitrile in a total amount of about 1 to about 13% by weight.

Abstract: A thermosetting resin composition for producing a color filter for a CMOS image sensor is provided. The thermosetting resin composition comprises an organic solvent and a self-curing copolymer having structural units represented by Formulae 1, 2, 3 and 4, which are described in the specification.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin, diaminodiphenylsulfone, and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.

Abstract: A coating composition comprises a first copolymer and a second copolymer. The first copolymer has at least one linear polymer strand having a weight average molecular weight of at least 1,500 Daltons and functionality X with an equivalent weight of no more than 500. The second copolymer has at least one linear polymer strand having a weight average molecular weight of at least 1,500 Daltons and functionality X? with an equivalent weight of no more than 1,500. The coating composition is free of gloss flattening agents, yet still produces a cured film having a low gloss of less than 70 gloss units at an angle of incidence of 60°, as measured according to ASTM D 2457.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: An one-part epoxy resin composition for the use of bonding of a coil which is preferable for impregnation of a motor and a generator for an automobile, especially of a drive motor-generator set for a hybrid car, which has superior storage stability and a cured resin of the composition has excellent adhesion properties, thermal stability, and reliability, are provided. The one-part epoxy resin composition of the present invention comprises (A) a bisphenol A type and/or F type epoxy resin which is in liquid form at room temperature, (B) methylnadic anhydride as a cycloaliphatic anhydride which is in liquid form at room temperature, and (C) a nitrogen-containing latent hardening accelerator.

Abstract: The coating agent of the invention is a coating agent to be used between conductor members, comprising a thermosetting resin, a white pigment, a curing agent and a curing catalyst, the coating agent to be used between conductor members having a white pigment content of 10-85 vol % based on the total solid volume of the coating agent, and a whiteness of at least 75 when the cured product of the coating agent has been allowed to stand at 200° C. for 24 hours.

Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.

Abstract: A thermosetting epoxy resin composition can be cured rapidly at low temperature with an aluminum chelate-based latent curing agent without the use of a cycloaliphatic epoxy compound. The thermosetting epoxy resin composition includes an aluminum chelate-based latent curing agent, a silanol compound of the formula (A), and a glycidyl ether-type epoxy resin: (Ar)mSi(OH)n??(A) wherein Ar is an optionally substituted aryl group, and m is 2 or 3, provided that the sum of m and n is 4. Examples of the silanol compound of the formula (A) include triphenylsilanol, diphenylsilanol, and the like.