Patents Examined by Samuel S Outten
  • Patent number: 11870417
    Abstract: The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator through the coupling mechanism, and the first resonator and the second resonator are connected with the substrate and are able to be displaced relative to the substrate. The coupling mechanism includes a coupling arm, a support shaft, a first connecting piece and a second connecting piece. The coupling arm includes a first force arm, a second force arm and a coupling portion. The support shaft has one end connected with the substrate, and one other end connected with the coupling portion. The first force arm is connected with the first resonator through the first connecting piece, and the second force is connected with the second resonator through the second connecting piece.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: January 9, 2024
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Zhan Zhan, Yang Li, Yuwei Liu, Qiuyu Tan, Rui Zhang
  • Patent number: 11848474
    Abstract: A coplanar waveguide transmission line and a design method thereof are provided. The coplanar waveguide transmission line includes a first dielectric substrate, a center conductor strip, and two ground conductor strips. The first dielectric substrate has a first surface and a second surface opposite to each other. The center conductor strip and the ground conductor strips are stacked and fixed to the first surface. The center conductor strip includes a first segment and a second segment. A width of the first segment is greater than a width of the second segment, so that the first segment and the second segment form a step structure. A rectangular groove recessed toward the second surface is defined in the first surface, and a part of the center conductor strip is stacked and fixed to a side, distal from the second surface, of the rectangular groove to form a defected ground structure.
    Type: Grant
    Filed: July 18, 2023
    Date of Patent: December 19, 2023
    Assignee: LANSUS TECHNOLOGIES INC.
    Inventors: Shulun Li, Jiashuai Guo
  • Patent number: 11849537
    Abstract: A filter module for reducing differential and common mode electrical noise may include at least a first electrically conductive busbar and a second electrically conductive busbar spaced apart from the first busbar, an at least partially electrically conductive housing at least partially enclosing the first busbar and the second busbar, at least a first common mode choke and a second common mode choke arranged in the housing and spaced apart from each other, at least a first bypass capacitor electrically connected to the first busbar and the second bus bar, at least a second bypass capacitor electrically connected to the first busbar and a midpoint, and at least a third bypass capacitor electrically connected to the second busbar and the midpoint.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: December 19, 2023
    Inventors: Juan Francisco Pardo Peris, Anton Esmoris Bertoa, Alejandro Hiroshi Closa Kobayashi
  • Patent number: 11837770
    Abstract: A directional coupler includes a main line and a sub-line electromagnetically coupled to each other, a variable termination circuit that is connected to one end of the sub-line and that has a variable impedance, a variable matching circuit that is connected to the other end of the sub-line and that has a variable impedance or a variable attenuator that has a variable attenuation, and a control circuit that controls the impedance of the variable termination circuit and that controls the impedance of the variable matching circuit or the attenuation of the variable attenuator. The control circuit includes a non-volatile memory and controls the impedance of the variable termination circuit in accordance with data stored in the memory.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: December 5, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kenta Seki, Ryangsu Kim, Katsuya Shimizu
  • Patent number: 11835843
    Abstract: The present disclosure describes systems and methods for novel phononic frequency combs and related sensing techniques realized by a piezoelectric multimode or single-mode mechanical resonator based on parametric pumping. In one embodiment of such a system, a single frequency electrical input provides an electrical signal comprising an amplitude and a single input frequency to a multimode mechanical resonator, in which a value of the single input frequency equals a sum of the resonance frequencies of the two resonance modes of the mechanical resonator. Accordingly, the mechanical resonator is configured to produce at least one phononic frequency comb in response to a motion of the mechanical resonator caused by the electrical signal.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: December 5, 2023
    Assignee: Georgia Tech Research Corporation
    Inventors: Azadeh Ansari, Mingyo Park
  • Patent number: 11838003
    Abstract: A composite filter device includes bandpass filters whose respective one ends are electrically connected in common. A first bandpass filter of the bandpass filters includes a first filter, a switch, a second filter, and an impedance element that is electrically connected to the switch and having an impedance value larger than the input impedance value of the second filter. The switch is configured to be switched between a first state in which the first filter and the second filter are electrically connected and a second state in which the first filter and the impedance element are electrically connected.
    Type: Grant
    Filed: June 9, 2022
    Date of Patent: December 5, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Junpei Yasuda, Morio Takeuchi
  • Patent number: 11831060
    Abstract: A high-frequency transmission line includes a multi-layer substrate, a plurality of line portions, a plurality of signal vias, a ground plane, and a plurality of metal portions. When a high-frequency signal that is transmitted through each of the plurality of line portions is transmitted through the transmission area corresponding to each of the plurality of line portions, the plurality of metal portions confine the high-frequency signal in the transmission area. The plurality of metal portions pass through at least a single dielectric layer, are electrically continuous with the ground plane. The plurality of metal portions are formed along the transmission direction and are arranged in an alternating manner with each of the plurality of signal vias so as to sandwich each of the plurality of signal vias in a direction differing from the transmission direction.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: November 28, 2023
    Assignee: DENSO CORPORATION
    Inventors: Kazumasa Sakurai, Kazuya Wakita
  • Patent number: 11824522
    Abstract: Aspects of the disclosure relate to wireless communication, and high-frequency filters with resonators configured to systematically modify phase characteristics of an antenna reflection coefficient. One example is a wireless communication apparatus for a multi-band system comprising a frequency band filter circuit having a filter passband that includes a first band of the multi-band system. The frequency band filter circuit comprises a plurality of resonators coupled between an antenna port and a signal port and a resonant structure electrically coupled to the plurality of resonators. The resonant structure has a resonance outside of the first band and a second band of the multi-band system, the resonance being closer to the second band than to the first band.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: November 21, 2023
    Assignee: RF360 Singapore Pte. Ltd.
    Inventors: Volker Schulz, Gerhard Kloska, Ibrahim Mehinovic, Philipp Schwegler
  • Patent number: 11824513
    Abstract: An acoustic wave device includes a piezoelectric substrate and an IDT electrode on the piezoelectric substrate. The IDT electrode includes first and second electrode fingers. When the propagation direction of acoustic waves is a first direction and the direction orthogonal or substantially orthogonal to the first direction is a second direction, an intersecting region of the IDT electrode includes a central region located toward the middle in the second direction and first and second edge regions on both sides in the second direction of the central region. The first and second electrode fingers include epitaxially grown oriented films in the central region and portions that do not include the oriented films in the first and second edge regions.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: November 21, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Katsuya Daimon, Yasumasa Taniguchi, Koji Yamamoto
  • Patent number: 11811388
    Abstract: An acoustic wave device includes a piezoelectric substrate and an IDT electrode on the piezoelectric substrate. The IDT electrode includes a first comb-shaped electrode including first electrode fingers and a second comb-shaped electrode including second electrode fingers. The IDT electrode includes a first portion in which a main electrode layer includes a first metal and a second portion in which a main electrode layer includes a second metal. The first electrode fingers and the second comb-shaped electrode include first facing portions facing each other with a gap in between, and the second electrode fingers and the first comb-shaped electrode include second facing portions facing each other with a gap in between. At least one of the first facing portions and second facing portions is the second portion, and a portion of the IDT electrode other than the second portion is the first portion.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: November 7, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hidetaro Nakazawa
  • Patent number: 11811384
    Abstract: A high frequency power supply alternately outputs a first AC voltage and a second AC voltage to a plasma generator. The amplitudes of the first AC voltage and the second AC voltage are different from each other. An impedance adjustment device is disposed in midway of the transmission line of the first AC voltage and the second AC voltage. When the AC voltage output from the high frequency power supply is switched to a first AC voltage, a microcomputer changes the capacitance of a variable capacitor circuit to a first target value. When the AC voltage output from the high frequency power supply is switched to a second AC voltage, the microcomputer changes the capacitance of the variable capacitor circuit to a second target value.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: November 7, 2023
    Assignee: DAIHEN Corporation
    Inventor: Tatsuya Morii
  • Patent number: 11805594
    Abstract: An apparatus includes a first conductor trace arranged to electrically couple a first complementary signal to provide differential signaling. The first conductor trace includes a first plurality of split traces to conduct the first complementary signal, and a first plurality of tie bars to connect the first split traces.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: October 31, 2023
    Assignee: Dell Products L.P.
    Inventors: Sandor Farkas, Bhyrav Mutnury
  • Patent number: 11799439
    Abstract: Aspects of this disclosure relate to a parallel hybrid acoustic passive filter. The parallel hybrid acoustic passive filter includes a first sub-filter and a second sub-filter. The first sub-filter includes a first acoustic resonator and a first non-acoustic passive component. The second sub-filter includes a second acoustic resonator and second first non-acoustic passive component. The first sub-filter and the second sub-filter are together arranged to filter a radio frequency signal. The parallel hybrid acoustic filter can be a band pass filter or a band stop filter, for example. Related multiplexers, wireless communication devices, and methods are disclosed.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: October 24, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hai H. Ta, Bo Pan, Weimin Sun
  • Patent number: 11791526
    Abstract: A polycrystal having a physical property that enables an AC resistance value to drop sharply is used to reduce transmission loss of a high frequency signal being transmitted. A high frequency transmission device D1 is provided that includes a dielectric 100 and a transmission line 200 adapted for transmitting therethrough high frequency signals. At least part of the transmission line 200 is located on or inside the dielectric 100. At least part of the transmission line 200 is composed of a polycrystal composed of conductor fine particles. The polycrystal has a physical property such that, when a high frequency signal to be transmitted through the transmission line 200 is of frequencies within one or more specific frequency bands, the AC resistance value drops sharply.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: October 17, 2023
    Assignee: HOSIDEN CORPORATION
    Inventors: Hayato Kondo, Kosuke Sasada
  • Patent number: 11791798
    Abstract: An acoustic wave device includes a piezoelectric substrate, and an IDT electrode provided on the piezoelectric substrate. The IDT electrode includes an overlap region where first and second electrode fingers overlap each other in a first direction. The overlap region includes a central region located in a substantially central portion of the overlap region with respect to a second direction. The central region includes a low acoustic velocity portion with an acoustic velocity less than the acoustic velocity in another portion. The overlap region includes first and second low acoustic velocity regions. The first and second low acoustic velocity regions are respectively located on first-and-second-busbar sides from the central region. The IDT electrode includes first and second high acoustic velocity regions. The first and second high acoustic velocity regions are respectively located outside the first and second low acoustic velocity regions with respect to the second direction.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: October 17, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kazuhiro Takigawa
  • Patent number: 11791793
    Abstract: Aspects of this disclosure relate to hybrid acoustic LC filter with harmonic suppression. The hybrid acoustic LC filter includes a hybrid passive/acoustic and a non-acoustic LC filter cascaded with the hybrid passive/acoustic filter. The hybrid passive/acoustic filter can be configured to filter a radio frequency signal. The hybrid passive/acoustic filter can include acoustic resonators and a non-acoustic passive component. The non-acoustic LC filter can be configured to suppress a harmonic of the radio frequency signal. The non-acoustic LC filter can be a low pass filter or a harmonic notch filter, for example. Related multiplexers, wireless communication devices, and methods are disclosed.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: October 17, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Weimin Sun, Hai H. Ta, Bo Pan
  • Patent number: 11784627
    Abstract: A Lamb wave resonator includes a piezoelectric material layer, a first finger electrode, a second finger electrode, at least two floating electrodes, and at least two gaps. The first finger electrode is disposed on one side of the piezoelectric material layer and includes a first main portion and first fingers. The second finger electrode is disposed on the side of the piezoelectric material layer and includes a second main portion and second fingers. The first fingers are parallel to and alternately arranged with the second fingers. The floating electrodes are disposed between each first finger and each second finger, and the gaps are disposed at two ends of each floating electrode, respectively.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: October 10, 2023
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Chin-Yu Chang, Yen-Lin Chen, Chien-Hui Li, Tai-I Yang, Yung-Hsiang Chen
  • Patent number: 11784628
    Abstract: An acoustic device includes a foundation structure and a transducer provided over the foundation structure. The foundation structure includes a piezoelectric layer between a top electrode and a bottom electrode. The piezoelectric layer has an active portion within an active region of the transducer, and a bi-polar border portion within a border region of the transducer. The piezoelectric material in the active portion has a first polarization. The bi-polar border portion has a first sub-portion and a second sub-portion, which resides either above or below the first sub-portion. The piezoelectric material in the first sub-portion has the first polarization, and the piezoelectric material in the second sub-portion has a second polarization, which is opposite the first polarization.
    Type: Grant
    Filed: September 21, 2022
    Date of Patent: October 10, 2023
    Assignee: Qorvo US, Inc.
    Inventors: Jyothi Swaroop Sadhu, Ralph Rothemund, Alireza Tajic
  • Patent number: 11777471
    Abstract: An acoustic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate and includes a main electrode layer. In the IDT electrode, a central region, first and second low acoustic velocity regions and first and second high acoustic velocity regions are disposed in this order. A duty ratio in the first low acoustic velocity region of first electrode fingers and the second low acoustic velocity region of second electrode fingers is larger than a duty ratio in the central region. The main electrode layer includes any one of Au, Pt, Ta, Cu, Ni, and Mo as a main component.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: October 3, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masakazu Mimura, Kazuhiro Takigawa
  • Patent number: 11757429
    Abstract: A hybrid filter device (1) includes an acoustic wave device (AD) that includes an acoustic wave resonator and a passive device (PD) that includes an inductor element or an inductor element and a capacitance element. At least one of the acoustic wave device (AD) and the passive device (PD) is mounted on a substrate (20) of the hybrid filter device (1) and the acoustic wave device (AD) and the passive device (PD) are electrically connected to each other. The acoustic wave device (AD) overlaps the passive device (PD) when the hybrid filter device (1) is viewed in a direction perpendicular to one main surface (20a) of the substrate (20).
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: September 12, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masanori Kato