Patents Examined by Sherman Ng
  • Patent number: 10856412
    Abstract: A substrate is disclosed. In an embodiment, a substrate includes a ceramic main body, an organic surface structure on at least one first outer face of the ceramic main body and outer redistribution layers integrated into the organic surface structure.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: December 1, 2020
    Assignee: TDK ELECTRONICS AG
    Inventors: Thomas Feichtinger, Katharina Tauber, Roman Geier
  • Patent number: 10854385
    Abstract: A method for producing a ceramic substrate that includes a substrate body having ceramic layers and columnar projecting electrodes on a first primary surface of the substrate body. The method includes a step of preparing electrode formation sheets for forming the projecting electrodes, a step of perforating the electrode formation sheets with through holes and filling the through holes with a first electrically conductive paste containing a first electrically conductive powder, a step of building a composite multilayer body by stacking ceramic green sheets and the electrode formation sheets on a first primary surface of the stack of ceramic green sheets. The first electrically conductive powder contains electrically conductive metal(s) and anti-sintering ceramic(s) that controls the sintering of particles of the electrically conductive metal(s), with at least part of the surface of the particles of the electrically conductive metal(s) covered with the anti-sintering ceramic(s).
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: December 1, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kumiko Ishikawa, Seiji Fujita, Tsutomu Sasaki
  • Patent number: 10854353
    Abstract: A terminal-equipped electrical wire that includes a terminal fitting; an electrical wire that includes a conductor surrounded by an insulation covering and is electrically connected to the terminal fitting in an electrical connection; and a resin cover that is made of a resin material and covers the electrical connection, wherein the resin cover is in contact with the terminal fitting and the insulation covering, a tensile shear adhesion strength between the resin cover and the terminal fitting is 1.0 MPa or higher, and a tensile shear adhesion strength between the resin cover and the insulation covering is 0.5 MPa or higher.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: December 1, 2020
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LIMITED, SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takuya Yamashita, Tetsuya Nakamura, Yoshiaki Yamano, Junichi Ono, Takaaki Ito
  • Patent number: 10854356
    Abstract: A fire resistant cable comprising: a conducting element (2; 21); a layer, surrounding the conducting element, made of a ceramifiable composition comprising: —a thermoplastic polymer mixture comprising: (a) a copolymer of ethylene with a C4-C12 alpha-olefin, having a density of from 0.860 to 0.910 g/cm3, a melt flow index not higher than 3 g/10 min and a melting point of 105° C. at most; (b) an ethylene homopolymer or copolymer of ethylene with a C4-C12 alpha-olefin, having a density of from 0.900 to 0.985 g/cm3, a melt flow index not higher than 5 g/10 min and a melting point of at least 110° C.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: December 1, 2020
    Assignee: PRYSMIAN S.p.A.
    Inventors: Vito Scrima, Fabio Tosi, Marco Andreoletti, Carlo Castelli
  • Patent number: 10849227
    Abstract: A circuit card assembly (CCA) stack includes a first circuit card assembly (CCA) with circuit components mounted thereto, wherein the first CCA includes a power contact and a return contact for powering the first CCA. A plurality of additional CCAs in a stack with the first CCA, wherein each CCA in the plurality of additional CCAs includes respective power and return contacts, and wherein each CCA in the plurality of additional CCAs includes a first aperture and a second aperture for passage of power buses. The first power bus can include one or more power wires bonded to power contacts of the CCAs, and one or more return wires bonded to return contacts of the CCAs.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: November 24, 2020
    Assignee: Simmonds Precision Products, Inc.
    Inventors: Neal R. Whatcott, Jason Graham
  • Patent number: 10847307
    Abstract: An inductor component includes an element body, a coil provided in the element body, and an outer electrode provided at the element body and electrically connected to the coil. The element body includes a bottom surface that faces the mounting substrate when the element body is mounted, the outer electrode includes an underlying layer and a coating film that covers the underlying layer. At the bottom surface of the element body, the underlying layer is embedded in the element body and does not protrude from the element body, and at least part of the coating film is embedded in the element body.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: November 24, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shinya Tajima, Yasunari Nakashima, Yuta Shimoda
  • Patent number: 10840616
    Abstract: According to a first aspect of the present invention, there is provided a method of forming a superconducting joint between ReBCO tapes. Two or more ReBCO tapes are provided, each having an exposed ReBCO region. A bridge is provided, comprising an exposed ReBCO layer and an oxygen-permeable backing on the exposed ReBCO layer. Each exposed ReBCO region is bonded to the exposed ReBCO layer of the bridge by heating to a first temperature (T1) in an environment where the partial pressure of oxygen is sufficiently low that the melting point of the ReBCO (TR) is less than the melting point of silver (TAg), the temperature (T1) being between the melting point of the ReBCO (TR) and the melting point of silver (TAg), (TR<T1<TAg). The resulting joint is annealed at a second temperature (T2) which is less than the melting point of ReBCO (TR) (T2<TR), for a time (t), in an environment where the partial pressure of oxygen is sufficient to reoxygenate the ReBCO at the second temperature (T2).
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: November 17, 2020
    Assignee: Tokamak Energy Ltd.
    Inventor: Greg Brittles
  • Patent number: 10836332
    Abstract: A connection structure connecting a conduit 12 to a protector 30, the conduit 12 having a wire 11 inserted therein and being configured to move in accordance with sliding of a sliding object, and the protector 30 being attached to an end portion of the conduit 12 and being configured to move with the conduit 12, wherein, the protector 30 includes: a latch portion 39 that is joined to the conduit 12 in a latched state; and a sliding portion 15 that can slide in the direction in which the conduit 12 extends, opposes the conduit 12 in a normal position, and restricts release of the latched state of the latch portion 39.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: November 17, 2020
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Satoshi Yamamoto, Kazuyoshi Ohara
  • Patent number: 10839984
    Abstract: Armoured cable (10) comprising: —a plurality of cores (12) stranded together according to a core stranding direction; —an armour (16) surrounding the plurality of cores (12) and comprising a layer of metal wires (16a) helically wound around the cores (12) according to an armour winding direction; wherein the at least one of core stranding direction (21) and the armour winding direction (22) is recurrently reversed along the cable length L so that the armoured cable (10) comprises unilay sections (102) along the cable length where the core stranding direction (21) and the armour winding direction (22) are the same. The invention also relates to a method for improving the performances of the armoured cable (10) and to a method for manufacturing the armoured cable (10).
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: November 17, 2020
    Assignee: PRYSMIAN S.p.A.
    Inventors: Paolo Maioli, Massimo Bechis
  • Patent number: 10839978
    Abstract: An electric cable for high-voltage applications is disclosed which comprises a core surrounded by an electrically insulating layer made of a composition based on a thermoplastic polymeric material charged with boron nitride powder in an amount up to 20 wt % with respect to the weight of the insulating composition, the boron nitride powder having a particle size distribution D50 up 0 to 15 ?m. Such a cable has improved thermal conductivity property as well as good dielectric resistance and workability in particular through extrusion processes.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: November 17, 2020
    Assignee: Prysmian S.p.A.
    Inventors: Romain Besson, Luigi Caimi, Alberto Bareggi, Armando Michele Ferrari, Ivan Troia
  • Patent number: 10839982
    Abstract: A twinaxial parallel cable includes two conductors arranged parallel to each other, an insulating layer formed around the two conductors by extrusion coating, a shield tape wound around the insulating layer while extending longitudinally, a drain wire arranged inside the shield tape, and an outer coating formed to cover the shield tape. A cross section of the insulating layer perpendicular to a longitudinal direction of the twinaxial parallel cable is formed into an oval shape having a long axis that is 1.7 to 2.2 times a length of a short axis. The insulating layer has a groove in a portion including an intersection of an outline of the insulating layer and a perpendicular bisector of the long axis. The groove is formed to be more than 0.5 times to 0.9 times an outer diameter or a thickness of the drain wire. The drain wire is retained in the groove so that a part of the drain wire protrudes toward the shield tape beyond the insulating layer.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: November 17, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Yuto Kobayashi
  • Patent number: 10834816
    Abstract: A printed circuit board structure and a wiring method therefor are disclosed. The printed circuit board structure comprises a first wiring channel formed inside the printed circuit board for transmitting a circuit signal; a pin, connected to the first wiring channel for connecting a chip to the printed circuit board; the pin comprising an unused pin and a used pin, the used pin comprising a peripheral pin and an internal pin; wherein the printed circuit board further comprises a second wiring channel, the second wiring channel leads out the internal pin by means of covering at least a portion of the unused pin. By means of using a printed circuit board structure and a wiring method to configure pins of the printed circuit board, the number of printed circuit board layers is reduced, and the current carrying capacity is enhanced.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: November 10, 2020
    Assignee: CANAAN CREATIVE CO., LTD.
    Inventors: Xuguang Liu, Nangeng Zhang
  • Patent number: 10833495
    Abstract: The invention relates to a monolithic electrical connection harness (1) having an adapted rigidity traveling along a determined path, including a flexible insulating casing (2a to 2c) inserting shielded electrical connection cables (C1 to C3) to constitute a bundle (F1 to F3), devices (S1 to S3) for holding the ends (Z1 to Z3) of the flexible casing (2a to 2c) on rear connections (R1 to R3) integrating the end zones (E1 to E3) of the cables (C1 to C3) In this harness (1), a reinforcing sheath (6) surrounds the cable bundle (F1 to F3) and is made up of one or more layers (61 to 63) of composite material made from a flexible matrix in polymer material in which a ply of fibers for reinforcing in robustness and/or stiffness is draped along the cable bundle (F1 to F3), the reinforcing fibers being assembled in each ply in a shape chosen from between a unidirectional web, a multidirectional web and a fabric of wires formed from braided fibers.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: November 10, 2020
    Assignee: LateLEC
    Inventors: Christophe Perrier, Alexandre Simon
  • Patent number: 10833494
    Abstract: Certain examples relate to an apparatus, method and system for electrical interconnection. Certain examples provide an apparatus comprising: an outer longitudinally extending member comprising a longitudinally extending perimeter region defining an inner longitudinally extending cavity; and at least a first longitudinally extending conductor and a separate second longitudinally extending conductor; wherein the at least first and second longitudinally extending conductors are embedded within the longitudinally extending perimeter region and extend along the length thereof.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: November 10, 2020
    Assignee: NOKIA SHANGHAI BELL CO., LTD.
    Inventors: Markus Pabst, Bernhard Wendorff, Jan Gwinner, Ahmed Malti
  • Patent number: 10825578
    Abstract: Example embodiments provide a device that includes a main cable jacket including one or more sub-cable jackets, and each of the sub-cable jackets includes a number of conduits.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: November 3, 2020
    Assignee: Biamp Systems, LLC
    Inventors: Charles D. Gollnick, Joshua Beltran, Rashid Skaf, Joseph E. Andrulis, Aaron Cohen, Kenneth Cornelison, Shirley Briggs, Gregory Saunders
  • Patent number: 10827602
    Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: November 3, 2020
    Assignee: ABB Power Electronics Inc.
    Inventors: Robert Joseph Roessler, Anjana Shyamsundar
  • Patent number: 10827615
    Abstract: A printed circuit board includes a substrate having a first surface and a second surface, opposite to the first surface, and having a through-portion penetrating between the first surface and the second surface; and a through-via disposed in at least a portion of the through-portion, wherein the through-via includes a first metal layer having a first groove portion facing an interior of the through-portion from the first surface of the substrate and a second groove portion facing the interior of the through-portion from the second surface of the substrate, and the first metal layer has a first region, and a second region, having different average grain sizes.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: November 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Chan Choi, Young Kwon Jeong, Min Soo Kim, Seong Jae Mun
  • Patent number: 10820411
    Abstract: A manufacturing method for a circuit board and a circuit board are provided. The method includes steps: providing a substrate having a first metal layer; forming a patterned first opening on the first metal layer to expose the substrate; forming a patterned first dielectric layer on the substrate, the first dielectric layer is made of a photosensitive dielectric material and covers the first opening; photosensitizing the first dielectric layer to cure the first dielectric layer; forming a patterned second metal layer on the first metal layer; forming a patterned third metal layer on the second metal layer, and the third metal layer being adjacent to the first dielectric layer; removing a portion of the first metal layer not covered by the second metal layer; and forming a second dielectric layer on the substrate. A thickness of the third metal layer is greater than a thickness of the second metal layer.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: October 27, 2020
    Assignee: Unimicron Technology Corporation
    Inventors: Shih-Lian Cheng, Zhe-Yong Lin, Li-Jie Liu, Ching Sheng Chen
  • Patent number: 10820447
    Abstract: A liquid immersion cooling system can include a tank having an upward facing opening at a top portion of the tank. A mounting mechanism fixes one or more electronic components to an interior of the tank. A bus bar assembly is located at the top portion of the tank, the bus bar assembly having a shield that covers one or more bus bars of the bus bar assembly from above. Power terminals of each of the one or more electronic components engage with the one or more bus bars of the bus bar assembly from below.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: October 27, 2020
    Assignee: BAIDU USA LLC
    Inventors: Harold Miyamura, Tianyi Gao
  • Patent number: 10811857
    Abstract: A bracket that manages cables on a ladder rack. The bracket includes a rung insertion area and an upper member. The rung insertion area is defined by a bottom, sidewalls extending from the bottom, and gussets extending from the bottom and positioned between the sidewalls. Each sidewall includes a top and two curved arms and each gusset includes a top and two sides. Slots are formed between each curved arm of the sidewalls and each side of the gusset. A ladder rung is inserted in the slots of the bracket to secure the ladder rung to the bracket.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: October 20, 2020
    Assignee: Panduit Corp.
    Inventor: Rodney G. Rouleau