Abstract: Inspection robots with swappable drive modules are described. An example inspect robot may include a first removeable interface plate on the side of a robot chassis. The first removable interface plate may couple a first drive module to an electronic board, within the chassis, where the electronic board includes a drive module interface circuit communicatively coupled to the first drive module. The example inspect robot may also include a second removeable interface plate on a side of a robot chassis. The second removable interface plate may couple a second drive module to an electronic board, within the chassis, where the electronic board includes a drive module interface circuit communicatively coupled to the second drive module.

Abstract: A chassis with built-in handles which do not add to dimensional clearance required for the chassis to be placed in a cavity includes a side plate, a mounting unit, and a handle. A mounting groove is defined on the side plate. The mounting unit is coupled to the side plate. The handle is partially clamped by the side plate and the mounting unit, and rotatably coupled with the side plate. By rotating the handle, the handle can be stored at least flush in the mounting groove.

Abstract: A packaging assembly and methodology provide a PCB substrate with one or more waveguide apertures and a conductive pattern which includes a plurality of landing pads that are disposed around peripheral edges of each waveguide aperture and that are connected to one another by trace lines so that, upon attachment and reflow of solder balls to the plurality of landing pads, the solder balls reflow along the trace lines to form a fully closed solder waveguide shielding wall disposed around peripheral edges of the first waveguide aperture.

Abstract: A substrate support includes a substrate support portion having an electrostatic chuck for adsorbing a substrate and a substrate heater electrode inside the electrostatic chuck; a ring support supporting an edge ring and having an edge ring heater electrode inside; a base having a central stage on which the substrate support portion is disposed, and an outer peripheral stage on which the ring support is disposed; a first power feeding terminal disposed immediately below the substrate support portion to supply a power to the substrate heater electrode; and a second power feeding terminal disposed immediately below the ring support to supply the power to the edge ring heater electrode. An upper surface of the outer peripheral stage is positioned lower than that of the central stage, and a thickness of the ring support is equal to or larger than 40% of a thickness of the substrate support portion.

Abstract: An apparatus and method are provided for repelling insects. An electrostatic field is provided about a user by: connecting the user directly to a source of high voltage and low current; or providing a conductive garment about the user and connecting the conductive garment to a source of high voltage and low current. At a sufficiently high voltage, the electrostatic field become effective at repelling insects from the user.

Abstract: A printed circuit board (PCB) includes an array of signal pads on a first surface of the PCB, a power contact pad on the first surface, and a ground contact pad on a second surface of the PCB. Each signal pad of the array of signal pads is associated with a signal contact of a central processing unit (CPU). The power contact pad provides power for the CPU apart from the array of signal pads. The ground contact pad provides a ground for the CPU apart from the array of signal pads.

Abstract: A display includes a plurality of first wirings which are provided on a first layer and each of which is arranged parallel to a first direction in a first area, and which are arranged on a second layer in a second area; a second wiring which is provided in the first layer in the first area and which is provided on a layer in the second area; and a third wiring which is provided on the first layer and arranged between the first wirings in the first area and which is arranged to intersect with first wirings in the second area. The first wirings is arranged to be inclined to the same side in the first direction in the second area. The second wiring is arranged to intersect with a portion of the plurality of first wirings in a plan view, in the second area.

Abstract: An electric wire connection structure is composed of insulated electric wires each including a core and an insulation coating covering the core. The cores of the insulated electric wires are connected to pads provided on a substrate. The insulated electric wires are arranged along a predetermined alignment direction and arranged parallel to each other. The insulation coating is removed at a part in a longitudinal direction of each of the insulated electric wires to expose the core. Exposed portions of the cores are connected to the pads, respectively. Some of the insulated electric wires are configured in such a manner that the core is exposed in an area where the insulation coatings of adjacent ones of the other insulated electric wires in the alignment direction are not removed.

Abstract: A circuit board includes a first insulating layer; a first wiring pattern and a second wiring pattern each formed to be side to side with each other on an upper surface of the first insulating layer; a second insulating layer formed on the upper surface of the first insulating layer to cover the first and second wiring patterns; a third wiring pattern formed on an upper surface of the second insulating layer to overlap the first wiring pattern in a vertical direction; a fourth wiring pattern formed on the upper surface of the second insulating layer to overlap the second wiring pattern in the vertical direction; a first via passing through the second insulating layer and connecting the first and fourth wiring patterns; and a second via passing through the second insulating layer and connecting the second and third wiring patterns.

Abstract: A storage compartment is provided. The device includes a housing unit with a door. The housing unit is designed to be concealed within a wall. The housing unit is secured to the wall by a plurality of fasteners. The door is pivotally connected to the housing unit via a plurality of hinges. The door provides access to an interior volume of the housing unit. The door includes more than one spring-loaded latch that secures the door to the housing unit. A plurality of electrical outlets is disposed on the interior walls of the housing unit. A recessed area of the housing unit provides a storage area for electrical cords, surge protectors, and other items. The door includes an aperture that allows for electrical cords within the storage area to be accessed when the door is closed.

Abstract: A composite capacitor that includes a first capacitor and a second capacitor. Each of plural first columnar conductors and each of plural second columnar conductors have a nano-size outer diameter. The composite capacitor includes a connecting conductor layer and a reinforcement conductor. The reinforcement conductor is located between a first counter electrode layer and a second counter electrode layer of the first capacitor and the second capacitor, respectively, and is connected to each of the first counter electrode layer, the second counter electrode layer, and the connecting conductor layer. The material forming the reinforcement conductor is the same as each of the first counter electrode layer and the second counter electrode layer and is different from the material forming the connecting conductor layer.

Abstract: A display device includes a display panel including one surface, on which an image is displayed, and an opposing surface opposite to the one surface; a support plate disposed on the opposing surface of the display panel and including one surface facing the display panel, an opposing surface opposite to the one surface thereof, where a plurality of openings is defined through the support plate from the one surface to the opposing surface thereof in a thickness direction such that the support plate further includes inclined inner peripheral surfaces defining the plurality of openings; and a coating layer disposed to surround the one surface of the support plate, the opposing surface of the support plate, and the inner peripheral surfaces of the support plate defining the plurality of openings.

Abstract: An electronic device is provided. The electronic device includes an outer housing that comprises a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding a space between the first surface and the second surface, a display adapted to expose at least a portion of the display through the first surface of the outer housing, a PCB arranged between the second surface and the display in an interior of the outer housing, a communication circuit arranged on or over the PCB, a first conductive structure formed of at least one of the first surface or at least a portion of the side surface is electrically connected to the communication circuit, and a second conductive structure formed of the portion of the display electrically connected to the first conductive structure.

Abstract: A heat dissipating mechanism is used to dissipate heat generated by a heat generation component of an electronic device. The heat generation component is disposed on a circuit board. The heat dissipating mechanism includes a rotation component and a heat dissipation component. The rotation component is disposed on the circuit board. The heat dissipation component is rotatably disposed on the rotation component. The heat dissipation component includes a contacting surface and a fin body. The contacting surface is a bottom surface of the fin body and configured to contact against the heat generation component.

Abstract: A big data cloud computing all-in-one machine apparatus, including an all-in-one machine main body, an integrated display screen and a back box support column is provided. A middle part of a top end of the all-in-one machine main body is fixedly connected with the integrated display screen, and a front surface of the integrated display screen is fixedly connected with the back box support column. Two sides of the top end of the all-in-one machine main body are fixedly connected with the top heat dissipation openings; the bottom end of the embedded support seat is fixedly connected with the base antiskid grounding mat; one end of the embedded support seat is fixedly connected with the embedded storage tab. The embedded support seat well improves the convenience of the device; the top heat dissipation openings well reflect the heat dissipation effectiveness of the device.

Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber (R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.

Abstract: A leakage of electromagnetic waves is suppressed effectively on the periphery of a heat radiating device. A heat radiating device (80) includes a plurality of fins (81) that are arranged on the inside of an opening (52a), a heat pipe (83) that includes a connecting portion (83a) being located between the plurality of fins (81) and a circuit board (50) and extending in a left-right direction along the circuit board (50), and a base plate (82) that supports the plurality of fins (81). The base plate (82) includes a plate left portion (82c). The plate left portion (82c) covers a lower surface of the heat pipe (83), the lower surface facing a side of a board shield (52), and closes a gap (G1) between a left end of the plurality of fins (81) and a left edge of the opening (52a) of the board shield (52).

Abstract: An information handling system with a cooling system may include a processor; a memory; a power management unit (PMU); a cooling system including: a fan; and a cooling system heat pipe; a detachable thermal module including: a first heat conductive element to be operatively coupled to a heat producing components such as a processor, a radio module, or other component; a second heat conductive element to be operatively coupled to the cooling system heat pipe of the cooling system; and a detachable thermal module heat pipe formed between the first heat conductive element and the second heat conductive element.

Abstract: Systems and methods for providing an electronics module including a raceway for mounting submodules and establishing electrical communication with said submodules. The raceway comprises a base structure and a conductive trace formed by a conductive plating process. Connection pads on the raceway are configured to receive connection nodes of the submodules for providing a continuous electrical connection between the raceway and the submodules for electrical communication and power transmission.

Abstract: A circuit board includes a conductive metal layer, at least one insulating layer, at least one thermally conductive insulating layer and a heat dissipation element. The conductive metal layer is mainly used to transmit electronic signals. The insulating layer is connected to the conductive metal layer. The thermally conductive insulating layer is sandwiched between the conductive metal layer and the insulating layer, and thermally contacts the conductive metal layer, and is used for thermally conducting the heat of the conductive metal layer. The heat dissipation element is in thermal contact with the thermally conductive insulating layer, and is used to conduct the heat of the thermally conductive insulating layer to the outside through a heat dissipation channel.