Patents Examined by Sherman Ng
  • Patent number: 11912863
    Abstract: A thermoplastic composition including a) 20 to 90 wt. % of a thermoplastic resin, b) 0.1 to 80 wt. % of a laser direct structuring additive and c) 10 to 80 wt. % of ceramic filler particles which do not have a laser direct structuring additive function, wherein at least 80 wt. % of c) is TiO2, wherein the composition has a loss tangent measured at 40 GHz of at most 0.014, wherein the total amount of a), b) and c) is 95 to 100 wt. % with respect to the total composition, wherein the composition further includes f) one or more additives, wherein the total amount of the additives is 0.1 to 5 wt. %, 0.3 to 5 wt. % or 0.3 to 3 wt. % relative to the total weight of the composition.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: February 27, 2024
    Assignee: MEP EUROPE B.V.
    Inventor: Bernardus Antonius Gerardus Schrauwen
  • Patent number: 11917760
    Abstract: A display panel according to one embodiment comprises: a display substrate that includes a display area and a pad area disposed around the display area, at least one pad terminal disposed on the substrate of the pad area, and an open portion which is at least partially and planarly surrounded by the pad terminal.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: February 27, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventor: Byoung Yong Kim
  • Patent number: 11917774
    Abstract: A quickly-fixable electronic device includes a fixing portion, a first base portion, and a second base portion. The fixing portion is provided with an electronic device. The first base portion is pivotally connectable with the fixing portion. The first base portion is provided with a receptacle. The receptacle receives and connects with the fixing portion. The second base portion is pivotally connected with the first base portion. The second base portion is provided with a magnetic attraction piece. The magnetic attraction piece enables quick fixing of the electronic device to a display screen. A pivoting motion between the fixing portion and the first base portion enables rotation of the electronic device by an angle. A pivoting motion between the first base portion and the second base portion enables inclining and swinging of the electronic device.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: February 27, 2024
    Assignee: OXTI CORPORATION
    Inventor: Chih-Feng Ho
  • Patent number: 11908725
    Abstract: The present invention relates to an electrostatic chuck heater having a bipolar structure, the electrostatic chuck heater comprising: a heater body having an internal electrode and an external electrode for selectively performing any one of an RF grounding function and an electrostatic chuck function according to a semiconductor process mode; and a heater support mounted below the heater body so as to support the heater body.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: February 20, 2024
    Assignee: MICO CERAMICS LTD.
    Inventors: Jin Young Choi, Jun Won Seo, Ju Sung Lee
  • Patent number: 11899498
    Abstract: A flexible printed circuit includes an insulating base. The insulating base includes a body portion and at least one first extension portion connected to an edge of the body portion. The first extension portion includes a via region, a bending region and a banding region that are sequentially away from the body portion. A plurality of vias are disposed in the via region. The plurality of vias include at least one first via and at least one second via, a center of an orthogonal projection of a first via on a reference plane perpendicular to a thickness direction of the insulating base is located on a first straight line parallel to a bending axis of the bending region, and a center of an orthogonal projection of a second via on the reference plane is not located on the first straight line.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: February 13, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Meizhu Zheng, Yuanyuan Li
  • Patent number: 11903146
    Abstract: A printed wiring board is provided with: a core substrate corresponding to a stack area in which an interlayer connection conductor constituting an inner via is continuous; and a build-up layer comprising a resin layer stacked on the core substrate and a conductor layer on said resin layer. A via inner space inside the interlayer connection conductor constituting the inner via is hollow, and said via inner space communicates to the outside via a hole section provided in the build-up layer.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: February 13, 2024
    Assignee: Kyocera Corporation
    Inventors: Tomoya Nagase, Takashi Ishioka
  • Patent number: 11897024
    Abstract: The present disclosure relates to a structure for electrically-connecting an external conductor. The structure comprises a wiring-substrate comprising a stack based arrangement of a plurality of layers, wherein said layers are defined as electrically conducting layers and insulating layer. A rivet is supported from the wiring substrate and comprises an embedded portion within the wiring substrate. The embedded portion comprises: an upper section extending through the stack of the plurality of layers, and, a bottom section extending laterally with reference to the upper section. A portion protruding from wiring substrate is provided for receiving an external-conductor and for thereby electrically connecting with the wiring substrate.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: February 13, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Max Richter, Olaf Bartz
  • Patent number: 11901102
    Abstract: A coil component includes: a magnetic base body formed by metal magnetic grains containing Fe, Si, and Cr, whose intensity ratio (IM/IH) of the strongest line intensity (IM) in a range of wavenumbers 650 to 750 cm?1, to the strongest line intensity (IH) in a range of wavenumbers 400 to 450 cm?1, in a Raman spectrum measured at the center part is 2 or higher, and which also has a part on the surface side of the center part where the intensity ratio (IM/IH) in a Raman spectrum is under 2; and a conductor placed inside or on the surface of the magnetic base body. The magnetic base body is constituted by a powder magnetic core made to have excellent electrical insulating property and high magnetic permeability.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: February 13, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Atsushi Tanada
  • Patent number: 11901097
    Abstract: A round superconductor wire and method for fabricating same are disclosed. Embodiments are directed to a round superconductor wire including at least two superconductor tapes wound on a wire former. Each superconductor tape includes: bottom stabilizer and silver layers; substrate disposed above the bottom silver layer; buffer film stack disposed above the substrate; superconductor film disposed above the buffer film stack; top silver layer disposed above the superconductor film; and top stabilizer layer disposed above the top silver layer. At least one of the bottom stabilizer layer, bottom silver layer, substrate, buffer film stack, superconductor film, top silver layer, or top stabilizer layer is of a different width, thickness, or material composition in one of the superconductor tapes than in another of the superconductor tapes. These and other embodiments achieve a round superconductor wire having improved current density in high magnetic field applications when made in small diameters.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: February 13, 2024
    Assignees: University of Houston System, AMPEERS LLC
    Inventors: Goran Majkic, Anis Ben Yahia, Wenbo Luo, Venkat Selvamanickam, Soumen Kar
  • Patent number: 11895775
    Abstract: A hybrid double-sided power switch module comprises a double PCB assembly with switch dies and conductive spacers disposed at both sides of the double PCB assembly in different topologies. The gate connections of the switch dies are enhanced by spring pins soldered in the THVs formed through the PCBs in alignment with the gate terminals. MFCs are positioned at both sides of the double PCBs assembly in contact with the tops of the switch dies and conductive spacers with fuzz buttons serving as contacts between the MFCs and the switch dies and spacers. MFCs serve different functions including AC bus-bars, DC bus-bars, heat-sinks, and their combination. The module can withstand external stress and is fabricated by a simplified and inexpensive process requiring only two solder pastes.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: February 6, 2024
    Assignee: University of Maryland, College Park
    Inventors: Yongwan Park, Shiladri Chakraborty, Alireza Khaligh
  • Patent number: 11895813
    Abstract: The present application provides a display device comprising: a display panel including a display region and a non-display region, wherein the non-display region includes first and second fan-out regions and a bending region; an optical functional film layer formed in the display region and the first fan-out region; an adhesive layer formed on the optical functional film layer; and a protective layer located in the bending region and with a gap with the optical functional film layer, and an end of the adhesive layer extends beyond the optical functional film layer and is connected to the protective layer, and the adhesive layer covers the optical functional film layer, the gap, and part of the protective layer.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: February 6, 2024
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Kuihua You, Jialiang Tang
  • Patent number: 11881658
    Abstract: A wire harness that includes an electric wire including a core wire and an insulation coating that covers an outer circumference of the core wire; an electromagnetic shield that surrounds an outer circumference of the insulation coating; a connection terminal that is electrically connected to an end of the core wire; a connector housing that holds the connection terminal and is made of a synthetic resin; a shielding pipe that extends from an inside to an outside of the connector housing in a protruding manner; and a fixing member that fixes an end of the electromagnetic shield to an outer circumferential surface of a portion of the shielding pipe that is disposed outside the connector housing in an electrically connected state.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: January 23, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Masahiro Hagi, Hirotaka Baba, Takeshi Shimizu
  • Patent number: 11882654
    Abstract: Disclosed is a wiring board, including: an insulating substrate containing aluminum oxide; and a metallized layer that includes a metal phase containing a metal material and a first glass phase containing a glass component and that is disposed on the insulating substrate. At least one of the insulating substrate and the metallized layer further contains mullite. In the metallized layer, the metal phase continues in a three-dimensional network shape, and the first glass phase is embedded between the metal phase.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: January 23, 2024
    Assignee: KYOCERA CORPORATION
    Inventor: Makoto Yamamoto
  • Patent number: 11881689
    Abstract: A method for installing an offshore installation is provided, the method including: a) providing a pipe for connecting the offshore installation with another offshore installation or an onshore installation; b) arranging an electrical cable inside the pipe; c) determining a level at or above the seabed, wherein the pipe includes a first portion arranged below the determined level and a second portion arranged above the determined level, and wherein the electrical cable is arranged inside the pipe so as to form a gap with an inner wall of the pipe along the first and second portion; d) determining an amount of cooling liquid such that, when the cooling liquid has a first temperature, the cooling liquid fills the gap along the first portion of the pipe, wherein the second portion of the pipe is free of the cooling liquid, and when the cooling liquid cools the electrical cable.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: January 23, 2024
    Assignee: SIEMENS GAMESA RENEWABLE ENERGY A/S
    Inventor: Johnny Soerensen
  • Patent number: 11882653
    Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: January 23, 2024
    Assignee: Liquid Wire Inc.
    Inventors: Mark William Ronay, Jorge E. Carbo, Jr., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
  • Patent number: 11882665
    Abstract: This application relates to the field of electronic technologies, and provides a printed circuit board and a manufacturing method thereof, and an electronic device. The printed circuit board has target holes that penetrate through the printed circuit board, and an area that is not provided with the target holes has blocking structures (B) for blocking liquid flow, where the area is on at least one side that is of the printed circuit board and that is connected to the target holes.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: January 23, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Zhengbao Sun, Xu Zhang, Bin Wang, Hai Hao, Lijun Peng
  • Patent number: 11877393
    Abstract: A stretchable circuit board according to an embodiment comprises: a substrate including one surface and the other surface opposite to the one surface; an electronic component disposed on the one surface of the substrate; and a wiring electrode disposed on the one surface of the substrate and connecting the electronic component, wherein the substrate includes an effective area, in which the electronic component is formed, and an ineffective area other than the effective area and includes a pattern part which is formed in the ineffective area and extends through the substrate from one surface to the other surface thereof.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Duck Hoon Park, Woo Young Chang, Jee Heum Paik
  • Patent number: 11875911
    Abstract: A communications cable is provided that includes a pair of twisted pair of wires, each coated with a fluoropolymer insulator. The twisted pair of wires is configured to carry a differential signal, such as a differential data signal and/or a differential power signal. The fluoropolymers are highly effective insulators and significantly reduce both the effects of internal and external electromagnetic interference while maintaining low cable attenuation, even when operating within a temperature range of ?40° C. to 150° C.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: January 16, 2024
    Assignees: DAIKIN AMERICA, INC., DAIKIN INDUSTRIES, LTD.
    Inventor: Daniel J. Kennefick
  • Patent number: 11876004
    Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Oh Cho, Yoon Tai Kim
  • Patent number: 11871518
    Abstract: A backlight module and a display device is disclosed. The backlight module includes a backplate, a light board framework, and assembled light board arranged in sequence. The assembled light board include multiple light boards with a seam formed between adjacent light boards. The light board framework is arranged on the backplate and includes a main body defining multiple mounting grooves provided in a number equal to the number of the light boards in the assembled light board. Each of the light boards is installed in one of the mounting grooves. A supplementary light-emitting diode (LED) is disposed between adjacent mounting grooves to supplement light for the seam between every two adjacent ones of the light boards.
    Type: Grant
    Filed: June 19, 2023
    Date of Patent: January 9, 2024
    Assignee: HKC CORPORATION LIMITED
    Inventors: Jiang He, Haijiang Yuan