Patents Examined by Sherman Ng
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Patent number: 12232277Abstract: A display device according to one or more embodiments comprises a flexible display panel, a connection film at least partially overlapping the display panel, and electrically connected to the display panel, source boards at least partially overlapping the connection film, and electrically connected to the connection film, and a flexible printed circuit portion electrically connecting the source boards, and wound or folded on the source boards.Type: GrantFiled: January 17, 2023Date of Patent: February 18, 2025Assignee: Samsung Display Co., Ltd.Inventors: Jae Ill Kim, Ji Hyun Kim, Byoung Haw Park, Jong Jae Lee, Jun Pyo Lee
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Patent number: 12224111Abstract: The composite electronic component includes: a substrate having a GND pattern; a coil component having at least three terminals and mounted on a first surface of the substrate; and an overlapping arrangement component mounted on the first surface so that at least a part of the overlapping arrangement component overlaps the coil component when viewed from a first direction perpendicular to the first surface. The substrate has at least three coil connection patterns formed on the first surface and connected to the terminals, at least two component connection patterns formed on the first surface and connected to the overlapping arrangement component, and a GND via connecting one of the component connection patterns and the GND pattern to each other. The GND via is arranged in a substrate outer region, which is outside a region of a hypothetical polygon connecting all of the coil connection patterns on the substrate with a shortest perimeter, when viewed from the first direction.Type: GrantFiled: March 21, 2023Date of Patent: February 11, 2025Assignee: TDK CORPORATIONInventors: Takashi Ito, Tasuku Kawagoe, Keigo Higashida
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Patent number: 12224226Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.Type: GrantFiled: August 29, 2022Date of Patent: February 11, 2025Assignee: InnoLux CorporationInventors: Chin-Lung Ting, Chung-Kuang Wei, Cheng-Chi Wang, Yeong-E Chen, Yi-Hung Lin
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Patent number: 12225791Abstract: Provided in the present disclosure are a display module and a vehicle display apparatus. The display module includes: a display panel, at least one flexible circuit board and at least one printed circuit board. The display panel includes a plurality of connection pads located in a bonding area. The flexible circuit board includes a first body, a plurality of output pads and a plurality of input pads, the first body includes a bendable portion and a flat portion which are connected, the bendable portion includes a protruding portion protruding relative to the flat portion. The printed circuit board includes a second body and a plurality of bonding pads, the second body includes a strip-shaped main body portion and at least one branching portion connected with a long side of the strip-shaped main body portion.Type: GrantFiled: March 29, 2022Date of Patent: February 11, 2025Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Jiaxiang Wang, Binfeng Feng, Fei Li, Qi Huang, Shangnan Jin, Yumin Li, Zhihong Cui
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Patent number: 12224569Abstract: A combined flashing and electrical junction box system includes an enclosure subsystem and an expanse subsystem. Preferably, the enclosure 5 subsystem and said expanse subsystem are both fireproof and waterproof. A method for installing lighting on a building having subsiding using a combination system and an accessory block.Type: GrantFiled: December 13, 2021Date of Patent: February 11, 2025Inventor: Michael S. Wiese
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Patent number: 12219725Abstract: A display device may include a display panel which is flexible and includes a first surface on which an image is displayed and a second surface on which the image is not displayed, a connection film at least partially overlapping a side of the display panel in a plan view, a printed circuit board at least partially overlapping a side of the connection film in a plan view and electrically connected to the connection film, a control board spaced apart from the printed circuit board, and a cable electrically connecting the printed circuit board and the control board. The cable may have a spiral shape.Type: GrantFiled: January 10, 2023Date of Patent: February 4, 2025Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Woo Guen Jang, Won Tae Kim, Soo Hyun Moon, Jun Seok Min, Hae Ju Yun
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Patent number: 12219744Abstract: In order to prevent a short-circuit failure between a conductive connecting portion (1) that is provided as a countermeasure against external electrical noises and an electronic circuit, a structure is adopted where a large number of electronic components (8) are mounted on a circuit board (5) that is mounted on a base (7), a metal cover (6) is disposed so as to cover upper portions of the electronic components (8), opening portions (3) are formed in the circuit board (5) at four positions on a periphery of the circuit board (5), protruding members (12) that are integrally formed with the base (7) are disposed at four positions respectively in alignment with the positions where the opening portions (3) are formed, the protruding members (12) are made to pass through the opening portions (3) at four positions from a back surface side of the circuit board (5) to protrude to a front surface side of the circuit board 5, the conductive connecting portions (1) are arranged in an outside direction with respect to thType: GrantFiled: May 31, 2021Date of Patent: February 4, 2025Assignee: Hitachi Astemo, Ltd.Inventors: Yusuke Takahashi, Yoshio Kawai
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Patent number: 12219713Abstract: Disclosed is a PCB arrangement and wiring structure of LED lamp beads, including a carrier board, and a VDD pin, a DIN pin, and a VSS pin are further arranged in the LED lamp bead installation area; similar pins are connected and wired in parallel with each other, and all the VSS pins are connected and wired in parallel with each other, so that the voltage between each set of lamp beads remains consistent; all the DIN pins are connected and wired in parallel with each other; and the carrier board is further provided with at least one set of VDD power input pin terminals, VSS power input pin terminals, and DIN control terminals, a plurality of the VDD pins are electrically connected to the VDD power input pin terminal, and a plurality of the VSS pins are electrically connected to the VDD power input pin terminal.Type: GrantFiled: July 5, 2024Date of Patent: February 4, 2025Assignee: Shenzhen HSG Electronics Co., LTDInventors: Wei Shen, Bo Guan, Zongze Ye
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Patent number: 12211649Abstract: A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and respectively disposed on first and second surfaces of the body, the first and second surfaces opposing each other. The body further includes a first via electrode, connecting the at least one first internal electrode and the first external electrode to each other in the first direction, and a second via electrode connecting the at least one second internal electrode and the second external electrode to each other in the first direction.Type: GrantFiled: June 28, 2022Date of Patent: January 28, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Min Cheol Park, Sang Jong Lee, Hyung Joon Kim, Hyun Sang Kwak, Chi Hyeon Jeong, Seong Hwan Lee
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Patent number: 12213241Abstract: A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.Type: GrantFiled: January 23, 2023Date of Patent: January 28, 2025Assignee: Meta Platforms Technologies, LLCInventors: Qiuming Li, Colden Niles Eldridge, Ming Lei, Yibo Liu, Md Rashidul Islam, Sung Hoon Oh
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Patent number: 12212107Abstract: A flat plate connector including a glass substrate, a conductive silver printing, an adhesion material for electrical connection, an insulated film, a conductive metal strip, and an additional adhesion tape. The flat connector having a dedicated cut-out, where the flat connector before mechanical and electrical bounding with the adhesion material can be fixed with a tape which, depending on its type, can also enhance pull-off resistance and ageing tests. The area is then defined as the surface where the connector adheres to the glass, including the different adhesion materials. The dedicated cut is made in the flat connector to generate a symmetric tensile stress on this adhesion area when the connector is submitted to a pull-off tensile force, the symmetry axis being defined by this pull force axis.Type: GrantFiled: May 28, 2021Date of Patent: January 28, 2025Assignee: AGC GLASS EUROPEInventor: Laurent Goutiere
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Patent number: 12213250Abstract: A host device includes surface mount conductive pads on a printed circuit board (PCB) for external peripheral communications. Conductive ink is printed on the conductive pads with a base member is printed over the conductive ink. Three-dimensional (3D) conductive wires are printed on the base member and extend along a housing to a new external port. Conductive ink is printed with a second base member and terminating ends of the wires are printed on the front of the base member establishing the new peripheral port for the host device. A peripheral device includes its own surface mount conductive pads which when aligned and brought into contact with the external port of the host device permits the host device and the peripheral device to establish a wired connection with one another without cables, without cable harnesses, and without port connectors.Type: GrantFiled: August 31, 2022Date of Patent: January 28, 2025Assignee: NCR Voyix CorporationInventors: John Paul Bacalso Aliganga, Jason Delos Angeles, Jan Angielee Alpuerto Gesite, Teofrenz Aralquez Ycot
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Patent number: 12207388Abstract: A fastening system, including: a fastener including: a hollow shaft; a threaded portion positioned on an outer surface of the hollow shaft; a first protrusion extending from an inner surface of the hollow shaft, the first protrusion including: a first angled surface; a first engagement surface; a nut corresponding to the fastener, including: a cavity having threaded portion; a projection positioned within the cavity of the nut, the projection including: a first locking feature positioned on an outer surface of the projection, the first locking feature including: a second angled surface; a first locking surface; wherein, in a first state of engagement of the fastener with the nut, the first angled surface of the first protrusion of the fastener engages with the second angled surface of the first locking feature of the projection to rotate the fastener with respect to the nut in response to downward force on the fastener.Type: GrantFiled: February 6, 2023Date of Patent: January 21, 2025Assignee: Dell Products L.P.Inventors: Tung-Yi Chen, Kang-Wei Fan, Jing-Tang Wu
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Patent number: 12202941Abstract: Provided are a film which includes at least a first resin layer containing aromatic polyester amide, and a second resin layer disposed on the first resin layer, and an elastic modulus of the second resin layer at 160° C. is less than 1.0 GPa.Type: GrantFiled: February 20, 2023Date of Patent: January 21, 2025Assignee: FUJIFILM CorporationInventors: Shohei Yamazaki, Yasuyuki Sasada
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Patent number: 12200888Abstract: A process variable transmitter includes a process variable sensor, and an electromagnetic interference (EMI) protection circuit coupled to the process variable sensor. The process variable transmitter also includes a hermetic module enclosing the EMI protection circuit, and electrical connectors coupled to the EMI protection circuit within the hermetic module. The electrical connectors are configurable from outside the hermetic module to connect electronic components of the EMI protection circuit in a configuration that provides transient protection.Type: GrantFiled: January 20, 2023Date of Patent: January 14, 2025Assignee: Rosemount Inc.Inventors: Christopher Lee Eriksen, Nicholas Aaron Wienhold, Kurt Calvin Diede
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Patent number: 12200887Abstract: An electronic device is provided. The electronic device includes a foldable housing and a flexible display. The foldable housing may provide a front surface of the electronic device and a rear surface of the electronic device. The flexible display may be located in an inner space of the foldable housing. The flexible display may be combined with a front cover of the foldable housing providing the front surface. The front cover may include a pattern in which a plurality of openings corresponding to a folding portion of the foldable housing or a plurality of recesses provided in a surface facing the flexible display are periodically provided. A plurality of sub-pixels emitting light of a same wavelength in the flexible display may be arranged in a same direction as a direction in which the plurality of openings or the plurality of recesses are periodically arranged.Type: GrantFiled: January 17, 2023Date of Patent: January 14, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Youngkyong Jo, Wooktae Kim, Taehyeong Ryu, Jungkyu Park, Youngmin Seo, Bora Lee, Sangbong Lee, Wonho Lee, Jongsu Lee
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Patent number: 12200871Abstract: A component-containing substrate includes a substrate base. The substrate base includes one or more wiring layers and one or more insulating layers and includes a cavity. The component-containing substrate further includes a pad at the bottom of the cavity and an electronic component bonded to a surface of the pad exposed in the cavity. A trench is formed in the surface of the pad, the trench continuing from the inside to the outside of the perimeter of the electronic component in a plan view.Type: GrantFiled: March 8, 2023Date of Patent: January 14, 2025Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Takao Koshi
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Patent number: 12199027Abstract: A glass core substrate includes a first glass layer; a second glass layer disposed on the first glass layer; a third glass layer disposed on the second glass layer; a first bonding layer disposed between the first glass layer and the second glass layer; a second bonding layer disposed between the second glass layer and the third glass layer; and a conductive connector, passing through the first glass layer, the first bonding layer, the second glass layer, the second bonding layer, and the third glass layer, wherein the conductive connector is configured to provide a vertical conductive path penetrating through the first glass layer, the first bonding layer, the second glass layer, the second bonding layer, and the third glass layer. A manufacturing method of a glass core substrate is also provided.Type: GrantFiled: August 19, 2024Date of Patent: January 14, 2025Inventor: Dyi-Chung Hu
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Patent number: 12193178Abstract: Discussed is a display that can include a display panel, a nut fixed to a rear surface of the display panel, a frame including a female thread formed in a fastening hole facing the nut, an outer adjusting member including a hollow portion formed therein having a male thread that is screwed with the female thread of the fastening hole, and an outer head portion protruding out of the hollow portion. An inner fixing member can be further included and can include a thread portion passing through the hollow portion and screwed with the nut, and an inner head portion seated on the outer head portion or the hollow portion.Type: GrantFiled: June 19, 2020Date of Patent: January 7, 2025Assignee: LG ELECTRONICS INC.Inventors: Myoungjin Cho, Seungwook Noh, Sungyeon Kim
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Patent number: 12193142Abstract: A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.Type: GrantFiled: December 8, 2022Date of Patent: January 7, 2025Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Trevor Timpane, Layne A. Berge, Patryk Gumann, Sean Hart, Curtis Eugene Larsen, Michael Good