Patents Examined by Sherman Ng
  • Patent number: 10411429
    Abstract: A conductive member production method is performed with use of a die that includes a first die and a second die. The first die includes a protruding portion having a recession-shaped depression formed in a leading end surface, the depression including a molding surface that is inclined so as to gradually extend toward the leading end surface side while extending laterally from the depression. The second die includes a recessed portion into which the protruding portion can be inserted. The method includes a heating step of heating a weld portion formation region that is a portion, with respect to an extending direction, of a conductive member constituted by multiple metal strands, and a pressing step in which the heated weld portion formation region is sandwiched between and pressed by the protruding portion of the first die and the recessed portion of the second die.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: September 10, 2019
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Osamu Satou, Jiguo Zheng, Masamichi Yamagiwa
  • Patent number: 10410765
    Abstract: A power cord structure is disclosed, comprising a conductive cord body consisting of plural conductive cords which are mutually entangled at a twist distance satisfying security requirements, and an opaque insulation protective outer layer, wherein the insulation protective outer layer includes an insulation cladding layer and a spiral color correspondence layer, the insulation cladding layer is wrapped around the outside of the conductive cord body; also, the spiral color correspondence layer spirally displays on the outer surface of the insulation cladding layer with at least three color segments, and the interval widths of such at least three color segments are in a proportional ratio to the twist distance satisfying security requirements of the plural conductive cords.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: September 10, 2019
    Inventor: Chia-Hua Lin
  • Patent number: 10407002
    Abstract: A grommet that includes a main body configured to fit into a through hole in a wall and come into contact with a circumferential edge of the through hole; and a reinforcement provided in a through space in the main body and configured to suppress inward distortion of the main body, the through space being open in a same direction as a penetrating direction of the through hole.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: September 10, 2019
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Hirokazu Nakai
  • Patent number: 10405420
    Abstract: Embodiments include devices and method related to a foldable printed circuit board that may be used in SSD applications. One embodiment relates to a foldable printed circuit board comprising a first rigid portion, a second rigid portion, and a first flexible region coupling the first rigid portion to the second rigid portion. The foldable printed circuit board also includes a third rigid portion and a second flexible region coupling the second rigid portion to the third rigid portion, wherein the first rigid portion and the third rigid portion each have a width that is less than that of the second rigid portion. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: September 3, 2019
    Assignee: INTEL CORPORATION
    Inventors: Andrew Morning-Smith, Eugene Lim, Meng Zhai
  • Patent number: 10404026
    Abstract: In a method for manufacturing a terminal-equipped electrical wire a core wire of an electrical wire is connected to a flat plate-shaped electrical wire connector portion of a terminal. An ultrasonic welding jig including an anvil and a welding horn is provided. After the electrical wire connector portion is placed on the anvil, the core wire of the electrical wire is placed on the electrical wire connector portion. By applying ultrasonic vibration along the axial direction of the core wire while pressing the core wire using the welding horn, the core wire is ultrasonically welded to the electrical wire connector portion. On the upper surface of the wire connection portions of the terminal, a positioning groove, into which the core wire is fit, is formed in advance, and the core wire is placed on the electrical wire connector portion while being fit into the positioning groove.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: September 3, 2019
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tomoki Idota, Ryouya Okamoto, Hiroshi Shimizu, Hitoshi Takeda
  • Patent number: 10400174
    Abstract: In a multi-layer insulated wire including: a conductor; an inner layer formed in periphery of the conductor; and an outer layer formed in periphery of the inner layer, the inner layer is made of a resin composition containing a base polymer containing polyolefin as a main component, and the outer layer is made of a resin composition containing a base polymer containing polyolefin as a main component so as to contain 80 or more and 250 or less parts by mass of metallic hydroxide per 100 parts by mass of the base polymer. The multi-layer insulated wire having an expansion start temperature of the outer layer that is equal to or lower than 344° C. is used.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: September 3, 2019
    Assignee: Hitachi Metals, Ltd.
    Inventors: Tsuyoshi Miura, Tamotsu Kibe, Makoto Iwasaki, Yoshiaki Nakamura
  • Patent number: 10405426
    Abstract: A printed wiring board includes: a core substrate having a core layer, first and second conductor layers, and through-hole conductors penetrating through the core layer and connecting the conductor layers; and first and second build-up layers each including an insulating layer, an inner side conductor layer, an outermost insulating layer, an outermost conductor layer, and a solder resist layer. Each of the conductor layers includes conductor circuits having substantially a trapezoid cross-sectional shape, and spaces between adjacent conductor circuits, and includes a metal foil, a seed layer, and an electrolytic plating film. The inner side conductor layers have the smallest minimum circuit width, the smallest minimum space width and the largest base angle among the conductor layers. The insulating layers have the smallest ten-point average roughness rz3, rz7 among the ten-point average roughness rz3, rz7, rz1, rz2, rz5 and rz9 of the core layer, insulating layers and outermost insulating layers.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: September 3, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Takema Adachi, Toshihide Makino, Hidetoshi Noguchi
  • Patent number: 10405446
    Abstract: An electronic device including a waterproof structure is provided. The electronic device includes a housing that includes a first face, a second face that faces in a direction substantially opposite to the first face, and a side surface that at least partially encloses a space between the first face and the second face, a middle plate arranged between the first face and the second face inside the housing to be substantially parallel to the first face, extending from the side surface, and including at least one opening, a printed circuit board arranged between the middle plate and the second face, a display arranged between the middle plate and the first face, and including a face directed toward the second face, and a seal member configured to hermetically seal the at least one opening of the middle plate, and arranged between the face of the display and the middle plate.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: September 3, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Min Choi, Woong-Chan Kim, Daehyeong Park, Sung-Gun Cho, Sung-Joo Cho, Young-Sik Choi, Kwang-Hwan Kim, Soonwoong Yang, Min-Sung Lee, Seungjoon Lee, Yuchul Chang
  • Patent number: 10388452
    Abstract: Disclosed herein is a coil component that includes a coil conductor part, and first and second high permeability parts provided respectively on both sides of the coil conductor part in a coil axis direction. The second high permeability part has a larger thickness in the coil axis direction than the first high permeability part. A low permeability part that segments at least a part of a magnetic path exists between the first and second high permeability parts in an outer diameter area of the coil conductor part when viewed in the coil axis direction.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: August 20, 2019
    Assignee: TDK CORPORATION
    Inventors: Toshio Tomonari, Sachiko Takano, Shigeki Sato
  • Patent number: 10389095
    Abstract: A network interface device includes a housing. The housing includes a base and a cover, the cover connected to the base and movable relative to the base between an open position and a closed position. The network interface device further includes an insert removably connectable to the base. The insert includes a base plate, and an adapter plate extending from the base plate and defining a subscriber section of the insert and a provider section of the insert. The subscriber section and provider section are opposite each other relative to the adapter plate. The adapter plate defines one or more adapter apertures extending therethrough. The insert further includes an organizer arm which includes a support member, an upper portion extending from the support member, and a lower portion extending from the support member opposite the upper portion.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: August 20, 2019
    Assignee: AFL Telecommunications LLC
    Inventors: Cecilia L. Stout, David J. Lane, Shirley Ball, William Miller, Joseph Cignarale
  • Patent number: 10388424
    Abstract: An electrical wire includes a conductor wire and a covering disposed over the conductor wire. The covering includes a thermoplastic composition. The thermoplastic composition includes a blend of an aromatic polyketone and a poly(etherimide-siloxane) copolymer. Electrical wires having such coverings can be useful in providing articles including electrical wires for high-heat applications including railway vehicle, automobile, marine vehicle, aircraft, or data transmission components.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: August 20, 2019
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Raghavendra Raj Maddikeri, Liang Shen
  • Patent number: 10390430
    Abstract: A circuit board includes a board defining a holding slot and a connector. The connector includes a conductive column and a pad fixed to one end of the conductive column. The pad is received within the holding slot. The conductive column is fixed within the board. The pad is soldered to a connecting portion of an electrical component. The pad defines a first through hole receiving solder when the connecting portion of the electrical component is soldered to the pad.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: August 20, 2019
    Assignees: HONGFUJIN PRECISION INDUSTRY (WUHAN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Hou-Yuan Chou, Yi-Chih Wu
  • Patent number: 10381152
    Abstract: A coil component has an outer electrode include a bottom-surface electrode portion disposed along a bottom surface of a component body and an end-surface electrode portion disposed along an end surface of the component body so as to be continuous with the bottom-surface electrode portion. The adhesive strength of the bottom-surface electrode portion with respect to the component body is lower than that of the end-surface electrode portion with respect to the component body.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: August 13, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Ryota Hashimoto
  • Patent number: 10366805
    Abstract: Insulated winding wire articles and associated formation methods are described. An insulated winding wire article may include a conductor and optional base insulation formed around the conductor. The conductor may be formed into a predefined shape having at least one bend, such as a U-shaped bend. A coating comprising parylene may be formed around the conductor and any base insulation.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: July 30, 2019
    Assignee: Essex Group, Inc.
    Inventors: Allan R. Knerr, David Marshall Cain
  • Patent number: 10368440
    Abstract: A printed wiring board includes: a core substrate having a core layer, conductor layers on the core layer, and through-hole conductors; a first build-up layer including an insulating layer on the substrate, an inner side conductor layer on the insulating layer, an outermost insulating layer on the inner side conductor layer, and an outermost conductor layer on the outermost insulating layer; and a second build-up layer including an insulating layer on the substrate, an inner side conductor layer on the insulating layer, an outermost insulating layer on the inner side conductor layer, and an outermost conductor layer on the outermost insulating layer. Each of the conductor layers, inner side conductor layers, and outermost conductor layers has a metal foil, a seed layer and an electrolytic plating film, and that each inner side conductor layer has the smallest thickness among the conductor layers, inner side conductor layers and outermost conductor layers.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: July 30, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Takema Adachi, Toshihide Makino, Hidetoshi Noguchi
  • Patent number: 10361517
    Abstract: An electromagnetic shielding component that includes a pipe body that is conductive; and a braid that is tubular and that is obtained by braiding conductive bar wires, the braid and the pipe body being coupled to each other by a coupler in a state in which an end of the braid is externally fitted onto an end of the pipe body.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: July 23, 2019
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takeshi Shimizu, Hirotaka Baba
  • Patent number: 10359181
    Abstract: An electrode pattern (13) formed on a ceramics layer (2) in a substrate for a light emitting device (circuit board (320)) of the present invention includes a first metal layer (5), a second metal layer (7), and an electrode terminal unit (10), and the thickness of a part at which the electrode terminal unit (10) is not formed in the electrode pattern (13) is at least equal to or greater than 35 ?m. Accordingly, it is possible to suppress heat resistance to be low.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: July 23, 2019
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Masahiro Konishi, Shin Itoh, Hiroshi Yamashita, Ippei Yamaguchi, Hiroyuki Nokubo, Yoshiaki Itakura
  • Patent number: 10355237
    Abstract: An electronic device includes a display module, a bottom cover disposed below the display module, and a top cover disposed above the display module and overlapping at least a portion of the display module. The top cover is coupled to the display module or the bottom cover. The display module includes a display panel, a display window. The display window includes a central portion disposed above the display panel and an edge portion connected to the central portion. The edge portion overlaps the top cover and is thinner than the central portion. The bezel is disposed on a bottom surface of the display window and overlaps the edge portion.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: July 16, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Myoungan Min
  • Patent number: 10355638
    Abstract: A solar junction box includes a box cover and a terminal plate. The terminal plate includes a plurality of terminals arranged side by side and diode units for connecting adjacent terminals, and the terminals and diode units are integrally packaged in plastic. Two outermost terminals are respectively used to connect cables. The terminal plate serving as a back plate of the box cover is fixedly connected to the box cover in detachable manner. A cavity for filling silica gel is formed between the box cover and the terminal plate. The assembly of the solar junction box is convenient, and it has relatively good heat dissipation and sealing performance.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: July 16, 2019
    Assignee: LEONI CABLE (CHINA) CO., LTD.
    Inventor: Wei Lu
  • Patent number: 10356915
    Abstract: There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: July 16, 2019
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventor: Yoshinori Matsuura