Patents Examined by Sherman Ng
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Patent number: 12202941Abstract: Provided are a film which includes at least a first resin layer containing aromatic polyester amide, and a second resin layer disposed on the first resin layer, and an elastic modulus of the second resin layer at 160° C. is less than 1.0 GPa.Type: GrantFiled: February 20, 2023Date of Patent: January 21, 2025Assignee: FUJIFILM CorporationInventors: Shohei Yamazaki, Yasuyuki Sasada
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Patent number: 12207388Abstract: A fastening system, including: a fastener including: a hollow shaft; a threaded portion positioned on an outer surface of the hollow shaft; a first protrusion extending from an inner surface of the hollow shaft, the first protrusion including: a first angled surface; a first engagement surface; a nut corresponding to the fastener, including: a cavity having threaded portion; a projection positioned within the cavity of the nut, the projection including: a first locking feature positioned on an outer surface of the projection, the first locking feature including: a second angled surface; a first locking surface; wherein, in a first state of engagement of the fastener with the nut, the first angled surface of the first protrusion of the fastener engages with the second angled surface of the first locking feature of the projection to rotate the fastener with respect to the nut in response to downward force on the fastener.Type: GrantFiled: February 6, 2023Date of Patent: January 21, 2025Assignee: Dell Products L.P.Inventors: Tung-Yi Chen, Kang-Wei Fan, Jing-Tang Wu
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Patent number: 12200888Abstract: A process variable transmitter includes a process variable sensor, and an electromagnetic interference (EMI) protection circuit coupled to the process variable sensor. The process variable transmitter also includes a hermetic module enclosing the EMI protection circuit, and electrical connectors coupled to the EMI protection circuit within the hermetic module. The electrical connectors are configurable from outside the hermetic module to connect electronic components of the EMI protection circuit in a configuration that provides transient protection.Type: GrantFiled: January 20, 2023Date of Patent: January 14, 2025Assignee: Rosemount Inc.Inventors: Christopher Lee Eriksen, Nicholas Aaron Wienhold, Kurt Calvin Diede
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Patent number: 12200887Abstract: An electronic device is provided. The electronic device includes a foldable housing and a flexible display. The foldable housing may provide a front surface of the electronic device and a rear surface of the electronic device. The flexible display may be located in an inner space of the foldable housing. The flexible display may be combined with a front cover of the foldable housing providing the front surface. The front cover may include a pattern in which a plurality of openings corresponding to a folding portion of the foldable housing or a plurality of recesses provided in a surface facing the flexible display are periodically provided. A plurality of sub-pixels emitting light of a same wavelength in the flexible display may be arranged in a same direction as a direction in which the plurality of openings or the plurality of recesses are periodically arranged.Type: GrantFiled: January 17, 2023Date of Patent: January 14, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Youngkyong Jo, Wooktae Kim, Taehyeong Ryu, Jungkyu Park, Youngmin Seo, Bora Lee, Sangbong Lee, Wonho Lee, Jongsu Lee
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Patent number: 12200871Abstract: A component-containing substrate includes a substrate base. The substrate base includes one or more wiring layers and one or more insulating layers and includes a cavity. The component-containing substrate further includes a pad at the bottom of the cavity and an electronic component bonded to a surface of the pad exposed in the cavity. A trench is formed in the surface of the pad, the trench continuing from the inside to the outside of the perimeter of the electronic component in a plan view.Type: GrantFiled: March 8, 2023Date of Patent: January 14, 2025Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Takao Koshi
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Patent number: 12199027Abstract: A glass core substrate includes a first glass layer; a second glass layer disposed on the first glass layer; a third glass layer disposed on the second glass layer; a first bonding layer disposed between the first glass layer and the second glass layer; a second bonding layer disposed between the second glass layer and the third glass layer; and a conductive connector, passing through the first glass layer, the first bonding layer, the second glass layer, the second bonding layer, and the third glass layer, wherein the conductive connector is configured to provide a vertical conductive path penetrating through the first glass layer, the first bonding layer, the second glass layer, the second bonding layer, and the third glass layer. A manufacturing method of a glass core substrate is also provided.Type: GrantFiled: August 19, 2024Date of Patent: January 14, 2025Inventor: Dyi-Chung Hu
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Patent number: 12193178Abstract: Discussed is a display that can include a display panel, a nut fixed to a rear surface of the display panel, a frame including a female thread formed in a fastening hole facing the nut, an outer adjusting member including a hollow portion formed therein having a male thread that is screwed with the female thread of the fastening hole, and an outer head portion protruding out of the hollow portion. An inner fixing member can be further included and can include a thread portion passing through the hollow portion and screwed with the nut, and an inner head portion seated on the outer head portion or the hollow portion.Type: GrantFiled: June 19, 2020Date of Patent: January 7, 2025Assignee: LG ELECTRONICS INC.Inventors: Myoungjin Cho, Seungwook Noh, Sungyeon Kim
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Patent number: 12193142Abstract: A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.Type: GrantFiled: December 8, 2022Date of Patent: January 7, 2025Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Trevor Timpane, Layne A. Berge, Patryk Gumann, Sean Hart, Curtis Eugene Larsen, Michael Good
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Patent number: 12193177Abstract: In an example, a display device may include a flexible display surface element disposed in a housing of the display device; and an adjustable carrier element having a flexible portion and a rigid portion. The flexible portion of the carrier element faces the interior of the housing, the rigid portion is in form of a linear guide and is directed toward external surroundings of the housing, and the flexible portion has at least one guide element. The display device may include a guide apparatus having a supporting surface positioned along the adjustment plane, which guide apparatus may include at least one rail element running along the adjustment axis, which rail element is directed such that the at least one guide element is guided along the adjustment axis in the rail element as the carrier element is adjusted; and an adjustment apparatus configured to control a change between a storing position and a roll-out position of the display surface element by moving the carrier element.Type: GrantFiled: June 23, 2021Date of Patent: January 7, 2025Assignee: AUDI AGInventor: Christian Wall
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Patent number: 12191588Abstract: A flexible printed circuit board includes a first flexible unit and a second flexible unit, where the first flexible unit includes a first connecting portion and a plurality of first wires, and each of the first wires includes a welding point located at the first connecting portion; each of the welding points is provided with a first connecting structure, and the welding point is electrically connected to the first connecting structure; the second flexible unit includes a first face and a second face, where the first face is located on a side of the second flexible unit facing away from the first flexible unit; the second flexible unit further includes a second connecting portion and a plurality of second wires; the second connecting portion is provided with a plurality of through holes, and the plurality of through holes are provided in one-to-one correspondence to the plurality of second wires.Type: GrantFiled: September 8, 2022Date of Patent: January 7, 2025Assignee: Honor Device Co., Ltd.Inventors: Yawei Zhou, Fan Luo
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Patent number: 12185481Abstract: An electronic device may include a front housing including an opening and a bonding area formed around the opening; a display module disposed to cover the opening by at least part thereof, wherein the display module may include: a display to provide visual information to a user; a base disposed along an edge area of the display and including a bonding part formed to correspond to the bonding area; and a stopper disposed to surround at least part of the bonding part and formed toward the housing, to provide a bonding space between the bonding area and the bonding part; and an adhesive member disposed in the bonding space, to connect between the bonding area and the bonding part. Various other implementation modifications are available.Type: GrantFiled: December 22, 2022Date of Patent: December 31, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Sunggun Cho, Jinwook Baik, Byounguk Yoon
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Patent number: 12177975Abstract: A wiring substrate includes a first conductor layer including wirings, an interlayer insulating layer formed on the first conductor layer and covering the first conductor layer, a second conductor layer formed on the interlayer insulating layer and including wirings, a via conductor formed in the interlayer insulating layer such that the via conductor is penetrating through the interlayer insulating layer and connecting the first conductor layer and the second conductor layer, and a wiring part formed in the interlayer insulating layer and including an embedded wiring layer filling one or more grooves formed in the interlayer insulating layer. The interlayer insulating layer includes a first insulating layer and a second insulating layer laminated on the first insulating layer, and the embedded wiring layer is formed in the first insulating layer on a side facing the second insulating layer and filling the groove or grooves formed in the first insulating layer.Type: GrantFiled: November 25, 2022Date of Patent: December 24, 2024Assignee: IBIDEN CO., LTD.Inventor: Toshiki Furutani
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Patent number: 12177998Abstract: A display apparatus includes a substrate including a display area and a peripheral area surrounding the display area, a display layer disposed on the display area, a cover window covering the substrate, and a cover panel disposed on the substrate, where the substrate is disposed between the cover window and the cover panel. The cover panel includes a body portion covering the substrate, and a buffer portion extending from a side of the body portion and disposed between the substrate and the cover window.Type: GrantFiled: December 14, 2022Date of Patent: December 24, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Changho Hyun, Joonhee Song, Kyemoon Lee
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Patent number: 12171076Abstract: An electronic device including a flexible display is provided. The electronic device includes a first housing, a second housing slidably coupled to a side surface of the first housing, a flexible display including a first area on the first housing and a second area extending from the first area, a gear structure arranged in the first housing, and an installation member rotatably coupled to the first housing and separated from or mounted on at least a part of a human body, wherein the flexible display can be rotated and rolled according to the rotation of the gear structure while the first area is exposed to the outside, such that at least a part of the second area may be exposed to the outside.Type: GrantFiled: December 5, 2022Date of Patent: December 17, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Hyunggwang Kang, Kibeom Kim, Teayoung Kim, Sanghyuk Park, Joungmin Cho, Myunghoon Kwak, Moonchul Shin, Yangwook Kim, Hyunju Hong
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Patent number: 12167540Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a first circuit pattern disposed on a lower surface or inside the first insulating layer; a second circuit pattern disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and surrounding the second circuit pattern; and a protective layer disposed on an upper surface of the second insulating layer, wherein the second insulating layer has at least one recess formed on its upper surface, and wherein the protective layer is disposed in the recess formed on the upper surface of the second insulating layer.Type: GrantFiled: September 9, 2020Date of Patent: December 10, 2024Assignee: LG INNOTEK CO., LTD.Inventors: Eui Yeol Yang, Se Woong Na, Do Hyuk Yoo
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Patent number: 12160955Abstract: A circuit board according to an embodiment includes an insulating layer including an upper surface and a lower surface, and having a via hole passing through the upper surface and the lower surface in a thickness direction from the upper surface to the lower surface, wherein the via hole includes: a first via part adjacent to the upper surface and having a constant inclination angle along the thickness direction; a second via part adjacent to the lower surface and having a constant inclination angle along the vertical direction; and a third via part disposed between the first via part and the second via part and having an inclination angle different from an inclination angle of the first via part and an inclination angle of the second via part.Type: GrantFiled: May 21, 2021Date of Patent: December 3, 2024Assignee: LG INNOTEK CO., LTD.Inventors: Dong Sun Kim, Sang Hyuck Nam, Sung Wuk Ryu
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Patent number: 12160946Abstract: A camera device according to one embodiment of the present invention includes a printed circuit board, a heat radiation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat radiation layer, a plurality of through-holes passing through the printed circuit board from the first surface to a second surface which is a surface opposite to the first surface are formed in the printed circuit board, and the plurality of through-holes are in contact with the heat radiation layer.Type: GrantFiled: May 6, 2021Date of Patent: December 3, 2024Assignee: LG INNOTEK CO., LTD.Inventors: Seong Su Eom, Sol Ip Lee, Hee Jung Lee
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Patent number: 12156337Abstract: A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 400 nm or more and 700 nm or less. The wiring lines (21, 22) have a surface roughness Ra, and the surface roughness Ra is 100 nm or less.Type: GrantFiled: April 28, 2021Date of Patent: November 26, 2024Assignee: Dai Nippon Printing Co., Ltd.Inventors: Seiji Take, Shuji Kawaguchi, Chiaki Hatsuta
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Patent number: 12156330Abstract: A light-transmitting electroconductive film (20) according to the present invention includes a region containing krypton at a content ratio of less than 0.1 atomic % at least partially in a thickness direction (D) of the light-transmitting electroconductive film (20). A transparent electroconductive film (X) according to the present invention includes a transparent substrate (10); and the light-transmitting electroconductive film (20) disposed on one surface side in the thickness direction (D) of the transparent substrate.Type: GrantFiled: March 18, 2021Date of Patent: November 26, 2024Assignee: NITTO DENKO CORPORATIONInventors: Nozomi Fujino, Taisuke Karasuda
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Patent number: 12151971Abstract: A glass composition includes greater than or equal to 45 mol % to less than or equal to 60 mol % SiO2; greater than or equal to 15 mol % to less than or equal to 25 mol % Al2O3; greater than or equal to 10 mol % to less than or equal to 20 mol % Li2O; greater than or equal to 0 mol % to less than or equal to 7.5 mol % Na2O; greater than or equal to 0 mol % to less than or equal to 5 mol % K2O; greater than or equal to 7 mol % to less than or equal to 13 mol % P2O5, and greater than or equal to 0 mol % to less than or equal to 4 mol % TiO2. The glass composition may have a liquidus temperature of less than or equal to 1300° C. and an inter-diffusion coefficient greater than or equal to 4000 ?m2/hour. The glass composition is chemically strengthenable. The glass composition may be used in a glass-based article or a consumer electronic product.Type: GrantFiled: November 21, 2022Date of Patent: November 26, 2024Assignee: CORNING INCORPORATEDInventors: John Philip Finkeldey, Timothy Michael Gross, Charlene Marie Smith, Jingshi Wu