Abstract: A multi-layer ceramic wiring board is patterned with arrays of footprints for high-temperature surface mounted device active and passive components on one side of the board that is patterned with arrays of standard SMD footprints to enable placement and attachment of components including primary 2-terminal components and active components where the SMD pads are connected through vias and buried-layer interconnect traces to a multiple connection point arrays on the front and back side of the ceramic wiring board. Each pad is connected to multiple instances of the pad grid to connections to be made with a single post-fired print.

Abstract: The present disclosure relates to a printed circuit board including a first insulating layer including a non-photosensitive insulating material, a first wiring layer embedded in the first insulating layer, where an upper surface thereof is exposed from the upper surface of the first insulating layer, includes a first metal layer, and a second metal layer covering at least a portion of each of the lower surface and side surface of the first metal layer with a thickness thinner than the first metal layer, and a second insulating layer disposed under the lower surface of the first insulating layer to cover at least a portion of a lower surface of the first wiring layer, and including the non-photosensitive insulating material.

Abstract: A medical device comprising a multilayer printed circuit board (PCB) comprising a heating element on an inner layer of the PCB; a single cell electrical power source to power the heating element; and a chamber adapted to contain a liquid, at least part of said chamber being defined by a thermally conductive material configured to provide a thermal transfer interface between the chamber and the PCB.

Abstract: A cap including a side wall portion having conductivity, a lid portion, a thin portion formed at least around the lid portion, and a beam portion supporting the lid portion is formed, an exposed component and a sealing component are mounted on a module substrate, the cap is mounted on the module substrate so as to surround an exposed component, the sealing component and the cap are sealed with a sealing resin, the lid portion is ground so as to reduce its thickness until the thin portion disappears, a shield layer is formed on an outer surface of the sealing resin and a side surface of the module substrate, a translucent adhesive sheet is attached on a top surface of the sealing resin, the beam portion is cut by laser through the adhesive sheet, and the adhesive sheet is peeled together with a lid portion.

Abstract: A high-frequency electronic component includes a ceramic multilayer substrate, ground electrodes provided at different layers of the ceramic multilayer substrate, and a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate. Two or more of the ground electrodes are exposed to the side surface of the ceramic multilayer substrate and are electrically connected to the shielding film. On the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes do not overlap each other in a thickness direction of the ceramic multilayer substrate.

Abstract: An information handling system and/or peripheral device includes a printed circuit board having at least one prepreg substrate coupled to at least one bio-based substrate to support operation of electronic components, such as mouse position sensor and scroll wheel rotation sensor, and having a layer of graphene between the prepreg substrate and the bio-based substrate. At end of life, the bio-based substrate is removed from the prepreg substrate, such as by melting of the biobased material, so that the prepreg substrate can be reused. In one embodiment, the prepreg substrate supports power and ground planes that bio-based substrates couple over so that the prepreg substrate can be reused along with the power and ground planes by coupling updated bio-based substrates over the reused prepreg substrate.

Abstract: The present application provides a display device comprising: a display panel including a display region and a non-display region, wherein the non-display region includes first and second fan-out regions and a bending region; an optical functional film layer formed in the display region and the first fan-out region; an adhesive layer formed on the optical functional film layer; and a protective layer located in the bending region and with a gap with the optical functional film layer, and an end of the adhesive layer extends beyond the optical functional film layer and is connected to the protective layer, and the adhesive layer covers the optical functional film layer, the gap, and part of the protective layer.

Abstract: A display device according to one or more embodiments comprises a flexible display panel, a connection film at least partially overlapping the display panel, and electrically connected to the display panel, source boards at least partially overlapping the connection film, and electrically connected to the connection film, and a flexible printed circuit portion electrically connecting the source boards, and wound or folded on the source boards.

Abstract: A combined flashing and electrical junction box system includes an enclosure subsystem and an expanse subsystem. Preferably, the enclosure 5 subsystem and said expanse subsystem are both fireproof and waterproof. A method for installing lighting on a building having subsiding using a combination system and an accessory block.

Abstract: The composite electronic component includes: a substrate having a GND pattern; a coil component having at least three terminals and mounted on a first surface of the substrate; and an overlapping arrangement component mounted on the first surface so that at least a part of the overlapping arrangement component overlaps the coil component when viewed from a first direction perpendicular to the first surface. The substrate has at least three coil connection patterns formed on the first surface and connected to the terminals, at least two component connection patterns formed on the first surface and connected to the overlapping arrangement component, and a GND via connecting one of the component connection patterns and the GND pattern to each other. The GND via is arranged in a substrate outer region, which is outside a region of a hypothetical polygon connecting all of the coil connection patterns on the substrate with a shortest perimeter, when viewed from the first direction.

Abstract: Provided in the present disclosure are a display module and a vehicle display apparatus. The display module includes: a display panel, at least one flexible circuit board and at least one printed circuit board. The display panel includes a plurality of connection pads located in a bonding area. The flexible circuit board includes a first body, a plurality of output pads and a plurality of input pads, the first body includes a bendable portion and a flat portion which are connected, the bendable portion includes a protruding portion protruding relative to the flat portion. The printed circuit board includes a second body and a plurality of bonding pads, the second body includes a strip-shaped main body portion and at least one branching portion connected with a long side of the strip-shaped main body portion.

Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

Abstract: Disclosed is a PCB arrangement and wiring structure of LED lamp beads, including a carrier board, and a VDD pin, a DIN pin, and a VSS pin are further arranged in the LED lamp bead installation area; similar pins are connected and wired in parallel with each other, and all the VSS pins are connected and wired in parallel with each other, so that the voltage between each set of lamp beads remains consistent; all the DIN pins are connected and wired in parallel with each other; and the carrier board is further provided with at least one set of VDD power input pin terminals, VSS power input pin terminals, and DIN control terminals, a plurality of the VDD pins are electrically connected to the VDD power input pin terminal, and a plurality of the VSS pins are electrically connected to the VDD power input pin terminal.

Abstract: In order to prevent a short-circuit failure between a conductive connecting portion (1) that is provided as a countermeasure against external electrical noises and an electronic circuit, a structure is adopted where a large number of electronic components (8) are mounted on a circuit board (5) that is mounted on a base (7), a metal cover (6) is disposed so as to cover upper portions of the electronic components (8), opening portions (3) are formed in the circuit board (5) at four positions on a periphery of the circuit board (5), protruding members (12) that are integrally formed with the base (7) are disposed at four positions respectively in alignment with the positions where the opening portions (3) are formed, the protruding members (12) are made to pass through the opening portions (3) at four positions from a back surface side of the circuit board (5) to protrude to a front surface side of the circuit board 5, the conductive connecting portions (1) are arranged in an outside direction with respect to th

Abstract: A display device may include a display panel which is flexible and includes a first surface on which an image is displayed and a second surface on which the image is not displayed, a connection film at least partially overlapping a side of the display panel in a plan view, a printed circuit board at least partially overlapping a side of the connection film in a plan view and electrically connected to the connection film, a control board spaced apart from the printed circuit board, and a cable electrically connecting the printed circuit board and the control board. The cable may have a spiral shape.

Abstract: A host device includes surface mount conductive pads on a printed circuit board (PCB) for external peripheral communications. Conductive ink is printed on the conductive pads with a base member is printed over the conductive ink. Three-dimensional (3D) conductive wires are printed on the base member and extend along a housing to a new external port. Conductive ink is printed with a second base member and terminating ends of the wires are printed on the front of the base member establishing the new peripheral port for the host device. A peripheral device includes its own surface mount conductive pads which when aligned and brought into contact with the external port of the host device permits the host device and the peripheral device to establish a wired connection with one another without cables, without cable harnesses, and without port connectors.

Abstract: A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A flat plate connector including a glass substrate, a conductive silver printing, an adhesion material for electrical connection, an insulated film, a conductive metal strip, and an additional adhesion tape. The flat connector having a dedicated cut-out, where the flat connector before mechanical and electrical bounding with the adhesion material can be fixed with a tape which, depending on its type, can also enhance pull-off resistance and ageing tests. The area is then defined as the surface where the connector adheres to the glass, including the different adhesion materials. The dedicated cut is made in the flat connector to generate a symmetric tensile stress on this adhesion area when the connector is submitted to a pull-off tensile force, the symmetry axis being defined by this pull force axis.

Abstract: A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and respectively disposed on first and second surfaces of the body, the first and second surfaces opposing each other. The body further includes a first via electrode, connecting the at least one first internal electrode and the first external electrode to each other in the first direction, and a second via electrode connecting the at least one second internal electrode and the second external electrode to each other in the first direction.

Abstract: Provided are a film which includes at least a first resin layer containing aromatic polyester amide, and a second resin layer disposed on the first resin layer, and an elastic modulus of the second resin layer at 160° C. is less than 1.0 GPa.