Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber (R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.

Abstract: An information handling system with a cooling system may include a processor; a memory; a power management unit (PMU); a cooling system including: a fan; and a cooling system heat pipe; a detachable thermal module including: a first heat conductive element to be operatively coupled to a heat producing components such as a processor, a radio module, or other component; a second heat conductive element to be operatively coupled to the cooling system heat pipe of the cooling system; and a detachable thermal module heat pipe formed between the first heat conductive element and the second heat conductive element.

Abstract: Systems and methods for providing an electronics module including a raceway for mounting submodules and establishing electrical communication with said submodules. The raceway comprises a base structure and a conductive trace formed by a conductive plating process. Connection pads on the raceway are configured to receive connection nodes of the submodules for providing a continuous electrical connection between the raceway and the submodules for electrical communication and power transmission.

Abstract: A circuit board includes a conductive metal layer, at least one insulating layer, at least one thermally conductive insulating layer and a heat dissipation element. The conductive metal layer is mainly used to transmit electronic signals. The insulating layer is connected to the conductive metal layer. The thermally conductive insulating layer is sandwiched between the conductive metal layer and the insulating layer, and thermally contacts the conductive metal layer, and is used for thermally conducting the heat of the conductive metal layer. The heat dissipation element is in thermal contact with the thermally conductive insulating layer, and is used to conduct the heat of the thermally conductive insulating layer to the outside through a heat dissipation channel.

Abstract: An apparatus comprises one or more power distribution units, and a power line filter device electrically connected to the one or more power distribution units. The power line filter device is configured to be electrically connected to a power source for the one or more power distribution units at a location between the power source and the one or more power distribution units. The power line filter device is configured to condition one or more signals in one or more power lines to prevent emission of data corresponding to one or more information technology devices.

Abstract: A display panel according to one embodiment comprises: a display substrate that includes a display area and a pad area disposed around the display area, at least one pad terminal disposed on the substrate of the pad area, and an open portion which is at least partially and planarly surrounded by the pad terminal.

Abstract: A quickly-fixable electronic device includes a fixing portion, a first base portion, and a second base portion. The fixing portion is provided with an electronic device. The first base portion is pivotally connectable with the fixing portion. The first base portion is provided with a receptacle. The receptacle receives and connects with the fixing portion. The second base portion is pivotally connected with the first base portion. The second base portion is provided with a magnetic attraction piece. The magnetic attraction piece enables quick fixing of the electronic device to a display screen. A pivoting motion between the fixing portion and the first base portion enables rotation of the electronic device by an angle. A pivoting motion between the first base portion and the second base portion enables inclining and swinging of the electronic device.

Abstract: A thermoplastic composition including a) 20 to 90 wt. % of a thermoplastic resin, b) 0.1 to 80 wt. % of a laser direct structuring additive and c) 10 to 80 wt. % of ceramic filler particles which do not have a laser direct structuring additive function, wherein at least 80 wt. % of c) is TiO2, wherein the composition has a loss tangent measured at 40 GHz of at most 0.014, wherein the total amount of a), b) and c) is 95 to 100 wt. % with respect to the total composition, wherein the composition further includes f) one or more additives, wherein the total amount of the additives is 0.1 to 5 wt. %, 0.3 to 5 wt. % or 0.3 to 3 wt. % relative to the total weight of the composition.

Abstract: The present invention relates to an electrostatic chuck heater having a bipolar structure, the electrostatic chuck heater comprising: a heater body having an internal electrode and an external electrode for selectively performing any one of an RF grounding function and an electrostatic chuck function according to a semiconductor process mode; and a heater support mounted below the heater body so as to support the heater body.

Abstract: The present disclosure relates to a structure for electrically-connecting an external conductor. The structure comprises a wiring-substrate comprising a stack based arrangement of a plurality of layers, wherein said layers are defined as electrically conducting layers and insulating layer. A rivet is supported from the wiring substrate and comprises an embedded portion within the wiring substrate. The embedded portion comprises: an upper section extending through the stack of the plurality of layers, and, a bottom section extending laterally with reference to the upper section. A portion protruding from wiring substrate is provided for receiving an external-conductor and for thereby electrically connecting with the wiring substrate.

Abstract: A flexible printed circuit includes an insulating base. The insulating base includes a body portion and at least one first extension portion connected to an edge of the body portion. The first extension portion includes a via region, a bending region and a banding region that are sequentially away from the body portion. A plurality of vias are disposed in the via region. The plurality of vias include at least one first via and at least one second via, a center of an orthogonal projection of a first via on a reference plane perpendicular to a thickness direction of the insulating base is located on a first straight line parallel to a bending axis of the bending region, and a center of an orthogonal projection of a second via on the reference plane is not located on the first straight line.

Abstract: A coil component includes: a magnetic base body formed by metal magnetic grains containing Fe, Si, and Cr, whose intensity ratio (IM/IH) of the strongest line intensity (IM) in a range of wavenumbers 650 to 750 cm?1, to the strongest line intensity (IH) in a range of wavenumbers 400 to 450 cm?1, in a Raman spectrum measured at the center part is 2 or higher, and which also has a part on the surface side of the center part where the intensity ratio (IM/IH) in a Raman spectrum is under 2; and a conductor placed inside or on the surface of the magnetic base body. The magnetic base body is constituted by a powder magnetic core made to have excellent electrical insulating property and high magnetic permeability.

Abstract: A printed wiring board is provided with: a core substrate corresponding to a stack area in which an interlayer connection conductor constituting an inner via is continuous; and a build-up layer comprising a resin layer stacked on the core substrate and a conductor layer on said resin layer. A via inner space inside the interlayer connection conductor constituting the inner via is hollow, and said via inner space communicates to the outside via a hole section provided in the build-up layer.

Abstract: A round superconductor wire and method for fabricating same are disclosed. Embodiments are directed to a round superconductor wire including at least two superconductor tapes wound on a wire former. Each superconductor tape includes: bottom stabilizer and silver layers; substrate disposed above the bottom silver layer; buffer film stack disposed above the substrate; superconductor film disposed above the buffer film stack; top silver layer disposed above the superconductor film; and top stabilizer layer disposed above the top silver layer. At least one of the bottom stabilizer layer, bottom silver layer, substrate, buffer film stack, superconductor film, top silver layer, or top stabilizer layer is of a different width, thickness, or material composition in one of the superconductor tapes than in another of the superconductor tapes. These and other embodiments achieve a round superconductor wire having improved current density in high magnetic field applications when made in small diameters.

Abstract: A hybrid double-sided power switch module comprises a double PCB assembly with switch dies and conductive spacers disposed at both sides of the double PCB assembly in different topologies. The gate connections of the switch dies are enhanced by spring pins soldered in the THVs formed through the PCBs in alignment with the gate terminals. MFCs are positioned at both sides of the double PCBs assembly in contact with the tops of the switch dies and conductive spacers with fuzz buttons serving as contacts between the MFCs and the switch dies and spacers. MFCs serve different functions including AC bus-bars, DC bus-bars, heat-sinks, and their combination. The module can withstand external stress and is fabricated by a simplified and inexpensive process requiring only two solder pastes.

Abstract: The present application provides a display device comprising: a display panel including a display region and a non-display region, wherein the non-display region includes first and second fan-out regions and a bending region; an optical functional film layer formed in the display region and the first fan-out region; an adhesive layer formed on the optical functional film layer; and a protective layer located in the bending region and with a gap with the optical functional film layer, and an end of the adhesive layer extends beyond the optical functional film layer and is connected to the protective layer, and the adhesive layer covers the optical functional film layer, the gap, and part of the protective layer.

Abstract: A wire harness that includes an electric wire including a core wire and an insulation coating that covers an outer circumference of the core wire; an electromagnetic shield that surrounds an outer circumference of the insulation coating; a connection terminal that is electrically connected to an end of the core wire; a connector housing that holds the connection terminal and is made of a synthetic resin; a shielding pipe that extends from an inside to an outside of the connector housing in a protruding manner; and a fixing member that fixes an end of the electromagnetic shield to an outer circumferential surface of a portion of the shielding pipe that is disposed outside the connector housing in an electrically connected state.

Abstract: Disclosed is a wiring board, including: an insulating substrate containing aluminum oxide; and a metallized layer that includes a metal phase containing a metal material and a first glass phase containing a glass component and that is disposed on the insulating substrate. At least one of the insulating substrate and the metallized layer further contains mullite. In the metallized layer, the metal phase continues in a three-dimensional network shape, and the first glass phase is embedded between the metal phase.

Abstract: A method for installing an offshore installation is provided, the method including: a) providing a pipe for connecting the offshore installation with another offshore installation or an onshore installation; b) arranging an electrical cable inside the pipe; c) determining a level at or above the seabed, wherein the pipe includes a first portion arranged below the determined level and a second portion arranged above the determined level, and wherein the electrical cable is arranged inside the pipe so as to form a gap with an inner wall of the pipe along the first and second portion; d) determining an amount of cooling liquid such that, when the cooling liquid has a first temperature, the cooling liquid fills the gap along the first portion of the pipe, wherein the second portion of the pipe is free of the cooling liquid, and when the cooling liquid cools the electrical cable.

Abstract: This application relates to the field of electronic technologies, and provides a printed circuit board and a manufacturing method thereof, and an electronic device. The printed circuit board has target holes that penetrate through the printed circuit board, and an area that is not provided with the target holes has blocking structures (B) for blocking liquid flow, where the area is on at least one side that is of the printed circuit board and that is connected to the target holes.