Abstract: A communications cable is provided that includes a pair of twisted pair of wires, each coated with a fluoropolymer insulator. The twisted pair of wires is configured to carry a differential signal, such as a differential data signal and/or a differential power signal. The fluoropolymers are highly effective insulators and significantly reduce both the effects of internal and external electromagnetic interference while maintaining low cable attenuation, even when operating within a temperature range of ?40° C. to 150° C.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: A backlight module and a display device is disclosed. The backlight module includes a backplate, a light board framework, and assembled light board arranged in sequence. The assembled light board include multiple light boards with a seam formed between adjacent light boards. The light board framework is arranged on the backplate and includes a main body defining multiple mounting grooves provided in a number equal to the number of the light boards in the assembled light board. Each of the light boards is installed in one of the mounting grooves. A supplementary light-emitting diode (LED) is disposed between adjacent mounting grooves to supplement light for the seam between every two adjacent ones of the light boards.

Abstract: Provided are a busbar unit and a method of manufacturing thereof configured to prevent an increase in resistance at a connection portion therebetween, to provide a good connection condition, and to easily achieve even a complicated wiring structure, in the case of connecting between a busbar and a pre-welded member (a terminal, another busbar, or the like) made of a metal material different from that of the busbar. A busbar unit includes a busbar made of a first metal material, and a welded member made of a second metal material to be connected to an end portion of the busbar. A welded portion between the end portion of the busbar and the welded member is configured by pressure welding between end surfaces butted against each other.

Abstract: A chip on film, a display panel, and a method of manufacturing the display panel are provided. The chip on film includes a flexible film and a driver chip. The flexible film includes at least a first group of lines and a second group of lines. M lines of the first group of lines are electrically connected to pins of the driver chip to form driver lines; and N lines of the second group of lines are not electrically connected to any pin of the driver chip, serving as nominal lines. By arranging the nominal lines, a conventional bonding machine may be applied to bond the chip on film to the display substrate. Costs for modifying the bonding machine may be reduced, and application scenarios of the chip on film may be increased.

Abstract: An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits. Some embodiments of the multi-cell converter comprise integrated secondary-side switching devices comprising control circuitry that monitors circuit conditions to determine when the switching device is to be ON and OFF, thereby eliminating the need for secondary-side switch control signals and signal buses, primary-to-secondary interface circuitry and centralized drive circuitry.

Abstract: A method for manufacturing a fan-out chip packaging structure with decreased use of a crack-inducing hot-soldering process includes a first carrier plate with first and a second outer wiring layers. Two first conductive posts are formed on the first outer wiring layer, one end of each post is electrically connected to the first outer wiring layer. A receiving groove is formed between first conductive posts, and a sidewall of each post is surrounded by a first insulating layer. An embedded component is laid in the receiving groove and a second carrier plate is formed on the first insulating layer, wherein the second carrier plate carries third and fourth outer wiring layers. A first outer component is connected to the second outer wiring layer, and a second outer component is connected to the fourth outer wiring layer.

Abstract: A support for mounting an accessory equipment assembly with one or more accessory equipment units, such as current transformer units, to a base of a bushing includes a conductor surrounded by an insulator part such that each of the accessory equipment units is positioned in a defined way regarding the conductor, wherein said support includes aligning means for aligning each individual accessory equipment unit separately with respect to the conductor. A corresponding accessory equipment module includes an accessory equipment assembly with one or more accessory equipment units, such as current transformer units, and a support for mounting the accessory equipment assembly as well as a bushing unit including a bushing and said kind of accessory equipment module.

Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.

Abstract: Anchor conductors extending from internal terminal conductors and being in contact with a component body are provided inside the component body. The anchor conductors are provided so as not to be connected to a coil conductor including a circulating portion, and so as not to be exposed on an outer surface of the component body. The anchor conductors are in contact with the component body to thereby enhance fixing force of the internal terminal conductors to the component body.

Abstract: [Object] The present invention provides a joined conductor and a method for manufacturing a joined conductor that can improve electrical conductivity between conductors.

Abstract: A fixing structure of a wiring member includes an adhesive member, a wire-like transmission member, and an adherent. The adhesive member includes a planar base body having conductivity, a first hot-melt adhesive agent provided on one main surface of the base body, and a second hot-melt adhesive agent provided on another main surface of the base body. The base body can generate heat by induction heating using an induction heating apparatus. The wire-like transmission member is bonded to the first hot-melt adhesive agent in the adhesive member on a side of the one main surface of the base body. The adherent is bonded to the second hot-melt adhesive agent in the adhesive member on a side of the another main surface of the base body.

Abstract: One aspect of the present invention is a coil component comprising: a magnetic substrate formed with magnetic metal particles containing Fe, Si and Cr, and a bonding layer containing oxygen and nitrogen that bonds the magnetic metal particles to each other; and a conductor arranged inside or on the surface of the magnetic substrate.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component, a first power regulator disposed above the first electronic component. The first power regulator is configured to receive a first power along a lateral surface of the first electronic component without passing the first electronic component and to provide a second power to the first electronic component. The electronic device also includes a passive component disposed in an electrical path between the first electronic component and the first power regulator.

Abstract: An integrated electronic switch includes an input unit and a circuit board. The input unit is configured to receive a drive signal output by a user. A sensing module for sensing the drive signal transmitted from the input unit, and a control module electrically connected to the sensing module are disposed on the circuit board, where the sensing module and the control module are disposed on a first side surface of the circuit board.

Abstract: A power module includes at least one power semiconductor element between first and second conductive layers, a first cooling member on the first conductive layer, a second cooling member under the second conductive layer, and at least one snubber capacitor between the first and second conductive layers. Each snubber capacitor has a capacitor core between first and second electrodes and first and second transition layers. The first transition layer is between the first conductive layer and the first electrode and the second transition layer is between the second electrode and the second conductive layer, or the first transition layer is between the first electrode and the capacitor core and the second transition layer is between the capacitor core and the second electrode. The first and second transition layers are conductive. A thermal expansion coefficient of the transition layers is between thermal expansion coefficients of adjacent elements of the snubber capacitor.

Abstract: A contacting device for electrical contacting of a printed circuit board with a coil body for a solenoid valve for a brake device for a vehicle, including: a helical electrically conductive contact spring which is configured to be contacted or being contactable with the printed circuit board at a first spring end and configured to be contacted or being contactable with the coil body at a second spring end, situated opposite the first spring end, to enable a resilient electrical contacting of the printed circuit board with the coil body; and a pin which is receivable or has been received in an interior space of the contact spring, the pin being configured to support the contact spring from the interior space in a received state received in the interior space. Also described are a related solenoid valve, method, and computer readable storage medium.

Abstract: An illustrative example embodiment of an electronic device includes an integrated circuit component having a plurality of solder balls on one side. The substrate includes a first side adjacent the one side of the integrated circuit component. The substrate includes a plurality of openings. At least some of those openings are aligned with the solder balls. A cooling plate is situated toward a second side of the substrate. A thermally conductive material within the plurality of openings is thermally coupled with the cooling plate. At least some of the thermally conductive material is thermally coupled with the solder balls.

Abstract: Provided are a printed circuit board, a display device and a method of manufacturing a display device. The printed circuit board includes a base film including a first surface and a second surface, lead lines disposed on the first surface of the base film, and a first cover layer that covers at least a part of the lead lines and includes fill-in portions disposed between the lead lines. Each of the fill-in portions has a surface height less than a surface height of each of the lead lines with respect to the first surface of the base film.

Abstract: A wind turbine including a plurality of elements including a tower, a nacelle mounted to the tower and a plurality of blades rotatable mounted to the nacelle is provided. At least one element of the tower, the nacelle and the blades includes a coaxial impedance member coaxially arranged about an axis of the element.