Abstract: A coil component includes: a core part including: a winding shaft; and a flange part provided on an axial-direction end of the winding shaft, which has an exterior face on the opposite side of the winding shaft, first and second side faces, and first and second groove parts provided on the exterior face and having a cut-out part on each the first and second side faces; a coil part including: a winding part of a conductor wound around the winding shaft; and two lead parts of the conductor led out from the winding part; and two terminal parts formed on the exterior face of the flange part; wherein the two lead parts are led in from the cut-out parts on the first and second side faces and fitted inside the groove parts, respectively, on the exterior face, and included in the pair of terminal parts, respectively.

Abstract: An icosahedral LED display screen belongs to the field of display screens and includes multiple cabinet main frames. Each cabinet main frame is formed with an accommodating cavity. A side of each cabinet main frame is provided with a flexible PCB, an outer side of the flexible PCB is disposed with LEDs, and an inner side of the flexible PCB is provided with a magnet fixedly therewith. The multiple e.g., twenty cabinet main frames are mutually connected to form an icosahedral sphere which has no end point similar to a football, and polygons that make up the sphere are the same, and therefore the cabinet main frames can be completely covered by the flexible PCBs to eliminate a missing of display at an endpoint and reduce design numbers and complexities of the cabinet main frames and the flexible PCBs. An installation of the LED display screen becomes more convenient.

Abstract: A power semiconductor package comprises a lead frame, a semiconductor chip, and a molding encapsulation. The lead frame comprises an elevated section comprising a source section; a drain section; and a plurality of leads. The semiconductor chip includes a metal-oxide-semiconductor field-effect transistor (MOSFET) disposed over the lead frame. The semiconductor chip comprises a source electrode, a drain electrode, and a gate electrode. The source electrode of the semiconductor chip is electrically and mechanically connected to the source section of the elevated section of the lead frame. The semiconductor chip is served as a low side field-effect transistor as a flipped-chip connected to a heat sink by a first thermal interface material. A high side field-effect transistor is connected to the heat sink by a second thermal interface material. The low side field-effect transistor and the high side field-effect transistor are mounted on a printed circuit board.

Abstract: A microphone includes a base, at least one sound receiving element, and a flexible circuit board. The base has a plurality of supporting portions, a plurality of damping portions, and a bearing portion. The plurality of supporting portions are spaced apart from each other. Each of the plurality of damping portions is disposed on an inner surface of the corresponding supporting portion. The bearing portion is connected to the plurality of damping portions and is suspended between the plurality of supporting portions. The at least one sound receiving element is disposed on the base. The flexible circuit board is disposed on the base and has a first transmission segment. The first transmission segment is electrically coupled to the at least one sound receiving element, and the first transmission segment has a plurality of bending sections.

Abstract: An electrical connection assembly includes an electrical box including a housing having an internal surface defining an internal volume of the housing. An electrical connector is positioned outside the internal volume of the housing and fixed to the housing with a fastener. The housing includes an aperture having an opening defining an insertion path extending from a location external to the housing along a frame of the electrical connector to a location within the internal volume of the housing. The assembly includes a disc mechanically secured to the housing relative to the opening to obstruct the insertion path. A retainer and a bushing including a membrane for the electrical connector as well as methods of making an electrical connector are also provided.

Abstract: An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.

Abstract: In one embodiment, an electronic assembly can include: a first electronic device package configured to be mounted on and electrically connected with a system substrate; a second electronic device package electrically connected to the system substrate; and an electrical pathway configured to extend from the system substrate through the first electronic device package and connected to an input terminal of the second electronic device package, the electrical pathway bypassing processing circuitry of the first electronic device package.

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: A superconducting device which includes a substrate, multiple niobium leads formed on the substrate, a niobium silicide (NbSix) passivation layer formed on a surface of at least one of the multiple niobium leads, and an aluminum lead formed directly on at least a portion of the NbSix passivation layer such that an interface therebetween is substantially free of oxygen and oxidized material, where the multiple niobium leads and the aluminum lead are constructed to carry a supercurrent while in use.

Abstract: Disclosed are an electronic component package, an electronic assembly, and a voltage regulation module. The electronic component package includes a substrate and a first electronic component. The substrate includes a first surface and a second surface; wherein the first surface is arranged with a first conductive layer, and the second surface is arranged with a second conductive layer. The substrate defines a first conductive hole connected to the first conductive layer and a second conductive hole connected to the second conductive layer. The first electronic component is received in the substrate and arranged with a first electrical connection terminal and a second electrical connection terminal; the first electrical connection terminal is connected to the first conductive layer through the first conductive hole, and the second electrical connection terminal is connected to the second conductive layer through the second conductive hole. The first electronic component is a passive electronic component.

Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including conductor pads, an underlayer formed on one of the conductor pads and including a metal different from a metal of the conductor layer, a solder resist layer formed on the base layer such that the solder resist layer is covering the conductor layer and has openings exposing the conductor pads, and a bump formed directly on a first conductor pad of the conductor pads and including a base plating layer formed in a first opening of the openings and a top plating layer formed on the base plating layer such that a metal of the base plating layer is same as the metal of the conductor layer. The conductor pads include a second conductor pad such that the second conductor pad is the one of the conductor pads having the underlayer.

Abstract: Disclosed herein is a transport system, comprising an electrified cable system, a carriage supported by a non-electrified static cable, an electrical drive system incorporated into the carriage, the electrical drive system being utilized to move the carriage along the non-electrified static cable, a transconnector configured to supply electrical power to the carriage, and a power distribution panel. Corresponding methods of making and using the system also are disclosed.

Abstract: A module includes a wiring board having a first main surface, a first component mounted on the first main surface and having a first height H1, a second component mounted on the first main surface and having a second height H2 lower than the first height H1, and a sealing resin arranged so as to cover the first component and the second component while covering the first main surface. Compared to a first connection terminal used for connection between the first component and the first main surface, a second connection terminal used for connection between the second component and the first main surface has a higher height. A surface of the first component on a side far from the first main surface and a surface of the second component on a side far from the first main surface are exposed from the sealing resin.

Abstract: According to one configuration, an inductor device comprises: core material and one or more electrically conductive paths. The core material is magnetically permeable and surrounds (envelops) the one or more electrically conductive paths. Each of the electrically conductive paths extends through the core material of the inductor device from a first end of the inductor device to a second end of the inductor device. The magnetically permeable core material is operative to confine (guide, carry, convey, localize, etc.) respective magnetic flux generated from current flowing through a respective electrically conductive path. The core material stores the magnetic flux energy (i.e., first magnetic flux) generated from the current flowing through the first electrically conductive path.

Abstract: A display panel includes a plastic substrate and a first inner lead bonding (ILB) electrode on the plastic substrate. The first ILB electrode includes a first bonding segment, a second bonding segment, and a first connection segment. The first bonding segment is extended in a first direction oblique to a vertical direction of the display panel. The first connection segment is configured to provide an electrical connection between the first bonding segment and the second bonding segment. The first ILB electrode is configured to be bonded to an integrated circuit chip using one of the first bonding segment or the second bonding segment.

Abstract: The present disclosure relates to an electronic component, a voltage regulation module and a voltage stabilizer. The electronic component may include a substrate, a first electronic element and a second electronic element. The substrate may be provided with a first surface and a second surface that are opposite to each other. The first electronic element may be embedded in the substrate, and may be provided with a first electrical connection terminal and a second electrical connection terminal. The first electrical connection terminal may connect with a first surface of the substrate, the second electrical connection terminal may connect with a second surface of the substrate. The second electronic element may be arranged on the second surface of the substrate and electrically connected to the second electrical connection terminal. The second electronic element may form a stack with the substrate along the first direction.

Abstract: An electronic device including a waterproof structure is provided. The electronic device includes a housing that includes a first face, a second face that faces in a direction substantially opposite to the first face, and a side surface that at least partially encloses a space between the first face and the second face, a middle plate arranged between the first face and the second face inside the housing to be substantially parallel to the first face, extending from the side surface, and including at least one opening, a printed circuit board arranged between the middle plate and the second face, a display arranged between the middle plate and the first face, and including a face directed toward the second face, and a seal member configured to hermetically seal the at least one opening of the middle plate, and arranged between the face of the display and the middle plate.

Abstract: An circuit board assembly includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

Abstract: An embedded module according to the present invention includes a base substrate having a multi-layer wiring, at least two semiconductor chip elements having different element thicknesses, each of the semiconductor chip element having a first surface fixed to the base substrate and having a connection part on a second surface, an insulating photosensitive resin layer enclosing the semiconductor chip elements on the base substrate and being formed by a first wiring photo via, a second wiring photo via, and a wiring, the first wiring photo via electrically connected to the connection part of the semiconductor chip elements, the second wiring photo via arranged at the outer periphery of each of the semiconductor chip elements and electrically connected to a connection part of the base substrate, the wiring arranged so as to be orthogonal to and electrically connected to the first wiring photo via and the second wiring photo via.