Abstract: A jumper chip component is designed to be mounted onto a printed board. The jumper chip component includes a base, a conductor, and an end face electrode. The base has electrical insulation properties. The conductor is disposed on a lower surface, facing the printed board, of the base to extend from a first end of the lower surface through a second end, facing the first end, of the lower surface. The end face electrode is disposed on at least a side surface of the base and arranged to be electrically connected to the conductor. The jumper chip component has one surface facing the printed board. The one surface is a flat surface.

Abstract: A mount for mounting a vehicle electric control module to a vehicle structure, the mount includes: a base configured to couple to the vehicle electric control module; a clip coupled to the base, the clip including a cantilever extending from the base and a snap coupled to the cantilever to be spaced apart from the base, the snap including an engagement surface facing the base and configured to engage the vehicle structure with a snap fit; and a hook coupled to the base, the hook including a contact surface facing the base and configured to contact the vehicle structure.

Abstract: This disclosure relates generally to a reusable actuating device utilizing multiple integrated planar shape memory alloy elements integrated with independent driver circuits and at least one return spring integrated onto a single multi-layer PCB with a novel layout to create an electrically and mechanically redundant integrated actuator solution uniquely suited for use in low-profile devices that can be utilized by themselves or as an initiator in a staged device to release higher loads. The apparatus of the invention is particularly useful for spacecraft and other vehicular actuation devices.

Abstract: A solder connection between a coaxial cable and a printed circuit board arrangement. The coaxial cable comprises an inner conductor, an outer conductor and a dielectric arranged in between. The printed circuit board arrangement comprises an outer conductor contact area and an inner conductor contact area. The outer conductor contact area comprises an outer conductor receiving opening. The coaxial cable runs at an angle to the printed circuit board arrangement, wherein a part of the outer conductor is arranged in the outer conductor receiving opening and wherein the inner conductor is arranged at the inner conductor contact area. A first solder joint connects the outer conductor to the outer conductor contact area. A second solder joint connects the inner conductor to the inner conductor contact area.

Abstract: An electrical assembly is constructed for mounting an electrical wiring device at an incline with respect to a support. The assembly includes a mounting bracket for receiving and supporting the electrical wiring device. The mounting bracket is received in a recess open end of a support, such as the open end of an adapter for an electrical box. The mounting bracket is coupled directly to the support. A weatherproof cover overlies the electrical wiring device and the bracket for closing the electrical wiring device and providing a weatherproof seal between the cover and the support.

Abstract: A packaging substrate can include a first surface having a first mounting region of a first electronic module region and a second mounting region of a second electronic module region, the second electronic module region being adjacent to the first electronic module region. The packaging substrate can include a second opposing surface having a first electrical contacts region of the first electronic module region and a second electrical contacts region of the second electronic module region. A saw street region can extend between the first and second electronic module regions, and a saw street feature can be formed on the second opposing surface within at least a portion of the saw street region, the saw street feature comprising a solder mask layer over a metal layer and being spaced from the first and second electronic module regions.

Abstract: Techniques, elements, and assemblies for high current board-level conductive pathways on printed circuit boards are provided. In one example, a method includes providing a circuit board having footprint elements that define a route between endpoints. The method includes applying solder paste onto the footprint elements, and placing modular conductive blocks along the route onto the solder paste associated with the footprint elements. The method also includes forming, by at least a solder reflow operation, an assembly comprising the circuit board and the modular conductive blocks that establishes a conductive pathway along the route with series coupling of the modular conductive blocks to each other.

Abstract: According to an embodiment, an electronic device includes: a first printed circuit board (PCB), a second PCB spaced apart from the first PCB, and a flexible printed circuit board (FPCB) connecting the first printed circuit board and the second printed circuit board. The electronic device includes a support plate including a hole through which a portion of the FPCB passes, and a waterproof member comprising a waterproof material disposed in the hole. The flexible printed circuit board includes a first connector connected the first PCB, a second connector, and a slit separating the first connector and the second connector. A portion of the slit may be disposed in the waterproof member.

Abstract: An optical package includes: a Printed Circuit Board (PCB) including a plurality of cut-out sections; a lens, including a first plurality of protrusions corresponding respectively to the plurality of cut-out sections, wherein the first plurality of protrusions includes three protrusions being guide posts, a first protrusion of the first plurality of protrusions is formed on a first side of the lens, and a second protrusion of the first plurality of protrusions is formed on a second side of the lens opposite to the first side, and when the lens is placed under the PCB, the first plurality of protrusions will pass through the cut-out sections; and a sensor for attaching on to the lens and the PCB.

Abstract: A semiconductor device includes a first insulated circuit board that is rectangular with first to fourth sides, including a first input wiring board and a first output wiring board each extending in a first direction parallel to the first side and being adjacent to each other. The first output wiring board includes a first output region electrically connected to a first output terminal and a first connection wiring region electrically connected to the output electrodes of the plurality of first semiconductor chips and being closer to the second side than is the first output region. The first connection wiring region has a first slit extending in the first direction from an end of the first connection wiring region at a side thereof where the first output region is located.

Abstract: Embodiments of the present disclosure relate to the technical field of PCBs, and in particular, relate to a method for manufacturing a stub-free via hole, a PCB, an electronic device, and a non-transitory readable storage medium. The method for manufacturing a stub-free via hole comprises: acquiring a target copper plating length of a to-be-opened via hole; forming a through-hole at a position of the to-be-opened via hole along a thickness direction of a PCB; blocking the through-hole to form a blind hole, so that a distance from a bottom of the blind hole to a surface of the PCB is equal to the target copper plating length; and performing copper plating on an inner wall of the blind hole to form a via hole.

Abstract: A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, wherein the coating layer includes a first functional group bonded to the first insulating layer, and a second functional group bonded to the first metal layer.

Abstract: An electronic component unit includes: a connection unit including a connector; an electrical connection box including a mating connector connected to the connector; and a first positioning portion including a protrusion provided on the electrical connection box and having a first through hole fastened with a bolt, and a pocket portion provided in the connection unit and having an insertion space portion into which the protrusion is inserted and a second through hole which is aligned with the first through hole in a fastening direction and into which the bolt is inserted.

Abstract: A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern, and a first ground pattern that are disposed on the second main surface and extend along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern, and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer and a second conductor layer.

Abstract: A wiring board includes an insulation layer and an electrical conductor layer that are layered. The insulation layer is a glass ceramic. The electrical conductor layer is a sintered body of a plurality of crystallites containing copper as a main component. The plurality of crystallites include polygonal crystallites having linear sides. The plurality of crystallites are in contact with each other via the linear sides as grain boundaries.

Abstract: A wiring substrate includes a first insulating layer, a conductor layer formed on the first insulating layer and including a wiring pattern, an organic coating film formed on the conductor layer such that the organic coating film is formed on the wiring pattern of the conductor layer, and a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer. The conductor layer is formed such that the wiring pattern has a polished surface on the opposite side with respect to the first insulating layer, and the organic coating film is formed on the wiring pattern of the conductor layer such that the organic coating film is covering the polished surface of the wiring pattern.

Abstract: An electronic device is provided and includes a backplane assembly, a detachable assembly and a locking assembly. The detachable assembly is detachably assembled with the backplane assembly. A slot is formed on the detachable assembly. The locking assembly is disposed between the backplane assembly and the detachable assembly for locking the detachable assembly on the backplane assembly. The locking assembly includes a latch component pivotally disposed on the backplane assembly. An end of the latch component is configured to stretch into the detachable assembly through the slot. The end of the latch component engages with the slot for restraining the detachable assembly from being detached from the backplane assembly when the latch component is located at a locking position. Besides, a related backplane assembly kit and a related detachable assembly kit are also provided.

Abstract: This application discloses a printed circuit board, a battery module, a battery pack, and an electrical device. The printed circuit board may include: a substrate, a pad, a solder paste layer, a component body, and a support assembly. The pad may be disposed above the substrate. The solder paste layer may be disposed above the pad. The component body may be disposed above the solder paste layer. The support assembly may be disposed between the pad and the component body to form a degassing space between the component body and the solder paste layer.

Abstract: A shock absorber for a printed circuit board (PCB) includes a first portion and a second portion. The first portion is positioned on a first side of the PCB at or near a connector that extends from the PCB. The second portion is positioned on a second side of the PCB, opposite the first portion. The first and second portions prevent the PCB from moving when the PCB is coupled to a host device. As the PCB is subjected to various movements, strains and stresses, the shock absorber prevents the PCB from cracking or breaking, especially at or near the connector, which is susceptible to cracking and breaking.

Abstract: A printed circuit board (PCB) land pad for a three-pin metal-oxide-semiconductor field-effect transistor (MOSFET) component comprises four pads with a split pad for a drain terminal of the MOSFET component. The PCB land pad comprises: a first pad to connect a gate terminal of the MOSFET component to a PCB; a second pad to connect a source terminal of the MOSFET component to the PCB; a third pad corresponding to connect a drain terminal of the MOSFET component to the PCB; and a fourth pad to connect the drain terminal of the MOSFET component to the PCB.