Abstract: A packaging substrate can include a first surface having a first mounting region of a first electronic module region and a second mounting region of a second electronic module region, the second electronic module region being adjacent to the first electronic module region. The packaging substrate can include a second opposing surface having a first electrical contacts region of the first electronic module region and a second electrical contacts region of the second electronic module region. A saw street region can extend between the first and second electronic module regions, and a saw street feature can be formed on the second opposing surface within at least a portion of the saw street region, the saw street feature comprising a solder mask layer over a metal layer and being spaced from the first and second electronic module regions.

Abstract: Techniques, elements, and assemblies for high current board-level conductive pathways on printed circuit boards are provided. In one example, a method includes providing a circuit board having footprint elements that define a route between endpoints. The method includes applying solder paste onto the footprint elements, and placing modular conductive blocks along the route onto the solder paste associated with the footprint elements. The method also includes forming, by at least a solder reflow operation, an assembly comprising the circuit board and the modular conductive blocks that establishes a conductive pathway along the route with series coupling of the modular conductive blocks to each other.

Abstract: According to an embodiment, an electronic device includes: a first printed circuit board (PCB), a second PCB spaced apart from the first PCB, and a flexible printed circuit board (FPCB) connecting the first printed circuit board and the second printed circuit board. The electronic device includes a support plate including a hole through which a portion of the FPCB passes, and a waterproof member comprising a waterproof material disposed in the hole. The flexible printed circuit board includes a first connector connected the first PCB, a second connector, and a slit separating the first connector and the second connector. A portion of the slit may be disposed in the waterproof member.

Abstract: An optical package includes: a Printed Circuit Board (PCB) including a plurality of cut-out sections; a lens, including a first plurality of protrusions corresponding respectively to the plurality of cut-out sections, wherein the first plurality of protrusions includes three protrusions being guide posts, a first protrusion of the first plurality of protrusions is formed on a first side of the lens, and a second protrusion of the first plurality of protrusions is formed on a second side of the lens opposite to the first side, and when the lens is placed under the PCB, the first plurality of protrusions will pass through the cut-out sections; and a sensor for attaching on to the lens and the PCB.

Abstract: A semiconductor device includes a first insulated circuit board that is rectangular with first to fourth sides, including a first input wiring board and a first output wiring board each extending in a first direction parallel to the first side and being adjacent to each other. The first output wiring board includes a first output region electrically connected to a first output terminal and a first connection wiring region electrically connected to the output electrodes of the plurality of first semiconductor chips and being closer to the second side than is the first output region. The first connection wiring region has a first slit extending in the first direction from an end of the first connection wiring region at a side thereof where the first output region is located.

Abstract: Embodiments of the present disclosure relate to the technical field of PCBs, and in particular, relate to a method for manufacturing a stub-free via hole, a PCB, an electronic device, and a non-transitory readable storage medium. The method for manufacturing a stub-free via hole comprises: acquiring a target copper plating length of a to-be-opened via hole; forming a through-hole at a position of the to-be-opened via hole along a thickness direction of a PCB; blocking the through-hole to form a blind hole, so that a distance from a bottom of the blind hole to a surface of the PCB is equal to the target copper plating length; and performing copper plating on an inner wall of the blind hole to form a via hole.

Abstract: A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, wherein the coating layer includes a first functional group bonded to the first insulating layer, and a second functional group bonded to the first metal layer.

Abstract: An electronic component unit includes: a connection unit including a connector; an electrical connection box including a mating connector connected to the connector; and a first positioning portion including a protrusion provided on the electrical connection box and having a first through hole fastened with a bolt, and a pocket portion provided in the connection unit and having an insertion space portion into which the protrusion is inserted and a second through hole which is aligned with the first through hole in a fastening direction and into which the bolt is inserted.

Abstract: A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern, and a first ground pattern that are disposed on the second main surface and extend along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern, and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer and a second conductor layer.

Abstract: A wiring board includes an insulation layer and an electrical conductor layer that are layered. The insulation layer is a glass ceramic. The electrical conductor layer is a sintered body of a plurality of crystallites containing copper as a main component. The plurality of crystallites include polygonal crystallites having linear sides. The plurality of crystallites are in contact with each other via the linear sides as grain boundaries.

Abstract: A wiring substrate includes a first insulating layer, a conductor layer formed on the first insulating layer and including a wiring pattern, an organic coating film formed on the conductor layer such that the organic coating film is formed on the wiring pattern of the conductor layer, and a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer. The conductor layer is formed such that the wiring pattern has a polished surface on the opposite side with respect to the first insulating layer, and the organic coating film is formed on the wiring pattern of the conductor layer such that the organic coating film is covering the polished surface of the wiring pattern.

Abstract: An electronic device is provided and includes a backplane assembly, a detachable assembly and a locking assembly. The detachable assembly is detachably assembled with the backplane assembly. A slot is formed on the detachable assembly. The locking assembly is disposed between the backplane assembly and the detachable assembly for locking the detachable assembly on the backplane assembly. The locking assembly includes a latch component pivotally disposed on the backplane assembly. An end of the latch component is configured to stretch into the detachable assembly through the slot. The end of the latch component engages with the slot for restraining the detachable assembly from being detached from the backplane assembly when the latch component is located at a locking position. Besides, a related backplane assembly kit and a related detachable assembly kit are also provided.

Abstract: This application discloses a printed circuit board, a battery module, a battery pack, and an electrical device. The printed circuit board may include: a substrate, a pad, a solder paste layer, a component body, and a support assembly. The pad may be disposed above the substrate. The solder paste layer may be disposed above the pad. The component body may be disposed above the solder paste layer. The support assembly may be disposed between the pad and the component body to form a degassing space between the component body and the solder paste layer.

Abstract: A shock absorber for a printed circuit board (PCB) includes a first portion and a second portion. The first portion is positioned on a first side of the PCB at or near a connector that extends from the PCB. The second portion is positioned on a second side of the PCB, opposite the first portion. The first and second portions prevent the PCB from moving when the PCB is coupled to a host device. As the PCB is subjected to various movements, strains and stresses, the shock absorber prevents the PCB from cracking or breaking, especially at or near the connector, which is susceptible to cracking and breaking.

Abstract: A printed circuit board (PCB) land pad for a three-pin metal-oxide-semiconductor field-effect transistor (MOSFET) component comprises four pads with a split pad for a drain terminal of the MOSFET component. The PCB land pad comprises: a first pad to connect a gate terminal of the MOSFET component to a PCB; a second pad to connect a source terminal of the MOSFET component to the PCB; a third pad corresponding to connect a drain terminal of the MOSFET component to the PCB; and a fourth pad to connect the drain terminal of the MOSFET component to the PCB.

Abstract: An electronic device is provided. The electronic device includes a tunable circuit. The tunable circuit includes a first substrate, a tunable component, a first signal terminal, a second signal terminal, a first control terminal, and a second control terminal. The tunable component includes a first terminal and a second terminal. The first signal terminal is coupled to the first terminal of the tunable component. The second signal terminal is coupled to the second terminal of the tunable component. The first control terminal is coupled to the first terminal of the tunable component. The second control terminal is coupled to the second terminal of the tunable component. At least a portion of the tunable circuit is formed on the first substrate.

Abstract: A circuit board is suitable for mounting an electronic package. The circuit board includes a power layer and a circuit board surface which includes a package region corresponding to the electronic package. The package region is rectangular and includes four sides. The power layer includes a first power plane, a second power plane, a third power plane, and the forth power plane. An orthographic projection of the second power plane on the circuit board surface extends from outside into the package region and extending through at least three of the sides. An area of the orthogonal projection of the second power plane on the circuit board surface in the package region is greater than areas of the orthogonal projections of the other power planes on the circuit board surface in the package region. In addition, an electronic assembly including the circuit board and the electronic package is also provided.

Abstract: A subsea cable repair system comprises a first wet mate connector part (11) and a second wet mate connector part (14). The first and second wet mate connector parts comprise a receptacle and a plug. Separate lengths of oil filled hose (12) are attached to one end of each of the first and second connector parts (11, 14) and a cable termination (13) is attached to the other end of each of the separate lengths of oil filled hose.

Abstract: An electrical bus system has a trunk bus that includes at least one positive bus line, an equal number of negative bus line, and a ground cable. The trunk bus lines extend through clamping blocks where some of the clamping blocks are coupled to brackets that are themselves coupled to vertical supports. The ground cable is coupled to vertical support using the bracket. Multi-tap shear bolt connectors are used to connect the trunk bus line to photovoltaic wires carrying the output from one or more solar panel arrays, thereby eliminating the need for combiner boxes used in conventional systems.

Abstract: A system for occupancy detection and prediction is disclosed. The system may include a modular control unit configured to control power to at least one load device, which may include a device control assembly configured to be removably coupled to a backplate. The device control assembly may include an occupancy sensor configured to detect a current occupancy state of a detection zone. The device control assembly may be configured to determine occupancy routines based on historical occupancy states of the detection zone and to predict future occupancy states. The device control assembly may be configured to control the power to the at least one load device based on the predicted future occupancy states.