Patents Examined by Stanley Tso
  • Patent number: 11368006
    Abstract: A clip includes first and second portions that are joined to one another by a living hinge. A snap includes first and second coupling elements that are respectively provided on the first and second portions. The first and second coupling elements are decoupled from one another in an open clip position and are coupled to one another in a closed clip position. Each of the first and second portions define an elongated slot that extends through a width of the clip that has an open end and a closed end. The open ends face a same direction. Each of the first and second portions include a first and second spring respectively. The first and second springs face one another. The first and second springs are configured to clamp about a wiring in the closed clip position.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: June 21, 2022
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: David R. Peterson, Joseph Sudik, Jr.
  • Patent number: 11343917
    Abstract: Provided is an air conditioner capable of preventing a soldering defect when a circuit element is installed on a circuit board. The air conditioner includes a circuit board configured to form a circuit, a choke coil installed on the circuit board and having a wire wound around on a core, and a support device installed at a lower side of the choke coil to support the choke coil, and provided with a through-hole allowing the wire to pass therethrough, wherein the support device includes a support portion that protrudes from a lower surface of the support device to support the choke coil installed on the circuit board at an interval from the circuit board, the support portion disposed to be spaced apart from the through-hole in a direction away from an outer edge of the support device.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: May 24, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Yong Hoon Kim
  • Patent number: 11343923
    Abstract: A screen supporting device includes: a drive component and a supporting component rotationally connected to the drive component. The drive component comprises a rotating shaft and a connecting rod that rotationally connected to the rotating shaft. The drive component and the supporting component are disposed in a non-display surface of the flexible display screen. The connecting rod is fixedly connected to the supporting component. Through the rotating connection between the rotating shaft and the connecting rod, the supporting component and the drive component relatively rotate and move away from each other to fold or expand the flexible display screen.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: May 24, 2022
    Assignee: YUNGU (GU'AN) TECHNOLOGY CO., LTD.
    Inventors: Hongqi Hou, Yongfeng Zhao, Fu Liao, Liwei Ding, Xuebin Li, Zhaoji Zhu
  • Patent number: 11337315
    Abstract: A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has L* of a CIE L*a*b* color space of 44.0 to 84.0. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to a surface of the surface treated copper foil 1 opposite to the first surface treatment layer 3.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: May 17, 2022
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Nobuaki Miyamoto, Atsushi Miki
  • Patent number: 11329469
    Abstract: An apparatus for limiting event energy in an underground structure having free space includes: an inner layer configured to envelope and seal an interior volume; an outer layer configured to envelope the inner layer; and, wherein the interior volume includes a volume-occupying material, having a solid material, a semi-solid material, a gaseous material, or any combination of the solid, the semi-solid, and the gaseous material.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: May 10, 2022
    Assignee: CONSOLIDATED EDISON COMPANY OF NEW YORK, INC.
    Inventors: Michael Donohue, Colleen Murach, Stanley Lewis
  • Patent number: 11322803
    Abstract: A busbar system is configured to carry current, such as, for example, in a battery system. The busbar system includes two or more busbars, that interface at respective surfaces and are aligned by one or more alignment features. The one or more alignment features may include a boss feature such as a pin or other protrusion, a recess such as a hole, slot, or other recess feature, or both a boss feature and a recess feature. Each busbar may include an alignment feature that engages with the alignment feature of the other busbar to cause, maintain, or otherwise effect alignment. Alignment of the busbars ensures relative position, prevents relative motion, or both. The busbars are engaged with each other by positioning the busbars such that their mating surfaces can engage, and then engaging alignment features of the busbars to provide alignment of the busbars relative to each other.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: May 3, 2022
    Assignee: Rivian IP Holdings, LLC
    Inventor: Kyle O'Neil
  • Patent number: 11317867
    Abstract: A physiological characteristic sensor assembly includes a flexible top housing including a needle port having a central opening, and a flexible lower housing defining a sensor bore through the lower housing, the sensor bore coaxial with the central opening of the needle port. The physiological characteristic sensor assembly also includes an electrical subsystem disposed between the top housing and the lower housing. The electrical subsystem includes a flexible printed circuit board having a sensor contact pad, a physiological characteristic sensor and an electrically conductive adhesive patch. The physiological characteristic sensor has a distal end that extends through the needle port and a proximal end that includes at least one electrical contact. The conductive adhesive patch electrically and physically couples the at least one electrical contact of the physiological characteristic sensor to the sensor contact pad of the flexible printed circuit board.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: May 3, 2022
    Assignee: Medtronic MiniMed, Inc.
    Inventors: Ellis Garai, David Choy, David C. Antonio, Robert C. Mucic
  • Patent number: 11317506
    Abstract: A circuit board with high light reflectivity includes an inner wiring base board, a base board with a high light reflectivity, a first insulation layer, a first conductor layer, and a second insulation layer. A first opening in the inner wiring base board receives the base board. The first insulation layer is stacked on a surface of the inner wiring base board and defines a second opening corresponding in position to the first opening and exposing a portion of the base board. The first conductor layer is on a surface of the first insulation layer away from the inner wiring base board and includes connecting pads on the base board. The second insulation layer and the second conductor are stacked in that order on another surface of the inner wiring base board. A method for manufacturing the circuit board is also disclosed.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: April 26, 2022
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Jin-Cheng Wu, Mei-Hua Huang, Ning Hou, Hua-Ning Wang, Qiang Song, Rong-Chao Li
  • Patent number: 11317516
    Abstract: A method of manufacturing a flexible laminate electronic device and the flexible laminate electronic device itself is disclosed. The method includes placing electronic components over a flexible substrate layer that includes electrical connections between ones of the electronic components. A first flexible additive layer that includes apertures is positioned to align ones of the electronic components in respective ones of the apertures. A subsequent flexible additive layer is arranged over the first flexible additive layer and the apertures are aligned around respective portions of ones of the electronic components protruding above the first flexible additive layer. A flexible cover layer is emplaced over the subsequent flexible additive layer.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: April 26, 2022
    Inventors: Hendrik J Volkerink, Ajay Khoche
  • Patent number: 11297721
    Abstract: An electronic component comprising a body and at least one terminal for soldering the body to a carrier is provided, with the terminal comprising: an electrode arranged on a surface of the body; an outgassing layer formed on and/or surrounded by the electrode, wherein the outgassing layer is configured to outgas when being heated; and an electrically conductive cover layer formed on the outgassing layer, wherein the cover layer is electrically connected to the electrode and seals the outgassing layer in a gastight manner between the cover layer and the electrode.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: April 5, 2022
    Assignee: VISHAY ISRAEL LTD.
    Inventor: Michael Belman
  • Patent number: 11284540
    Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: March 22, 2022
    Assignee: Elbit Systems Ltd.
    Inventors: Oleg Naigertsik, Alex Fischman, Ian Engleman, Isaac Jak Kettner
  • Patent number: 11277923
    Abstract: A printed wiring board includes a conductor layer, an outermost resin insulating layer having a first surface and a second surface on the opposite side with respect to the first surface and laminated on the conductor layer such that the second surface faces the conductor layer, and metal posts formed in the outermost resin insulating layer such that the metal posts are penetrating through the outermost resin insulating layer and reaching the conductor layer. The metal posts include first metal posts and second metal posts such that each of the first metal posts has a first upper surface positioned above the first surface of the outermost resin insulating layer and having an entirely flat surface and that each of the second metal posts has a second upper surface positioned above the first surface of the outermost resin insulating layer and having a partly flat surface.
    Type: Grant
    Filed: November 27, 2020
    Date of Patent: March 15, 2022
    Assignee: IBIDEN CO., LTD.
    Inventors: Yukinobu Mikado, Tomoaki Shinozuka
  • Patent number: 11272645
    Abstract: An electronic device and an electromagnetic shielding frame are provided. The electromagnetic shielding frame includes a ring-shaped portion and a plurality of soldering tabs that extend from the ring-shaped portion along a protruding direction. The soldering tabs are spaced apart from each other and are in a ring-shaped arrangement. At least one of the soldering tabs has a patterned slot layout so as to be defined as a patterned tab. A portion of the patterned slot layout of the patterned tab arranged away from the ring-shaped portion has a layout distance. The patterned slot layout is arranged along a first direction and a second direction. The first direction and the protruding direction have a first angle therebetween that is smaller than 90 degrees, and the second direction and the protruding direction have a second angle therebetween that is smaller than 90 degrees.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: March 8, 2022
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Jen-Yung Chang, Tiao-Ming Hsu
  • Patent number: 11272610
    Abstract: A printed wiring board includes a first insulator, a second insulator, a first conductor, and a second conductor. The first conductor is between the first insulator and the second insulator. The first conductor contains a first conductive material. The second conductor includes a first portion. The first portion is between the first insulator and the first conductor. The first portion is in contact with the first conductor and extends along the first conductor. The second conductor contains a second conductive material. The second conductive material is lower in electrical resistivity than the first conductive material. The second insulator is closer to an outside of the printed wiring board than the first insulator is in a thickness direction of the printed wiring board.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: March 8, 2022
    Assignee: Kioxia Corporation
    Inventor: Daigo Suzuki
  • Patent number: 11231445
    Abstract: Provided is a sensor chip including: a board; a three-dimensional object provided on the board, the three-dimensional object being a cuboid or a cube having a first surface and a second surface facing the first surface and including an insulating material; a first coil provided on the first surface; a second coil provided on the second surface, the second coil being electrically connected to the first coil; and a magnetic measurement element provided in the three-dimensional object. Directions of magnetic fields generated in the first coil and the second coil by current for electrically conducting the first coil and the second coil are the same.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: January 25, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventor: Jia Liu
  • Patent number: 11229119
    Abstract: A printed circuit board includes a core layer having a first through-portion, a coil structure disposed in the first through-portion and comprising a support member, a first coil pattern in a planar spiral form disposed on one surface of the support member, and a body comprising a magnetic substance, wherein the support member and the first coil pattern are accommodated in the body, a first build-up layer covering at least a portion the core layer and disposed in at least a portion of the first through-portion, a first wiring layer disposed on one surface of the first build-up layer, and a first via layer passing through at least a portion of the first build-up layer and connected to the first wiring layer. The first via layer comprises a first wiring via connecting at least a portion of the first wiring layer to the first coil pattern.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: January 18, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ki Jung Sung, Tae Seong Kim, Jae Woong Choi
  • Patent number: 11228124
    Abstract: In some embodiments, connecting a component to a substrate by adhesion to an oxidized solder surface includes: forming one or more conductive solder connections between the component and one or more conductive portions of the substrate; adhering the component to an oxidized surface of a solder portion applied to the substrate.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: January 18, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Mark K. Hoffmeyer, Steven P. Ostrander, Thomas Weiss, Thomas E. Lombardi
  • Patent number: 11217440
    Abstract: A glass-metal feedthrough consists of an external conductor, a glass material and an internal conductor. The internal conductor has a coefficient of expansion ?internal, the glass material has a coefficient of expansion ?glass, and the external conductor has a coefficient of expansion ?external. The coefficient of expansion of the internal conductor ?internal is greater than the coefficient of expansion of the glass material ?glass and the coefficient of expansion of the external conductor ?external is at least 2 ppm/K, such as at least 4 ppm/K, greater than the coefficient of expansion of the glass material ?glass in the temperature range of 20° C. to the glass transformation temperature.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: January 4, 2022
    Assignee: Schott AG
    Inventor: Robert Hettier
  • Patent number: 11209945
    Abstract: In printed wiring that is formed, on a surface of a base member. by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: December 28, 2021
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi Sakaue
  • Patent number: 11205536
    Abstract: An electrical transformer system includes an electrical transformer and a depressurization system in fluid communication with an outlet of the electrical transformer. The depressurization system may include a rupture disk having a downwardly facing domed portion extending toward the outlet of the electrical transformer. The domed portion has an apex and a base with a retention portion surrounding the domed portion adjacent the base. A score line network extends circumferentially around the domed portion adjacent the base and spaced apart from the apex. The score line network includes a plurality of serrated score line segments and a plurality of hinge score line extending from the score line segments towards the apex of dome portion. The rupture disk may be interested into a housing assembly with a removable cover.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: December 21, 2021
    Assignee: SENTRY GLOBAL SOLUTIONS, INC.
    Inventors: Gerald D. Basore, William R. Kendrick