Patents Examined by Stanley Tso
  • Patent number: 12041715
    Abstract: A cover window includes a base layer including a first flat portion and a first bending portion bent from a first end of the first flat portion and a coating layer including a first coating portion disposed on the first flat portion and a second coating portion disposed on the first bending portion and having a thickness less than a thickness of the first coating portion. A first end of the second coating portion has a thickness greater than a thickness of a second end of the second coating portion, and the first end of the second coating portion is closer to the first coating portion than the second end of the second coating portion is.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: July 16, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyunseung Seo, Jihyun Ko, Dong-Sung Lee, Changmoo Lee, Jonghwan Cho
  • Patent number: 12033797
    Abstract: A discrete metal-insulator-metal (MIM) energy storage component, the energy storage component comprising: a MIM-arrangement comprising: a first electrode layer; a plurality of conductive nanostructures grown from the first electrode layer; a conduction controlling material covering each nanostructure in the plurality of conductive nanostructures and the first electrode layer uncovered by the conductive nanostructures; and a second electrode layer covering the conduction controlling material; a first connecting structure for external electrical connection of the capacitor component; a second connecting structure for external electrical connection of the capacitor component; and an electrically insulating encapsulation material at least partly embedding the MIM-arrangement.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: July 9, 2024
    Assignee: SMOLTEK AB
    Inventors: Vincent Desmaris, Rickard Andersson, Muhammad Amin Saleem, Maria Bylund, Anders Johansson, Fredrik Liljeberg, Ola Tiverman, M Shafiqul Kabir
  • Patent number: 12033544
    Abstract: Disclosed herein are a stretchable display panel and device and a manufacturing method thereof. The stretchable display panel comprises: a lower substrate having an active area and a non-active area surrounding the active area; a plurality of individual substrates disposed on the lower substrate and located in the active area; a plurality of pixels disposed on the plurality of individual substrates; and a connection line disposed between the plurality of individual substrates and the lower substrate, wherein the modulus of the plurality of individual substrates is higher than that of at least one part of the lower substrate, and wherein the connecting line extends to the bottom surface of the individual substrates, such that the connecting line electrically connects a pad disposed on the individual substrates without a step in the top surface of the connecting line. That is, the connecting line has a uniform height from the lower substrate for its entire length.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: July 9, 2024
    Assignee: LG Display Co., Ltd.
    Inventors: Eunah Kim, Hyunju Jung
  • Patent number: 12022610
    Abstract: The disclosure generally relates to a method of creating patterned metallic circuits (e.g., silver circuits) on a substrate (e.g., a ceramic substrate). A porous metal interlayer (e.g., porous nickel) is applied to the substrate to improve wetting and adhesion of the patterned metal circuit material to the substrate. The substrate is heated to a temperature sufficient to melt the patterned metal circuit material but not the porous metal interlayer. Spreading of molten metal circuit material on the substrate is controlled by the porous metal interlayer, which can itself be patterned, such as having a defined circuit pattern. Thick-film silver or other metal circuits can be custom designed in complicated shapes for high temperature/high power applications. The materials designated for the circuit design allows for a low-cost method of generating silver circuits other metal circuits on a ceramic substrate.
    Type: Grant
    Filed: February 10, 2022
    Date of Patent: June 25, 2024
    Assignee: BOARD OF TRUSTEES OF MICHIGAN STATE UNIVERSITY
    Inventors: Jason Dale Nicholas, Quan Zhou, Thomas Rector Bieler
  • Patent number: 12021342
    Abstract: A busbar system is configured to carry current, such as, for example, in a battery system. The busbar system includes two or more busbars, that interface at respective surfaces and are aligned by one or more alignment features. The one or more alignment features may include a boss feature such as a pin or other protrusion, a recess such as a hole, slot, or other recess feature, or both a boss feature and a recess feature. Each busbar may include an alignment feature that engages with the alignment feature of the other busbar to cause, maintain, or otherwise effect alignment. Alignment of the busbars ensures relative position, prevents relative motion, or both. The busbars are engaged with each other by positioning the busbars such that their mating surfaces can engage, and then engaging alignment features of the busbars to provide alignment of the busbars relative to each other.
    Type: Grant
    Filed: April 5, 2022
    Date of Patent: June 25, 2024
    Assignee: Rivian IP Holdings, LLC
    Inventor: Kyle O'Neil
  • Patent number: 12014012
    Abstract: In printed wiring that is formed, on a surface of a base member, by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: June 18, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi Sakaue
  • Patent number: 12002388
    Abstract: Disclosed herein are a stretchable display panel and device and a manufacturing method thereof. The stretchable display panel comprises: a lower substrate having an active area and a non-active area surrounding the active area; a plurality of individual substrates disposed on the lower substrate and located in the active area; a plurality of pixels disposed on the plurality of individual substrates; and a connection line disposed between the plurality of individual substrates and the lower substrate, wherein the modulus of the plurality of individual substrates is higher than that of at least one part of the lower substrate, and wherein the connecting line extends to the bottom surface of the individual substrates, such that the connecting line electrically connects a pad disposed on the individual substrates without a step in the top surface of the connecting line. That is, the connecting line has a uniform height from the lower substrate for its entire length.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: June 4, 2024
    Assignee: LG Display Co., Ltd.
    Inventors: Eunah Kim, Hyunju Jung
  • Patent number: 12004295
    Abstract: An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: June 4, 2024
    Assignee: Corning Incorporated
    Inventor: Shrisudersan Jayaraman
  • Patent number: 12003083
    Abstract: An electrical outlet assembly is mountable in a floor or work surface, and includes an upper bezel and a lower insert that are joined in a non-rigid manner that permits some adjustment to the spacing and/or tilt of the upper bezel relative to the lower insert. The upper bezel and lower insert are joined together by a plurality of fasteners extending between a plurality of fastener receivers coupled to the upper bezel, and to the lower insert. At least one end of each coupling fastener is loosely captured in such a way that when the coupling fasteners are fully secured, they are permitted to move axially relative to the fastener receiver or the lower insert. This allows the lower insert to be repositionable in its axial direction relative to the upper bezel, and also permits the lower insert to be tilted out of alignment with the upper bezel.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: June 4, 2024
    Inventor: Norman R. Byrne
  • Patent number: 12004294
    Abstract: A method of manufacturing a base plate includes the following steps: providing a first substrate, the first substrate including a first base layer, a first copper coating and a second copper coating covered on two sides of the first base layer; opening at least one first hole on the first substrate, the first hole penetrating the first base layer and the first copper; forming a first electroplated coating on the first copper coating, the first copper coating filling the first hole to form a first connecting portion; opening at least one second hole on the first connecting portion and the first electroplated coating to form a plurality of second connecting pins.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: June 4, 2024
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventor: Zhi Guo
  • Patent number: 12004298
    Abstract: Disclosed herein are devices, methods, and methods of making devices for facilitating condition monitoring of machinery allowing improve efficiencies and increased lifetime of the machinery while also reducing maintenance. In one embodiment, a device includes an enclosure assembly and a printed circuit board (PCB) assembly. The enclosure assembly includes a cap, a base mechanically coupled with the cap, and a support bracket mechanically coupled with the base. The PCB assembly includes a processor, a memory coupled with the processor, a first sensor electrically coupled with the processor, a second sensor electrically coupled with the processor, and a communication interface electrically coupled with the processor. The device, when installed, may generally form a shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: June 4, 2024
    Assignee: Shinkawa Electric Co., Ltd.
    Inventors: Kotaro Matsumoto, Hiroyuki Matsuda, Hiroshi Aoki, Masaru Terada, Ovel Emerson, Paul A. Lowe
  • Patent number: 11991820
    Abstract: An apparatus, such as a sensor device, may include a housing. The housing may include a top wall, bottom wall, and one or more side walls that define a cavity. A circuit board may be positioned within the housing. One or more chamber side walls may surround a portion of the circuit board and define a chamber within the cavity of the housing. A pathway may be provided that defines a fluid communication channel between the portion of the circuit board and an exterior of the housing. For example, a portion of the pathway may be provided along a perimeter of or through an activation member, such as a push-button or switch positioned along an exterior of the housing.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: May 21, 2024
    Assignee: Comcast Cable Communications, LLC
    Inventors: Osman Cueto, David Luksenberg
  • Patent number: 11980724
    Abstract: A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: May 14, 2024
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Steven J. Meyer, James E. Blood, David A. Chizek, Matthew Hein, Daniel J. Foster
  • Patent number: 11984692
    Abstract: An electrical junction box comprises an electrically conductive housing and at least one cable end wherein an everted braided shield section of the cable end is received in a retainer section of the housing and an electrically conductive adhesive is provided.
    Type: Grant
    Filed: September 21, 2022
    Date of Patent: May 14, 2024
    Assignee: Aptiv Technologies (2) S.à r.l.
    Inventors: Olaf Patz, Pawel Olek, Piotr Momot, Wojciech Lesniak
  • Patent number: 11979986
    Abstract: A component-embedded substrate includes: a plurality of insulating layers each including a wiring pattern formed on one surface; an embedded component including a connection terminal; and a plurality of vias that electrically connect the connection terminal to the wiring patterns adjacent to each other in a lamination direction. The plurality of insulating layers is laminated on the connection terminal. Each of the plurality of vias is composed of a via hole formed in the respective insulating layer of the plurality of the insulating layers and a conductive material provided in the via hole. One of the plurality of vias is a connection via directly connected to the connection terminal. Another of the plurality of vias is a first adjacent via adjacent to the connection via in the lamination direction. The first adjacent via is connected to the wiring pattern formed on a surface of a top insulating layer.
    Type: Grant
    Filed: March 20, 2023
    Date of Patent: May 7, 2024
    Assignee: Fujikura Ltd.
    Inventors: Masakazu Sato, Nobuki Ueta, Yoshio Nakao, Masatoshi Inaba
  • Patent number: 11964845
    Abstract: A cord reel assembly including a single, continuous cord having stationary and retractable segments, with the stationary segment including multiple connectors and sheath covering such connectors where the connectors twist and untwist relative to the sheath in response to the retract and extension of the retractable segment.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: April 23, 2024
    Assignee: Astronics Connectivity Sys. & Cert. Corp.
    Inventors: John Alford, Christopher Hinojosa
  • Patent number: 11961654
    Abstract: A coil component includes: an element body part 10; a coil 30 embedded in the element body part 10; an external electrode 50a electrically connected to the coil 30 and provided at least on a bottom face 12 of the element body part 10 along a side 13a of the bottom face 12; and an external electrode 50b electrically connected to the coil 30 and provided at least on the bottom face 12 along a side 13b, wherein the external electrode 50a has a joining part 56a physically and electrically joined to the bottom face 12, and a non-joining part faces the bottom face 12 but is positioned away from the bottom face 12 before being mounted on a circuit board, wherein the non-joining part is positioned closer to the external electrode 50b on the bottom face 12 than is the joining part 56a.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: April 16, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Hirotaka Wakabayashi
  • Patent number: 11950670
    Abstract: A waterproof container is adapted for an electronic device with a touch screen. The waterproof container includes an upper component and a lower component. The upper component includes a first layer, a second layer and a third layer. The second layer is disposed between the first layer and the third layer. A second touched part of the second layer is connected to a first touched part of the first layer by a plurality of first connections. The second touched part of the second layer is connected to a third touched part of the third layer by a plurality of second connections, and the plurality of first connections and the plurality of second connections are staggered relative to each other. The lower component is connected to the upper component. An accommodating space is enclosed by the lower component and the upper component for accommodating the electronic device.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: April 9, 2024
    Assignee: Universal Trim Supply Co., Ltd.
    Inventors: Chih-Wei Yang, Shih-Sheng Yang, Hou-Chun Yang
  • Patent number: 11950390
    Abstract: An electrical conductor assembly for use in a power distribution assembly includes an electrical conductor and a casing covering at least a portion of the electrical conductor. A spring member is mounted to the casing and configured to apply a compressive force to the electrical conductor.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: April 2, 2024
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Joel Anthony Furco, Andrew Francis Scarlata, Joseph M. Manahan, Patrick S. Ward
  • Patent number: 11943869
    Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: March 26, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Brandon Summey, Peter A. Blais, Robert Andrew Ramsbottom, Jeffrey Poltorak, Courtney Elliott