Patents Examined by Stanley Tso
  • Patent number: 11892153
    Abstract: The invention relates generally to an illuminable wall socket plate for replacing existing wall socket plates in one simple installation step. The illuminable wall socket plate obtains electric current from a socket to power a light by connecting metal tabs on the back side of the illuminable wall socket plate to socket terminals, and transferring electric current from the socket terminals to a light in the wall socket plate through conductive material, in accordance with the invention described herein.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: February 6, 2024
    Assignee: SnapRays, LLC
    Inventor: Daniel A. Diotte
  • Patent number: 11888302
    Abstract: An object is to be able to increase the force necessary for removal in a state where an elastic attaching member is attached to an attachment target member as much as possible. An elastic attaching member for attaching an attachment component to an attachment target member includes an elastic main body part formed from an elastic material and a high rigidity part formed from a material more rigid than the elastic main body part, the elastic main body part covering at least part of the attachment component, part of the high rigidity part being embedded in the elastic main body part, and another part of the high rigidity part protruding outward from at least part of the elastic main body part to form a protruding part.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: January 30, 2024
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kyungwoo Kim, Toshinari Kobayashi, Hironobu Yamamoto
  • Patent number: 11889629
    Abstract: A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: January 30, 2024
    Assignee: AT&SAustria Technologie & Systemtechnik AG
    Inventors: Gerald Weidinger, Gerald Weis, Ivan Salkovic, Karl Kirchheimer
  • Patent number: 11872405
    Abstract: A feedthrough assembly includes: a ferrule; an insulating structure; and a seal fixedly securing the insulating structure within the ferrule, the seal comprising a glass and single-phase particulate dispersed therein; wherein the glass includes: 25% to 40% B2O3; 0 to 25% CaO; 0 to 25% MgO; 0 to 25% SrO; 0 to 10% La2O3; 5% to 15% SiO2; and 10% to 20% Al2O3; wherein all percentages are mole percentages of the glass.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: January 16, 2024
    Assignee: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, Andrew J. Thom
  • Patent number: 11877398
    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: January 16, 2024
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Guy Nesher
  • Patent number: 11869718
    Abstract: A multilayer capacitor includes a capacitor body having first to sixth surfaces, including a plurality of first and second dielectric layers and a plurality of internal electrodes stacked; and first and second external electrodes. The internal electrode includes first and second internal electrodes, a first floating electrode disposed between the first and second internal electrodes on the first dielectric layer, and second and third floating electrodes disposed on the second dielectric layer. The second floating electrode overlaps a portion of the first internal electrode and a portion of the first floating electrode, and the third floating electrode overlaps a portion of the second internal electrode and a portion of the first floating electrode. a/L is 0.113 or more, in which L is a length of the capacitor body, and a is a distance between the first floating electrode and the first or second internal electrodes.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: January 9, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gi Sub Lee, Ah Young Lee, Chung Hyeon Ryu
  • Patent number: 11848263
    Abstract: The present invention relates to a multilayered printed circuit board having excellent durability while having a thin thickness, a method for manufacturing the same, and a semiconductor device using the same.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: December 19, 2023
    Assignee: LG CHEM, LTD.
    Inventor: Seung Lak Kim
  • Patent number: 11848159
    Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and a pair of external electrodes disposed on opposing ends of the capacitor body and connected to exposed portions of the internal electrodes, wherein the external electrodes respectively include a conductive layer including a connection portion formed on one end surface of the capacitor body and connected to the internal electrode and a band portion extending from the connection portion to a portion of a neighboring surface of the capacitor body, a conductive resin layer covering a corner of the connection portion of the conductive layer and having a cutout portion so that a portion of an edge of the connection portion is exposed, and a plating layer covering the conductive layer and the conductive resin layer and contacting a portion of the conductive layer due to the cutout portion.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: December 19, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Beom Joon Cho
  • Patent number: 11839028
    Abstract: A filter unit is provided to retrofit within signal lines that couple analog cockpit gauges to transducers in rotorcraft systems. The filter unit may include a housing assembly and an electromagnetic interference (EMI) filter assembly housed therein. The filter assembly may include a printed circuit board (PCB) having conductive PCB traces and a signal line input connector configured to connect to multiple transducer signal lines. The filter assembly may also include a signal line output connector configured to connect to multiple analog cockpit gauge signal lines and a plurality of common mode chokes electrically connected between the signal line input connector and the signal line output connector. Each common mode choke may be positioned on the PCB so that it does not electrically/magnetically interfere with the other common mode chokes of the plurality of common mode chokes.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: December 5, 2023
    Assignee: Sidus Space, Inc.
    Inventor: Valerij Ojdanic
  • Patent number: 11837407
    Abstract: A multilayer capacitor includes a capacitor body including first to sixth surfaces, dielectric layers and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction; and first and second external electrodes; wherein the first and second internal electrodes are disposed to be offset in the first direction, wherein a first plurality of the first and second internal electrodes is disposed to be adjacent to the fifth surface in the third direction, a second plurality is disposed to be adjacent to the sixth surface in the third direction, and a third plurality is disposed in a central region in the third direction, and wherein internal electrodes among the first and second internal electrodes, disposed to be adjacent to the surface in the same direction, include an even number of two or more of internal electrodes disposed to be offset therebetween.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: December 5, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geon Yong Lee, Dong Seuk Kim
  • Patent number: 11830658
    Abstract: A method for manufacturing a coil component includes: providing multiple metal magnetic grains; preparing a magnetic body paste by mixing the multiple metal magnetic grains, a binder resin containing a resinate having at least one element selected from the group consisting of Si, Al, Cr, Mg, Ti, and Zr, and a solvent; forming a compact using the magnetic body paste; heat-treating the compact to form, on surfaces of the metal magnetic grains, bonding parts constituted by an amorphous oxide containing carbon and the at least one element, thereby forming a magnetic base body wherein the multiple metal magnetic grains are bonded via the bonding parts; forming a coil that includes a metal conductor; and forming external electrodes on surfaces of the magnetic base body and connecting end parts of the coil to the external electrodes, respectively.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: November 28, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Kazuki Misawa, Kinshiro Takadate, Shinsuke Takeoka
  • Patent number: 11817689
    Abstract: An electrical assembly is constructed for mounting an electrical wiring device at an incline with respect to a support. The assembly includes a mounting bracket for receiving and supporting the electrical wiring device. The mounting bracket is received in a recess open end of a support, such as the open end of an adapter for an electrical box. The mounting bracket is coupled directly to the support. A weatherproof cover overlies the electrical wiring device and the bracket for closing the electrical wiring device and providing a weatherproof seal between the cover and the support.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: November 14, 2023
    Assignee: HUBBELL INCORPORATED
    Inventors: Michael Jay Zbriger, Joseph Nicholas Cretella, Roy Joseph Itzler, Joseph Anthony Dimaria
  • Patent number: 11812556
    Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: November 7, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Hyun Park, Yong Ho Baek, Jae Hoon Choi
  • Patent number: 11799374
    Abstract: A package structure is disclosed. The package structure includes processor die connected to a top surface of a package substrate. The package structure further includes a DC-DC power converter attached to a bottom surface of the package substrate. The DC-DC power converter is located at least within an open area of an interconnect component that connects the bottom surface of the package substrate and a top surface of a motherboard.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: October 24, 2023
    Assignee: International Business Machines Corporation
    Inventors: Xin Zhang, Todd Edward Takken, Yuan Yao
  • Patent number: 11792924
    Abstract: Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof. The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: October 17, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Taehyeun Ha, Taeje Park
  • Patent number: 11792919
    Abstract: A case includes a header with a first isolation barrier, a cover with a second isolation barrier, and a printed circuit board (PCB) including a slot in which the first isolation barrier or the second isolation barrier is located and a primary-circuit side and a secondary-circuit side located on opposites sides of the slot.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: October 17, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Lee Francis
  • Patent number: 11785720
    Abstract: A multilayer ceramic capacitor includes an interposer including, on a side in a length direction, a first through conductive portion that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The interposer includes, on the other side in the length direction, a second through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The first mounting electrode includes a first portion that covers a portion of a first interposer end surface on the one side in the length direction of the interposer. The second mounting electrode includes a second portion that covers a portion of a second interposer end surface on the other side in the length direction of the interposer.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: October 10, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Satoshi Yokomizo
  • Patent number: 11783971
    Abstract: A joint joins an alloy member to a ceramic member via a glass joining agent, which is joined to the alloy member by a material bonded joint and to the ceramic member by a further material bonded joint. The glass joining agent is made of a glass having a melting point below 800° C.; a coefficient of thermal expansion of at least 9-10?6 K?1 and a bismuth content of at least 10%. The alloy member has a coefficient of thermal expansion of at least 9-10?6 K?1. The ceramic member has a maximum coefficient of thermal expansion of 8-10?6 K?1. The material bonded joint defines a mixing region that is a partial region of the ceramic member, and the bismuth content in the mixing region is higher than that of the ceramic member outside the mixing region.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: October 10, 2023
    Assignee: KISTLER HOLDING AG
    Inventors: Giovanni Mastrogiacomo, Hans Beat Maerki, Thomas Cadonau
  • Patent number: 11778747
    Abstract: A wiring board includes: a base material including, on one side of the base material, a protruding part that protrudes toward an outside, wherein the protruding part has a shape in which a center portion of a principal surface rises from the outer periphery, and a plurality of external connection terminals is arranged on the principal surface. A composite substrate includes: the above-mentioned wiring board and a metallic frame member, wherein the frame member includes an opening whose shape is corresponding to a shape in a plan view of the protruding part, and the frame member is arranged such that the opening surrounds the protruding part to fill a periphery of the protruding part. An electric device includes: an electric element on a right face of the wiring board.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: October 3, 2023
    Assignee: Kyocera Corporation
    Inventors: Toshifumi Higashi, Youji Furukubo, Takafumi Yamaguchi
  • Patent number: 11765834
    Abstract: An electronic module including an electronic panel, a circuit unit, a support film, and a connection portion. The circuit unit includes a circuit film electrically connected to the electronic panel and a circuit chip mounted on the circuit film. The support film is attached to the circuit film. The connection portion is attached to the support film and covers the circuit chip.
    Type: Grant
    Filed: July 26, 2020
    Date of Patent: September 19, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: In-Su Baek, Seung Hwan Baek, Hyungwoo Kwon, Gyunsoo Kim, Kijong Kim, Minki Kim