Abstract: A trilayer polymer film includes a core layer and first and second outer layers on opposing surfaces of the core layer. The compositions of each of the layers is as described herein, wherein the first outer layer and the second outer layer each independently include a fluoropolymer having a melting temperature that is at least 15° C. less than a melting temperature of the core layer. The film can be useful in the preparation of multilayer conductors and magnetic self-resonant structures.

Abstract: A component carrier having: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, a component provided in and/or on the stack, said component comprising at least one electrically conductive surface connected to an electrically conductive connecting element, said connecting element extending from said electrically conductive surface away from the stack and configured to be connected to at least one external component to be mounted on the component carrier when at least one connecting surface provided in/on the external component is faced to the electrically conductive surface of the component, wherein the connecting element is made of a heterogeneous conductive structure that is arranged to permanently compensate for a relative movement between said electrically conductive surface of the component and said connecting surface of the external component. Also provided is a package using such component carrier.

Abstract: The invention provides a circuit board structure and a manufacturing method thereof. The circuit board structure includes a line portion, a first insulating layer, and a conductive terminal. The first insulating layer is disposed on the line portion. The conductive terminal is disposed on the first insulating layer and embedded in the first insulating layer to be electrically connected with the line portion. The conductive terminal includes a first portion, a second portion, and a third portion. The first portion protrudes from a surface of the first insulating layer. The second portion is embedded in the first insulating layer and connected to the first portion. The third portion is disposed between the line portion and the second portion. A width of the second portion is greater than a width of the third portion.

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer includes resin and inorganic particles including first particles and second particles such that the first particles have flat exposed portions, the second particles are embedded in the resin, and the surface of the resin insulating layer includes the resin and the flat exposed portions of the first particles.

Abstract: In some implementations, an electrical cable for use in a wellbore proximate to a subsurface formation may comprise a conductive element, where the conductive element comprises one or more electrically conductive fibers. The electrical cable may additionally comprise a conductive binder configured to melt to form a liquid conductor that is configured to, when in a liquid state, surround the conductive element.

Abstract: A unitary busbar provides power from one connection point in an electric vehicle to another connection point. The unitary busbar includes a central solid core conductor, an insulation layer over the solid core conductor, and an electromagnetic shield fitted around the insulator. The unitary busbar is capable of being bent into specific configurations that allow it to conform to the body of an electric vehicle.

Abstract: The invention relates to an electronic circuit including a substrate and at least one electronic component. Each electronic component includes at least one data port that receives data. The electronic circuit also includes, for each data port, a current injection terminal and a breakable electrical trace located in the thickness of the substrate and extending between the data port and the injection terminal. Each breakable electrical trace includes a fusible segment, and each breakable electrical trace is configured to break, by melting of the fusible segment, upon the injection, at the injection terminal, of an electric current having an intensity greater than a predetermined trace breaking threshold.

Abstract: A method for manufacturing a circuit board that achieves both high adhesion and excellent high-frequency characteristics is provided. The circuit board includes a high-frequency circuit including a substrate, a ground layer, and a signal layer, and at least the signal layer is a layer derived from a copper foil. The method includes: (a) designing a specification of a high-frequency circuit having a predetermined impedance Z1 based on an assumption that the high-frequency circuit is manufactured using a copper foil without an adhesive layer; and (b) forming a high-frequency circuit in accordance with the specification, except for using, instead of the copper foil without an adhesive layer, an adhesive-layer-attached copper foil to form the signal layer so that an adhesive layer is interposed between the substrate and the signal layer, thereby manufacturing a circuit board in which the high-frequency circuit has an impedance Z2 that is greater than Z1.

Abstract: An electronic component that includes: a substrate; a first electrode layer on the substrate and including conductive fillers and a binder; an insulation layer on the first electrode layer, the insulation layer having a via hole that penetrates the insulation layer in a lamination direction of the substrate, the first electrode layer, and the insulation layer; a second electrode layer on the insulation layer; and a via conductor in the via hole, the via conductor electrically coupling the first electrode layer and the second electrode layer, wherein a portion of the first electrode layer overlapping with the via hole in a top view includes a coupling layer coupled to the via conductor, the coupling layer having a content rate of the binder lower than a content rate of the binder in a portion of the first electrode layer positioned outside the via hole in the top view.

Abstract: A wiring board includes an insulation layer made of a ceramic, and an electrical conductor layer extending in a planar direction inside the insulation layer. The electrical conductor layer is constituted by a sintered body of a plurality of crystallites containing a metal as a main component. When a specific range of the electrical conductor layer is specified in a cross-sectional view, a linear length in the planar direction is defined as L0, and a length of a contour of the electrical conductor layer is defined as L1, L1/L0 is within a range from 1.04 to 1.40.

Abstract: According to an aspect, a stretchable device includes: a resin base member including a plurality of bodies disposed apart from each other and a plurality of hinges that couple the bodies to each other; and an array layer provided on the resin base member. The array layer includes a plurality of wiring lines extending along the hinges and spaced apart from each other in a width direction of the hinges. Each of the hinges has a plurality of bends bending when viewed in a stacking direction in which the resin base member and the array layer are stacked. Each of the bends has at least one or more slits that are formed between the wiring lines when viewed in the stacking direction and that divide the bend in the width direction.

Abstract: An item of electrical equipment includes an electronic board, an electronic component fixed onto the electronic board and disposed parallel to the electronic board, and a heat sink configured to dissipate the heat emitted by the electronic component. A retention member supports a bearing element which presses onto the electronic component in a direction orthogonal to the electronic board and in a direction away from the electronic component relative to the electronic board. The bearing element is configured to press the electronic components onto the heat sink.

Abstract: An electrical box assembly for installation in a wall structure having a support member includes an electrical box having a front face with a front opening leading into an interior of the electrical box, a bracket slidably coupled to an outer circumferential surface of the electrical box with the bracket configured to be securely coupled to the support member of the wall structure, a sealing element disposed on the electrical box at or adjacent the front face thereof with the sealing element configured to form a seal with an inner facing surface of the wall structure, and an adjustment mechanism configured to selectively adjust a position of the electrical box relative to the bracket with respect to an axial direction of the electrical box to adjust a sealing force present between the sealing element and the wall structure.

Abstract: An electronic device is provided, the electronic device includes a driving substrate, the driving substrate includes a plurality of first grooves and a plurality of second grooves, the first grooves and the second grooves have different sizes, at least one first electronic component of the plurality of first electronic components is disposed in one of the plurality of first grooves, at least one second electronic component of the plurality of second electronic components is disposed in one of the plurality of second grooves, a maximum length passing through a center of a bottom surface of the at least one first electronic component is defined as L1, a bottom length of one side of at least one second groove among the second grooves is defined as L2, and the at least one first electronic component and the at least one second groove satisfy the condition of L1>L2.

Abstract: An electronic device having a central area and a peripheral area surrounding the central area is provided. The electronic device includes a substrate, a through hole, a buffer layer, a first circuit structure, an electronic component and a first pad. The substrate has a first surface and a second surface opposite to the first surface. The through hole penetrates through the substrate and has a first through hole and a second through hole. The buffer layer covers the first surface, the second surface, an inner wall of the first through hole and an inner wall of the second through hole. The first circuit structure is disposed on the first surface. The first through hole corresponds to the central area, the second through hole corresponds to the peripheral area, and a width of the second through hole is greater than a width of the first through hole.

Abstract: Embodiments herein describe air vents that provide air flow for cooling but still provide EMI shielding. In one embodiment, the air vents have a first opening on a first side of a body of a chassis and a second opening on a second, opposite side of the body. These openings form an aperture through the side of the chassis. In addition, the first opening has a smaller diameter than the second opening.

Abstract: A locking mechanism particularly adapted to lock a cover of an electrical connector which connects an electrical transmission conductor to a distribution conductor. The locking mechanism includes a tip portion, a spiral portion, a holding portion, and an engagement portion, where the tip portion has a smaller cross-sectional area than the spiral portion and where the engagement portion is a widest portion of the locking mechanism. The present invention is also directed to a method of using the locking mechanism to lock the cover, as well as to a cover system which includes the locking mechanism and the cover engaged such that the cover is locked.

Abstract: A flexible circuit board includes an inner wiring substrate, a first cover film, a second cover film, a first adhesive block, and two outer wiring substrates. The inner wiring substrate includes a dielectric layer, and the dielectric layer includes a first flat portion, a second flat portion, and a foldable portion connecting the first flat portion and the second flat portion. The first cover film is disposed on the first flat portion and located between the first flat portion and the second flat portion. The second cover layer is disposed on the second flat portion and is located between the first flat portion and the second flat portion. The first adhesive block bonds the first cover film and the second cover film, and the inner wiring substrate is located between the two outer wiring substrate. A method for manufacturing the flexible circuit board is also disclosed.

Abstract: A wiring board includes: a substrate; a first seed layer provided on the substrate; a first conductive layer provided on the first seed layer; a first insulating layer provided on the first conductive layer; a second seed layer provided on the first insulating layer; and a second conductive layer provided on the second seed layer. An area of the first insulating layer is smaller than an area of the first conductive layer. An area of the second conductive layer is smaller than the area of the first insulating layer. A region of the first insulating layer not overlapping the second conductive layer includes a first region surrounding the second conductive layer and a second region outside the first region. A surface roughness of the second region is larger than a surface roughness of the first region.

Abstract: Provided are an electric control component, an air conditioner having the same, and an assembly method for the electric control component. The electric control component includes a circuit board, a chip, a radiator and a fixing member. The chip is disposed on the circuit board. The radiator is disposed at a side of the chip away from the circuit board. The fixing member is configured to rigidly connect the radiator to the circuit board. At least one of the circuit board and the radiator has an engagement portion adapted to be engaged with a pre-tightening device for clamping the radiator and the circuit board.