Abstract: A multilayer coil component 1 includes an element body 2, a pair of terminal electrodes 3, and a glass layer G provided on the terminal electrode 3. Each of the pair of terminal electrodes 3 is provided with a plurality of first projecting portions 33 tapered toward the other facing terminal electrode 3 side in an end portion 31b facing the side in the facing direction of a pair of end surfaces 2a and 2b. The glass layer G is provided along the edge of the terminal electrode 3 including at least the first projecting portion 33 in the end portion 31b of the terminal electrode 3.

Abstract: The electronic module including a metal base, a ceramic substrate, and a die-capacitor is disclosed. The ceramic substrate is mounted on the metal base via eutectic solder. The ceramic substrate includes a main substrate having a back surface facing the metal base and a front surface opposite to the back surface, and a back metal layer placed on the back surface of the main substrate and joined to the eutectic solder. The die-capacitor is mounted on the front surface of the ceramic substrate along one edge of the ceramic substrate. The back surface of the ceramic substrate is provided with an exposure region where the back metal layer is not provided. The exposure region includes a main region corresponding to an outer shape of the die-capacitor spreading along the front surface and an edge region extending from the main region to the one edge of the ceramic substrate.

Abstract: This disclosure provides systems, methods, and apparatus related to printed circuit boards. In one aspect, a device includes a first board and a second board. The first board includes at least two pins defined at an end of the first board. The first pin and the second pin are positioned along a first line and parallel to the first line. The second board includes at least two slots defined at an end of the second board. The first slot and the second slot are positioned along a second line and are angled from the second line by about ±10° to 15°. Each of the pins in the first board is engaged with each of the slots in the second board and forms an electrical connection between the first pin and the first slot and the second pin and the second slot.

Abstract: Embodiments of the invention are directed to a method for manufacturing a composite polymer insulator. The method includes: providing an elongate core having a core axis, the core including a first core main section, a second core main section, and a core midsection axially interposed between the first and second core main sections; and mounting a joint sleeve around the core midsection. The method further includes molding a polymeric first housing onto the core such that: the first housing surrounds the first core main section; and a joint section the first housing overlaps and bonds to the joint sleeve. The method further includes molding a polymeric second housing onto the core such that: the second housing surrounds the second core main section; and a joint section of the second housing overlaps and bonds to the joint sleeve.

Abstract: An electronic component and a board having the same mounted thereon are provided. The electronic component includes a capacitor body, a pair of external electrodes, respectively disposed on end portions of the capacitor body, a pair of metal frames, respectively disposed to be connected the pair of external electrodes, and a conductive bonding layer disposed between the external electrode and the metal frame and having a discontinuous region.

Abstract: A multilayer capacitor includes a body having a plurality of dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and further including an active region in which the first and second internal electrodes overlap each other, and upper and lower covers disposed above and below the active region, respectively; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively, wherein the upper and lower covers include barium titanate (BT, BaTiO3) and Yttria-stabilized zirconia (YSZ).

Abstract: Provided are a circuit board component and a terminal. The circuit board component includes: a circuit board and a wire disposed on the circuit board, where the wire includes a first portion and a second portion, a line width of the first portion is greater than or equal to a line width threshold, and a line width of the second portion is less than the line width threshold.

Abstract: A mounted structure of a supporting-terminal-equipped capacitor chip includes first and second supporting terminals. The first supporting terminal includes a first helical electrically conductive portion extending in a first axial direction along a main surface. The second supporting terminal includes a second helical electrically conductive portion extending in a second axial direction along the main surface. The first helical electrically conductive portion is electrically connected to a first outer electrode at an outer peripheral side surface of the first helical electrically conductive portion. The second helical electrically conductive portion is electrically connected to a second outer electrode at an outer peripheral side surface of the second helical electrically conductive portion.

Abstract: A condition monitoring device configured to be mounted on a machine for sensing, for example, vibrations produced by the machine during operation, includes a base, a printed circuit board assembly lying in a first plane, and first and second fasteners, each having a longitudinal axis, lying in a second plane perpendicular to the first plane, the first and second fasteners extending through the printed circuit board assembly and into the base. A third plane is perpendicular to the first and second planes and is located halfway between the longitudinal axes of the first and second fasteners. An integrated power supply is connected to the printed circuit board assembly, and at least two active sensing cells, such as vibration sensors, are arranged symmetrically relative to the second plane and/or symmetrically relative to the third plane.

Abstract: A wiring board includes a resin insulating layer having a component mounting surface, first connection pads formed on the component mounting surface of the resin insulating layer, second connection pads formed on the component mounting surface of the resin insulating layer such that the second connection pads are surrounding the first connection pads, and a protruding part including a metal material and formed on the component mounting surface of the resin insulating layer such that a portion of the protruding part is embedded in the resin insulating layer and that the protruding part is positioned between the first connection pads and the second connection pads and surrounding the first connection pads.

Abstract: Electronic device package stiffener and capacitor technology is disclosed. A combination stiffener and capacitor can include a structural material configured to be coupled to a substrate. The structural material can have a shape configured to provide mechanical support for the substrate. The combination stiffener and capacitor can also include first and second electrodes forming a capacitor. An electronic device package and a package substrate configured to receive the combination stiffener and capacitor are also disclosed.

Abstract: This invention provides a method for mounting an electroacoustic component on a PCB and an electroacoustic component structure, so as to improve the problem that the traditional electroacoustic component affects the electrical characteristics due to the high temperature baking action in a reflow oven. The method comprises a step of separating and constructing a housing of the electroacoustic component. The housing comprises a shell seat and a base seat, the shell seat is provided with a plurality of sound producing components, and the base seat is provided with at least two conducting terminals for adhering the base seat to the PCB. The conducting terminals on the base seat and the at least two contacts on the PCB are adhered to each other and electrically connected in the reflow oven, and then the shell seat and the base seat are combined to make the shell seat and the base seat with the PCB combined outside the reflow oven into a single body to form an electroacoustic component that is mounted on the PCB.

Abstract: A ceramic electronic device includes: a multilayer chip in which each of internal electrode layers and each of dielectric layers are alternately stacked, wherein the multilayer chip has a first capacity region having a first electrostatic capacity C1 and a first inductance L1 and a second capacity region having a second electrostatic capacity C2 and a second inductance L2, wherein the first electrostatic capacity C1, the first inductance L1, the second electrostatic capacity C2 and the second inductance L2 satisfy (C1·L1)/(C2·L2)<0.5 or 1.9<(C1·L1)/(C2·L2).

Abstract: A magnetic base body comprises multiple metal magnetic grains and bonding parts for bonding the multiple metal magnetic grains, wherein the bonding parts are constituted by an amorphous mixture containing carbon and an oxide of at least one element selected from silicon, aluminum, chromium, magnesium, titanium, and zirconium. A coil component using the magnetic base body can improve mechanical strength while ensuring insulation reliability.

Abstract: An onboard power supply device includes capacitors, a holder holding the capacitors, a mounting board having the capacitors mounted thereon and having the holder fixed thereto, and a heat-generating component mounted on the mounting board. Each of the capacitors includes a capacitor body and a lead terminal extending from the capacitor body. The holder includes a base part, first holding parts bundled by the base part and holding the capacitors, second holding parts each connected to a corresponding one of the first holding parts, and a fixing part extending from an outer edge of the base part toward the mounting board and fixed to the mounting board. The capacitor body of each of the capacitors is held by a corresponding one of the first holding parts. The lead terminal of each of the capacitors is held by a corresponding one of the second holding parts. The mounting board has a through-hole therein through which the lead terminal passes. The through-hole is connected to the lead terminal.

Abstract: A display device is provided. The display device includes an auxiliary substrate, a display substrate, and a circuit board. The auxiliary substrate includes an auxiliary circuit. The display substrate is disposed on the auxiliary substrate. The display substrate includes a circuit. The circuit board is electrically connected to the auxiliary substrate. The circuit of the display substrate is electrically connected to the auxiliary circuit through a first conductive via, and the circuit board provides a signal to the auxiliary circuit.

Abstract: A storage drive, including: a main module, including: a main printed circuit board (PCB) having a first side positioned opposite to a second side; flash memory components positioned on the main PCB at a first end of the storage drive, a controller module positioned on the main PCB at a second end of the storage drive opposite to the first end; and a capacitor module, including: a module printed circuit board (PCB) having a first side positioned opposite to a second side; a plurality of capacitors positioned on the module PCB on the first side of the module PCB, wherein the capacitor module is coupled to the main module such that the capacitor module is positioned at the first end of the storage drive and the first side of the capacitor module faces the first side of the main module.

Abstract: A wiring sheet includes one or more carbon wires each of which is one of a signal line and a power supply line, and which are conductors including carbon as a main material and have flexibility; and an insulation sheet that encloses substantially an entirety of the one or more carbon wires, includes an electrical insulator as a main material, and has flexibility.

Abstract: According to various embodiments, an electronic device may include a housing, and a display disposed to at least part of the housing. The display may include a display panel including at least one pixel, and a substrate layer disposed below the display panel. The substrate layer may include a bendable connecting area extending to the outside of the display panel. The display may further include a display driving circuit disposed to one face of the connecting area, a Flexible Printed Circuit Board (FPCB) electrically coupled with at least part of the connecting area and including a contact area to which a conductor electrically coupled with a ground portion of the electronic device is exposed, and a shielding member electrically coupled with the contact area. The shielding member may be disposed on the FPCB and one face of the connecting area to cover at least part of the display driving circuit. Various other embodiments may also be possible.

Abstract: The present disclosure is related to a power module includes a first printed circuit board (PCB), a second PCB, a magnetic component and a connecting component. A secondary side switch set and a winding are disposed on the first PCB, respectively. A primary side switch set is disposed on the second PCB adjacent to the first PCB. A magnetic component includes an upper magnetic cover disposed on the first side of the first PCB; a lower magnetic cover disposed between the first PCB and the second PCB; and a lateral column located between the two magnetic covers. The lateral column passes through the first PCB, and is fastened with the two magnetic covers. The magnetic component and the winding collaboratively form a transformer. The connecting component is disposed between the two PCBs to connect the corresponding potential points of the two PCBs.