Abstract: The present invention relates to a multilayered printed circuit board having excellent durability while having a thin thickness, a method for manufacturing the same, and a semiconductor device using the same.

Abstract: A filter unit is provided to retrofit within signal lines that couple analog cockpit gauges to transducers in rotorcraft systems. The filter unit may include a housing assembly and an electromagnetic interference (EMI) filter assembly housed therein. The filter assembly may include a printed circuit board (PCB) having conductive PCB traces and a signal line input connector configured to connect to multiple transducer signal lines. The filter assembly may also include a signal line output connector configured to connect to multiple analog cockpit gauge signal lines and a plurality of common mode chokes electrically connected between the signal line input connector and the signal line output connector. Each common mode choke may be positioned on the PCB so that it does not electrically/magnetically interfere with the other common mode chokes of the plurality of common mode chokes.

Abstract: A multilayer capacitor includes a capacitor body including first to sixth surfaces, dielectric layers and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction; and first and second external electrodes; wherein the first and second internal electrodes are disposed to be offset in the first direction, wherein a first plurality of the first and second internal electrodes is disposed to be adjacent to the fifth surface in the third direction, a second plurality is disposed to be adjacent to the sixth surface in the third direction, and a third plurality is disposed in a central region in the third direction, and wherein internal electrodes among the first and second internal electrodes, disposed to be adjacent to the surface in the same direction, include an even number of two or more of internal electrodes disposed to be offset therebetween.

Abstract: A method for manufacturing a coil component includes: providing multiple metal magnetic grains; preparing a magnetic body paste by mixing the multiple metal magnetic grains, a binder resin containing a resinate having at least one element selected from the group consisting of Si, Al, Cr, Mg, Ti, and Zr, and a solvent; forming a compact using the magnetic body paste; heat-treating the compact to form, on surfaces of the metal magnetic grains, bonding parts constituted by an amorphous oxide containing carbon and the at least one element, thereby forming a magnetic base body wherein the multiple metal magnetic grains are bonded via the bonding parts; forming a coil that includes a metal conductor; and forming external electrodes on surfaces of the magnetic base body and connecting end parts of the coil to the external electrodes, respectively.

Abstract: An electrical assembly is constructed for mounting an electrical wiring device at an incline with respect to a support. The assembly includes a mounting bracket for receiving and supporting the electrical wiring device. The mounting bracket is received in a recess open end of a support, such as the open end of an adapter for an electrical box. The mounting bracket is coupled directly to the support. A weatherproof cover overlies the electrical wiring device and the bracket for closing the electrical wiring device and providing a weatherproof seal between the cover and the support.

Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.

Abstract: A package structure is disclosed. The package structure includes processor die connected to a top surface of a package substrate. The package structure further includes a DC-DC power converter attached to a bottom surface of the package substrate. The DC-DC power converter is located at least within an open area of an interconnect component that connects the bottom surface of the package substrate and a top surface of a motherboard.

Abstract: A case includes a header with a first isolation barrier, a cover with a second isolation barrier, and a printed circuit board (PCB) including a slot in which the first isolation barrier or the second isolation barrier is located and a primary-circuit side and a secondary-circuit side located on opposites sides of the slot.

Abstract: Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof. The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.

Abstract: A joint joins an alloy member to a ceramic member via a glass joining agent, which is joined to the alloy member by a material bonded joint and to the ceramic member by a further material bonded joint. The glass joining agent is made of a glass having a melting point below 800° C.; a coefficient of thermal expansion of at least 9-10?6 K?1 and a bismuth content of at least 10%. The alloy member has a coefficient of thermal expansion of at least 9-10?6 K?1. The ceramic member has a maximum coefficient of thermal expansion of 8-10?6 K?1. The material bonded joint defines a mixing region that is a partial region of the ceramic member, and the bismuth content in the mixing region is higher than that of the ceramic member outside the mixing region.

Abstract: A multilayer ceramic capacitor includes an interposer including, on a side in a length direction, a first through conductive portion that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The interposer includes, on the other side in the length direction, a second through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The first mounting electrode includes a first portion that covers a portion of a first interposer end surface on the one side in the length direction of the interposer. The second mounting electrode includes a second portion that covers a portion of a second interposer end surface on the other side in the length direction of the interposer.

Abstract: A wiring board includes: a base material including, on one side of the base material, a protruding part that protrudes toward an outside, wherein the protruding part has a shape in which a center portion of a principal surface rises from the outer periphery, and a plurality of external connection terminals is arranged on the principal surface. A composite substrate includes: the above-mentioned wiring board and a metallic frame member, wherein the frame member includes an opening whose shape is corresponding to a shape in a plan view of the protruding part, and the frame member is arranged such that the opening surrounds the protruding part to fill a periphery of the protruding part. An electric device includes: an electric element on a right face of the wiring board.

Abstract: Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.

Abstract: An electronic module including an electronic panel, a circuit unit, a support film, and a connection portion. The circuit unit includes a circuit film electrically connected to the electronic panel and a circuit chip mounted on the circuit film. The support film is attached to the circuit film. The connection portion is attached to the support film and covers the circuit chip.

Abstract: A ceramic electronic device includes a multilayer chip having dielectric layers and internal electrode layers and having a first main face and a second main face that have a rectangular shape in a planar view, external electrodes each of which extends from the first main face to the second main face at each of two diagonal corners of the rectangular shape, the external electrodes being spaced from each other, each of the external electrodes being connected to a part of the internal electrode layers, and a conductor that is provided on the first main face, the second main face or both of the first main face and the second main face, is spaced from the external electrodes, and is provided in a region which includes an intersection point of perpendicular bisectors of two adjacent sides of the rectangular shape.

Abstract: A railway termination shunt enclosure including one or more receptacles, each of the one or more receptacles being configured to receive a termination shunt. The enclosure also includes at least one mounting surface and a connector assembly rotatably attaching the one or more receptacles to one or more of the at least one mounting surface.

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the surface of the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, a light-permeable sheet, and a top shielding layer. The circuit board has no slot recessed in the surface thereof. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip. The top shielding layer is formed on an outer surface of the light-permeable sheet and has an opening that is located above a sensing region of the sensor chip.

Abstract: An electronic device includes a substrate, a plurality of conductive patterns, and a tunable element. A plurality of conductive patterns are disposed on the substrate. The tunable element is disposed on at least one conductive pattern in the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad are overlapped with the at least one conductive pattern in the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.

Abstract: A wiring substrate includes a substrate, a first metal and a second metal. The substrate has a first surface, a second surface opposite the first surface, and a side surface connected to the first surface and the second surface. The first metal film is disposed so as to extend from the first surface to the side surface. The second metal film is disposed so as to extend from the second surface to the first metal film disposed on the side surface.

Abstract: A glass-metal feedthrough includes: an external conductor having a coefficient of expansion ?external, and having an opening formed therein; an internal conductor disposed in the opening, the internal conductor including iron and having a coefficient of expansion ?internal, the external conductor and the internal conductor being configured to not release nickel when in contact with a human or animal body or biological cells of a cell culture; and a glass material surrounding the internal conductor within the opening and having a coefficient of expansion ?glass, the coefficient of expansion of the internal conductor ?internal and the coefficient of expansion of the external conductor ?external are such that a joint pressure on the internal conductor of at least 30 MPa is generated in a temperature range of 20° C. to a glass transformation temperature of the glass material.