Patents Examined by Stephen E. Jones
  • Patent number: 10090574
    Abstract: The present invention provides a microstrip isolation structure for reducing crosstalk, comprising a microstrip line and two grounded resistors. The microstrip line comprises a plurality of indentation structures arranged periodically. The two grounded resistors are connected to two ends of the microstrip line, respectively. The plurality of indentation structures are periodically arranged in a subwavelength configuration that a period length of the plurality of indentation structures is far smaller than a wavelength of a transmission signal generated by a crosstalk around the microstrip line, whereby impingement of electromagnetic wave is confined by the plurality of indentation structures.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: October 2, 2018
    Inventor: Chia-Ho Wu
  • Patent number: 10084424
    Abstract: A device and associated method for adjusting electrical impedance based on contact action are disclosed. The device includes a drive unit (1), a contact unit (2), a monitoring unit (3), and a control unit (4). The monitoring unit (3) measures an impedance signal of an electromagnetic functional material (7) in an alternating-current circuit, and transfers the impedance signal to the control unit (4). In response to the impedance signal measured by the monitoring unit (3), the control unit (4) controls the drive unit (1) to apply a mechanical load on the contact unit (2), which causes the contact unit (2) to contact the electromagnetic functional material (7). The value of a contact load is adjusted, so as to adjust the electrical impedance of the electromagnetic functional material (7), thereby achieving the objective of adjusting the impedance matching in the alternating-current circuit in real time.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: September 25, 2018
    Assignees: Peking University, Jilin University
    Inventors: Daining Fang, Hao Zhou, Yongmao Pei, Faxin Li, Hongwei Zhao, Ji Fu
  • Patent number: 10085337
    Abstract: The coaxial cable assembly generally has a coaxial cable; and a connector assembled to an end of the coaxial cable, the connector having a dielectric body having a connecting surface, a longitudinal groove recessed in the connecting surface and having a groove end spaced from an edge of the connecting surface, and a coplanar waveguide along the connecting surface, the coplanar waveguide having a signal conductor extending from the groove end to the edge and between ground conductors each extending from a respective lateral side of the longitudinal groove to the edge; the end of the coaxial cable being received in the longitudinal groove and having an inner conductor electrically connected to the signal conductor and an outer conductor electrically connected to the ground conductors in a manner allowing connection of the coaxial cable with another coplanar waveguide of an integrated circuit.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: September 25, 2018
    Assignee: INSTITUT NATIONAL D'OPTIQUE
    Inventors: Christophe Fisné, Alex Paquet, Bruno Fisette
  • Patent number: 10084222
    Abstract: An RF filter for improving PIMD performance includes: a housing having at least one cavity and a dielectric resonator held in the cavity; washers shaped as circular plates and made of metal that are joined to an upper and lower portion of the dielectric resonator; and a cover joined to the housing. A protrusion may be formed on one side of the washer to contact the cover or the housing, where the washer protrusion may increase in height along a direction moving away from the center.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: September 25, 2018
    Assignee: ACE TECHNOLOGIES CORPORATION
    Inventors: Dong-Wan Chun, Sung Soo Chung, Jung Geun Park
  • Patent number: 10062942
    Abstract: A transmission line portion of a high-frequency transmission cable includes a dielectric body in which a first ground conductor, a signal conductor, and a second ground conductor are arranged along a thickness direction of the dielectric body from a first principle surface side. The second ground conductor is arranged at a position that does not overlap the signal conductor when viewed in a direction perpendicular or substantially perpendicular to the first principle surface. The third ground conductor and the signal conductor are located at the same position in the thickness direction of the dielectric body. The second and third ground conductors are connected to the first ground conductor via interlayer-connector conductors. The width of the second and third ground conductors is narrower than the width of the signal conductor, but a sum of the widths of the second and third ground conductors is larger than the width of the signal conductor.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: August 28, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Noboru Kato
  • Patent number: 10063215
    Abstract: An apparatus includes a radio frequency (RF) input port, an RF output port, a variable attenuation network, a first filter network, a second filter network, and a third filter network. The variable attenuation network may be coupled between the RF input port and the RF output port. Attenuation of the variable attenuation network is controlled by a first control signal and a second control signal. The first filter network may be connected between the RF input port and the RF output port. The second filter network may be connected between the variable attenuation network and a ground potential. The third filter network may be connected between the variable attenuation network and the ground potential. The first, the second, and the third filter networks modify performance of the variable attenuation network to produce a particular tilt of a radio frequency signal passing through the apparatus between the RF input port and the RF output port.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: August 28, 2018
    Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
    Inventor: Brian J. McNamara
  • Patent number: 10063212
    Abstract: A high-frequency module includes a propagation path that has a simple structure and improves filter characteristics by causing an inductor and a matching network to electromagnetic field couple with each other such that attenuation characteristics outside of a frequency band of a transmission signal are improved without increasing the size of the high-frequency module. In addition, unintended electromagnetic field coupling between a first filter and the inductor is significantly reduced or prevented by a shield electrode. Therefore, unintended propagation of a high-frequency signal is significantly reduced or prevented. Therefore, the attenuation characteristics outside of the frequency band of transmission signal input to the transmission terminal are improved more effectively.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: August 28, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Shinya Mizoguchi
  • Patent number: 10056669
    Abstract: A transmission line includes a dielectric base body including stacked dielectric layers. A first signal conductor, a second signal conductor, and a ground conductor are included inside the dielectric base body. The first signal conductor includes a first end portion signal conductor and a second end portion signal conductor, which are two end portions in a transmitting direction, and a signal conductor that defines and functions as a main conductor portion. A signal conductor of the second signal conductor and the main conductor portion are provided on different dielectric layers. The signal conductor of the second signal conductor and the signal conductor of the first signal conductor are formed on the same dielectric layer. The ground conductor has an increased width and is located between the signal conductor of the second signal conductor and the main conductor portion in a stacking direction.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: August 21, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takahiro Baba, Yuki Wakabayashi
  • Patent number: 10051725
    Abstract: This circuit board includes a plate body made of a dielectric body and having a front surface and a back surface, a differential signal line formed on the front surface, the differential signal line being made of a pair of signal lines, and a ground conductor formed on the back surface. The signal lines include: terminals formed at a distance from the ground conductor, in an end portion at a prescribed distance from one end of the back surface; connection pads connected to the terminals and provided on the end portion of the front surface so as to be opposed to the terminals; transmission line units extending from the connections pads; and a widened portion provided in a position on the transmission line units corresponding to a space between the terminal and the ground conductor, the widened portion having a line width greater than that of the transmission line units.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: August 14, 2018
    Assignee: KYOCERA CORPORATION
    Inventor: Yoshiki Kawazu
  • Patent number: 10049807
    Abstract: In a laminated coil component, first coil conductor patterns define a coil opening that generates a magnetic flux in a first direction, second coil conductor patterns define a first coil opening that generates a magnetic flux in the first direction, and a second coil opening that generates a magnetic flux in a second direction. A difference in area between the first coil opening and the second coil opening determines a degree of coupling of the coil defined by the first coil conductor pattern and the coil defined by the second coil conductor pattern. This provides a close proximal arrangement of a plurality of coils proximally while significantly reducing or preventing unnecessary coupling between the coils.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: August 14, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kenichi Ishizuka
  • Patent number: 10050326
    Abstract: A transmission line includes, in a dielectric body, a first ground conductor, and first and second signal conductors arranged in a width direction of the dielectric body. The first ground conductor includes a first signal conductor ground portion disposed closer to a first side of the dielectric body in a thickness direction than the first signal conductor, a second signal conductor ground portion disposed closer to a second side of the dielectric body in the thickness direction than the second signal conductor, and an intermediate portion that connects the first signal conductor ground portion to the second signal conductor ground portion. The intermediate portion is disposed between a first transmission line including the first signal conductor and the first signal conductor ground portion and a second transmission line including the second signal conductor and the second signal conductor ground portion.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: August 14, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Kuniaki Yosui, Nobuo Ikemoto, Fumie Matsuda
  • Patent number: 10050601
    Abstract: An elastic wave apparatus includes a piezoelectric substrate, an IDT electrode on the piezoelectric substrate and includes first electrode fingers, second electrode fingers, a first busbar, and a second busbar, a capacitive electrode including third electrode fingers, fourth electrode fingers, a third busbar, and a fourth busbar, an insulating film laminated on the capacitive electrode, a first wiring line including a first portion facing the capacitive electrode via the insulating film, and a second wiring line that connects the first busbar and the third busbar. The capacitive electrode extends in a lateral direction with respect to the IDT electrode in a surface acoustic wave propagation direction.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: August 14, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tomohiko Murase
  • Patent number: 10045434
    Abstract: A printed circuit board (‘PCB’) comprising: an interior socket configured to receive a connector pin of a first electronic component, the connector pin characterized by a pin impedance; a signal trace coupled to the interior socket, the signal trace configured to transmit electrical signals between the first electronic component and other electronic components mounted on the PCB, the signal trace characterized by a trace impedance; and an insulator between the interior socket and a sleeve that surrounds the interior socket, the sleeve physically configured such that an effective pin impedance matches the trace impedance within a predetermined threshold, wherein the effective pin impedance represents the resistance experienced by electrical signals passing through the connector pin when the connector pin is inserted into the interior socket.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: August 7, 2018
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Candice L. Coletrane, Bradley D. Herrman
  • Patent number: 10044086
    Abstract: A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: August 7, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Kuniaki Yosui
  • Patent number: 10038231
    Abstract: A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: July 31, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kuniaki Yosui
  • Patent number: 10038420
    Abstract: A first coil element includes a first loop-shaped conductor and a second loop-shaped conductor. A second coil element includes a third loop-shaped conductor and a fourth loop-shaped conductor. The first loop-shaped conductor and the second loop-shaped conductor are sandwiched in a stacking direction between the third loop-shaped conductor and the fourth loop-shaped conductor. A conductive pattern which is a portion of the first loop-shaped conductor and a conductive pattern which is a portion of the second loop-shaped conductor are connected in parallel. Then, each of a conductive pattern which is a remaining portion of the first loop-shaped conductor and a conductive pattern which is a remaining portion of the second loop-shaped conductor is connected in series with the parallel circuit.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: July 31, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kenichi Ishizuka
  • Patent number: 10033084
    Abstract: A cavity resonator or filter constructed on electromagnetic bandgap (EBG) substrate is provided that includes an external controlling assemble having a plurality of components configured to change a working frequency of the cavity resonator or filter. A dual-band bandpass filter is provided that includes two or more single band filters on a single EBG substrate and an external controlling assemble having a plurality of components configured to change a working frequency of the cavity resonator or filter.
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: July 24, 2018
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Guann-Pyng Li, Yu Guo
  • Patent number: 10033350
    Abstract: A tunable duplexer is specified is disclosed. In an embodiment, the duplexer includes a transmission port, a reception port, a common port and a core having a first inductive element and a second inductive element. The duplexer further includes a first signal path electrically connecting the transmission port to the core, a second signal path electrically connecting the reception port to the core and a third signal path electrically connecting the common port to the core. A first tunable capacitive element electrically connects the first signal path to ground and a second tunable capacitive element electrically connects the second signal path to ground, wherein the first inductive element and the second inductive element are inductively and conductively coupled to one another.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: July 24, 2018
    Assignee: SnapTrack, Inc.
    Inventor: Edgar Schmidhammer
  • Patent number: 10033079
    Abstract: In a non-reciprocal circuit element, electric power handling capability is improved, and leakage power between adjacent channels is reduced. In addition, balance is taken between reduction of noise between adjacent ports and an increase in insertion loss. A non-reciprocal circuit element includes a YIG ferrite (10) and a plurality of conductors (15) disposed on the YIG ferrite (10) and intersecting each other in an insulated state. A part of Y of the YIG ferrite (10) is substituted with at least any one element of Ho, Dy, and Gd, or a part of Fe of the YIG ferrite (10) is substituted with Co.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: July 24, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yuki Nakaike, Kenji Matsuda, Yuko Fujita
  • Patent number: 10027011
    Abstract: The waveguide device, in which first/second openings are formed at end parts of a waveguide path, comprises a waveguide path obtained by uniting first/second waveguides. The first waveguide is provided with a first recessed part which has an opening with a same shape as the first opening and has a bottom part formed in a first direction as seen from the opening. The second waveguide is provided with a second recessed part which has an opening with a same shape as the second opening and has a bottom part formed in a second direction as seen from the opening. The first/second waveguides are united in a manner such that, positions of the bottom parts of the first/second recessed parts are different from each other in a direction differing from the first/second directions, and the first/second recessed parts connect with each other at the respective bottom parts.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: July 17, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akimichi Hirota, Yukihiro Tahara, Takashi Maruyama, Tomohiro Takahashi, Kazuyoshi Yamashita