Patents Examined by Stephen E. Jones
  • Patent number: 10027008
    Abstract: An irreversible circuit element includes first and second high pass isolators each including first and second center electrodes intersecting with and being insulated from each other on a ferrite to which a direct-current magnetic field is applied with a permanent magnet. One end of the first center electrode is an output port and the other end thereof is an input port, and one end of the second center electrode is another output port and the other end thereof is a ground port. A pass frequency band of the first isolator is higher than a pass frequency band of the second isolator. Respective output portions of the first and second isolators are electrically connected and defined as one output terminal, and a low pass filter LPF is inserted between the output terminal and the output port of the second isolator.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: July 17, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaya Wada, Yoshiki Yamada
  • Patent number: 10027009
    Abstract: A high-frequency signal transmission line includes a dielectric body, a signal conductor, and a ground conductor. The dielectric body extends along a high-frequency signal transmission direction. The signal conductor is in the dielectric body and extends along the high-frequency signal transmission direction. The ground conductor is in the dielectric body and is electromagnetically coupled to the signal conductor. The dielectric body includes, along the high-frequency signal transmission direction, a plurality of straight portions and a curved portion connecting the plurality of straight portions. In the curved portion, the signal conductor is located at a position on an inner side of a curve relative to a center position in a width direction of the dielectric body.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: July 17, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takahiro Baba, Kuniaki Yosui
  • Patent number: 10027010
    Abstract: There is provided a printed circuit board structure, a dielectric substrate structure and a method of manufacturing thereof using wideband microstrip lines for reducing signal reflection, resonance and radiation for maintaining signal quality. The widths of certain portions of the wideband microstrips and underlying substrate portions are tapered gradually for achieving a reduction in a signal reflection, resonance and radiation therefore resulting in maintaining signal quality.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: July 17, 2018
    Assignee: United Arab Emirates University
    Inventors: Rashad Ramzan, Omar Farooq Sidiqui, Azam Beg
  • Patent number: 10003311
    Abstract: An amplifier circuit includes an RF input port, an RF output port, a reference potential port, and an RF amplifier having an input terminal and a first output terminal. An output impedance matching network electrically couples the first output terminal to the RF output port. A first inductor is electrically connected in series between the first output terminal and the RF output port, a first LC resonator is directly electrically connected between the first output terminal and the reference potential port, and a second LC resonator is directly electrically connected between the first output terminal and the reference potential port. The first LC resonator is configured to compensate for an output capacitance of the RF amplifier at a center frequency of the RF signal. The second LC resonator is configured to compensate for a second order harmonic of the RF signal.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: June 19, 2018
    Assignee: Infineon Technologies AG
    Inventors: Timothy Canning, Richard Wilson, Haedong Jang, David Seebacher, Christian Schuberth, Rongguo Zhou, Bayaner Arigong
  • Patent number: 10003115
    Abstract: A terminator has an upper dielectric layer provided on an upper broad wall of a post-wall waveguide, and a microstrip line (MSL) provided on the upper dielectric layer. A blind via has one end thereof connected with one end of the MSL and is inserted inside the post-wall waveguide. A chip resistor has one end thereof connected with the other end of the MSL and has the other end thereof connected with the upper broad wall.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: June 19, 2018
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Patent number: 10003322
    Abstract: Circuits and methods for eliminating or mitigating the amount of temperature-dependent variation in the relative attenuation of a multi-valued digital step attenuator (DSA) by using resistive components having temperature-dependent resistance values that compensate for or offset changes in the temperature-dependent ON resistance (RON) of the switches within the DSA. In some embodiments, DSA attenuator cell switches are fabricated to have positive first-order resistance temperature (FORT) coefficients, while temperature-compensating series attenuation resistances are fabricated as a positive FORT coefficient resistor and temperature-compensating shunt resistances are fabricated as either a negative FORT coefficient resistor or a combination of a negative FORT coefficient resistor in parallel with a positive FORT coefficient resistor.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: June 19, 2018
    Assignee: pSemi Corporation
    Inventor: Fleming Lam
  • Patent number: 9991577
    Abstract: A cavity filter that uses cross-coupling is disclosed, which includes: a housing, in which multiple cavities are formed, with the cavities being open towards a first direction; multiple resonators held respectively in the multiple cavities; and a coupling member arranged to pass through an aperture between a first cavity and a second cavity, from among the multiple cavities, such that the coupling member is positioned between a first resonator and a second resonator. Here, the coupling member includes a first extending portion and a second extending portion, the first extending portion is positioned closer to the first resonator than to the second resonator and extends towards one side of the housing along the first direction, and the second extending portion is positioned closer to the second resonator than to the first resonator and extends towards the other side of the housing along the first direction.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: June 5, 2018
    Assignee: ACE TECHNOLOGIES CORPORATION
    Inventors: Dong-Wan Chun, Jae-Ok Seo
  • Patent number: 9991933
    Abstract: The invention relates to an attenuator for stepwise attenuating a radio frequency signal. The attenuator comprises a first attenuation module that is configured to stepwise attenuate a radio frequency signal within a first signal frequency range. The attenuator comprises a second attenuation module that is configured to stepwise attenuate a radio frequency signal with a second signal frequency range, wherein the second attenuation module is arranged in parallel to the first attenuation module. The attenuator further comprises a switching element, wherein the switching element switches either the first attenuation module or the second attenuation module to an output node of the attenuator.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: June 5, 2018
    Assignee: Rohde & Schwarz GmbH & Co. KG
    Inventor: Simon Schmid
  • Patent number: 9985584
    Abstract: According to one embodiment, a high-frequency semiconductor amplifier includes an input terminal, an input matching circuit, a high-frequency semiconductor amplifying element, an output matching circuit and an output terminal. The input terminal is inputted with a fundamental signal. The fundamental signal has a first frequency band and a first center frequency in the first frequency band. The input matching circuit includes an input end and an output end. The input end of the input matching circuit is connected to the input terminal. The high-frequency semiconductor amplifying element includes an input end and an output end. The input end of the high-frequency semiconductor amplifying element is connected to the output end of the input matching circuit. The high-frequency semiconductor amplifying element is configured to amplify the fundamental signal.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: May 29, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kazutaka Takagi, Yukio Takahashi
  • Patent number: 9983336
    Abstract: A technique relates to a microwave device. A microwave system is configured to output a microwave readout signal, where the microwave system has an input and an output. An output microwave transmission line is connected to the output of the microwave system. A distributed Bragg reflector, integrated into a transmission line geometry, is configured as a low-loss infrared filter that blocks infrared radiation while allowing transmission of the microwave readout signal. The low-loss infrared filter is connected to the output microwave transmission line.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: May 29, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Baleegh Abdo
  • Patent number: 9985601
    Abstract: A step attenuator with constant input capacitance and having good performance is disclosed. In an exemplary design, an apparatus includes a step attenuator having a constant input capacitance for different amounts of attenuation. The step attenuator receives an input signal, provides a variable amount of attenuation for the input signal, and provides an output signal. The step attenuator may include a plurality of attenuator sections coupled in series. Each attenuator section may include a plurality of capacitors and may have the constant input capacitance. At least one of the plurality of attenuator sections may be selected or unselected to obtain a selected amount of attenuation for the step attenuator. An attenuator section may provide a predetermined amount of attenuation or a variable amount of attenuation when selected. The apparatus may further include a power detector that receives and determines the power of the output signal from the step attenuator.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 29, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Xinwei Wang, Xiangdong Zhang, Marc Gerald Dicicco
  • Patent number: 9985684
    Abstract: A passive equalizer is provided. The passive equalizer includes a first resistive element, a first inductive element, a second resistive element, and a first variable capacitor. The first resistive element is coupled between an input node and an output node. The first inductive element and the second resistive element are coupled in series between the output node and a first voltage supply node. The first variable capacitor is coupled between the input node and a first node located between the first inductive element and the second resistive element.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: May 29, 2018
    Assignee: NXP USA, INC.
    Inventor: Kevin Yi Cheng Chang
  • Patent number: 9979065
    Abstract: A filter includes a top panel, a bottom panel, two first side panels located between the top panel and the bottom panel, and at least one diaphragm that has a metal surface. The two first side panels, the top panel and the bottom panel form a rectangular waveguide. The at least one diaphragm is connected to both the top panel and the bottom panel and separates a cavity of the rectangular waveguide into several cavity chambers that extend along an input/output direction of the rectangular waveguide. At least one of the first side panels is an adjustable side panel whose position relative to the diaphragm is adjustable.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: May 22, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Shaofeng Xu
  • Patent number: 9979375
    Abstract: A communication matching network for multi-harmonic suppression includes a communication circuit configured to provide a signal. The communication matching network further includes a matching circuit configured to receive the signal from the communication circuit and suppress one or more harmonics of the received signal to generate a filtered signal, wherein the matching circuit includes a transformer comprising a first winding and a second winding, wherein the first winding includes a first inductance and the second winding includes a second inductance and wherein the matching network includes a harmonic trap including a third inductance such that the third inductance is located inside or within a physical layout of the first winding and/or the second winding. The communication matching network further includes a receiver circuit configured to receive the filtered signal from the matching circuit for further processing.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: May 22, 2018
    Assignee: Intel IP Corporation
    Inventors: Stephan Leuschner, Jose Pedro Diogo Faisca Moreira
  • Patent number: 9979376
    Abstract: A tunable impedance network includes at least one variable impedance bank comprising a plurality of digitally controlled unit cells each connected from at least a first end to a routing wire. The tunable impedance network is provided with selection means arranged for selecting, based on a desired impedance, a corresponding predetermined digital control signal to be supplied to the variable impedance bank to switch-on a corresponding combination of the unit cells. Between each pair of unit cells in the variable impedance bank, a routing wire section is provided having a respective routing impedance. Each of the predetermined digital control signals is provided for switching-on a combination of unit cells in such a way that the routing impedance of the routing wire section is exploited to fine-tune the actual impedance generated by the variable impedance bank.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: May 22, 2018
    Assignee: IMEC VZW
    Inventors: Benjamin Poris Hershberg, Barend van Liempd
  • Patent number: 9974160
    Abstract: Systems and methods described herein are provided for electrically coupling conductors within a multilayered printed circuit board (PCB) using an interconnect formed along an outer surface of one or more stripline boards making up the multilayered PCB. The multilayered PCB may include first and second stripline boards each having multiple dielectric layers. A first conductor may be formed in the first stripline between the multiple dielectric layers and a second conductor may be formed in the second stripline between the multiple dielectric layers. The interconnect may be formed over an outer surface the dielectric layers such that the interconnect extends from the first conductor to the second conductor. An electrically conductive wall may be formed over the edge or side portion of the dielectric layers to form a cavity that encloses the interconnect and the outer surface of the multilayered PCB.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: May 15, 2018
    Assignee: Raytheon Company
    Inventors: Thomas V. Sikina, Mary K. Herndon, John P. Haven, Alkim Akyurtlu
  • Patent number: 9972878
    Abstract: An adjustable constant impedance phase shifter is provided. In the adjustable constant impedance phase shifter a conductive circuit path is arranged between a conductive sheet and a parallel plane that is parallel to the conductive sheet; an edge of a dielectric plate and an edge of a conductive plate are adjoined such that the dielectric plate and the conductive plate form a slide member; and the slide member is movably arranged along a slide path between the circuit element and the conductive sheet so that any point of the conducting circuit path is consistently enclosed between the slide member and the parallel plane, and so that the relative permittivity of a medium adjacent to a point on the conductive circuit path is simultaneously changed as the slide member is moved.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: May 15, 2018
    Assignee: Filtronic Wireless AB
    Inventor: Bjorn Lindmark
  • Patent number: 9973167
    Abstract: Impedance matching circuits and methods for radio frequency (RF) transmission coil are disclosed. An example impedance matching circuit includes a coil matching circuit, a RF power detection circuit, and a spectrometer. The spectrometer outputs an output voltage reversely applied on a varactor diode of the coil matching circuit. An impedance of the coil matching circuit is changed based on the output voltage. The spectrometer outputs a RF transmission signal to the RF power detection circuit, receives a power of a RF reflected signal corresponded to the output voltages. The spectrometer receives powers of different RF reflected signals corresponded to different output voltages, and assigns an output voltage corresponded to a minimum power of the RF reflected signals as an impedance matching voltage, where an equivalent impedance of the coil matching circuit and the RF transmission coil matches with an impedance of RF transmission lines.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: May 15, 2018
    Assignee: Shenyang Neusoft Medical Systems Co., Ltd.
    Inventors: Jianhua Shi, Hongbing Hu, Huidong Gu, Haiquan Li, Hongwei Wang, Lin Wu, Haobo Jin
  • Patent number: 9972882
    Abstract: A multi-mode cavity filter, including at least one dielectric resonator body incorporating a piece of dielectric material having a shape to support first resonant mode and a second substantially degenerate resonant mode; excitation device(s) for at least one of: establishing an electromagnetic field external to, but immediately adjacent to, a face of the dielectric resonator body or for extracting energy from an electromagnetic field located external to, but immediately adjacent to, a face of the dielectric resonator body, a layer of conductive material in contact with and covering the dielectric resonator body on the face of the dielectric resonator body: at least one aperture in the layer of conductive material for inputting signals to the dielectric resonator body and/or outputting signals from the dielectric resonator body, wherein the excitation device is located, in at least two dimensions, at an electrical center of the face of the dielectric resonator body.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: May 15, 2018
    Assignee: MESAPLEXX PTY LTD.
    Inventors: Steven John Cooper, David Robert Hendry, Peter Blakeborough Kenington
  • Patent number: 9966180
    Abstract: A transmission line impedance transformer including at least two different dielectric media having different dielectric properties, each of the dielectric media being configured to taper in thickness along the length of the impedance transformer in an inverse relationship with respect to each other so as to form a combined dielectric medium having an effective dielectric property that is graded along the transmission path. The two or more dielectric media may be disposed between two conductors to provide an impedance transformer in which a characteristic impedance of the transmission line varies along its length in response to the gradation of the effective dielectric property of the combined dielectric medium.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: May 8, 2018
    Assignee: Raytheon Company
    Inventors: Daniel B. Schlieter, Patrick J. Kocurek, Christopher A. Loehrlein, Brandon W. Pillans