Abstract: A method for measuring composite distortion levels using a coherent multicarrier RF signal generator having incrementally related frequencies is disclosed. The invention provides for the use of a coherent multicarrier signal generator that permits arbitrary RF carrier phase control on an individual carrier basis in order to enable sequential distortion measurements under varying carrier phase conditions. In order to obtain measurement results that match those obtained by the use of prior art non-coherent signal sources, the present invention provides for averaging of distortion measurement results over a ‘phase configuration ensemble’ that is obtained by multiple sequential measurements, in which the individual carrier phases for each measurement are preselected at random.

Abstract: An AC/DC voltage reference system has at least one micromechanically fabricated electrode pair having first and second electrodes facing each other so that the electrodes are disposed at a distance from each other, whereby at least one of the electrodes is movable against a spring force. An AC signal is applied over the electrodes to establish an electrostatic force at a frequency substantially higher than the effective mechanical resonant frequency of the movable electrode. The system further includes an apparatus for detecting the AC voltage applied between the electrodes, thus forming an AC voltage reference.

Abstract: An integrated circuit is forced into a test mode through executing the following steps: presenting a test forcing pattern on a subset of the circuit's external pins for driving the circuit to a test mode, presenting the electronic test forcing pattern to the circuit and finally executing the test proper. In particular, the following steps are implemented: presenting the pattern on a single pin in the form of an aggregate of a clocking sequence and a transition signalling data sequence as input data for an on-circuit storage element; clocking the storage element by a delayed version of the test forcing pattern; sequentially storing successive data parts of the test forcing pattern under control of successive clock parts of the delayed test forcing pattern; matching a predetermined string of the stored data parts versus a standard pattern, and upon finding a match driving the circuit to a test condition for then executing a test procedure.

Abstract: An apparatus and method for the nondestructive inspection of dielectric materials are disclosed. Monochromatic, phase coherent electromagnetic radiation, preferably in the 5-50 gigahertz frequency range (i.e., microwaves) impinges on the sample. In accordance with Snell's law, the microwaves are partly transmitted and partly reflected at each interface where the dielectric constant changes (e.g., where there are delaminations, cracks, holes, impurities, or other defects.) A portion of the reflected beam is combined with the signal reflected by the specimen being inspected. These two signals have the same frequency, but may differ in amplitude and phase. The signals combine to produce an interference pattern, a pattern that changes as the specimen changes, or as the position of the specimen changes relative to that of the detector.

Abstract: An interconnect apparatus for testing bare semiconductor dice comprises raised contact members on a semiconductive substrate. The contact members are covered with an insulation layer and a conductive cap connected by a conductive trace to a testing circuit. The trace is covered with coaxial layers of a silicon-containing insulation and a metal for shielding the trace from “crosstalk” and other interference. An apparatus for simultaneous testing of multiple dies on a wafer has thermal expansion characteristics matching those of the semiconductor die or wafer and provides clean signals.

Abstract: An optical current transducer configured to sense current in the conductor is disclosed. The optical current transducer includes a light source and a polarizer that generates linearly polarized light received from a the light source. The light is communicated to a magneto-optic garnet that includes, among other elements, bismuth, iron and oxygen and is coupled to the conductor. The magneto-optic garnet is configured to rotate the polarization of the linearly polarized light received from the polarizer. The optical current transducer also includes an analyzer in optical communication with the magneto-optic garnet. The analyzer detects the rotation of the linearly polarized light caused by the magneto-optic garnet.

Abstract: An apparatus is provided for determining the response of an electrometer used in an electrophotographic recording apparatus. The apparatus includes a movable base disposed adjacent said electrometer. The base includes a non-conductive material. A conductive pattern is disposed on the base. The conductive pattern is electrically connected to a variable power supply. A motor moves or drives the base past the electrometer. The motor is controlled by a motor control to vary the speed of movement of said base. A method is also provided for determining the response of an electrometer used in an electrophotographic recording apparatus. An electrometer to be tested is selected and the operational parameters of the electrometer are dynamically tested.

Abstract: A corrosion sensor for use within a fluid flow path includes a sensing element and circuitry coupled to the sensing element for detecting corrosion of the sensing element. Another embodiment of a corrosion sensor for use within a fluid flow path comprises a hermetic housing, a sensing element attached to an external portion of the housing for exposure to the fluid flow path, and circuitry disposed within said hermetic housing, which circuitry is coupled to the sensing element for detecting corrosion of the sensing element.

Abstract: Disclosed is a wafer containing a semiconductor substrate, at least one metal layer formed over the semiconductor substrate, and at least one electrical sensor embedded at least one of on and in the wafer to facilitate real time monitoring of the metal layer as it progresses through a subtractive metallization process. The system contains a wafer comprising at least one metal layer formed on a semiconductor substrate, at least one electrical sensor in contact with the wafer and operable to detect and transmit electrical activity associated with the wafer, and an electrical measurement station operable to process electrical activity detected and received from the electrical sensor for monitoring a subtractive metallization process in real-time.

Abstract: The object of the invention is to provide a water immersion detecting circuit, which is free from false detection and is stable and highly sensitive in operation. There is provide a water immersion detecting circuit provided on a printed board 11 of an electronic unit and used for detecting water immersion of the electronic unit based on a change of resistance generated between a pair of sensor electrodes for detecting water immersion P10, p11, wherein the pair of sensor electrodes P10, P11 are positioned opposite to each other on the printed board 11, and a U-shaped slit (opening) 12 is formed between the sensor electrodes P10, P11.

Abstract: A test socket for testing a packaged semiconductor device. The test socket includes a test substrate, at least one support member, and at least one securing member. Terminals of the test substrate are electrically connectable to a testing device. The terminals may by located within recesses that are configured to receive leads. The shapes of each support member and securing member may be complementary to the respective shapes of the bottom and top surfaces of leads extending from the packaged semiconductor device. Upon placement of a packaged semiconductor device on the test substrate, the leads are aligned with and positioned against their corresponding terminals and the support member. The securing elements are then placed against the leads to bias each lead against its corresponding terminal.

Abstract: Apparatus and methods for creating a fault such as a varying resistance fault causing static are disclosed. Devices according to the invention include a housing having an entrance face and defining an interior region, a quantity of granular electrically conductive material contained within the interior region, and a pair of electrical conductors extending through the entrance face of the housing, each conductor having a first portion that extends into the interior region of the device. Each of the first portions includes a distal portion that is in electrical contact with the granular conductive material, and the quantity of granular material is such that the granular material provides an intermittent electrical connection between the distal portions.

Abstract: A distance measurement system is provided. The distance measurement system includes at least one resonant circuit, at least one magnetic element with predetermined magnetic properties, a transmitter operable to transmit an electromagnetic pulse, a receiver operable to detect oscillations emitted by said resonant circuit in response to said electromagnetic pulse, and an analyzer operable to analyze an amplitude envelope property of said oscillations, to thereby determine a distance between the resonant circuit and the magnetic element.

Abstract: A method of inspecting semiconductor die and lead frame assemblies uses rotation invariant/scale invariant processing methods of machine vision data. A training image is acquired and processed to form a training model. A runtime image is acquired and processed using rotation invariant/scale invariant tools to find a runtime instance of the trained model and produce x, y, theta and scale information. The runtime instance is aligned to the train time model, or vice versa, and then compared to the train time model. The features and edges from the runtime image are compared to features and edges of the training model to identify discrepancies as possible defects. The possible defects are further processed with a morphological filter and/or a blob filter to further refine images of the defects. Alternative implementations of the invention measure adhesive wet-out around semiconductor dies and provide measurements of die rotation.

Abstract: A method of testing semiconductor devices on a wafer, including a tasting circuit formed on the wafer for providing an output signal indicative of at least one operational characteristic of the devices. The output signal provided by the testing circuit is compatible for monitoring using an integrated circuit tester. The testing circuit includes an oscillator, an N-bit counter, and an N-bit shift register, all formed on the semiconductor wafer. The tester resets the counter and enables the oscillator, at which time the oscillator produces oscillator pulses at an oscillator frequency. During a predetermined time period, the counter receives and counts the oscillator pulses from the oscillator, and produces a pulse count corresponding to the number of oscillator pulses received. The shift register receives the count from the counter as an N-bit digital data word. The tester shifts the N number of bits of the digital data word out of the shift register, and manipulates the bits to determine a count value.

Abstract: A tool for diagnosing and repairing defective wires. The tool is configured as a pair of pliers, wherein the pliers have the ability to cut, strip and twist wire. The pliers also contain two different piercing probes. The first piercing probe extends away from the body of the pliers, thereby enabling the pliers to be used as a circuit testing probe. The second piercing probe is located at a specific point on the jaws of the pliers. When a wire is placed in the jaws of the pliers at that point, the wire becomes pierced by the second piercing probe as the plier jaws close. The force at which the second piercing probe is biased against the wire is determined by the degree of manual force applied to the handles of the pliers. As either piercing probe pierces the insulation surrounding a wire, the body of the pliers is brought to the same electrical potential as the wire. A wire lead extends from the pliers and connects to a ground potential at a remote location.

Abstract: A method of measuring an accuracy with which an electric-component mounting system mounts one or more electric components on a circuit substrate, the electric-component mounting system including one or more component holders for holding the electric component or components, a substrate supporting device for supporting the circuit substrate, a first image-taking device for taking an image of at least a portion of the electric component held by the component holder, and a second image-taking for taking an image of at least a portion of the circuit substrate supported by the substrate supporting device, the method including the step of measuring, with the electric-component mounting system, at least one positional error of one of the component holder, the first image-taking device and the second image-taking device relative to one or each of the others of the component holder and the first and second image-taking devices.

Abstract: A method for determining the remaining operating life of a fluorescent lamp comprising cathodes, when the fluorescent lamp is a part of a fluorescent lamp circuit, which in addition to the fluorescent lamp includes a ballast, for example a capacitor and an inductance. In accordance with the method the remaining operating life of the fluorescent lamp is deduced from a phase difference of a voltage applied over a cathode in relation to another current or voltage phase in the fluorescent lamp circuit.

Abstract: A microwave microscope having a resonant slit formed in a highly conductive end of a microwave waveguide forming a probe tip. A short dielectric rod is fit into the waveguide near its conductive end. A longer dielectric rod is placed in back of the short dielectric rod with a small gap between the two rods. The length of the shorter rod and the size of the gap are chosen to form a dielectric resonator at the microwave frequency adjacent to the probe tip. Thereby, the impedance of the waveguide can be matched to the generally high impedance of the slit probe tip. Preferably, the dielectric constant of the materials is high, thereby reducing the size of the waveguide and probe tip relative to the microwave wavelength.

Abstract: The present invention is a non-invasive cable tester. The cable tester comprises a sensor for detecting an electric field emitted by a live electric cable. The resulting signal from the sensor is then filtered, amplified, and compared to a threshold value to determine the energization status of the electric cable. A meter can be provided to get a reading of the amplified signal that can be compared to a predetermined threshold value. Also, a detector circuit can be provided that includes a comparator in electrical communication with a light-emitting device such as a light-emitting diode. The detector circuit processes the amplified signal and compares it to a predetermined threshold value. If the electric cable is energized, the output of the comparator either causes the light-emitting device to emit light or not emit light, as desired. This enables an operator to determine the status of the electric cable simply by determining whether the light-emitting device is lit.