Abstract: A virtual fabrication environment for semiconductor device structure development is discussed. The insertion of a multi-etch process step using material-specific behavioral parameters into a process sequence enables a multi-physics, multi-material etching process to be simulated using a suitable numerical technique. The multi-etch process step accurately and realistically captures a wide range of etch behavior and geometry to provide in a virtual fabrication system a semi-physical approach to modeling multi-material etches based on a small set of input parameters that characterize the etch behavior.

Abstract: A method, an article of manufacture, and a system for designing a mask. The method for designing a mask is implemented by a computer device having a memory, a processor device communicatively coupled to the memory, and a module configured to carry out the method including the steps of: generating an optical domain representation from a design pattern and an imaging light; and optimizing the optical domain representation under a constraint that values of negative excursions at predetermined evaluation points must be greater than or equal to predetermined negative threshold values assigned to the predetermined evaluation points; where: the optical domain representation is a variable representation of a wavefront; the imaging light is light that is transmitted through the mask; the negative excursions are in an object domain representation of the optical domain representation; and the predetermined evaluation points are in the object domain representation.

Abstract: Roughly described, a scan-based test architecture is optimized in dependence upon the circuit design under consideration. In one embodiment, a plurality of candidate test designs are developed. For each, a plurality of test vectors are generated in dependence upon the circuit design and the candidate test design, preferably using the same ATPG algorithm that will be used downstream to generate the final test vectors for the production integrated circuit device. A test protocol quality measure such as fault coverage is determined for each of the candidate test designs, and one of the candidate test designs is selected for implementation in an integrated circuit device in dependence upon a comparison of such test protocol quality measures. Preferably, only a sampling of the full set of test vectors that ATPG could generate, is used to determine the number of potential faults that would be found by each particular candidate test design.

Abstract: An electronic design automation (EDA) tool for adding a feature to a target parameterized cell (pcell) in an electronic circuit design includes a memory that stores the electronic circuit design, and a processor in communication with the memory. The processor defines a specification of an add-on pcell. The specification includes a feature to be added to the target pcell. The processor reads the properties associated with the target pcell and generates the add-on pcell based on its specification and the properties of the target pcell. The add-on pcell then is instantiated and bound to the target pcell, which adds the feature to the target pcell.

Abstract: A calculation method for generating a layout pattern in a photomask includes at least the following steps. A two-dimensional design layout including several geometric patterns distributed in a plane is provided to a computer system. The computer system is used to mark portions of the geometric patterns and generate at least one marked geometric pattern and at least one non-marked geometric pattern. The marked geometric pattern is then simulated and corrected by the computer system so as to generate a 3-D design layout. Through the simulation and correction, the marked geometric pattern and the non-marked geometric pattern are arranged alternately along an axis orthogonal to the plane. The 3-D design layout is outputted to a mask-making system afterwards.

Abstract: One method disclosed herein involves, among other things, generating a set of mandrel mask rules, block mask rules and a virtual, software-based non-mandrel-metal mask. The method also includes creating a set of virtual non-mandrel mask rules that is a replica of the mandrel mask rules, generating a set of metal routing design rules based upon the mandrel mask rules, the block mask rules and the virtual non-mandrel mask rules, generating the circuit routing layout based upon the metal routing design rules, decomposing the circuit routing layout into a mandrel mask pattern and a block mask pattern, generating a first set of mask data corresponding to the mandrel mask pattern, and generating a second set of mask data corresponding to the block mask pattern.

Abstract: A method and apparatus to design a circuit is described. In on embodiment, the method comprises selecting a target clock for a design of the circuit, and determining a plurality of latencies for a portion of the circuit. The method further comprises determining a representation of a data flow graph for the portion of the circuit, the data flow graph having a first node connected with a second node by a number of extra delays determined based on the target clock and the plurality of latencies, the first node and second node representing paths that start from and end in registers in the portion of the circuit, the first node connecting to a node between a first input of the portion of the circuit and an input of a register of the portion of the circuit. The method continues to retime the design for the circuit to operate at the target clock based on the representation of the data flow graph, wherein at least one of the selecting, determining, and retiming is performed by a processor.

Abstract: A method of reliability evaluation and system fail warning using on chip parametric monitors. The method includes determining impact of parametric variation on reliability by identifying key parametric questions to be answered by stress, identifying parametric macros for each parameter, and identifying layout sensitive areas of evaluation. The process can also include a set of parametric macros in one of a test site or a product to be stressed, testing the set of parametric macros prior to start of stress and at each stress read out, and setting life time parameter profile for technology.

Abstract: A debug port configured to generate and provide a return clock is disclosed. In one embodiment, an integrated circuit (IC) includes one or more functional units and a debug port (DP). The DP is configured to enable access by an external debugger to the functional unit(s) of the IC for debugging purposes. The DP includes circuitry that may generate a first clock signal that is provided to the functional unit(s) during debug operations. Receiving test result data at the DP may require a return clock signal that is not provided by the functional unit(s). Accordingly, the IC may include a clock modifier coupled to receive the first clock signal. The clock modifier may generate a second clock signal based on the first, the second clock signal being provided to the DP as a return clock signal.

Abstract: A computer-based system and method for modeling integrated circuit congestion and wire distribution determines a boundary where a tile congestion corresponding to a first layer group is equivalent to a first blockage ratio corresponding to a second layer group, formulates a piece-wise linear formula that relates the tile congestion to a number of wires of a two-dimensional tile, and distributes a portion of the number of wires to a layer of the tile based on the tile congestion.

Abstract: Systems and methods for semiconductor device reliability qualification during semiconductor device design. A method is provided that includes defining performance process window bins for a performance window. The method further includes determining at least one failure mechanism for each bin assignment. The method further includes generating different reliability models when the at least one failure mechanism is a function of the process window, and generating common reliability models when the at least one failure mechanism is not the function of the process window. The method further includes identifying at least one risk factor for each bin assignment, and generating aggregate models using a manufacturing line distribution. The method further includes determining a fail rate by bin and optimizing a line center to minimize product fail rate. The method further includes determining a fail rate by bin and scrapping production as a function of a manufacturing line excursion event.

Abstract: A method includes determining one or more potential merges corresponding to a color set Ai and a color set Aj of N color sets, represented by A1 to AN, used in coloring polygons of a layout of an integrated circuit. N is a positive integer, i and j are integers from 1 to N, and i?j. One or more potential cuts corresponding to the color set Ai and the second color set Aj are determined. An index Aij is determined according to the one or more potential merges and the one or more potential cuts. A plurality of parameters F related to the index Aij is obtained based on various values of indices fi and fj. A parameter F is selected among the plurality of parameters F based on a definition of the index Aij.

Abstract: In some embodiments, in a method for considering in-phase grouping for a voltage-dependent design rule, for a first net and a second net in a schematic, first data for obtaining the differences between first voltage values of the first and second nets, and between second voltage values of the first and second nets is provided. For each of the first and second nets, the first voltage value is larger than the second voltage value. A layout for the schematic is generated. In the layout, a relationship of a first shape and a second shape associated with the first and the second nets, respectively, is defined using the first data.

Abstract: A control unit, e.g., for a motor vehicle, includes a circuit board, a high-impedance circuit component situated on the circuit board and having an impedance of 1 k? or higher in relation to ground of the control unit, and at least one conductive protection element electrically connected to ground and situated adjacent to the high-impedance circuit component. The protection element has a height within a protective distance from the high-impedance circuit component that is at least equal to the protective distance. A method for designing a circuit board of a control unit, and a computer program product for executing the method, include the steps of specifying a position of the high-impedance circuit component, and specifying a position of the protection element such that the protection element has a height within a protective distance from the high-impedance circuit component that is at least equal to the protective distance.

Abstract: Computationally intensive electronic design automation operations are accelerated with algorithms utilizing one or more graphics processing units. The optical proximity correction (OPC) process calculates, improves, and optimizes one or more features on an exposure mask (used in semiconductor or other processing) so that a resulting structure realized on an integrated circuit or chip meets desired design and performance requirements. When a chip has billions of transistors or more, each with many fine structures, the computational requirements for OPC can be very large. This processing can be accelerated using one or more graphics processing units.

Abstract: Data-driven processing of a circuit design includes converting each pattern of one or more input patterns from a first format into a second format. Each pattern identifies one or more inputs and one or more outputs and specifies each function that generates each of the one or more outputs from the one or more inputs. Each pattern of the second format is stored in a database. An input circuit design is searched for circuit design elements that match patterns in the database. Data indicative of each pattern in the database that matches a circuit design element is output.

Abstract: Various embodiments identify a routing layer of an electronic design, create spacetile(s) by performing spacetile punch(es) for the routing layer, identify an area probe from the spacetile(s), and routes the electronic design by using the one or more area probes for performing area search for routing solutions. Some embodiments identify two routing layers of an electronic design, perform spacetile punch(es) to form spacetile(s) for the routing layers, determine a via spacetile layer, identify spacetile(s) as one or more area probes based on the via spacetile layer, and routes the electronic design by using the one or more area probes for performing area search for routing solutions while transitioning between the two routing layers. One of the two routing layers may be a tracked routing layer, and the other may be a trackless routing layer. The tracked routing may be gridded or gridless.

Abstract: A semiconductor circuit includes an array of repeating blocks, each of the blocks having a device, and at least one signal line connecting the devices of the blocks. A model of the semiconductor circuit is generated to include a functional area corresponding to at least one first block of the array, and a loading area corresponding to at least one second block of the array. In the functional area, parasitic parameters of the at least one signal line and the device of the at least one first block are extracted. In the loading area, parasitic parameters of the at least one signal line are extracted, but parasitic parameters of the device of the at least one second block are not extracted.

Abstract: Systems and methods are disclosed for modifying the hierarchy of a System-on-Chip and other circuit designs to provide better routing and performance as well as more effective power distribution. A user specifies desired modifications to the design hierarchy and then the system automatically alters the hierarchy by performing group, ungroup, and move operations to efficiently and optimally implement the desired hierarchy modifications. Any modifications to port and signal names are automatically resolved by the system and the resultant RTL matches the function of the input RTL. The user then evaluates the revised hierarchy with regard to power distribution and routing congestion, and further hierarchy modifications are performed if necessary. A widget user interface facility is included to allow user-guided direction of hierarchy modifications in an iterative fashion.

Abstract: Disclosed is a method of monitoring operation of programmable logic for a streaming processor, the method comprising: generating a graph representing the programmable logic to be implemented in hardware, the graph comprising nodes and edges connecting nodes in the graph; inserting, on each edge, monitoring hardware to monitor flow of data along the edge. Also disclosed is a method of monitoring operation of programmable logic for a streaming processor, the method comprising: generating a graph representing the programmable logic to be implemented in hardware, the graph comprising nodes and edges connecting the nodes in the graph; inserting, on at least one edge, data-generating hardware arranged to receive data from an upstream node and generate data at known values having the same flow control pattern as the received data for onward transmission to a connected node.