Abstract: A method of calculating electrical interactions of circuit elements in an integrated circuit layout without flattening the entire database that describes the layout. In one embodiment, a hierarchical database is analyzed and resistance and capacitance calculations made for a repeating pattern of elements are re-used at each instance of the repeated pattern and adjusted for local conditions. In another embodiment, a circuit layout is converted into a number of tiles, wherein the resistance and capacitance calculations made for the circuit elements in the center and a boundary region of the tiles are computed separately and combined. Environmental information that affects electrical interaction between circuit elements in different levels of hierarchy is calculated at a lower level of hierarchy so that such calculations do not need to be made for each placement of a repeated cell and so that not all interacting elements need to be promoted to the same hierarchy level to compute the electrical interactions.

Abstract: High performance clock distributions and similar wiring networks require improvements in reliability and performance. This is especially true when hierarchical wiring with different metal thicknesses is employed and when a smaller number of large, higher-power buffers are used to reduce timing variability. Routing of critical nets improves robustness, reliability, and resistance while minimizing track and power usage. The method further optimizes the use of multiple physical pins on buffers to achieve desired electrical criteria. This involves optimal selection of additional routing beyond what is needed to satisfy simple connectivity. The routing involves an iterative process to select and evaluate additional possible routes on multiple layers. Each iteration involves extraction and simulation or estimation, and additional routes are added until the desired electrical criteria are met.

Abstract: A method of optimizing power and timing for an integrated circuit (IC) chip, which uses an IC technology that exhibits temperature inversion, by modifying a voltage supplied to the IC chip, while meeting power consumption and timing delay performances across lower and higher temperature ranges. A high voltage is selected that meets a closed timing analysis across a full temperature range to meet a timing performance and a low voltage is selected to meet the timing performance and the power performance across a lower temperature range to a temperature cut point in the higher temperature range. The IC chip is turned on at the high voltage and the high voltage is lowered to the low voltage when the temperature cut point is exceeded to meet the power performance while maintaining the timing performance.

Abstract: A method of determining a pattern of a mask to be used in an exposure apparatus. The mask is arranged on an object plane of a projection optical system. The method includes calculating a value of a first evaluation function used to evaluate a cost of drawing a provisional pattern on a mask blank to manufacture the mask, calculating a value of a second evaluation function used to evaluate an image of the provisional pattern, which is formed on an image plane of the projection optical system when a mask having the provisional pattern is arranged on the object plane, and changing the provisional pattern. The calculations are repeated, and the provisional pattern is determined as the pattern of the mask, when the value of the first evaluation function meets a first predetermined standard and the value of the second evaluation function meets a second predetermined standard.

Abstract: Exemplary embodiments include a method for modifying a circuit synthesis flow having automated instructions, the method including receiving circuit design input for a circuit design, receiving custom specifications to the circuit design input, synthesizing high level logic from the circuit design input, placing logic on the circuit design, refining the circuit design and generating a circuit description from the circuit design.

Abstract: A method of optimizing power and timing for an integrated circuit (IC) chip, identifies a plurality of valid temperature and voltage combinations that allow integrated circuit chips produced according to the integrated circuit chip design to operate within average power consumption goals and timing delay goals. Such a method selects temperature cut points from the valid temperature and voltage combinations for each of the integrated circuit chips, calculates a power consumption amount of each of the temperature cut points, and adjusts the temperature cut points based on the power consumption amount until the temperature cut points achieve the average power consumption goals. Next, this method tests each of the integrated circuit chips, and records the temperature cut points in the memory of the integrated circuit chips.

Abstract: System-on-chip (SoC) designs include large amounts of interconnected intellectual property blocks and standard-cell logic using complex bus fabrics. Today SoC design-closure that validates design targets of area, timing, congestion and power constraints is accomplished post routing as over 80% of validation problems are due to global-interconnect. A method is disclosed that allows the designers to achieve global design-closure and physical topology constraints, early in the design cycle, at much higher levels of abstraction. In particular, logic hierarchy of the design is converted into a physical hierarchy of functional-related clusters of locally-connected logic. The clusters and inter-cluster global connections can be refined to meet design constraints in order to generate a top-level floor-plan in the form of library and constraint files.

Abstract: Among other things, one or more techniques and systems for generating a common design rule check (DRC) rule set for verification of a design layout and for generating a common dummy insertion utility for design layout processing are provided. That is, the common DRC rule set comprises a set of design rules having design rule constraint values corresponding to a restriction threshold, such as a most restrictive value. The common dummy insertion utility is used to insert dummy polygons into a design layout according to a dummy size constraint and a dummy spacing constraint. The design layout is verified as compliant with the common DRC rule set. Once verified, the design layout can be converted from a universal design layout format to a target metal scheme to create a transformed design layout. In this way, design layouts, formatted according to the universal design layout, can be transformed to other formats.

Abstract: In a method of designing a printed circuit board, a package capacitance, a package inductance, and a chip capacitance of an actual memory device are calculated. A signal line capacitance and a signal line inductance per unit length of a signal line are calculated based on characteristics of the printed circuit board. A length of the signal line for each pin is determined based on the package capacitance and the signal line capacitance.

Abstract: Techniques for compacting routing in lower level blocks to free routing resources for upper level blocks are disclosed. In some embodiments, a specification of a hierarchical integrated circuit design comprising a lower level block and an upper level block is obtained. The specification includes an initial routing plan for the lower level block. Subsequently, a compacted routing plan for the lower level block using constrained routing resources comprising fewer routing tracks than the initial routing plan and resulting in at least one unused track as well as a routing plan for the upper level block using the at least one unused track are generated.

Abstract: Systems and methods are described for simultaneously deriving an effective x-sigma corner for multiple, different circuit and/or process metrics for a semiconductor device. The result is an effective sigma that is representative of design intent. Some implementations account for covariance, and use joint probability as the criteria for the effective x-sigma corner (e.g., as opposed to a unique sigma level of each individual metric). Analysis results for each metric can be transformed to metric distributions in a common distribution framework, and a correlation matrix can be calculated. The transformed metric distributions can be input to a joint probability distribution set to achieve a target joint sigma level. The joint probability distribution and correlation matrix values can be used to back-calculate scaled x-sigma corners for each metric distribution. Simulation of the device can be performed at one or more of the scaled x-sigma corners.

Abstract: Logic gates in a child unit of a hierarchical integrated circuit design that are visible in an abstract model of the child unit of the hierarchical integrated circuit design are marked. A hide bit is set for the marked logic gates and a modification on the child unit is performed. The marked logic gates in the child unit are preserved during modification of the child unit. The hide bit is cleared from each marked logic gate and the logic gates are unmarked when modification of the child unit is complete.

Abstract: A system and a method are disclosed for performing clock re-convergence pessimism removal (CRPR) during hierarchical static timing analysis (HSTA). A clock network is divided into a plurality of blocks. A top level includes clock components not included in the plurality of blocks. Block level analysis is performed to determine timing information for each of the plurality of blocks. If available, CRPR data from top level analysis is accounted for in block level analysis. Subsequently, similar analysis is performed on components that are included in top level analysis. If available, CRPR data from bottom level analysis is accounted for in top level analysis. CRPR data can be requested during levels of analysis from the other level. These steps are repeated until analysis is complete.

Abstract: In one embodiment, a method for determining a contour simplification of an object for a simulation is provided. An object in a layout of a transistor design to be created with the photolithographic process is determined. The object includes a width and a length in the layout. A contour simulation is performed to determine a generated contour object. The contour simulation simulates parametric variation factors that may occur in the photolithographic process. An adjusted width and adjusted length of the object is then determined based on the generated contour object. The adjusted width and the adjusted length are usable to determine a parametric model for simulation of the object. For example, a layout versus schematic (LVS) tool may back-annotate the layout. Then, a SPICE simulation may use the output of the LVS tool to verify the electrical behavior of the transistor using the adjusted width and adjusted length.

Abstract: A via design method includes doing a simulation according to input data to obtain the impedance of the via of the reference printed circuit board (PCB). An optimal via model is determined according to a group of input data. Simulating is performed according to the thickness of a PCB to-be-designed and the optimal via model data, to obtain the impedance of a via of a PCB to be designed. The number of the anti-pads of the via of the PCB to be designed is recorded when the difference between the impedance of the via of the PCB to be designed and the impedance of the via model of the reference PCB does not fall within a preset range. An interval between each two adjacent anti-pads of the via of the PCB to designed is determined according to the recorded number and the thickness of the PCB to be designed.

Abstract: Systems and techniques for multiple-instantiated-module (MIM)-aware pin assignment are described. An aggregate cost function can be determined, wherein the aggregate cost function is aggregated across all instances of an MIM for placing a pin at a particular location on the boundary of the MIM. The aggregate cost function can then be used by a pin assignment engine to place the pin in the MIM. A pin assignment engine can place one pin at a time, or place multiple pins at a time by trying to optimize the aggregate cost over multiple pins. Some embodiments can propagate pin-alignment constraints through one or more instances of one or more MIMs in the circuit design layout, and then perform pin assignment while observing the pin-alignment constraints. In some embodiments, pin assignment can be performed on MIMs in decreasing order of the number of pin-alignment constraints that are imposed on the MIMs.

Abstract: A method is provided to produce a constraint information for use to implement a routing process used to generate routing signal lines in an integrated circuit design comprising: producing a net topology pattern structure that corresponds to a logical net that is associated with at least two instance item structures of at least one functional design, wherein the net topology pattern structure is associated with the at least two instance item structures and includes multiple constituent structures that indicate at least one constraint upon physical implementation of the logical net structure.

Abstract: A computer system identifies active nets in a netlist of a circuit design by performing simulation of the netlist. Active nets are interconnections between circuit components showing a level of activity during the simulation. The computer system extracts, from a layout of the circuit design, a parasitic netlist of a part of the circuit design, where the part determined by the active nets. The parasitic netlist is a list of parasitic nets, or unwanted circuit interconnections that are unavoidable adjuncts of the active nets. The computer system performs simulation of the circuit design including the netlist of a circuit design and the parasitic netlist of the part of the circuit design.

Abstract: According to an aspect of an embodiment, a method of designing an analog circuit may include selecting multiple analog components for a circuit. The method may also include ordering the analog components. The method may also include determining at least one pareto-optimal design point for a parameter of each analog component. The pareto-optimal design point for each analog component may be based on a performance metric, the parameter for the respective analog component, and constraints resulting from pareto-optimal design points for analog components ahead of the respective analog component within the ordering of the analog components.

Abstract: A system and method for determining power leakage of an electronic circuit design that includes a plurality of digital logic elements, using an electronic design automation (EDA) tool that includes a processor and an automatic test pattern generation (ATPG) tool for generating multiple sets of input value strings. The ATPG tool generates test patterns that include input value strings for simulating each digital logic element of the circuit design independently. A mapping between generated output values and corresponding input values is stored in a look up table (LUT). Thereafter, the ATPG tool generates test patterns that include input value strings for simulating the real-time behavior of the circuit design. The processor determines power leakage of the circuit design based on probability of occurrence of each unique input value string at the input of each digital logic element and corresponding predetermined power leakage values.