Abstract: Embodiments that design integrated circuits using a 1×N compiler in a closed-loop 1×N methodology are disclosed. Some embodiments create a physical design representation based on a behavioral representation of a design for an integrated circuit. The behavioral representation may comprise RTL HDL with one or more 1×N building blocks. The embodiments may alter elements of the 1×N building block by using logic design tools, synthesis tools, physical design tools, and timing analysis tools. Further embodiments comprise an apparatus having a first generator to generate a behavioral representation of a design for an integrated circuit, a second generator to generate a logical representation of the design, and a third generator to generate a physical design representation of the design, wherein the representation generators may create updated versions of the representations which reflect alterations made to 1×N building block elements.

Abstract: Disclosed are a method, apparatus, and computer program product for performing interactive layout editing to address double patterning approaches to implement lithography of electronic designs. A spatial query is performed around the shape(s) being created during editing with the distance of allowed spacing in a single mask. If a design error is encountered, corrective editing may occur to correct the error. Checking may occur to make sure that the error detection and corrective actions can be performed interactively.

Abstract: A method and system for computing Fourier coefficients for a Fourier representation of a mask transmission function for a lithography mask. The method includes: sampling a polygon of a mask pattern of the lithography mask to obtain an indicator function which defines the polygon, performing a Fourier Transform on the indicator function to obtain preliminary Fourier coefficients, and scaling the Fourier coefficients for the Fourier representation of the mask transmission function, where at least one of the steps is carried out using a computer device.

Abstract: Method for performing timing closure of integrated circuits in the presence of manufacturing and environmental variations. The starting design is analyzed using statistical static timing analysis to determine timing violations. Each timing violation in its statistical canonical form is examined. In a first aspect of the invention, the canonical failing slack is inspected to determine what type of move is most likely to fix the timing violation taking into account all relevant manufacturing and environmental variations. In a second aspect of the invention, pre-characterized moves such as insertion of delay pad cells are evaluated for their ability to fix the timing violation without triggering timing, and the best move or set of moves is selected.

Abstract: A design support apparatus includes a detecting unit, a determining unit, and an inserting unit. The detecting unit detects a via that connects wirings in a circuit to be designed that is expressed by layout information. The determining unit determines the connection position of a dummy via that does not connect wirings, to be on at least one of wirings connected to the via detected by the detecting unit. The inserting unit inserts the dummy via at the connection position determined by the determining unit.

Abstract: Disclosed are a method, system, and computer program product for implementing various embodiments of the methods for implementing multi-power domain digital or mixed-signal verification and low power simulation. The method or the system comprises automatically generating one or more net or terminal expression, set, or one or more overriding net or terminal expression by reading, importing, or interpreting the power data file for the electronic circuit design; identifying one or more schematics of the electronic circuit design; generating an annotated schematic of the electronic circuit design by automatically annotating at least one of the one or more schematics with some of the one or more net or terminal expression, set, or one or more overriding net or terminal expression; and performing verification of the electronic circuit design by using at least the annotated schematic.

Abstract: Some embodiments of the invention provide a configurable integrated circuit (“IC”). The configurable IC includes a set of multiplexers that each has a set of input terminals, a set of output terminals, and a set of select terminals. The set of multiplexers includes a group of multiplexers, where at least one input terminal of each multiplexer in the group is a permanently inverting input terminal. During at least a set of cycles during the operation of the configurable IC, several multiplexers in the group of multiplexers are used to implement a particular function.

Abstract: Methods and systems are provided for analyzing cells of a cell library used to generate a layout. One exemplary method involves determining a routed connection location utilized in the layout for a pin of the cell for each instance of the cell in the layout. The method continues by determining a utilization metric for the pin of the cell based on the plurality of routed connection locations and a plurality of possible connection locations for the pin, and displaying the utilization metric on a display device.

Abstract: A utility includes a design-for-manufacturing (DFM) checker configured to check layout patterns of an integrated circuit, and a layout change instruction generator configured to generate a layout change instruction based on a result generated by the DFM checker. The DFM checker and the layout change instruction generator are embodied on a non-transitory storage media. The layout change instruction specifies an identifier of a layout pattern among the layout patterns, and a respective layout change to be performed on the layout pattern.

Abstract: A custom prototyping board and a controller are integrated to form an emulation system for emulating a circuit design. The controller may be disposed on an adaptor board. The custom prototyping board is defined by a set of board description files which further define the FPGA device(s) used in the system as well as the wire connections among the FPGA devices and connectors on the custom prototyping board. The FPGA device(s) is configured in accordance with the partitioned circuit design. Each partitioned circuit in the FPGA device is associated with a verification module for communicating with the controller to control and probe the emulation. A host workstation may be used to link with the controller to support co-simulation or co-emulation of the circuit design.

Abstract: A programmable device system includes one or more network-on-chip (NoC) die layers vertically connected to one or more programmable chip dice layers. The NoC die layer includes interconnects, a bus or non-blocking switches, and optionally memory blocks and direct memory access engines. The NoC die layer improves on-chip communications by providing fast and direct interconnection circuitry between various parts of the programmable chip die.

Abstract: A counter/timer circuit and a method of operating the counter/timer circuit are described. In one embodiment, a method of operating a counter/timer circuit involves determining a match condition by comparing a count value of the counter/timer circuit with a value stored in a match register of the counter/timer circuit and delaying an assertion of the match condition based on a value programmed in a match companion register of the counter/timer circuit. The match companion register is associated with the match register. Other embodiments are also described.

Abstract: Approaches for binning integrated circuits using timing are provided. A method includes performing a statistical timing analysis of a design. The method also includes identifying bin sub-spaces within a process space of the design. The method further includes determining a frequency limit for each said bin sub-space. The method additionally includes closing timing to the frequency limit for each said bin sub-space.

Abstract: A technique validates results from a circuit simulation estimation program. The technique determines whether the estimated results satisfy Kirchhoff's current law (KCL), Kirchhoff's voltage laws (KVL), and power conservation for the original circuit. A reporting tool shows the validation results and may be customized by the user. The tool can show in the original circuitry where the estimated results may be inaccurate.

Abstract: A circuit design, responsive the input signals, may be obtained and processed. The circuit design may define connections between combinational elements, memory elements, and input signals. Identification of cut-off points may be performed with respect to predetermined combinational logic input signals. The cut-off points may be connections whose values are not dependant on the value of the predetermined combinational logic input signals. An approximated circuit design may be synthesized by relaxing the logic associated with the cut-off points. Based on the approximated circuit design, processing may be performed. In some exemplary embodiments, a clock gating function of a memory element may be determined by approximating the circuit design with respect to the output signal of the memory element. The clock gating function may be determined based on the approximated circuit design and introduced to the circuit design, with or without additional refinement.

Abstract: A potential-supply connection interconnect is provided in a multilayer interconnect layer. The potential supply connection interconnect overlaps some cell of I/O cells in the outer peripheral cell column and some cell of I/O cells in the inner peripheral cell column in a plan view. The potential-supply connection interconnect connects a power potential supply interconnect located below the outer peripheral cell column to a power potential supply interconnect located below the inner peripheral cell column and also connects a ground potential supply interconnect located below the outer peripheral cell column to a ground potential supply interconnect located below the inner peripheral cell column.

Abstract: The present disclosure relates to a method of routing probe pads to micro-bumps of an interposer. An interposer is provided having target micro-bumps and probe pads. The probe pads are initially unassigned. Target micro-bump locations and probe pad locations are obtained. Possible route assignments from the probe pads to the target micro-bumps are obtained. Costs are developed for the possible route assignments at least partially according to the target micro-bump locations and the probe pad locations. Final assignments are selected from the possible assignments according to the costs.

Abstract: An apparatus having two or more parallel carry chain structures, each of the carry chain structures comprising a series of logical structures, where at least one of the logical structures within each of the carry chain structures has an associated input node, output node and carry node. The input node corresponds to a function input term, the output node corresponds to an output term of the function and the carry node corresponds to a carry value to a following logical structure in the series of logical structures.

Abstract: Aspects of the present disclosure are directed toward methods and systems which generate a plurality of Read-Only Memory (ROM) codes. In response to generating the ROM codes, an image is generated for each of the plurality of ROM codes. The images for each of the plurality of ROM codes are mapped on a single reticle, and a wafer is provided, which includes a plurality of individual devices. The reticle is utilized, which includes an image for each of the plurality of ROM codes, to print a respective one of the images onto a respective one of the plurality of individual devices.

Abstract: The present invention is directed to a method and system for rapidly identifying physical locations of manufacturing defects on the surface of a semiconductor die. The method and system first retrieve information about an electrical failure from an IC's electrical test result and then identify a set of electrical elements from the IC's layout design including a start resource and an end resource. Next, the method and system identify a physical signal path between the start resource and the end resource using the IC's layout design. Finally, the method and system examine a corresponding region on the semiconductor die that covers the physical signal path for manufacturing defects that may be responsible for the electrical failure.