Abstract: A static random access memory (SRAM) includes a data line, a data line bar, and a current path block. The current path block includes at least two transistors configured to provide a current path for the data line in transition from a first logic voltage to a second logic voltage, wherein the current path block is connected to the data line and the data line bar.

Abstract: An electromechanical switch is described, which comprises a conductive body and a plurality of carbon nanotubes being separate to each other, each of the carbon nanotubes being connected to at least one common terminal electrode with at least one of its ends, wherein in an open state of the switch each of the carbon nanotubes substantially projects along a surface of the conductive body and keeps up a gap to said surface, and wherein in a closed state of the switch at least one carbon nanotube is bend in a direction of the surface to close an electrical contact between said terminal electrode and the conductive body. The size of the gap between the respective carbon nanotube and the surface is different for each one of the plurality of carbon nanotubes.

Abstract: A semiconductor memory device having read and write operations includes a discrimination signal generating unit for generating a discrimination signal during the write operation and a selective delay unit for receiving and selectively delaying a command-group signal in response to the discrimination signal.

Abstract: An apparatus, system, and method are disclosed for determining a read voltage threshold for solid-state storage media. A data set read module reads a data set from storage cells of solid-state storage media. The data set is originally stored in the storage cells with a known bias. A deviation module determines that a read bias for the data set deviates from the known bias. A direction module determines a direction of deviation for the data set. The direction of deviation is based on a difference between the read bias of the data set and the known bias. An adjustment module adjusts a read voltage threshold for the storage cells of the solid-state storage media based on the direction of deviation.

Abstract: A method for testing a primary memory of control and regulation electronics of a frequency converter is described. The primary memory includes (i) at least one matrix of memory cells, (ii) means for addressing the at least one memory cell matrix, and (iii) a write/read circuit The method includes examining at least a part of the means for addressing with regard to address errors and examining at least a part of the memory cells with regard to cell errors. The examining steps are performed independently of one another. The examining at least a part of the means for addressing includes examining individual address bits of an n-bit wide address bus in steps that are performed independently of one another. The examining is dependent on use of the primary memory for operation of the frequency converter.

Abstract: A method of using Joule heating to regenerate nanowire based biosensors. The nanowire based biosensor contains various detection molecules, such as nucleic acids, bound to the surface of the nanowire. Binding of analyte nucleic acids to the detection molecules alters the electrical properties of the nanowire, producing a detectable signal. By passing a Joule heating effective amount of electrical current through the nanowire, the nanowire may be heated to a temperature sufficient to dissociate the bound analyte from the detection molecule, without damaging the detection molecules or the bond between the detection molecules and the nanowire surface. The Joule heated nanowires may thus be regenerated to an analyte-free “fresh” state and used for further sensing. In alternate embodiments, the specificity of the nanowire for a particular analyte may be modulated by using Joule heating to heat the nanowire to an intermediate temperature where some analytes bind and some do not.

Abstract: In one embodiment of the invention, a memory integrated circuit is provided including a memory array, a register, and control logic coupled to the register. The memory array in the memory integrated circuit stores data. The register includes one or more bit storage circuits to store one or more identity bits of an identity value. The control logic provides independent sub-channel memory access into the memory integrated circuit in response to the one or more identity bits stored in the register.

Abstract: In a non-volatile memory system, a programming speed-based slow down measure such as a raised bit line is applied to the faster-programming storage elements. A multi-phase programming operation which uses a back-and-forth word line order is performed in which programming speed data is stored in latches in one programming phase and read from the latches for use in a subsequent programming phase of a given word line. The faster and slower-programming storage elements can be distinguished by detecting when a number of storage elements reach a specified verify level, counting an additional number of program pulses which is set based on a natural threshold voltage distribution of the storage elements, and subsequently performing a read operation that separates the faster and slower programming storage elements. A drain-side select gate voltage can be adjusted in different programming phases to accommodate different bit line bias levels.

Abstract: An area saving electrically-erasable-programmable read-only memory (EEPROM) array, having: a plurality of parallel bit lines, a plurality of parallel word lines, and a plurality of parallel common source lines. The bit lines are classified into a plurality of bit line groups, containing a first group bit line and a second group bit line; the word line includes a first word line; and the common source lines include a first common source line. In addition, a plurality of sub-memory arrays are provided. Each sub-memory array contains a first, second, third, and fourth memory cells. Wherein, the first and second memory cells are symmetrically arranged, and the third and fourth memory cells are symmetrically arranged; also, the first and second memory cells, and the third and fourth memory cells are symmetrically arranged with the first common source line as a symmetric axis.

Abstract: A nonvolatile memory device comprises a page buffer unit comprising page buffers, each coupling first and second input and output (IO) lines and a latch circuit for outputting data together or coupling a sense node and the first or second I/O line together, in response to an operation mode; a Y decoder unit comprising decoders, each selecting one or more of the page buffers in response to address signals and outputting a first or second control signal to the selected page buffers in response to the operation mode; a mode selection unit outputting first and second operation selection signals for selecting the operation mode; and an I/O control unit comprising I/O control circuits, each detecting data, inputted and output through the first and second I/O lines, and outputting the detected data or coupling one of the first and second I/O lines to a data line.

Abstract: Consistent with the present disclosure, a plurality of FIFO buffers, for example, are provided in a switch, which also includes a switch fabric. Each of the plurality of FIFOs is pre-filled with data for a duration based on a skew or time difference between the time that a data unit group is supplied to its corresponding FIFO and a reference time. The reference time is the time, for example, after a delay period has lapsed following the leading edge of a synch signal, the timing of which is a known system parameter and is used to trigger switching in the switch fabric. Typically, the delay period may be equal to the latency (often, another known system parameter) or length of time required for the data unit to propagate from an input circuit, such as a line card of the switch or another switch, to the FIFO that receives the data unit. At the reference time, temporally aligned data unit groups may be read or output from each FIFO and supplied to the switch fabric.

Abstract: A memory cell is provided, in which a resistance value is appropriately controlled, thereby a variable resistance element may be applied with a voltage necessary for changing the element into a high or low resistance state. A storage element 10, a nonlinear resistance element 20, and an MOS transistor 30 are electrically connected in series. The storage element 10 has a nonlinear current-voltage characteristic opposite to a nonlinear current-voltage characteristic of the MOS transistor 30, and changes into a high or low resistance state in accordance with a polarity of applied voltage. The nonlinear resistance element 20 has a nonlinear current-voltage characteristic similar to the nonlinear current-voltage characteristic of the storage element 10.

Abstract: A method for erasing a non-volatile memory includes: performing a first pre-erase program step on the non-volatile memory; determining that the non-volatile memory failed to program correctly during the first pre-erase program step; performing a first soft program step on the non-volatile memory in response to determining that the non-volatile memory failed to program correctly; determining that the non-volatile memory soft programmed correctly; performing a second pre-erase program step on the non-volatile memory in response to determining that the non-volatile memory soft programmed correctly during the first soft program step; and performing an erase step on the non-volatile memory. The method may be performed using a non-volatile memory controller.

Abstract: A nonvolatile memory device has memory cells coupled to bit lines and word lines and page buffers each coupled to one or more of the bit lines. Program and verification operations are performed on a first logical page from among first and second logical pages included in memory cells selected for a program operation. Data are loaded which will be programmed into the second logical page into first to third latches of a selected page buffer, coupled to the selected memory cells, from among the page buffers. A data setting operation is performed. The second logical page is programmed so that a distribution of threshold voltages of the selected memory cells has one of first to fourth threshold voltage distributions according to states of the data of the first to third latches and performing verification operations for the first to fourth threshold voltage distributions.

Abstract: A memory device includes diode plus resistivity switching element memory cells coupled between bit and word lines, single device bit line drivers with gates coupled to a bit line decoder control lead, sources/drains coupled to a bit line driver, and drains/sources coupled to bit lines, single device word line drivers with gates coupled to a word line decoder control lead, sources/drains coupled to a word line driver output, and drains/sources coupled to word lines, a first bleeder diode coupled between a bit line and a first bleeder diode controller, and a second bleeder diode coupled between a word line and a second bleeder diode controller. The first bleeder diode controller connects the first bleeder diode to low voltage in response to a bit line decoder signal. The second bleeder diode controller connects the second bleeder diode to high voltage in response to a word line decoder signal.

Abstract: A magnetic memory element (10) for use in a cross-point type memory is provided with a spin valve structure having a free layer (5), a nonmagnetic layer (4), and a pinned layer (3). The magnetic memory element is also provided with another nonmagnetic layer (6) on one surface of the free layer (5), and furthermore, a magnetic change layer (7) whose magnetic characteristics change depending on temperature so as to sandwich the nonmagnetic layer (6) with the free layer (5). In the magnetic change layer (7), the magnetization intensity increases depending on temperature.

Abstract: A memory chip includes a memory circuit unit configured to include memory cells for storing data, a data input and output (I/O) buffer unit configured to include a plurality of data I/O buffer circuits, wherein one of the data I/O buffer circuits is operated by default in order to input and output data to and from the memory chip, a plurality of driver control units configured to generate a plurality of driver addition signals to enable corresponding ones of the data I/O buffer circuits depending on whether a power supply voltage has been received, and a controller configured to generate I/O enable signals for controlling an operation of the data I/O buffer unit.

Abstract: A semiconductor memory device includes a plurality of memory banks each having a plurality of memory cell arrays, a plurality of sense amplification units corresponding to the memory banks, configured to sense data corresponding to a selected memory cell to amplify the sensed data, and a common delay unit configured to delay a plurality of respective bank active signals activated in correspondence with the memory banks by a predetermined time to generate an operation control signal for controlling the sense amplification units.

Abstract: In a nonvolatile memory device, a cache program operation for the next data is performed in a first latch, and a verification program operation for the current data is performed using a second latch. Thus, data collision can be avoided and execution time can be reduced.

Abstract: When threshold voltages of constituent transistors are reduced in order to operate an SRAM circuit at a low voltage, there is a problem in that a leakage current of the transistors is increased and, as a result, electric power consumption when the SRAM circuit is not operated while storing data is increased. Therefore, there is provided a technique for reducing the leakage current of MOS transistors in SRAM memory cells MC by controlling a potential of a source line ssl of the driver MOS transistors in the memory cells.