Abstract: A circuit on a printed circuit board transmits radio frequency (RF) signals. A modulator operatively coupled to the printed circuit board modulates a signal to be transmitted by modulating an information signal onto a carrier signal. A ground plane attaches to edges and to first and second surfaces of the printed circuit board. The ground plane electrically connects to components of the modulator. A power transistor physically attaches to the printed circuit board and electrically connects to the ground plane through a slot in the printed circuit board. The ground plane provides a suitable ground reference potential for both the modulator and the power transistor without individually constructed circuit boards for each. A ground isolation barrier formed on the ground plane may prevent “cross talk” between the modulator and the power transistor.

Abstract: A circuit card that includes a single ground plane connectable to a chassis-ground and a logic device having a ground pin connected to the single ground plane. The connection between the ground pin and the single ground plane provides a direct path between the logic device and the chassis-ground. A power supply is connected to an input pin of the logic device for providing a logic voltage to the logic device. The power supply is connectable to a battery.

Abstract: A plurality of converter circuits is connected in parallel while reducing conduction loss. A converter circuit is formed on each of a plurality of circuit boards, and a plurality of types of terminal connection patterns containing power input terminal connection patterns and power output terminal connection patterns are formed on the end portions of each of the circuit boards with the disposition positions substantially matching each other. The terminal connection patterns at the same position of each circuit board are sandwiched by each of clips of a common terminal member, each of the circuit boards is laminated and fixed, and the converter circuits of each of the circuit boards are connected in parallel. The conduction path for electrically connecting the converter circuit of each circuit board becomes short, making it possible to reduce conduction loss.

Abstract: According to various embodiments of the present invention, a bonding pad structure of a semiconductor device reduces damage caused by thermo-mechanical stress in beam lead bonding. A method of fabricating an improved bonding pad structure is also provided. A polysilicon film plate is preferably formed between a bonding pad metal layer and a dielectric layer. The polysilicon film plate absorbs external thermo-mechanical stress and improves the durability of the bonding pad in a bond pull test (BPT). The bonding between the bonding pad metal layer and the dielectric layer is also improved. Other features and advantages are also provided.

Abstract: In a flexible printed wiring board obtained by connecting metal bumps of a first flexible printed wiring part and connection pads of a second flexible printed wiring part, the first flexible printed wiring part is composed of a conductive layer and insulating layer adjacent thereto, holes A being provided in the insulating layer so as to reach the conductive layer, metal plugs being formed in these holes by an electrolytic plating method, metal bumps being produced by making the tips of these metal plugs project from the insulating layer. In this way, as many as possible flexible printed wiring boards can be obtained from a laminated sheet for flexible printed wiring of prescribed size.

Abstract: A multilayer PCB has first and second signal transmission lines and first and second ground layers. A signal via is connected between the first and second transmission lines. Ground vias extending parallel to the signal via are connected between the first and second ground layers. The end of the first ground layer protrudes with respect to the second ground layer and extends nearer to the signal via than the second ground layer. Thus, it is possible to stabilize the characteristic impedance of the first transmission line.

Abstract: A high-frequency integrated circuit (IC) module comprising a multilayer mounting board on which an integrated circuit with a plurality of high-frequency signal terminals is mounted, and IC connecting portions disposed on one surface of the multilayer mounting board and respectively connected with the high-frequency signal terminals. The high-frequency IC module further comprises external connection terminal portions disposed at wider intervals than those between the high-frequency signal terminals, high-frequency signal lines provided within the multilayer mounting board, first through holes for connecting the inner ends of the high-frequency signal lines with the IC connecting portions, and second through holes for connecting the outer ends of the high-frequency signal lines with the external connection terminal portions.

Abstract: An electronic component having at least one semiconductor chip, a rewiring layer connected to the semiconductor chip, and a printed circuit board associated with the rewiring layer. The rewiring layer is provided with flexible contacts that correspond with contact faces of the printed circuit board, and the rewiring layer is solidly connected to the printed circuit board via a flat intermediate layer. A method for producing the electronic component is described.

Abstract: The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same.

Abstract: Disclosed is an optical-electrical wiring board, comprising an electrical wiring board having a through-hole formed therein and an optical wiring layer laminated on the board and including a core and a clad surrounding the core. The electrical wiring board includes an electrical wiring formed on one surface of the board and pads on which optical parts are mounted. The pads are electrically connected to the electrical wiring and arranged on one surface of the electrical wiring board in the vicinity of a through-hole. The core includes a horizontal waveguide for propagating the light beam in a horizontal direction along the electrical wiring board and a vertical waveguide having a part arranged inside the through-hole and crossing the horizontal waveguide. The vertical waveguide propagates the light beam in a direction perpendicular to the electrical wiring board.

Abstract: A multiple network electronic component includes an insulator having a first element-forming surface and a second element-forming surface spaced thicknesswise from the first element-forming surface, a plurality of first intermediate film conductors 20A formed on the first element-forming surface and spaced from each other, a plurality of second intermediate film conductors 20B formed on the second element-forming surface and spaced from each other in corresponding relation to the first intermediate film conductors, and a plurality of through-conductive paths penetrating the insulator for electrically connecting each of the first intermediate film conductors to a corresponding one of the second film conductors. The first element-forming surface is formed with a plurality of first elements and a plurality of second elements, and each of the first and second elements has one end connected to a respective one of the first intermediate film conductors.

Abstract: A hybrid printed circuit carrier including a ceramic carrier, traces applied on the carrier, circuit components located on said carrier and a plurality of switch contacts. The switch contacts form a portion of a movable switch and are fixedly applied on the same surface of the carrier as the traces and the circuit components. The application of at least a portion of the fixed contacts of the moving switch allows these contacts to be located on the carrier in the same process step as the location of the other components to be located on the carrier. This application can be executed easily using a pick-and-place apparatus, thereby avoiding labor-intensive manual processing. Also, contact elements for a plug connection with wires can be applied on the carrier. The location of the contact elements onto said carriers obviates the need for screw connections, etcetera for making electrical connections with the switch unit, which are classically formed by wires.

Abstract: A plurality of module substrates have circuit boards, respectively. The circuit boards are stacked with a space therebetween, and are connected to first end portions of connecting members. The second end portions of the connecting members are connected to connecting pads disposed on a motherboard. The module substrates are thus stacked and mounted on the motherboard so as to increase the mounting density. By causing the connecting members for the upper circuit board to project further than the connecting members for the lower circuit board, the connecting members for the upper and lower circuit boards are prevented from touching each other.

Abstract: A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.

Abstract: In a junction flexible wiring circuit board used for performing junction between a suspension board for mounting a magnetic head of a hard disk drive thereon and a control circuit board for operating the magnetic head, a metal layer is formed on at least one of a surface of an electrically insulating base layer and a surface of an electrically insulating cover layer.

Abstract: A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide power to the integrated circuit. The power laminate may also include a voltage regulator circuit, and a plurality of decoupling capacitors.

Abstract: A die package is formed, which allows additional electrical connections to the die by using internal leads or traces from a lead frame. The internal leads are exposed through an upper or lower surface of the package, thereby allowing an additional die package to be stacked and electrically connected to the underlying die or additional inputs/outputs to underlying external circuitry, such as a printed circuit board.

Abstract: An interconnection structure comprises: an interlayer insulating film; and first interconnection layer to which low potential is applied and second interconnection layer to which high potential is applied when the interconnection structure is used, formed with the interlayer insulating film therebetween; and a via hole formed in the interlayer insulating film for electrically connecting the first interconnection layer and second interconnection layer. Overlap regions including regions of the first interconnection layer and the second interconnection layer faced said via hole are formed for both the first interconnection layer and second interconnection layer.

Abstract: The invention is related to a multi-chip-module and to a method for its manufacture. The module comprises a base carrier, on which at least in some areas signal conductor tracks and signal contact surfaces arranged at least in a single layer are located, and with at least one semiconductor component operating in the signal range and connected with the signal conductor track and signal contact surfaces. The purpose is to achieve a high degree of integration with a multi-chip-module of this type. To do so, in addition at least in some areas on the base carrier power conductor tracks and power contact surfaces arranged in at least one layer are located. Furthermore, at least one power electronics component operating in the power range is provided, which is connected with at least one power conductor track, at least one power contact surface and at least one signal conductor track.

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.