Abstract: The present invention provides an Nb-Ti alloy type superconducting wire having a superconducting filament including a member made of Nb-Ti alloy and a pinning member made of Nb or Nb alloy having no superconducting properties under operating magnetic field, the Nb-Ti based alloy containing Ti in a content of 48 to 65% by weight and the superconducting filament containing Nb or an Nb alloy (A) in a ratio of 20 to 35% by volume. The present invention further provides an Nb-Ti alloy type superconducting wire having a superconducting filament including a member made of Nb-Ti alloy and a pinning member made of Ti or Ti alloy having a critical temperature lower than that of the Nb-Ti alloy and/or having no superconducting properties; the Nb-Ti based alloy containing Ti in a content of 25 to 45% by weight and the superconducting filament containing Ti or a Ti alloy in a ratio of 20 to 35% by volume.

Abstract: Surface and near surface hardened medical implants are provided. These implants are fabricated from titanium alloys that contain an amount of zirconium sufficient to permit the formation of a significant amount of zirconium oxide at the surface of the implant to cause surface hardening. Further, the zirconium-containing titanium alloy implants are characterized in having an alloy core with an oxygen-rich layer surrounding the core, and a surface layer, overlying the oxygen-rich layer, including mixed oxides of the metals present in the alloy. A zirconium-rich interface may sometimes be present between the oxygen-rich layer and the mixed-oxide surface layer. The method of producing these surface hardened implants includes the steps of heating the implant in an oxygen containing environment at a temperature sufficient to allow oxygen to diffuse to and react with the implant surface and near surface.

Abstract: Ti powders and Al powders are combined to prepare a mixture of 40.about.55 at % of Al and the balance of Ti. After CIP and degassing, plastic working by hot extrusion is applied to form a shaped mixture of Ti and Al. The shaped mixture is then processed by HIP to synthesize titanium aluminide while diffusing Al into the Ti structure to form an Al.sub.2 O.sub.3 phase occurring from both the reaction between Al and oxygen contained in the Ti structure and the oxides on the Al surface, and to disperse the Al.sub.2 O.sub.3 to form the Al.sub.2 O.sub.3 protective film. With the reaction between Al and oxygen contained in the Ti structure and with the "Pegging" effect, both the Al.sub.2 O.sub.3 a phase formed at the grain boundaries of crystals or in the crystal grains of titanium aluminide and the Al.sub.2 O.sub.3 phase existing on the surface of raw material Al powder peg the surface Al.sub.2 O.sub.3 film to the surface of the titanium aluminide body.

Abstract: TiAl-besed intermetallic compound alloys contain chromium and consist essentially of a dual-phase microstructure of .gamma. and .beta. phases, with the .beta. phase precipitating at .gamma. grain boundaries. The .beta. phase precipitating at .gamma. grain boundaries is 2% to 25% by volume fraction. A process for preparing TiAl-based intermetallic compound alloys comprises the steps of preparing a molten TiAl-based intermetallic compound alloy of a desired composition, solidifying the molten alloy, homogenizing the solidified alloy by heat treatment, and thermomechanically working the homogenized alloy.

Abstract: Oxidation and sulfidation resistant alloys and mixtures including chromium and niobium as well as oxidation and sulfidation resistant articles including chromium and niobium present as either an alloy or a mixture are provided. A method for preparing an oxidation and sulfidation resistant article by preparing a material including chromium and niobium and either forming an article directly from the chromium and niobium containing material or forming the article from a base material and coating the material with a coating including a chromium and niobium-containing material is provided.

Abstract: Two phase, TiAl.sub.2 -based, ternary aluminides of iron, nickel and other transitional metals are disclosed. A transformation from the tetragonal crystal configurations of the TI--Al system to the face-centered cubic configurations of the TI--Al--Fe and TI--Al--Ni systems is attributed to the transitional elements substituting for titanium in the face-centered cubic crystal lattice of the titanium aluminides. The resulting alloys of the composition Ti.sub.30 M.sub.4 Al.sub.66 or Ti.sub.25 M.sub.9 Al.sub.66, including Ti.sub.30 Fe.sub.4 Al.sub.66 and Ti.sub.30 Ni.sub.4 Al.sub.66, are low density, high temperature, aluminum-rich alloys possessing desirable properties, including ductility.

Abstract: Alloys which form metallic glass upon cooling below the glass transition temperature at a rate appreciably less than 10.sup.6 K/s comprise beryllium in the range of from 2 to 47 atomic percent and at least one early transition metal in the range of from 30 to 75% and at least one late transition metal in the range of from 5 to 62%. A preferred group of metallic glass alloys has the formula (Zr.sub.1-x Ti.sub.x).sub.a (Cu.sub.1-y Ni.sub.y).sub.b Be.sub.c. Generally, a is in the range from 30 to 75% and the lower limit increases with increasing x. When x is in the range of from 0 to 0.15, b is in the range of from 5 to 62%, and c is in the range of from 6 to 47%. When x is in the range of from 0.15 to 0.4, b is in the range of from 5 to 62%, and c is in the range of from 2 to 47%. When x is in the range of from 0.4 to 0.6, b is in the range of from 5 to 62%, and c is in the range of from 2 to 47%. When x is in the range of from 0.6 to 0.

Abstract: A titanium matrix composite having eutectically formed titanium alloy reinforcement containing at least two of the elements of silicon, aluminum, zirconium, manganese, chromium, molybdenum, carbon, iron, boron, cobalt, nickel, germanium and copper.

Abstract: The alloy is preferably an alloy having a niobium and titanium base according to the expression:Nb-Ti.sub.27-40.5 -Al.sub.4.5-10.5 -Hf.sub.1.5-5.5 Cr.sub.4.5-7.9 V.sub.0-6,wherein the ratio of concentrations of Ti to Nb (Ti/Nb) is greater than or equal (.gtoreq.) to 0.5, andwherein the maximum concentration of the Hf+V+Al+Cr additives is less than or equal (.ltoreq.) to the expression:16.5+(5.times.Ti/Nb),and the minimum concentration of these additives is 10.5.The crystal form of the alloy is specifically body centered cubic crystal form.

Abstract: A hyper-eutectic aluminum-silicon powder containing extremely fine primary crystal silicon, is prepared by atomizing. First, a molten metal of a hyper-eutectic aluminum-silicon alloy containing phosphorus is prepared. This molten metal or melt is atomized with air or an inert gas and quench-solidified. Aluminum-silicon alloy powder containing primary crystal silicon of not more than 10 .mu.m in crystal grain size is obtained. This aluminum-silicon alloy powder contains at least 12 percent by weight and not more than 50 percent by weight of silicon and at least 0.0005 percent by weight and not more than 0.1 percent by weight of phosphorus. When this hyper-eutectic aluminum-silicon alloy powder is employed, it is possible to prepare a consolidate of powder which has improved mechanical properties, and provides a high yield.

Abstract: A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device constructed by electrically connecting a semiconductor package to a substrate by such a method. The alloy wire is produced by drawing an alloy material produced by quench solidifying an alloy containing Pb, Sn or In as a principal element, and an additive element or additives elements. The tip of the alloy wire is heated to form a ball to be joined to the aluminum alloy wiring line as a bump contact. The Brinell hardness number of the ball is H.sub.B 6 or higher.

Abstract: The alloy of the present invention features controlled amounts of tin, nitrogen, and niobium and includes tin (Sn) in a range of greater than 0 to 1.50 wt. %, wherein 0.6 wt. % is typical. The alloy also has iron (Fe) in a range of greater than 0 to 0.24 wt. %, and typically 0.12 wt. %; chromium (Cr) in a range of greater than 0 to 0.15 wt. % and typically 0.10 wt. %; nitrogen (N) in a range of greater than 0 to 2300 ppm; silicon, in a range of greater than 0 up to 100 ppm, and typically 100 ppm; oxygen (O) in a range of greater than 0 and up to 1600 ppm, and typically 1200 ppm; niobium (Nb) in a range of greater than 0 wt. % to 0.5 wt. % and typically 0.45 wt. %; and the balance zirconium.

Abstract: A method of making a titanium base alloy comprising the steps of: heating a titanium base alloy to a temperature ranging from .beta.-transus minus 250.degree. C. to 5-transus; the titanium base alloy consisting essentially of about 3.42 to 5 wt. % Al, 2.1 to 3.7 wt. % V, 0.85 to 3.15 wt. % Mo, at least 0.01 wt. % 0, at least one element selected from the group consisting of Fe, Ni, Co and Cr, and the balance being titanium, and satisfying the following equations: 0.85 wt. %.ltoreq.X wt %.ltoreq.3.15 wt %, 7 wt %.ltoreq.Y wt %.ltoreq.13 wt. %, X wt. %=Fe wt. %+Ni wt. %+Co wt. %+0.9.times.Cr wt. %, Y wt. %=2.times.Fe wt. %+2.times.Ni wt. %+2.times.Co wt. %+1.8.times.Cr wt. %+1.5.times.V wt. %+Mo wt. %, and hot working the heated alloy with a reduction ratio percent of at least 50%.

Abstract: An electromagnetically stable Nb.sub.3 Al multifilamentary superconducting wire having a high current density at a high level of magnetic field such as 20 tesla is provided by cold drawing a composite multicore consisting of a large number of Al or Al alloy core and a Nb matrix into a multifilamentary wire, and then dipping the multifilamentary wire into a molten metal bath to coating the periphery of the wire with the molten metal for providing electromagnetically stabilizing the wire. The molten metal bath is provided within an inert gas sealing chamber.

Abstract: The invention relates to a process for improving the aging response and uniformity in a beta titanium alloy comprising the steps of:(a) cold working said beta titanium alloy to at least about 5% so that a reasonable degree of recrystallization can be obtained during subsequent solution treatment;(b) pre-aging said cold worked alloy at about 900.degree. to about 1300.degree. F. for a time in excess of about 5 minutes to obtain a pre-aged alloy;(c) solution treating said pre-aged alloy at a time and temperature to achieve a reasonable degree of recrystallization of said pre-aged alloy above the beta transus; and(d) aging said solution treated alloy at temperature and times to achieve a pre-aged, solution treated and aged beta titanium alloy substantially in a state of metallurgical equilibrium.

Abstract: A titanium-base alloy, and weldment made therefrom, consisting essentially of, in weight percent, aluminum 4 to 5.5, preferably 5.0, tin up to 2.5, preferably 0.5 to 1.5 or 1; zirconium up to 2.5, preferably 0.5 to 1.5 or about 1; vanadium 0.5 to 2.5, preferably 0.5 to 1.5 or about 1; molybdenum 0.3 to 1, preferably, 0.66 to 1 or about 0.8; silicon up to 0.15, preferably 0.07 to 0.13 or about 0.1; oxygen 0.04 to 0.12, preferably 0.07 to 0.11 or about 0.09; iron 0.01 to 0.12, preferably 0.01 to 0.09 or about 0.07 and balance titanium and incidental impurities.

Abstract: A Ti--Al--V--Cr intermetallic alloy having an atomic percent composition of 5-35 Al, 10-15 (V+Cr), the balance being Ti. The alloy is partially of DO.sub.19 type and partially of B2 type and has high temperature strength and excellent room temperature ductility. The alloy is produced by arc melting the metallic components Ti, Al and at least one of V and Cr; followed by homogenizing the melted components; solidifying the melted components to form an alloy; hot working the solidified alloy by isothermal forming to form a beta-phase polycrystalline microstructure; transforming the metastable .beta.-phase into a two-phase microstructure; and equilibrating the two-phase microstructure by prolonged annealing.

Abstract: The present invention presents a method and an apparatus for heat treating a metallic material by performing hydrogen absorption in or desorption from the metallic material. The method includes the steps of recovering the hydrogen gas released from a desorption step and recycling it to a hydrogen absorbing step. Hydrogen recovering can be performed either in a device containing a hydrogen absorbing alloy or in a second heat treating furnace containing the metallic material. Various controlling devices are used to regulate the process of heat treating and recovering of hydrogen gas.

Abstract: The invention relates to a new process for obtaining tissue-protective devices of bone surgery implants prepared from a medical-purity metal, titanium and/or a titanium-base microalloy containing at least 98% by weight of titanium, by establishing a biocompatible (tissue-protective) coating on the metal surface by anodic oxidation after degreasing and chemical or electrochemical etching, which comprises carrying out the anodic oxidation of the etched implant surfaces in an aqueous solution of a phosphate concentration lower than 20% by weight with a current density of 2 to 50 mA/cm.sup.2 until reaching a voltage of at least 105 V, then, after washing to ion-free, heat-treating the thus-oxidized implants at a temperature between 120.degree. C. and 750.degree. C. for 5 to 120 minutes, and repeating once or twice the anodic oxidation and heat-treatment with the phosphate concentration, current density and temperature values as given above for the first step.

Abstract: A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 93-98% tin, 1.5-3.5% silver, 0.2-2.0% copper, and 0.2-2.0% antimony. The alloy composition has a melting temperature of 210.degree.-215.degree. C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.