Abstract: A memory device that includes: a memory controller; a control unit; and a memory cell array that includes memory blocks, each memory block comprising: memory cells, word lines respectively coupled to the memory cells, signal lines to transfer signals to perform programming operations to one or more memory cells of the memory cells, a first metal layer coupled to a first group of lines and configured to route the first group of the lines to the control unit, the lines comprising the word lines and the signal lines, and a second metal layer coupled to a second group of the lines and configured to route the second group of the lines to the control unit, wherein the memory controller is configured to: control the control unit to (i) select particular memory cells and (ii) program data to the particular memory cells is disclosed.

Abstract: A base element for switching a magnetization state of a nanomagnet includes a heavy-metal strip having a surface. A ferromagnetic nanomagnet is disposed adjacent to the surface. The ferromagnetic nanomagnet has a first magnetization equilibrium state and a second magnetization equilibrium state. The first magnetization equilibrium state or the second magnetization equilibrium state is settable in an absence of an external magnetic field by a flow of electrical charge through the heavy-metal strip. A method for switching a magnetization state of a nanomagnet is also described.

Abstract: A method for accessing a flash memory module is provided. The flash memory module is a 3D flash memory module including a plurality of flash memory chips, each flash memory chip includes a plurality of blocks, each block includes a plurality of pages, and the method includes: configuring the flash memory chips to set at least one super block of the flash memory chips; and allocating a buffer memory space to store a plurality of temporary parities generated when data is written into the at least one first super block.

Abstract: A quantum memory system includes a chalcogenide optical fiber link, a magnetic field generation unit and a pump laser. The chalcogenide optical fiber link includes a photon receiving end opposite a photon output end and is positioned within a magnetic field of the magnetic field generation unit when the magnetic field generation unit generates the magnetic field. The pump laser is optically coupled to the photon receiving end of the chalcogenide optical fiber link. The chalcogenide optical fiber link includes a core doped with a rare-earth element dopant. The rare-earth element dopant is configured to absorb a storage photon traversing the chalcogenide optical fiber link upon receipt of a first pump pulse output by the pump laser. Further, the rare-earth element dopant is configured to release the storage photon upon receipt of a second pump pulse output by the pump laser.

Abstract: A ternary content addressable memory (TCAM) device includes a memory cell. The memory cell includes a data storage circuit, a limiter circuit, and a discharge circuit. The data storage circuit includes a first resistor and a second resistor connected in series to divide a voltage corresponding to search data, and configured to store cell data. The limiter circuit is configured to receive the divided voltage through an input terminal and transmit an output voltage through an output terminal based on a level of the divided voltage. The discharge circuit discharges a matching line indicating whether the stored cell data matches with the search data, based on the output voltage of the limiter circuit.

Abstract: Nonvolatile memory (e.g. phase change memory) devices, systems, and methods of programming the nonvolatile memory including sensing of a snapback current using a set demarcation voltage for set bit mapped cells and a reset demarcation voltage for reset bit mapped cells before selective writes.

Abstract: A resistive memory and a resistance window recovery method for a resistive memory cell thereof are provided. During a first period, an over reset voltage difference is applied between a top electrode and a bottom electrode of the resistive memory cell, wherein the over reset voltage difference falls in a reset complementary switching (reset-CS) voltage range of the resistive memory cell. During a second period, a set voltage difference is applied between the top electrode and the bottom electrode of the resistive memory cell to increase a compliance current of the resistive memory cell. During a third period, a reset operation is performed on the resistive memory cell.

Abstract: A circuit for selecting a row of memory cells of a memory device to be refreshed may include: a cold table suitable for storing as a cold row a row selected as a hammered row when the row selected as the hammered row is neither one of cold rows stored in the cold table nor one of hot rows stored in a hot table; and the hot table suitable for storing, as a hot row, the row selected as the hammered row when the row selected as the hammered row is one of the cold rows stored in the cold table.

Abstract: A magnetoresistive random access memory (MRAM) and associated apparatus and methods are described. The MRAM generally includes a heavy metal layer coupled to a source line, and a plurality of bit cells coupled to a word line, a plurality of bit lines, and the heavy metal layer, such that the heavy metal layer is a continuous layer coupling the bit cells to the source line, wherein each of the bit cells comprises a magnetic tunnel junction (MTJ) and a transistor, a gate of the transistor being coupled to the word line, and at least one of a source or a drain of the transistor being coupled to the MTJ or at least one of the bit lines.

Abstract: Systems, methods, and devices are provided for increasing uniformity of wear in semiconductor devices due to, for example, negative-bias temperature instability (NBTI). The method may include receiving a first NBTI control signal. The method may involve receiving a second NBTI control signal based at least in part on the first NBTI control signal. The method may also involve asserting the first NBTI control signal at a clock input pin of a latch. Further, the method may include asserting the second NBTI control signal at a data input pin of the latch. The method may additionally involve toggling electrical elements downstream of the latch based at least in part on an output of the latch based on the first and second NBTI control signals to increase uniformity of wear on the electrical elements in a default low-power state during NBTI toggling mode.

Abstract: Integrated circuits with volatile random-access memory cells are provided. A memory cell may be coupled to write bit lines and a read bit line. The write bit line may not be coupled to any precharge circuitry. The read bit line may only be precharged during memory access operations. In one suitable arrangement, the read bit line may be precharge immediately after an address decoding operation and before an evaluation phase. In another suitable arrangement, the read bit line may be precharged after an addressing decoding operation and in parallel with the evaluation phase. In either arrangement, a substantial amount of leakage and active power can be reduced.

Abstract: The present disclosure includes apparatuses and methods related to performing logical operations using sensing circuitry. An example apparatus comprises an array of memory cells and sensing circuitry coupled to the array of memory cells. The sensing circuitry includes a primary latch and a secondary latch. The primary latch is coupled to a pair of complementary sense lines and selectively coupled to a pair of adjacent complementary sense lines. The secondary latch is selectively coupled to the primary latch. The primary latch and secondary latch are configured to shift a data value between the pair of adjacent complementary sense lines and the primary latch. The primary latch and secondary latch are configured to shift the data value from the pair of adjacent complementary sense lines without activating a row line.

Abstract: In one example in accordance with the present disclosure a control circuit is described. The control circuit includes a source following component to receive an input voltage and output a switching voltage. The circuit also includes an input leg of a current mirror coupled to the source following component. The input leg of the current mirror replicates the switching voltage to an output leg of the current mirror of a memristive bit cell. The circuit also includes a number of current control components. At least one of the current control components enforces a constant current through the source following component and other current control components maintain the input leg of the current mirror and the output leg of the current mirror at the same current.

Abstract: Methods include programming a first portion of memory cells of a string of series-connected memory cells closer to a particular end of the string than a second portion of memory cells of the string in an order from a different end of the string to the particular end, and programming the second portion of memory cells in an order from the particular end to the different end. Methods further include incrementing a first read count and a second read count in response to performing a read operation on a memory cell of a block of memory cells, resetting the first read count in response to performing an erase operation on a first portion of memory cells of the block of memory cells, and resetting the second read count in response to performing an erase operation on the second portion of memory cells of the block of memory cells.

Abstract: Various implementations described herein are directed to an integrated circuit having core circuitry with an array of bitcells arranged in columns of bitcells that may represent bits. A first column of bitcells may represent a nearest bit of the bits, and a last column of bitcells may represent a farthest bit of the bits. The integrated circuit may include sense amplifier circuitry coupled to the core circuitry to assist with accessing data stored in the array of bitcells. The integrated circuit may include multiplexer circuitry coupled to the sense amplifier circuitry. The integrated circuit may include first bypass circuitry coupled to outputs of the sense amplifier circuitry at the farthest bit. The integrated circuit may include second bypass circuitry coupled to an output of the multiplexer circuitry at the nearest bit.

Abstract: A method for evaluating the thermal effects of 3D RRAM arrays and reducing thermal crosstalk, including the following steps: Step 1: calculating the temperature distribution in the array through 3D Fourier heat conduction equation; Step 2, selecting a heat transfer mode; Step 3, selecting an appropriate array structure; Step 4, analyzing the effect of position of programming device in the array on the temperature; Step 5, analyzing the thermal crosstalk effect in the array; Step 6, evaluating thermal effects and thermal crosstalk; Step 7, changing the array structure or modify operating parameters based on the evaluation results to reduce the thermal crosstalk.

Abstract: A system and method for utilizing a security key stored in non-volatile memory, and for generating a PUF-based data set on an integrated circuit including non-volatile memory cells, such as flash memory cells, are described. The method includes storing a security key in a particular block in a plurality of blocks of the non-volatile memory array; utilizing, in a security logic circuit coupled to the non-volatile memory array, the security key stored in the particular block in a protocol to enable access via a port by external devices or communication networks to data stored in blocks in the plurality of blocks; and enabling read-only access to the particular block by the security logic for use in the protocol, and preventing access to the particular block via the port.

Abstract: A memory device includes a first data driver configured to send a first data according to a first clock signal; a first data port electrically coupled to the first data driver, the first data port configured to receive the first data; a second data driver configured to send a second data according to a second clock signal, wherein the second clock signal does not match the first clock signal; and a second data port electrically coupled to the second data driver, the second data port configured to receive the second data.

Abstract: A memory apparatus includes a memory cell array including a plurality of memory cells, a temperature sensor, a temperature compensated self refresh (TCSR) block, and a command controller. The temperature sensor is configured to generate temperature information by measuring internal temperature of the memory apparatus. The TCSR block is configured to vary and output, in a test mode of the memory apparatus, period information for adjusting a refresh period for the memory cell array according to the temperature information. The command controller is configured to adjust, in response to the period information, the refresh period for the memory cell array by controlling an external command.

Abstract: A crossbar array includes a number of memory elements. A vector input register has N voltage inputs to the crossbar array. A vector output register has M voltage outputs from the crossbar array. An analog-to-digital converter (ADC) is electronically coupled to the vector output register. A digital-to-analog converter (DAC) is electronically coupled to the vector input register. A clustering processor is electronically coupled to the ADC and to the DAC. The clustering processor is configured to program columns of the crossbar array with a set of k cluster center values; apply voltages to rows of the crossbar array where the applied voltages represent a set of data values; and determine a minimum distance of each data value to each k cluster center values based on the voltage output from the output register of each of the plurality of the programmed columns.