Abstract: A probe device for measuring the electric characteristics of an IC chip on a wafer, etc. is disclosed. The probe device includes a unit having a micro-strip line structure in which a plurality of probes are integrally formed. The unit comprises a flexible insulating quartz base plate, a plurality of mutually insulated lead strips provided on one surface of the base plate, and a ground strip provided on the other surface of the base plate. Notches are formed in those regions of the insulating base plate, which are located between the lead strips at an end portion of the unit. The unit is supported such that the tip end portion of the unit is formed as a free-end portion and the unit is inclined by a predetermined angle toward electrode pads on the IC chip with respect to an imaginary horizontal plane. The combination of each of the lead strip, the insulating quartz base plate and the ground strip constitute a micro-strip line. At the tip end portion of the unit, each micro-strip line serves as the probe.

Abstract: A system and method for testing the continuity of interconnecting nets on a substrate to be used in multi-chip technology is provided. The system includes coupling a test pad (15) to the net (12) to be tested. The test pad (15) is coupled through a diode (34) to a common node (32). The voltage of a first node (16) of the net (12) is sensed by a voltmeter (38) which is coupled to ground. A predetermined current signal is applied to each node (16, 18, 20, 22) in the net through the use of a probe (42). The voltage of the remaining nets (14) is sensed by a voltmeter (44). If an erroneous interconnection (31) is present between the net (12) to be tested and any other net (14) on the substrate, the voltage of the other net (14) will fluctuate. The voltmeter (38) will indicate if there is an electrical connection between the node (16) and the test pad (15) during testing.

Abstract: A performance board for mounting thereon an IC under test is attached to an analog testing part of an IC tester which includes first and second AC signal generators, a DC voltage generator, a timing signal generator, a digitizer, a precision voltage measurement unit and a test processor. On the performance board there are provided an analog switch, a detector circuit, a band pass filter connected to the output of the second AC signal generator, a band elimination filter connected to the output of the first AC signal generator and a switching circuit. The analog switch outputs a rectangular-wave signal by turning ON and OFF the output DC voltage of the DC voltage operator at the frequency and with the duty ratio of a timing signal from the timing generator.

Abstract: An electronic watthour meter is digitally configurable to operate as several different types of watthour meters for metering electrical energy from a variety of different electric utility services. Automatic scaling of line input currents is provided to scale the voltage input to an analog to digital converter over selected ranges such that low level and high level input signals are measured in an optimum range. A digital signal processor is employed to calculate values for metered electrical energy and output pulses, each proportional to a quantum of energy flowing in the circuit being metered. The processor calculates the value of DC offset errors inherent in the various analog circuits of the meter and uses that value in the calculation of metered electrical energy to compensate for such offset errors. The meter employs automatic and manually initiated test functions for testing the operation of the processor and other critical circuits in the meter.

Abstract: An AC current sensor comprising a generally C-shaped main coil with a fixed gap between its ends. A pair of compensating coils are positioned at fixed locations in the main coil's gap. The longitudinal axes of the compensating coils lie on an imaginary straight line which extends between the centers of the main coil's ends; and their electrical centers are each spaced the same distance from their respective ends of the main coil. A compensating coil gap is defined between the electrical centers of the compensating coils. The main coil defines a measuring recess in which the sensed AC current carrying conductor is located when a measurement is taken. When the ratio of the size of the main coil gap to the size of the compensating coil gap is equal to the square root of three, the AC current sensor's accuracy and outside signal rejection increase most rapidly with increased distance of the sensed AC current carrying conductor from the compensating coil gap, and the AC current sensor's size can be minimized.

Abstract: An apparatus for tranmitting signals that can be broken down into at least one AC voltage component between a rotor and a stator from a sender unit to a receiver unit, with the help of annular coils, the coil windings of which form components of the sender or receiver unit, and which are arranged coaxially to the axis of rotation of the rotor and inductively coupled is to be developed so as to generate measured values that are associated with the rotational speed.

Abstract: A voltage in a selected area of an object is measured by launching an input light beam into an electrooptic material whose refractive index is changed in accordance with an electric field created by the voltage in a selected area of an object to be measured, and detecting a change in polarization or in a deflection angle of an output light beam from the electrooptic material. A medium having a dielectric constant greater than the air is placed between the area to be measured and the electrooptic material.

Abstract: A test apparatus for a semiconductor device is provided to be used for testing, wafer by wafer, a semiconductor device formed on a semiconductor wafer. The test apparatus for a semiconductor device comprises a test head, a probe card and a selection circuit. The probe card has an insulating transparent base plate, and protruding parts are formed on the main surface of the base plate corresponding to electrode pads on a test object semiconductor wafer, and conductive layer forming a prober for the electrode pad is formed on the surface of each of these protruding parts. A wiring layer is formed on the surface opposite to the main surface. The wiring layer and the probers are connected electrically through the through holes provided on the base plate. A prober to be connected to the test head is switched electrically, which makes it possible to test a semiconductor device without moving the corresponding semiconductor wafer.

Abstract: A device for measuring an electric field comprises three optical fiber sensors, which each have a piezoelectric sensor element, as well as an interferometer for generating a sensor signal. The optical fiber sensors have piezoelectric sensor elements that exclusively detect with the aid of the inverse piezoelectric effect a predetermined directional component, assigned in each case, of the electric field. The directional components of the different sensor elements are each aligned perpendicular to one another. An evaluation circuit determines the absolute value and direction of the electric field from the sensor signals generated.The sensor elements are preferably formed by a single piezoelectric body, on whose faces the sensor fibers are fixed.

Abstract: In an interferometric fiberoptic sensor with homodyne detection for measuring electrical fields or voltages, the measurement signal is compensated separately from operating point control. The measurement signal originating from the electrical field is compensated in a piezoelectric modulator (5) which consists of modulator elements which are identical with the at least one sensor element (3) with respect to material, geometric shape and crystal orientation. Additional separate apparatus (4) with a sufficiently large phase swing are provided for operating point control. Modulator element and sensor element (3) are essentially at the same temperature so that the temperature-dependence of the matter constants of the sensor element and the temperature-dependence of the fiber interferometer are eliminated. The sensor preferably operates in accordance with the principle of a fiberoptic two-mode interferometer.

Abstract: The invention relates to an input circuit for an electrical energy meter, which circuit has a current path and a voltage path, the current path being associated with a mutual conductance transformer. In order to compensate for the differentiating function of the transformer, but without introduicng interference signals, the current path includes an active filter connected as an integrator and provided with a coupling capacitance suitable for blocking low frequency signals.

Abstract: Vertically propagated defects in integrated circuits are detected utilizing an apparatus which includes a first meander structure formed on or in a substrate and a second meander structure electrically insulated from the first meander. Each meander includes intermediate segments, the ends of which are interconnected by folded segments. A first set metal of strips are electrically insulated from the first and second meanders. The ends of each strip in the first set are electrically connected to the ends of a corresponding intermediate segment of the first meander. A second set metal or strips are electrically insulated from the first set of strips, the first meander and the second meander. The ends of each strip in the second set are electrically connected to the ends of a corresponding intermediate segment of the second meander and at least a portion of the second set of strips overlies at least a portion of the first set of strips.

Abstract: A device for the electric characterization of samples, comprises a UHF resonator intended to be coupled locally to the sample. The resonator is formed by a microstrip or triplate line loop (20) carried by a conducting plane (16) and having a gap of small length with respect to the length of the loop and an assembly (32) for receiving the sample in a position in which the sample is coupled selectively to the edges of the gap without being interposed therebetween. The edges of the gap of the loop are fixed to two electrodes of small area passing through a thin plate of dielectric material having a flat face for application against the sample.

Abstract: Calibrated voltage cursors with respect to an input waveform signal are produced for display with the input waveform signal by injecting the cursor signals into the signal path prior to any gain stages in the signal path.

Abstract: A wafer containing an array of integrated circuit dice, wherein the dice are separated by scribe lanes in which the wafer may be cut to dice the wafer into individual die, is so constructed as to enable burn-in testing of the integrated circuits while they are still in the wafer. In this wafer, individual integrated circuits of the array include contact pads that extend into the scribe lanes for use during burn-in testing of the integrated circuits while they are contained in the wafer. A system for testing such a wafer includes a testing station for applying and monitoring burn-in test signals for individual integrated circuits; and contact probes for coupling the testing station to the contact pads for a plurality of the individual integrated circuits to enable separate burn-in tests to be conducted simultaneously for a plurality of the individual integrated circuits while they are contained in the wafer.

Abstract: The testing of printed circuit boards is facilitated by a device which comprises a plurality of switches for electrically connecting or disconnecting the circuit board from electronic equipment which uses it, such as a small computer. The apparatus connects between the bus terminals on the computer and those on the printed circuit board and provides a plurality of switches controlling the connection of address, data, control and power signals. The switches are controlled in a predetermined sequence such that the electronic equipment need not be shut down to permit removal and replacement of the circuit board.

Abstract: A negative feedback high current driver for an in-circuit tester comprises a three stage amplifier for supplying a high current overdriving signal to a device under test. The high current overdriving signal substantially cancels out any remaining component of an in-circuit generated signal appearing at an input to the device under test.

Abstract: An electrical test probe comprises an outer barrel, and a plunger extending axially through the barrel and having an outer portion extending through an open end of the barrel and terminating in a contact tip outside the barrel for contact with a test point. The plunger is supported within the barrel by spring pressure for allowing spring biased relative axial motion between the plunger and the barrel. The plunger is rotatable about its axis during relative axial motion between the plunger and barrel against the bias of the spring so that rotation of the plunger causes enhanced contact between the probe and a test point on a circuit board under test.

Abstract: A current sensing buffer 26 for driving a digital signal line of a unit under test 12 is composed of current mirror circuits in series with output switching transistors supplying test signals to the digital signal line. The current mirror circuits 66, 72 and 80, 84 generate sample currents corresponding to the magnitude of current through the respective drivers 68 and 78 to detect drive faults caused by bus or component failures. In buses comprised of several digital signal lines, one current sensing buffer 26 is used per line, and each curent sensing buffer 26 is controlled by a programmable circuit tester 10. The current sensing buffer 26 can be incorporated into an interface pod 14 which is substituted for a control component of a unit under test 12.

Abstract: A current conductor is provided with opposing notches to produce a restricted section and with magnetic flux sensors on opposite sides of the restricted current section. The flux sensors are connected to differential amplification circuitry. The restricted section increases the concentration of magnetic flux sensed, and the differential amplification circuitry eliminates the sensing of currents in external conductive paths. An electrostatic shield is provided between the shaped conductor and the magnetic flux sensors to elminate electrostatic effects on the output signal. The flux sensors and differential amplification circuitry is fabricated in an integrated circuit chip. For small currents, the shaped conductor may be deposited on the chip; otherwise a shaped conductor is formed and a mounting substrate of insulating material, such as ceramic, is used to support the integrated circuit chip on the shaped conductor with each of the two sensors centered respectively within the two opposite notches.