Abstract: A display module includes a substrate, a plurality of LEDs that are disposed on the substrate and irradiate light, and a light blocking layer that covers the plurality of LEDs, and fills intervals among the plurality of LEDs, each interval of the intervals being a distance between two adjacent LEDs of the plurality of LEDs, and wherein the light blocking layer includes a plurality of openings formed such that a top surface of each of the plurality of LEDs is exposed.

Abstract: A display substrate includes a driving substrate and a stacked structure disposed at a side of the driving substrate. The stacked structure includes a plurality of emission layers and a plurality of carrier transport layers that are stacked in a direction perpendicular to the side of the driving substrate. The stacked structure forms a plurality of light-emitting devices, and each light-emitting device includes at least two emission portions that are respectively located in at least two emission layers. The plurality of light-emitting devices include a plurality of first light-emitting devices and a plurality of second light-emitting devices. Emission portions in each first light-emitting device are separated from each other. At least two emission portions in each second light-emitting device are adjacent to each other, and the at least two adjacent emission portions share at least one carrier transport layer.

Abstract: A display device is disclosed. The display device includes a substrate provided with a plurality of subpixels including a first light emitting area and a second light emitting area, a first electrode in the first light emitting area of each of the plurality of subpixels on the substrate, a first light emitting layer provided on the first electrode, a second electrode provided on the first light emitting layer, a second light emitting layer provided on the second electrode, a third electrode provided on the second light emitting layer, and a light guide structure provided between the substrate and the first electrode, guiding light emitted from the first light emitting layer to be emitted to the second light emitting area.

Abstract: The present disclosure discloses a display substrate and a manufacturing method thereof, a display panel, and a display apparatus. The display substrate comprises: a base substrate, and display units on the base substrate; each of the display units comprises: an anode, a hole transporting layer, an electroluminescent layer, an electron transporting layer and a cathode, all of which are superposed in sequence; a plurality of nano-grooves are disposed on a surface of at least one of the hole transporting layer and the electron transporting layer, the surface is in contact with the electroluminescent layer; and a distance between any two adjacent nano-grooves is on a nanometric order of magnitude. The present disclosure is useful in improving the capability of the display units in resisting bending and preventing the display units from being ruptured due to a bending process.

Abstract: An array substrate, a display panel, and a display device.

Abstract: Embodiments of the present disclosure provided a display panel and a display device. The display panel includes a plurality of pixel defining units, each of the plurality of pixel defining units has a pixel hole for arranging a sub-pixel, and a first guide groove section connecting to the pixel hole, and the first guide groove sections corresponding to two adjacent pixel defining units are connected to each other to form a first guide groove.

Abstract: The present invention discloses an organic light emitting diode flexible array substrate including a displaying region, a folding region adjacent to the displaying region, a flexible substrate, barrier layer, a buffer layer, a polycrystalline layer stacked together, a first insulation layer disposed on the buffer layer and covering the polycrystalline layer, a first metal layer, a second metal layer, and a third metal layer. Folding signal lines are formed on a portion of the second metal layer in the folding region. Folding signal lines are formed on a portion of the third metal layer in the folding region. Double folding signal lines of the second metal layer and third metal layer drastically increase reliability and lifespan of the signal lines in the folding region.

Abstract: An HVIC is a gate driver IC that drives a three-phase inverter and includes high-potential-side regions for three phases on a single semiconductor substrate. The high-potential-side region includes an n-type region and has a potential that is fixed at a power source voltage potential through a VB contact region in the n-type region. The high-potential-side region has a high-side driving circuit that drives an upper arm element of the inverter. An interphase region between adjacent high-potential-side regions has no GND contact region and no GND contact electrode arranged therein, and has only a p-type region at a ground potential constituting a low-potential-side region. The high-potential-side region of one phase has a p?-type opening between the high-side driving circuit of thereof and the high-side driving circuit or the GND contact region of an adjacent high-potential-side region that is of another phase and sandwiches the interphase region therebetween.

Abstract: An organic light emitting diode display panel includes a pixel definition layer on a base substrate for defining a pixel having at least a first subpixel, a second subpixel, and a third subpixel; a first electrode in the first subpixel and the second subpixel; a first organic light emitting layer for emitting light of a first color in the first subpixel; a second organic light emitting layer for emitting light of a second color in the second subpixel; a second electrode on a side of the first organic light emitting layer and the second organic light emitting layer distal to the first electrode; a third organic light emitting layer for emitting light of a third color on a side of the second electrode distal to the base substrate; and a third electrode on a side of the third organic light emitting layer distal to the base substrate.

Abstract: An array substrate and a manufacturing method thereof, wherein the array substrate includes a substrate; an active layer disposed on the substrate; a gate insulating layer disposed on the active layer; a gate disposed on the gate insulating layer; and a protection region dispose between the active layer and the gate, wherein the protection region is disposed on two sides of the gate and disposed on a same layer as the gate insulating layer.

Abstract: The present application provides a display panel and a display device. The display panel includes a plurality of first pixel circuits located in a bending display region and a plurality of second pixel circuits located in a non-bending display region, a first gap is defined between two adjacent first pixel circuits, a second gap is defined between two adjacent second pixel circuits, a width of the first gap is greater than a width of the second gap, and at least one through groove is formed in a region corresponding to the first gap and extends along an extending direction of the first gap.

Abstract: Described examples include integrated circuits, drain extended transistors and fabrication methods in which a silicide block material or other protection layer is formed on a field oxide structure above a drift region to protect the field oxide structure from damage during deglaze processing. Further described examples include a shallow trench isolation (STI) structure that laterally surrounds an active region of a semiconductor substrate, where the STI structure is laterally spaced from the oxide structure, and is formed under gate contacts of the transistor.

Abstract: A method includes forming a first semiconductor layer over a substrate; forming a second semiconductor layer over the first semiconductor layer; forming a dummy gate structure over the second semiconductor layer; performing an etching process to form a recess in the first and second semiconductor layers; forming a epitaxy structure over in the recess, wherein the epitaxy structure is in contact with the first and second semiconductor layers; performing a solid phase diffusion process to form a doped region in the epitaxy structure, in which the doped region is in contact with the second semiconductor layer and is separated from the first semiconductor layer; and replacing the dummy gate structure with a metal gate structure.

Abstract: The present disclosure provides a standable OLED display device comprising a first shell, a second shell, a support plate, four first rods, and an OLED panel. The first shell and the second shell have sliders and chutes. Each slider partially slides in a corresponding chute. Two first rods are rotatably connected to the first shell and the support plate. Two other first rods are rotatably connected to the second shell and the support plate. The OLED panel is disposed on the support plate, the first shell, and the second shell, and two opposite sides thereof are respectively inserted in the first shell and the second shell. When the first shell and the second shell slide close to each other, the support plate rises in parallel with respect to the first shell and the second shell so that the device is changed from an initial planar state to a standing state.

Abstract: The present invention provides a display panel and a manufacturing method of the display panel. The display panel includes a base substrate, a light emitting device layer, an encapsulation layer, and a color filter layer. The color filter layer includes multiple first light shielding portions, multiple color resists, and multiple second light shielding portions. An opening is formed between each two adjacent second light shielding portions and arranged corresponding to the pixel unit. The present invention increases an area for inkjet printing in a high-resolution small-sized display panel and reduces the reflectivity of the display panel to ambient light, and edges of the color filter layer less affect a light emitting device.

Abstract: Disclosed is a power module capable of maximizing heat dissipation performance through application of a thick lead frame and a ceramic coating layer to upper and lower sides of a semiconductor device.

Abstract: The present application discloses a display substrate. The display substrate includes a base substrate; a thin film transistor for driving image display including an active layer; and a first light shielding layer on the base substrate and in an inter-subpixel region between two adjacent subpixel regions. A projection of the first light shielding layer on the base substrate at least partially covers a projection of the inter-subpixel region between two adjacent subpixel regions on the base substrate. The projection of the first light shielding layer on the base substrate is outside a projection of the active layer on the base substrate.

Abstract: An organic light-emitting diode (OLED) display panel including a composite substrate including a first substrate, a barrier layer, a plurality of inorganic layers each interlaced therein with an organic material structure, and a second substrate interlaced therein with an organic material structure; a buffer layer disposed on the composite substrate; a thin film transistor layer disposed on the buffer layer; an OLED device layer disposed on the thin film transistor layer; and an encapsulation layer disposed on the OLED device layer.

Abstract: Provided are a display panel, a driving method thereof and a display device. The display panel includes a substrate, a pixel unit layer and an electrochromic layer. The pixel unit layer includes multiple pixel units arranged in an array and each pixel unit includes a main pixel region and a sub-pixel region. Along a direction facing away from the substrate, the main pixel region includes a first electrode, an organic light-emitting layer and a second electrode, and the sub-pixel region includes a third electrode and a fourth electrode. The first electrode is disposed in the same layer as the third electrode, the second electrode is disposed in the same layer as the fourth electrode, and the main pixel region is insulated from the sub-pixel region. The electrochromic layer is disposed on one side of the pixel unit layer facing away from the substrate.

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.