Patents Examined by Xiaoliang Chen
  • Patent number: 11402754
    Abstract: The present invention provides a photosensitive resin composition from which a dry resist film having excellent resilience, storage stability and heat resistance can be produced. The photosensitive resin composition according to the present invention includes a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group, a photopolymerization initiator and a thermal curing agent, wherein the thermal curing agent is a polycarbodiimide compound having a carbodiimide group, the carbodiimide group in the polycarbodiimide compound is protected by an amino group that can be dissociated at a temperature equal to or higher than 80° C. and the polycarbodiimide compound has a weight average molecular weight of 400 to 5000 and a carbodiimide equivalent of 180 to 2500.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: August 2, 2022
    Assignee: ARISAWA MFG. CO., LTD.
    Inventors: Takashi Gondaira, Makoto Tai
  • Patent number: 11399429
    Abstract: A semiconductor package device includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first interconnection layer is within the first dielectric layer. The second interconnection layer is on the second surface of the first dielectric layer and extends from the second surface of the first dielectric layer into the first dielectric layer to electrically connect to the first interconnection layer. The second dielectric layer covers the second surface and the lateral surface of the first dielectric layer and the second interconnection layer.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: July 26, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ming-Ze Lin, Chia Ching Chen, Yi Chuan Ding
  • Patent number: 11388822
    Abstract: Methods for forming circuit boards and circuit boards using an adhesion layer are described. A substrate with two surfaces is exposed to a bifunctional organic compound to form an adhesion layer on the first substrate surface. A resin layer is then deposited on the adhesion layer and the exposed substrate surfaces. Portions of the resin layer may be removed to expose metal pads for contacts.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: July 12, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Tapash Chakraborty, Steven Verhaverbeke, Han-Wen Chen, Chintan Buch, Prerna Goradia, Giback Park, Kyuil Cho
  • Patent number: 11387117
    Abstract: A component carrier having a base structure consisting of an electrically conductive material, an electronic component arranged on the base structure and a surrounding structure on the base structure, where the surrounding structure at least partially surrounds the electronic component laterally.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: July 12, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Minwoo Lee
  • Patent number: 11382218
    Abstract: In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: July 5, 2022
    Assignee: TDK CORPORATION
    Inventors: Takaaki Morita, Seiichi Tajima, Takashi Kariya
  • Patent number: 11380603
    Abstract: An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: July 5, 2022
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Fu-Yun Shen, Cong Lei, Ming-Jaan Ho, Hsiao-Ting Hsu
  • Patent number: 11375614
    Abstract: The present disclosure provides a wiring structure, a display substrate and a display device, and belongs to the field of display technology. The wiring structure of the present disclosure comprises a body portion provided with hollow patterns; the body portion has a first side and a second side which are provided opposite to each other along an extending direction of the wiring structure, and both the first and second sides are wavy; the body portion comprises a plurality of conductive elements sequentially connected along the extending direction of the wiring structure; and in each conductive element, a length of a protruding portion on the first side in the extending direction of the wiring structure is different from that of a protruding portion on the second side in the extending direction of the wiring structure.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: June 28, 2022
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Zhifeng Zhan, Peng Huang, Yanxin Wang, Shuquan Yang, Wei Wang
  • Patent number: 11375624
    Abstract: A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a Ni deposited amount of 20 to 200 ?g/dm2 and a Zn deposited amount of 20 to 1,000 ?g/dm2. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: June 28, 2022
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Nobuaki Miyamoto, Atsushi Miki
  • Patent number: 11372459
    Abstract: A fastener includes a base having a joint plate extended therefrom toward a first direction, a joint plate extended from the joint plate toward a second direction and configured to secure to an electronic base board, and a fastening member protruded thereon toward a third direction. The fastener includes an elastic compressive unit connected to the joint plate and including a pushing part configured to abut with a circuit board downwardly rotated. Subject to the stress in the first direction and applied by the circuit board, the pushing part is moved back and the elastically-compressive unit is compressed to make the circuit board rotate to the bottom side of the pushing part, and an edge of the circuit board can be inserted into and abutted thereon the fastening member, and the circuit board is accommodated in a fastening space formed on the outside of the fastening member.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: June 28, 2022
    Assignee: HANWIT PRECISION INDUSTRIES LTD.
    Inventors: Ying-Chih Tseng, Ching-Kai Chang
  • Patent number: 11363725
    Abstract: A clamping assembly for use in a pick and place assembly process includes a fixture and a carrier. The fixture includes at least one retaining feature configured to releasably secure to the carrier such that a part and a substrate are clamped together between the fixture and the carrier.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: June 14, 2022
    Assignee: UNIVERSAL INSTRUMENTS CORPORATION
    Inventors: Peter Joseph Dionne, Bernard Whalen
  • Patent number: 11357109
    Abstract: An electronic device includes first and second housings rotatably coupled with each other through a hinge, thereby being in a folded state or an unfolded state. The electronic device further includes first and second printed circuit boards (PCBs) disposed in the first and second housings, respectively, and at least one wiring member electrically connecting the first and second PCBs. The electronic device further includes a window disposed over the first and second housings and the hinge, and a display disposed under the window. The display includes a display panel extending in the first housing and having a first FPCB electrically connected to a ground of the first PCB. The display includes a polymer member, a first conductive member disposed in the first housing and electrically connected to the first FPCB, and a second conductive member disposed in the second housing.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: June 7, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jungchul An, Jaehwan Park, Changyong Seo, Seungki Choi
  • Patent number: 11350525
    Abstract: A method is provided for mounting a semiconductor IC to a substrate without a socket or solder. The method includes disposing a guide structure on the substrate. The substrate has multiple contact pads disposed thereon. The substrate also has multiple nuts formed therein for connecting to one or more bolts. The method also includes placing the semiconductor IC inside the guide structure such that the semiconductor IC makes contact with the contact pads. A top plate is disposed on the semiconductor IC. Further, the top plate and the semiconductor IC are fastened to the substrate.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: May 31, 2022
    Assignee: NUVOTON TECHNOLOGY CORPORATION
    Inventor: Simon Wilson
  • Patent number: 11348888
    Abstract: An electronic component includes an electronic device including a substrate, and a wiring board including a conductor unit electrically connected to the electronic device and an insulation unit configured to support the conductor unit. The substrate includes a front surface including a first region, a back surface including a second region, and an end surface connecting the front surface and the back surface. The substrate further includes a first portion located between the first region and the second region and a second portion having a thickness smaller than that of the first portion. The insulation unit of the wiring board is located between a virtual plane surface located between the first region and the second region and the second portion.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: May 31, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hidemasa Oshige
  • Patent number: 11347091
    Abstract: A button deck assembly includes a button deck having at least one mechanical pushbutton, the pushbutton includes a lens cap, a liquid-crystal display (LCD) panel, and an optical block configured to transmit images from the LCD panel for display through the lens cap, a bottom surface of the optical block is positioned on the LCD panel, an air gap is defined between a top surface of the optical block and the lens cap. The assembly also includes a printed circuit board (PCB) assembly defining a PCB aperture, the PCB aperture is sized to receive the optical block, and an elastomeric membrane defining a membrane aperture sized to receive the optical block, the optical block extends from the LCD panel through the PCB and membrane apertures, the membrane channels fluid flow to outer edges of the membrane and around the PCB assembly and the LCD panel.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: May 31, 2022
    Assignee: Aristocrat Technologies Australia Pty Limited
    Inventor: Timothy Seckel
  • Patent number: 11343918
    Abstract: A method of making a printed circuit board includes a step of providing a double-sided plate that is an insulating substrate having conductive layers on respective surfaces thereof, a first coating step of coating a first surface of the double-sided plate with a first photosensitive resin film, a second coating step of coating a second surface of the double-sided plate with a second photosensitive resin film, a first exposure step of exposing the photosensitive resin film coating the first surface after the first and second coating steps, and a second exposure step of exposing the photosensitive resin film coating the second surface after the first exposure step, wherein a maximum depth of a depression in an outermost surface of the second photosensitive resin film used in the second exposure step is less than 1.0 ?m.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: May 24, 2022
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Shigeaki Uemura, Eiko Imazaki, Koji Nitta, Yoshio Oka, Hideki Matsuoka, Ippei Tanaka, Takayuki Yonezawa
  • Patent number: 11337308
    Abstract: A display panel and a display apparatus containing the display panel are disclosed. The display panel includes a substrate, a circuit structure, and a first bonding adhesive. The substrate has a first bonding area. The circuit structure has a second bonding area that opposingly faces the first bonding area. The first bonding adhesive is arranged between, and configured to contact the first bonding area and the second bonding area. At least one of the first bonding area or the second bonding area comprises at least one first indentation. The first bonding adhesive at least partially fills one or more of the at least one first indentation.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: May 17, 2022
    Assignees: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Chunghao Cheng, Kun Guo
  • Patent number: 11337314
    Abstract: A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a root mean square gradient of roughness curve elements R?q according to JIS B0601:2013 of 5 to 28°. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: May 17, 2022
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Nobuaki Miyamoto, Atsushi Miki
  • Patent number: 11329038
    Abstract: The present disclosure provides a display device, including: a display panel, a main circuit board, and a plurality of chip-on-films bonded between the display panel and the main circuit board. The wiring area is provided with a plurality of first binding regions; the plurality of first binding regions are distributed along the wiring area. The main circuit board is provided with a plurality of second binding regions which are corresponding to the first binding regions in a one-to-one manner. A shape of the main circuit board is the same as a shape of the wiring area. A first end of each chip-on-film is bonded to one corresponding first binding region; a second end of each chip-on-film is bonded to one corresponding second binding region.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: May 10, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Pan Xu, Yicheng Lin, Ling Wang, Guoying Wang, Xing Zhang, Ying Han, Dongfang Yang
  • Patent number: 11328858
    Abstract: An inductor component including a spiral wiring wound into a planar shape. A first magnetic layer and a second magnetic layer are located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane of the wound spiral wiring. A vertical wiring extending from the spiral wiring in the normal direction penetrates the inside of the first magnetic layer or the second magnetic layer.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: May 10, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshimasa Yoshioka, Akinori Hamada
  • Patent number: 11327372
    Abstract: A display panel including a substrate, a plurality of bonding pads, and a plurality of conductive traces is provided. The substrate has a substrate edge, a display region, and a peripheral region disposed between the substrate edge and the display region. The plurality of bonding pads are arranged in the peripheral region of the substrate. The plurality of conductive traces are electrically connected to the bonding pads. The conductive traces extend between the bonding pads and the substrate edge and have a plurality of breaks. A method of fabricating the display panel is also provided.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: May 10, 2022
    Assignee: Au Optronics Corporation
    Inventors: Chih-Yu Yu, Yi-Wei Tsai, Yung-Hsiang Lan, Yen-Huei Lai