Abstract: A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a semiconductor die coupled to the inner surface of the first substrate; and a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate.

Abstract: A flexible printed circuit board (FPCB) assembly includes an electrically conductive layer configured to transmit a signal, a dielectric layer provided on the electrically conductive layer, a ground layer provided on the dielectric layer, and an auxiliary metal layer provided on or under the ground layer, and connecting a plurality of regions of the ground layer to each other, where the electrically conductive layer, the dielectric layer, the ground layer, and the auxiliary metal layer are flexible.

Abstract: An immersion cooling tank includes a tank body and a liquid flow tube. The tank body holds a coolant and an electronic device. The tank body defines an inlet and an outlet. The inlet and the outlet are respectively located at opposite ends of the electronic device for inputting and outputting the coolant. The coolant flows through the electronic device. The liquid flow tube includes at least one adjuster. The liquid flow tube is located inside the tank body and coupled to at least one of the inlet or the outlet. The at least one adjuster faces the electronic device for controlling an amount of the coolant flowing in or out of the tank body.

Abstract: A printed wiring board having a sheet material including a cloth-like material woven of reinforced fiber. An angle between a warp thread and a weft thread of the reinforced fiber of the sheet material is 90 degrees. In the sheet material, threads configuring the cloth-like material are cut so that one side of a circumferential edge portion of the sheet material is tilted leftward or rightward at an angle no smaller than 5 degrees and no larger than 30 degrees and a length of a cut portion obtained by cutting out the cloth-like-material configuration threads aligned on a cutting blade with the cutting blade is longer by 0.3 mm to 6.3 mm than a total length of a clearance between an upper blade and a lower blade configuring the cutting blade for cutting the cloth-like material and a thickness of the cloth-like-material configuration threads aligned on the cutting blade.

Abstract: Methods and systems for stacking multiple chips with high speed serializer/deserializer blocks are presented. These methods make use of Through Via (TV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serializer/deserializer blocks, using the TVs.

Abstract: Provided are a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer other than the above component (B), wherein the component (B) is one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups; and a prepreg, a resin film, a laminated board, a printed wiring board and a semiconductor package, each using the maleimide resin composition.

Abstract: An electronic device is disclosed. The electronic device includes: a flexible printed circuit board configured to connect a first printed circuit board and a second printed circuit board and including a rigid area and a flexible area, and a guide at least partially coupled to the rigid area, and located inside the flexible printed circuit board.

Abstract: A package body includes: a substrate; a plurality of electronic components, arranged on the substrate; a package material layer, located on the substrate and packaging the plurality of electronic components; a low frequency shielding conductive structure, embedded in the package material layer, where the low frequency shielding conductive structure is located on a side of the package material layer away from the substrate and is spaced apart from the plurality of electronic components, the low frequency shielding conductive structure is provided with a plurality of through holes, an area of an opening of each of at least some of the through holes is less than 1 mm*1 mm, and a thickness of the low frequency shielding conductive structure is not less than 10 ?m.

Abstract: A circuit board structure for a display device includes a substrate, a bump, a protective layer, and a moisture-resistant layer. The substrate includes a first surface and a second surface opposite to the first surface. The bump is disposed on the first surface of the substrate and includes a first inorganic material. The protective layer is disposed on the first surface of the substrate. The protective layer includes an organic material and a first opening, in which the bump is positioned in the first opening. The moisture-resistant layer entirely covers the protective layer. The moisture-resistant layer includes a second inorganic material and a second opening, in which a portion of the bump is exposed in the second opening.

Abstract: A power module comprises a chip, a power lead electrically connected to the chip and at least one substrate, each of at least one substrate including an outer metal layer bonded to an outer side portion of an insulating layer and an inner metal layer bonded to an inner side portion of the insulating layer, respectively, wherein the outer metal layer and the inner metal layer have different perimeters so that the outer metal layer and the inner metal layer have asymmetric structures.

Abstract: A circuit assembly includes a first conductive member; a second conductive member; and a holding member that is insulating and holds the first conductive member and the second conductive member; wherein the first conductive member has a first exposed surface exposed from the holding member, the second conductive member has a second exposed surface exposed from the holding member, the holding member includes an insulating portion located between the first exposed surface and the second exposed surface, and a conductive film covers at least a part of the first exposed surface and at least a part of the second exposed surface, while extending over the insulating portion.

Abstract: The disclosure provides a display module, including a display substrate and a FPC board; the display substrate includes a first base substrate, first bonding terminals, first impedance-test bonding terminals, and an antenna radiation structure; the FPC board includes a second base substrate, second bonding terminals, second impedance-test bonding terminals, and an antenna receiving structure; the first bonding terminals are bonded and connected to the second bonding terminals; the first impedance-test bonding terminals are bonded and connected to the second impedance-test bonding terminals; the antenna radiation structure has two ends respectively connected to two first impedance-test bonding terminals; the antenna receiving structure has two ends respectively connected to two second impedance-test bonding terminals; and the two first impedance-test bonding terminals connected to the antenna radiation structure are respectively bonded and connected to the two second impedance-test bonding terminals connected

Abstract: A component carrier includes a stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a magnetic element assembled to the stack, and a dielectric layer structure on the stack. The magnetic element includes an embedded inductive element. The dielectric layer structure at least partially surrounds the magnetic element. Further, a manufacturing method and a use of photo-imaging are described.

Abstract: An autoclavable electronics unit for an endoscope, the autoclavable electronics unit including: a multi-layer printed circuit board having a rigid region and a flexible region, the rigid region being reinforced by stiffener material to have a greater rigidity than the flexible region and the flexible region is configured to be bendable. Where the multi-layer printed circuit board is formed from structured layers made of conductive and non-conductive materials adhered together, in which the conductive structures form conductor tracks and contact surfaces; the rigid region is provided with one or more electronic components; and the rigid region is covered by an epoxy resin.

Abstract: A circuit module includes: a main substrate; a submodule that is mounted on a top surface of the main substrate; a main sealing resin that is provided on the top surface of the main substrate, and covers at least part of the submodule; and a conductive shield film that covers at least part of the main sealing resin. The submodule includes a sub-substrate, an electronic part that is mounted on a top surface of the sub-substrate, a plurality of conductive members that have linear shapes, and are connected to the top surface of the sub-substrate and the shield film, and a subsealing resin that is provided on the top surface of the sub-substrate, and covers the electronic part and part of each of the plurality of conductive members.

Abstract: A flexible circuit board for transmitting a signal in a frequency band includes an intermediate region in which a signal line is disposed as a transmission line for transmitting the signal in the frequency band, and a pad region extending from the intermediate region and disposed at one end or both ends of the flexible circuit board, a pad electrically connected to the signal line and formed to face a first direction of the flexible circuit board, and a ground pattern overlapping at least a portion of the pad and formed to face a second direction of the flexible circuit board and disposed in the pad region where the second direction is opposite to the first direction.

Abstract: A package for an optical module includes a substrate provided through a side wall in a first direction. The substrate includes a first wiring layer including a first signal terminal, a second signal terminal, and a first ground terminal. The package includes a second wiring layer disposed under the first wiring layer. The second wiring layer includes a first ground pattern and a first insulating layer disposed between the first wiring layer and the second wiring layer, and includes a groove extending along the first direction, the groove being filled with a metal. The groove is provided within the first ground terminal, in a plan view, and the first insulating layer is free of the groove. The first ground terminal is electrically coupled to the first ground pattern through the metal of the groove.

Abstract: A device includes comprising first and second printed circuit boards. Walls couple the first and second printed circuit boards to each other and define a first cavity between the first and second printed circuit boards. Electric conductors associated with the walls electrically connect the first and second printed circuit boards. An integrated circuit chip is mounted to a first surface of the first integrated circuit board in the first cavity. The integrated circuit chip is electrically connected to conductive tracks of the first surface of the first printed circuit board. Surface-mounted components are mounted on top of and in contact with conductive tracks of a first surface of the second printed circuit board. The first surfaces of the first and second printed circuit boards are arranged facing towards each other. The first and second printed circuit boards may form rigid components of a flex-rigid type printed circuit board.

Abstract: An electronic component sub-mount includes a body having a top surface, a bottom surface, and a supporting surface. The top and bottom surfaces are located on opposite sides of the body. The supporting surface is located on one side of the body, and an angle that is not equal to 0 degrees is formed between the supporting surface and the bottom surface. A first conductive layer is disposed on the bottom surface and includes multiple first conductive lines. A second conductive layer is disposed on the supporting surface, extending to the top surface, and includes multiple second conductive lines. The second conductive lines on the supporting surface have a first pin layout, and the second conductive lines on the top surface have a second pin layout different from the first pin layout. The second pin layout matches the pin layout of first conductive lines on the bottom surface.

Abstract: A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.