Patents Examined by Xiaoliang Chen
  • Patent number: 10806026
    Abstract: A fusible via is disclosed. The fusible via includes an upper contact. The fusible via further includes a handle portion having a first end and a second end. The upper contact is disposed on the first end of the handle portion. The handle portion comprises an alloy and a blowing agent. The alloy melts above a predefined solder reflow temperature but below a thermal degradation temperature of the blowing agent. The fusible via further includes a lower contact disposed on the second end of the handle portion.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: October 13, 2020
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Jeffrey N. Judd, Scott D. Strand, Timothy J. Tofil
  • Patent number: 10796928
    Abstract: A wiring structure includes a first unit, a second unit, a first insulation wall, a first redistribution layer and a third unit. The first unit is disposed at a first elevation and having a first circuit layer and a first dielectric layer surrounding the first circuit layer. The second unit is disposed at the first elevation and having a second circuit layer and a second dielectric layer surrounding the second circuit layer. The first insulation wall is disposed between the first unit and the second unit. The first redistribution layer is disposed on the first unit and the second unit, and electrically connected between the first unit and the second unit. The third unit is disposed on the first redistribution layer and having a third circuit layer and a third dielectric layer surrounding the third circuit layer.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: October 6, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen Hung Huang
  • Patent number: 10794639
    Abstract: A cooling structure includes a plurality of heat radiation parts configured to cool a heat generating component and a holding member configured to hold the plurality of heat radiation parts. Moreover, the heat radiation parts of the cooling structure each include a base portion located on the side of the heat generating component and a fin portion extending from the base portion and radiating heat. Furthermore, the base portions of the heat radiation parts abut on each other.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: October 6, 2020
    Assignee: NEC CORPORATION
    Inventor: Makoto Fushimi
  • Patent number: 10798829
    Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: October 6, 2020
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell
  • Patent number: 10796977
    Abstract: Circuitry to apply heat to a die while the die junction temperature is below a minimum die junction temperature of an operating die junction temperature range for the die is provided. The circuitry to avoid a system boot failure when the die junction temperature is below the operating die junction temperature range of the die.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: John Fallin, Daniel J. Ragland, Jonathan P. Douglas
  • Patent number: 10791622
    Abstract: A printed wiring board of the present disclosure that includes a power supply layer and a ground layer. A power supply layer pattern formed in the power supply layer includes a power supply layer electrode and a branch that is a direct-current power feeding path connecting adjacent electromagnetic band gap (EBG) unit cells. A capacitive coupling element including a capacitive coupling element body is disposed to oppose the power supply layer electrode with an interlayer provided therebetween.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: September 29, 2020
    Assignees: NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY, KYOCERA CORPORATION
    Inventors: Yoshitaka Toyota, Kengo Iokibe, Xingxiaoyu Lin, Toshiyuki Kaneko, Masanori Naito, Toshihisa Uehara
  • Patent number: 10784039
    Abstract: An inductor component including a spiral wiring wound into a planar shape. A first magnetic layer and a second magnetic layer are located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane of the wound spiral wiring. A vertical wiring extending from the spiral wiring in the normal direction penetrates the inside of the first magnetic layer or the second magnetic layer.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: September 22, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshimasa Yoshioka, Akinori Hamada
  • Patent number: 10785871
    Abstract: Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Terminals may be inserted into the terminal holes and connected to conductive features or plating within the holes. A conductive element may be provided on the substrate to connect to a terminal. Alternatively solder may be dispensed into the holes for surface mounting.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: September 22, 2020
    Assignee: VLT, Inc.
    Inventors: Patrizio Vinciarelli, Michael B. LaFleur
  • Patent number: 10775858
    Abstract: A liquid immersion cooling tank includes a reservoir and a liquid flow tube. The reservoir contains an insulating coolant to immerse an electronic device. The liquid flow tube includes an adjusting member. The reservoir includes an inlet and an outlet. The inlet and the outlet are respectively arranged at opposite ends of the electronic device. The liquid flow tube is located inside the reservoir. The liquid flow tube is coupled to at least one of the inlet and the outlet. The adjusting member faces the electronic device to control an amount of inflow or outflow of the insulating coolant. When the electronic device is immersed in the reservoir for cooling, the insulating coolant flows through the electronic device. The liquid flow tube coupled to the inlet or the outlet of the reservoir uses the adjusting member to control the amount of inflow or outflow of the insulating coolant.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: September 15, 2020
    Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
    Inventors: Tze-Chern Mao, Yen-Chun Fu, Chih-Hung Chang, Yao-Ting Chang, Li-Wen Chang, Chao-Ke Wei
  • Patent number: 10777359
    Abstract: A multilayer ceramic capacitor and a manufacturing method thereof are disclosed. The multilayer ceramic capacitor includes a base part including ceramic dielectrics, and inner electrodes formed in the ceramic dielectrics and arranged in interval by a staggered manner; two first outer electrodes of outer electrode layers are sintered and formed on two sides of the base part, and in electrical contact with the inner electrode terminals of the inner electrodes. Second outer electrodes are formed on outer parts of the two first outer electrodes. The inner electrodes and the first outer electrodes have barium titanate powder and nickel powder with average particle diameters in range of 0.2 ?m to 0.4 ?m, so that the inner electrodes are in good electrical contact with the first outer electrodes, to improve binding strength and reduce peeling of the first outer electrodes from the inner electrodes.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: September 15, 2020
    Assignee: Holy Stone Enterprise Co., Ltd.
    Inventors: Atsuo Nagai, Keisuke Seino, Sheng-Yi Chen
  • Patent number: 10779406
    Abstract: A wiring substrate includes a first insulating layer, an electronic component, a resin layer, a second insulating layer, a wiring pattern, and a via interconnect. The first insulating layer includes a cavity. The electronic component includes a first surface at which a pad is formed and a second surface facing away from the first surface and fixed in the cavity via an adhesive layer. The resin layer is on the first surface of the electronic component and covers the pad. The second insulating layer is on the first insulating layer and covers the resin layer. The wiring pattern is on the second insulating layer. The via interconnect pierces through the second insulating layer and the resin layer to electrically connect the wiring pattern to the pad.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: September 15, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Toru Hizume
  • Patent number: 10774983
    Abstract: Support system for mobile devices with a main body provided with a lower stop element, movable in a vertical direction with respect to the main body, two lateral stop elements simultaneously movable, in opposite directions, with respect to the main body, an elastic element acting on the lateral stop elements and which tend to move the latter two in a horizontal approaching direction of their respective front flanges, and an upper stop element mounted on the main body with the possibility of manual movement in a vertical direction. The support system may further include a power source and lighting elements integrated in the main body.
    Type: Grant
    Filed: July 4, 2017
    Date of Patent: September 15, 2020
    Assignee: AIKLO TECHNOLOGIES, S. L.
    Inventors: Sergio Ehlis Pirretas, David Palomar Cros
  • Patent number: 10772212
    Abstract: The present invention relates to an electrochemical or chemical treatment device for high aspect ratio circuit board with through hole comprises: an electroplating tank; a solution storage tank; a positioning frame, the positioning frame fixes the circuit board inside the electroplating tank for the electroplating tank to be divided into a solution accumulated area and a suction area by the positioning frame and the circuit board; a priming piping sucking solution from the solution storage tank to the solution accumulated area; a suction cap corresponding to the suction area; and a suction piping connected to the suction cap, using the negative pressure produced by suction to make the solution flow through the through hole of the circuit board, and further having a better result of electroplating the bore of through hole of the high aspect ratio circuit board.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: September 8, 2020
    Assignee: U-Pro Machines Co., Ltd.
    Inventors: Hsin-Chi Iou, Chieh-Yuan Cheng
  • Patent number: 10772204
    Abstract: An electronic device includes a circuit board, and first and second elements. The first element includes a first connection portion including a recess portion, and first connection portion side electrodes exposed to the first connection portion. The second element includes a second connection portion and second connection portion side electrodes exposed to the second connection portion. The circuit board includes first and second board side electrodes respectively disposed at positions opposed to each other in plan view. The first connection portion side electrode and the second connection portion side electrode are joined to the first board side electrode and the second connection portion side electrode connected to each other. The first connection portion side electrode and the first board side electrode are disposed along the recess portion in plan view of the circuit board.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: September 8, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takahiro Baba
  • Patent number: 10765044
    Abstract: An electric power conversion device is provided with a case (60) which includes: a first member (61) having a first region (73) defining therein a first passage (78, 79) in which a cooling medium flows, and a second region (74) disposed on a side of the first region; and a second member (88) disposed so as to at least partly overlap with the second region as seen from a direction orthogonal to the second region in a spaced apart relationship to the second region, and internally defining a second passage (91) connected to the first passage. A reactor (31) is positioned in the first region, and a switching device (33) is positioned on the surface of the second member facing away from the first member while a capacitor (35) is positioned between the second member and the second region of the first member.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: September 1, 2020
    Assignee: Honda Motor Co., Ltd.
    Inventors: Toshiki Ikeda, Jun Kato, Kosuke Nishiyama, Takanori Sakaguchi, Takaaki Fushimi, Shinnosuke Sato, Ryota Kitamoto, Yusuke Shindo
  • Patent number: 10764998
    Abstract: An electronic circuit board includes electronic components to be mounted; a plurality of hard rigid board portions each of which has an insulating insulator and a conductive circuit pattern and electrically connects the mounted electronic component to the circuit pattern; and at least one soft flexible board portion which has an insulating insulator, has a conductive circuit pattern electrically connected to each of the circuit patterns of at least two rigid board portions among the plurality of rigid board portions, and is integrated with the rigid board portions which are electrically connected to the circuit pattern thereof. A plurality of contact relays as the electronic components is dispersedly arranged on the respective rigid board portions.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: September 1, 2020
    Assignee: YAZAKI CORPORATION
    Inventors: Masayuki Naohara, Tomohiro Sugiura, Yoshihiro Kawamura
  • Patent number: 10764990
    Abstract: A heat-dissipating module having an elastic mounting structure includes a carrier circuit board, a main circuit board, a heat dissipating module, and a plurality of elastic mounting components configured to mount mounting holes of the carrier circuit board and mounting grooves of the heat dissipating module in series, so as to fix the carrier circuit board, the main circuit board and the heat dissipating module. As a result, the plurality of elastic mounting components can provide stress buffer and good bonding effect for the thermally conductive device of the heat dissipating module bonded on an upper surface of the heat source device.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 1, 2020
    Assignee: ADLINK TECHNOLOGY INC.
    Inventor: Hua-Feng Chen
  • Patent number: 10763040
    Abstract: A taping reel with a plurality of coil components packed in the tape reel, comprising a tape including a plurality of pockets arranged along a longitudinal direction and each having one of the coil components stored therein, and a reel around which the tape is wound. The coil components each include a core including a winding core part, and a coil wound around the winding core part and including a plurality of wires. The coil includes a twisted wire portion in which the plurality of wires is twisted together. The plurality of coil components includes first coil components having the twisting direction of the twisted wire portion opposite to the twisting direction of the twisted wire portion of other coil components.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: September 1, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takashi Sukegawa, Masashi Miyamoto, Ryota Hashimoto, Kentaro Yamaguchi, Chihiro Yamaguchi
  • Patent number: 10754387
    Abstract: Provided is a lead wiring line formed on a reinforcement film, and the lead wiring line includes a portion overlapping a bottom portion of a recessed portion in a plan view and a portion overlapping a head portion of a protruding portion in a plan view.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: August 25, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Takao Saitoh, Yohsuke Kanzaki, Masaki Yamanaka, Yi Sun, Seiji Kaneko
  • Patent number: 10757821
    Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: August 25, 2020
    Assignee: RICHVIEW ELECTRONICS CO., LTD.
    Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang