Abstract: Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.

Abstract: An immersion cooling tank includes a tank body and a liquid flow tube. The tank body holds a coolant and an electronic device. The tank body defines an inlet and an outlet. The inlet and the outlet are respectively located at opposite ends of the electronic device for inputting and outputting the coolant. The coolant flows through the electronic device. The liquid flow tube includes at least one adjuster. The liquid flow tube is located inside the tank body and coupled to at least one of the inlet or the outlet. The at least one adjuster faces the electronic device for controlling an amount of the coolant flowing in or out of the tank body.

Abstract: Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, a transformer may be formed in the electrical package. The transformer may include a first conductive loop that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first conductive loop from a second conductive loop that is formed in the package. Additional embodiments of the invention include forming a capacitor formed in the electrical package. For example, the capacitor may include a first capacitor plate that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first capacitor plate form a second capacitor plate that is formed in the package. The thin dielectric spacer material in the transformer and capacitor allow for increased coupling factors and capacitance density in electrical components.

Abstract: An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

Abstract: Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.

Abstract: A package substrate and manufacturing method thereof are provided. The package substrate includes a substrate and an electronic component. The substrate includes a cavity. The electronic component is disposed in the cavity. The electronic component includes a first region and a second region, and an optical recognition rate of the first region is distinct from that of the second region.

Abstract: Disclosed in embodiments of the present disclosure are a flexible circuit board assembly, a display assembly and a display device. The flexible circuit board assembly includes: a first flexible circuit board, including a component part, the component part being provided with components; and a first wave absorbing layer, disposed on the component part and configured to cover the components. The display assembly includes a display module and the flexible circuit board assembly; the display module includes a module body and a second binding part, and the second binding part is configured to be bent to a back surface of the module body; and the first flexible circuit board is located on the back surface of the module body and includes a first binding part, and the first binding part is bound and connected to the second binding part of the display module.

Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.

Abstract: A shaft and a display device are disclosed. The display device includes the shaft including a plurality of planar sections and arc sections. Each of the arc sections is disposed between adjacent ones of the planar sections. A flexible display screen includes a first side, a third side, and a second side sequentially arranged, and the third side is fixed on the shaft. When the flexible display screen is rolled on the shaft, each chip-on-film is placed on a corresponding one of the planar sections, so that a problem that the chip-on-films arranged on the flexible display screen are prone to peel is solved.

Abstract: A flexible printed circuit board includes a power wiring layer transmitting power and a signal wiring layer insulated and stacked over or under the power wiring layer. The flexible printed circuit board may also include an upper wiring layer and a lower wiring layer insulated and stacked each other, and the power wiring layer and the signal wiring layer are provided between the upper wiring layer and the lower wiring layer.

Abstract: An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

Abstract: According to various embodiments, an electronic apparatus comprises: a housing including a front plate, a rear plate disposed facing a direction opposite the front plate, and a side bezel enclosing at least a portion of the space between the front plate and the rear plate; a circuit board disposed between the front plate and the rear plate; a first radiating conductor disposed to form at least a portion of the side bezel; a connection member comprising a conductive material disposed between the circuit board and the rear plate; and a processor or communication module comprising communication circuitry disposed on the circuit board. The connection member includes a first curved part provided on one end and contacting the circuit board, and a second curved part provided on another end and contacting the first radiating conductor, thereby electrically connecting the first radiating conductor to the circuit board.

Abstract: A printed circuit board assembly includes a first printed circuit board, a second printed circuit board disposed on the first printed circuit board and including an antenna pattern, a third printed circuit board disposed on the first printed circuit board, one or more first electronic components disposed between the first and the second printed circuit board and electrically connected to at least one of the first and the second printed circuit board, one or more second electronic components disposed between the first and the third printed circuit board, and electrically connected to at least one of the first and the third printed circuit board, a first interposer substrate electrically connecting the first printed circuit board and the second printed circuit board to each other, and a second interposer substrate electrically connecting the first printed circuit board and the third printed circuit board to each other.

Abstract: Printed wiring board manufacturing method, and printed wiring board.

Abstract: An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respective two land-side BGA pads through the offset interposer. The land-side BGA is configured to interface with a first-level interconnect. The POP-side BGA is configured to interface with a POP substrate. Each of the two land-side pads has a different footprint than the respective two POP-side pads.

Abstract: An electronic device is provided. The electronic device comprises a housing, a flexible display configured to be at least partially rolled around a rotation axis in a substantially circular shape in an internal space of the housing, a battery located in the internal space in which the flexible display is rolled, a first printed circuit board located on one surface of the battery that is oriented in a direction of the rotation axis, the first printed circuit board being electrically connected to the flexible display and including a first wireless communication circuitry, and a second printed circuit board located inside the housing to face the first printed circuit board and including a second wireless communication circuitry. The first printed circuit board may be configured to be rotatable about the rotation axis in a state of being electrically connected to the second printed circuit board.

Abstract: In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.

Abstract: An electronic device according to various embodiments may include: a first frame at least partially exposed to an outside of the electronic device and comprising a metal material, a flexible printed circuit board at least a portion of which is disposed adjacent to the first frame, a first connector electrically connecting the flexible printed circuit board and a main board of the electronic device, a bendable second connector electrically connecting the flexible printed circuit board and the first frame, a bolt including a bolt body extending through a groove formed in the second connector to be bolt-coupled to a bolt groove formed in the first frame and a bolt head formed integrally with the bolt body and disposed in a first direction with respect to the first frame, a plate disposed adjacent to the bolt head of the bolt and coupled to the first frame in the first direction to allow the bolt body of the bolt to be maintained in a state of being coupled to the bolt groove formed in the first frame, and an int

Abstract: Disclosed is a method of manufacturing a stretchable substrate having improved stretch uniformity according to various embodiments of the present disclosure in order to implement the above-described object. The method may include forming an auxetic including a plurality of unit structures, and attaching one or more elastic sheets to the auxetic and forming a stretchable substrate.

Abstract: A semiconductor package device includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first interconnection layer is within the first dielectric layer. The second interconnection layer is on the second surface of the first dielectric layer and extends from the second surface of the first dielectric layer into the first dielectric layer to electrically connect to the first interconnection layer. The second dielectric layer covers the second surface and the lateral surface of the first dielectric layer and the second interconnection layer.