Abstract: A cooling cover for an RF power amplifier device having a mounting support, a first lead, and a heat generating die mounted on the first lead. The cooling cover is comprised of a body of a thermally conductive material and having a first surface and a second surface. A layer of thermally conductive and electrical non-conductive material is deposited upon the second surface of the cooling cover. When the cover is coupled to the mounting support, the first surface is in contact with the mounting support and the second surface is in contact with the first lead thereby providing a low resistance heat path between the heat generating die and mounting support.

Abstract: An electronic assembly (100) includes a first circuit board (120) which houses electronic components (122), a second circuit board (140) being three-dimensional and having integral members (143) to receive and position the first circuit board (120), and an electrical connector (130) between the first circuit board (120) and the second circuit board (140).

Abstract: A semiconductor device comprises a printed circuit board with circuit pattern formed thereon, and a semiconductor wafer having terminals installed on its peripheral portion. Semiconductor chips are mounted on one surface or both surfaces of the semiconductor wafer. A connector is installed on the printed circuit board for electrical connection with the terminals. When the terminals are connected to the circuit pattern, the semiconductor wafer is installed substantially vertically on the printed circuit board. Or a semiconductor wafer member is constituted by two semiconductor wafers, and a closed space is internally formed between the two wafers and heat pipes for heat radiation are inserted in the closed space.

Abstract: A circuit board with electrical components in which the components are inserted with their insulated bodies into through bores of the circuit board, slightly protruding from the underside and top of the board, and having contact surfaces which are soldered to a strip conductor. The lower ends of the components terminate in a hemispherical cup or rounded conical tip and have at least one lower contact surface protruding into the strip conductor and soldered to it. The upper ends of the components comprise a plurality of upper contact surfaces insulated from each other and connected to a plurality of contact elements protruding from the component body. The contact elements are connected at a distance around the bores to the strip conductor on top of the circuit board by soldering paste.

Abstract: A printed circuit board on the rear of an automotive instrument cluster is covered by a flat panel of polystyrene in contact with the circuit board to protect circuit components against electrostatic discharge. Openings in the panel allow large components which are not sensitive to ESD to protrude beyond the panel.

Abstract: A mounting structure for an EMI prevention filter which facilitates mounting and dismounting of the EMI prevention filter onto and from an electric wire having a connector to be releasably connected to an electronic apparatus, and which allows reliable mounting of the EMI prevention filter even where the EMI prevention filter and an object electric wire do not conform fully to each other in configuration. An outer holder in which the EMI prevent filter is accommodated is disposed such that the electric wire extends through the inside thereof, and the, the outer holder is resiliently deformed and locked in this condition, where after a second threaded portion is screwed with a first threaded portion to mount the EMI prevention filter onto the electric wire.

Abstract: The disclosure relates to electronic units formed by two printed circuit type boards that are electrically and mechanically coupled and that have a single plug for their connection. To facilitate the placing of these units between two pairs of grooves, the assembling the two boards comprise adjusting elements to adjust the distance between the two boards to two distinct values: one when the boards are inserted into the grooves and the other for an effect of locking the boards between the pairs of grooves. To this end, it is possible to use bars crossed by a screw that makes it possible, by screwing, to place two outside sections of the bar in a position of overthrust with respect to an inside section of the bar. The screwing is done after the electronic unit has been inserted into the grooves in order to lock the boards against the flanks of the grooves.

Abstract: An inexpensive arrangement for mounting multiple, closely spaced integrated circuit chips (18, 20, 22, 24) on a low temperature co-fired ceramic (LTCC) substrate (10) uses a mandrel-produced thin film decal (26) having patterns of interconnecting conductive traces (34, 46, 47) that connect to the fine pitch connecting pads (60) of the integrated circuit chips at one end and connect to the relatively coarse pitch connecting pads (50) of the low temperature co-fired ceramic substrate at the other end. The interconnect decal is formed independently of the LTCC substrate and is provided with chip connections at a pitch of about 0.004 inches. The interconnect pads of the decal are connected by conductive traces on the decal to the LTCC pads which have a pitch in the order of about 0.01 inches or greater.

Abstract: A control device and method of making the same are provided, the control device comprising two generally flat and rectangular circuit boards each having a component carrying side and an opposite solder side, each circuit board having a peripheral edge, and mounting structure holding the two circuit boards in spaced apart generally parallel relation with certain sides thereof facing each other, the mounting structure comprising a bracket unit generally engaging and encircling the peripheral edges of the two circuit boards so as to generally close the space between the two circuit boards around generally the entire peripheral edges thereof.

Abstract: A modularized electronic system such as notebook or palmtop for packaging and assembling a plurality of internal and external modules comprises at least one upper case assembly and one lower case assembly for clamping the internal modules in between. Each internal module comprises a module head, a module body and a near port. The module head further comprises a connector on its bottom and is vertically plugged in a receptacle on a PCB board assembly attached to the lower case assembly. The lower case assembly further comprises a U-shaped opening on top of a side panel behind the module assembly for the attachment of the rear port. The upper case assembly further comprises a module clamping device under its top panel which is removably attached to the upper end of the module assembly when the external enclosure case is closed whereby the module assembly and the PCB board assembly are horizontally clamped between the upper and lower case assemblies.

Abstract: Within an electronic shelf, physically separating or isolating in a front to rear direction keying elements from connector alignment elements to provide a separation distance, minimizes the undesirable interaction that may occur between keying elements and connector alignment elements due to tolerance effects. Worst case manufacturing tolerances with respect to keying elements, for example, no longer influence in any significant way, the co-action of the connector alignment elements. Insertion of circuit packs into respective receiving stations is achieved with less effort since effort is not required to overcome extra frictional forces resulting from the keying elements interacting with the connector alignment elements.

Abstract: An article of manufacture which has a substrate including electrical leads and bond pads electrically connected to the leads. Two or more integrated circuit semiconductor chips are supported on the substrate. Each of the chips includes a plurality of edges and a plurality of input/output (I/O) bond pads. A portion of the bond pads on each chip are located adjacent at least one edge of the respective chip. At least two separate sections of Tape Automated Bonding (TAB) tape electrically connect the I/O bond pads on each chip to the bond pads on the substrate. In a refinement of the invention, the sections of TAB tape each include a plurality of inner lead bond leads extending from a longitudinal (along the tape length) edge of the tape. Each inner lead bond is connectable to one of the I/O bond pads on the chips.

Abstract: A flexible printed circuit board is provided including a flexible sheet having at least one electrically conductive layer, with a printed circuit pattern and a fold retainer pattern formed in one of the electrically conductive layers. The fold retainer pattern is electrically isolated from the printed circuit pattern. The fold retainer pattern has notches that indicate where the sheet is to be folded when the flexible sheet is folded, it is held in its folded shape by the fold retainer pattern.

Abstract: A protective shield for attachment to an electrical control on an electric water heater having a heating element extending into the water heater tank below the control. The shield has an upper section attached to the control and a depending lower section that shields the electrical connections to the heating element. The lower section is hinged to the upper section for upward swinging movement to a raised position providing access to the heating element. Latches on the opposite sides of the shield releasably hold the lower section in its raised position. Attachment of the shield to the control is effected by upwardly opening shield sockets that receive downwardly extending projections on the control and by a shield top end loop received over a lug on the control.

Abstract: To prevent the lead terminals of an electronic circuit component from being bent due to the vibration of the component after being mounted on a circuit board, each lead terminal has a tapered portion formed between an inserted tip portion and a cut dumb bar portion and having a width which decreases from the dumb bar portion toward the tip portion to prevent stresses from concentrating in the terminal.

Abstract: A wiring patch panel cabinet accommodates plural termination devices. A cabinet support structure includes spaced apart top and bottom walls and opposed sidewalls. The cabinet support structure secures a plurality of individual patch panels. Each patch panel accommodates termination devices of a given type. The termination devices of one patch panel may be different from the termination devices of another patch panel supported by the cabinet structure. The patch panels are supported by the cabinet in side-by-side vertical orientation to facilitate removal and repair of an individual patch panel without disturbing adjacent patch panels.

Abstract: In an IC memory card, sub-modules, in each of which a plurality of memory ICs are mounted on each of two opposed surfaces of a sub-substrate, are mounted on each of two opposed surfaces of a single substrate. Since the number of substrates connected to a connector is one, soldering of the connector is facilitated, and the structure of the connector can be simplified. Furthermore, in an IC memory card, the sub-modules may be mounted on the substrate in such a manner that they are stacked in two stages at an opening in the substrate. In this way, the thickness of the IC memory card can be minimized. Also, the use of the die bonding process makes connection between the sub-module and the substrate easy.

Abstract: An electromagnetically shielded self-molding package for an electronic component comprises a pair of bags having an electrically conductive coating therebetween and disposed about the component and having a polymerizable resin completely filling the space between the bags and the component.

Abstract: Card cages for mounting an array of electronic modules are provided for. The card cage comprises a plurality of generally rectangular shaped panels, including a top panel, a bottom panel, a back panel, and two side panels. The panels are adapted for assembly into a generally right-rectangular prism shaped frame having a closed back and an open front and defining one or more module mounting areas. The card cage also comprises guides adapted to slidably receive one or more electronic modules having electrical connectors. The guides are provided on at least one panel defining each mounting area. The back panel has electrical connectors adapted to engage the electrical connectors of the electronic modules. The top, bottom, and side panels are interlockable. Those interlockable panels are fabricated from a single sheet of metal and have a plurality of integral interlocking members. The interlocking members collectively constitute a plurality of associated pairs of tongues and openings.

Abstract: The electric device has a printed circuit board (10) which carries an electronic circuit with electronic components (12). The circuit is provided with a plug connector strip (14) for making electrical contact. In addition to the housing cover (27) and housing base (32), additional plastic coverings (16, 23) which are tight against moisture are provided to protect the circuit against moisture in a reliable manner and cover the printed circuit board on the upper side (11) and the underside (22) in the manner of a hood. These plastic parts are connected with the printed circuit board so as to be tight against moisture. The housing cover (27) and housing base (30) need not carry out any sealing functions and serve exclusively to protect against mechanical damage and, under certain circumstances, for shielding.