Abstract: The electric device has a printed circuit board (10) which carries an electronic circuit with electronic components (12). The circuit is provided with a plug connector strip (14) for making electrical contact. In addition to the housing cover (27) and housing base (32), additional plastic coverings (16, 23) which are tight against moisture are provided to protect the circuit against moisture in a reliable manner and cover the printed circuit board on the upper side (11) and the underside (22) in the manner of a hood. These plastic parts are connected with the printed circuit board so as to be tight against moisture. The housing cover (27) and housing base (30) need not carry out any sealing functions and serve exclusively to protect against mechanical damage and, under certain circumstances, for shielding.

Abstract: Fault-tolerant power distribution system for back-mounted hardware in which a backplane arrangement delivers alternative sources of system power in a prioritized pattern to each of a plurality of fault-tolerant electronic cards via a plurality of system slots, each slot including a power port having electrical contacts in a common system pinout, and the cooperating system cards have electrical contacts in the same common system pinout. Any of the system cards can be installed in any system slot and will receive the system power in one of a plurality of fault-tolerant prioritizations.

Abstract: An electronic package comprises a component mounted on a substrate, such as a printed circuit board, by a solder connection that is based upon a tin alloy containing zinc. The connection is formed to copper faying surface on the substrate, and includes a first layer formed of a zinc-free tin metal bonded to the copper surface and a second layer formed of the tin-zinc solder alloy bonded to the first layer. The first layer provides a zinc-free barrier between the copper and the tin-zinc alloy to retard zinc migration to the copper interface that would otherwise result in dezincification of the solder alloy and reduce the mechanical properties of the connection.

Abstract: A unit for controlling valves being actuated by electromagnets for a pressure fluid includes a housing having a housing frame and a lid defining an interior. At least one valve coil and components of the at least one valve coil, such as a wound coil body and a yoke ring, are disposed in the housing. The at least one valve coil is spaced from the housing frame defining interstices therebetween, and the components are mutually spaced apart defining interstices therebetween. A circuit carrier is disposed in the interior of the housing and is electrically connected to each valve coil. The same resilient potting composition fills up the interstices between the components and between each valve coil and the housing frame, without any boundary layers. A method for producing such a unit includes resiliently embedding the components and the at least one valve coil in the housing frame in one operation with the resilient potting composition.

Abstract: A knitted or braided electromagnetic shielding material is formed by interweaving metallic or metal-clad wire rods, and each wire rod has a solder-plated layer on its surface. By heating the knitted or braided material, the wire rods are securely soldered to one another, thus preventing the knitted or braided material from loosening or disentangling, Furthermore, the contact resistance between the wire rods is reduced by the solder connections, thus enhancing the electromagnetic shielding effect of the knitted or braided material and further causing no difference in the electromagnetic shielding effect of the knitted or braided material in relation to its weaving direction. An electromagnetic shielding gasket clad with the knitted or braided material can be easily secured to a housing of electronic components, by using the solder-plated layers of the wire rods to melt the gasket thereto.

Abstract: Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitized flexible circuit. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication.

Abstract: A socket for mounting an external integrated circuit on a printed circuit board is described. The socket includes a base having a bottom that can be mounted on the printed circuit board and a top that can receive the external integrated circuit. A plurality of connectors are located on the top of the base for coupling to the external integrated circuit. An in-socket embedded integrated circuit is embedded inside the base for providing a predetermined electronic function. The external integrated circuit and the in-socket embedded integrated circuit occupy substantially minimized space on the printed circuit board. The external integrated circuit can be a microprocessor and the in-socket integrated circuit can also include a microprocessor. The socket can be used for a computer system that allows the embedded microprocessor functioning when the external microprocessor is not coupled to the plurality of connectors of the base.

Abstract: This is a pen cursor structure for a positional digitizing device such as a digitizing tablet or a pen-driven computer. It comprises a structure of an electrically insulating material having a plurality of areas for receiving and carrying electrical components, an inner structure having a plurality of electrical contacts disposed within the areas and a plurality of electrical traces interconnecting the plurality of electrical contacts. The structure is curved about a longitudinal axis to fit within an outer, hollow, pen-shaped housing.

Abstract: An apparatus for increasing the number of electrical I/O ports on an existing computer system chassis, while maintaining the RF shield of the chassis and without changing the design of the existing chassis, by the use of an I/O expansion box. The I/O expansion box comprises a bottom and a cover. The bottom has a base plate with openings for cables from the computer chassis to pass therethrough and has lips at the openings. The lips extend outwardly away from the recess and are used to attach the base plate to the chassis at its I/O port openings. The cover has a top with openings therein for the attachment of electrical cable connectors that are attached to the cables from the computer chassis. The number of openings in the top of the cover are greater than the number of openings in the base plate of the bottom.

Abstract: A specially designed electronic component is surface mounted on a printed circuit board substrate member having a spaced series of electrically conductive circuitry connection portions disposed on a side surface thereof. The electronic component has a body portion with a spaced series of elongated metal lead members fixedly secured thereto and projecting outwardly therefrom. Longitudinal portions of the lead members are soldered to the circuitry connection portions. Side surface areas of these longitudinal portions are clad with a second metal material having a coefficient of thermal expansion substantially different than that of the underlying longitudinal lead member portions. During fabrication of the circuit board a solder paste material is deposited on the circuitry connection portions and the lead member longitudinal portions are placed in a closely adjacent, aligned relationship with the circuitry connection portions.

Abstract: An electronic part assembly composed of electronic parts wherein a projecting electrode formed on an electrode pad is pressed against a wiring pattern of a circuit board. A cover member a arranged so as to cover the electronic parts, and has a leg portion designed to be joined to the circuit board. A shape memory alloy member is arranged between the cover member and the electronic parts to press a reverse side surface so that electric connection between the projecting electrode and the wiring pattern can be maintained.

Abstract: The invention relates to an interconnection system between a mother card and a plurality of daughter cards provided with connectors. In order to make it possible to increase the density of interconnections between the mother card (10) and the daughter cards (20, 22, 23), additional direct connections are provided between adjacent connectors in addition to the "conventional" electrical connections provided between the connectors (40, 42) and the bases (12, 14). To do this, additional connection elements (47, 48, 50, 52) connected to conductors inside the connectors are disposed facing one another in the side faces (40b, 42a) of the connectors.

Abstract: There is provided a mounting arrangement for an integrated circuit chip carrier 7. The carrier 7 is retained in a holder 5 using the lateral forces created by the interference between leads 12 of the carrier and the walls 17 of the holder 5. A lid 6 is applied to the carrier 5 and leaf springs 3 are disposed in between. The lid 6 clips on to a circuit board 8 by virtue of barbed legs 4 and holes 11. The springs 3 urge the leads 12 against contact pads 9 on the circuit board 8.

Abstract: When resistor elements, common electrodes and individual electrodes are formed on a substrate, a disconnected portion, i.e., open portion is formed in one of the common electrodes. After the respective resistor elements are trimmed, the disconnected portion of the one common electrode is bridged by a conductor.

Abstract: A terminal board assembly for a dynamoelectric machine, adapted for supporting an overload device, comprises a body and an overload device support integral with the body and extending therefrom for cradling the overload device when the overload device is supported on the terminal board assembly. The body and the overload device support each include apparatus releasably secured in engagement with the overload device for retaining the overload device against displacement from the overload device support.

Abstract: A generally rectangular housing base or body portion has an upward-opening central cavity and mounting ears extending from each corner. A wiring board on which electronic circuit components are mounted is supported in the cavity of the base. Each end portion of the wiring board extends from the cavity between two of the mounting ears. The top of the cavity is closed by a lid to enclose the circuit components. The opposite ends of the wiring board projecting from the housing cavity are adapted for connection of different pin or stud terminal connectors so that the housing-board unit is capable of being easily joined to or arranged with other electrical parts or units.

Abstract: A semiconductor package and an electronic circuit board in which the semiconductor package is mounted on an external circuit board. The semiconductor package has a substrate assembly and a semiconductor mounted on the substrate, where the substrate assembly is composed of a thick film circuit in the form of a ceramic circuit board and a pair of thin film circuits disposed one on each of opposite surfaces of the thick film circuits. Such a substrate assembly has one surface thereof connected to, i.e. electrically contacting, the semiconductor and an opposing surface thereof adapted to be connected to an external circuit. The thin film circuits of the assembly are formed of a heat-resisting resin and a conducting material.

Abstract: Disclosed is a chip carrier including a base having terminal slots along the four sides thereof, and terminals each of which having a mounting contact inserted in either terminal slot and a connecting leg disposed out of the respective terminal contact for fastening to a printed circuit board, wherein the base comprises four straight ribs horizontally disposed along the terminal slots at an inner side to keep the connecting leg of every terminal at the same elevation. Each straight rib has grooves spaced corresponding to the terminals slots on tile same side to hold the connecting legs of the terminals in position.

Abstract: An assembly for mounting fiber optic transceivers. A front wall having a plurality of holes is provided. A plurality of mounting members are attached to the rear of the front wall and extend perpendicularly from each of the plurality of holes. The mounting members include a base, a pair of side walls and rear wall coupled to the base, and a flexible clamp member attached to the rear wall. The flexible clamp member includes a pair of short wall portions impressed at each end to provide securing dimples and an integral back wall portion to seat the fiber optic transceiver.

Abstract: The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection electrically interconnecting each assembly. The electrical interconnection formed from an elastomeric interposer having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection is disposed over the array of electronic devices so that the electrical interconnection between adjacent electronic devices.