Abstract: Disclosed is a flexible display apparatus in which a bending area bent with respect to a bending line disposed in a first direction is provided, and even when the flexible display apparatus is folded with respect to a folding line provided in a second direction intersecting the first direction, a crack does not occur. The flexible display apparatus includes a cover substrate and a display module disposed on a rear surface of the cover substrate to display an image. Also, the flexible display apparatus includes a flat part, a first bending part bent at a first curvature from a first side of the flat part with respect to a first bending line, and a folding part folded with respect to a folding line. The folding part does not overlap the first bending part.

Abstract: In one or more embodiments, a receptacle connector may include multiple springs that are configured to hold a plug connector to the receptacle connector when the plug connector is mated with the receptacle connector; a terminal; and multiple conductors disposed on the terminal in parallel side-by-side spaced apart relationship, each conductor of the multiple conductors disposed on the terminal includes a U-shaped section to give the conductor a spring property in a direction orthogonal to a longitudinal axis of the receptacle connector to contact a respective conductor of multiple conductors of the plug connector and includes a section that is configured to be soldered to a printed circuit board. In one or more embodiments, the receptacle connector may be configured to mate with the plug connector in a first position and a second position rotated one hundred and eighty degrees from the first position.

Abstract: A circuit board that includes a substrate that has an upper surface on which a circuit pattern is formed, and a lower surface to which a plurality of bus bars that are spaced apart are fixed; a placement through hole that extends through the upper surface and the lower surface and faces a bus bar of the plurality of bus bars and in which an electronic component is placed; and a terminal conductor foil that protrudes inward into the placement through hole from the lower surface and to which a terminal of the electronic component is connected.

Abstract: An electrical junction box includes: a connector housing that is to be fitted to a mating connector housing; a terminal held by a terminal holding portion provided in the connector housing; a first board connected to an end portion on an extension portion side of the terminal, the extension portion extending from the terminal holding portion toward a direction opposite to a fitting direction; a second board facing the first board; and a heat-generating component installed on the second board in the vicinity of the extension portion.

Abstract: Provided is a communication device based on a flexible circuit board communicating wirelessly. The communication device includes: a control unit configured to collectively control the communication device based on the flexible circuit board; a power supply unit configured to supply power to a configuration included in the communication device based on the flexible circuit board based on a control of the control unit; a flexible circuit board; and a plurality of antennas disposed on the flexible circuit board.

Abstract: According to one embodiment, a display device includes a substrate, a display element provided on the substrate, a driver provided on the substrate configured to drive the display element and a first wire electrically connected to the display element. The first wire includes a first bent portion projecting in a first direction and provided in a first location, and a second bent portion projecting in a direction opposite to the first direction and provided in a second location different from the first location in the first direction and a second direction crossing the first direction.

Abstract: A printed circuit board may include a controller socket, first and second sockets provided on a top surface, third and fourth sockets provided on a bottom surface, and first, second, and third branching points. The first branching point may be spaced apart from the controller socket by a first distance in a horizontal direction parallel to the top surface and may be electrically connected to the controller socket. The second branching point may be spaced apart from the first branching point by a second distance longer than the first distance and may be electrically connected to the first branching point, the first and third sockets. The third branching point may be spaced apart from the first branching point by a third distance longer than the first distance and may be electrically connected to the first branching point, the second and fourth sockets.

Abstract: Various applications of interconnect substrates in power management systems are described.

Abstract: A method of manufacturing a flexible display device includes: forming an integrated circuit chip, a flexible printed circuit board and a frontplane laminate over a driving substrate; adhering a front protective layer over the frontplane laminate and the flexible printed circuit board, such that the front protective layer is in contact with the frontplane laminate, in which the front protective layer has a first opening corresponding to the integrated circuit chip; and filling a second adhesive into the first opening and covering an upper surface, a side surface or a combination thereof of the integrated circuit chip. A flexible display device is also provided.

Abstract: A circuit board includes a flexible wiring board having a first section in one end and a second section next to the first section in a plan view; a plate-shaped reinforcing member embedded in the flexible wiring board in the first section; and a first multilayer wiring layer on a top surface of the flexible wiring board in the first section, the first multilayer wiring layer having an opening that exposes a portion of a top surface of the reinforcing member for mounting a device thereon.

Abstract: An example continuous glucose monitor includes a printed circuit board (“PCB”) having first and second outer layers and an inner layer; a semiconductor package having a plurality of pins coupled to the first outer layer of the PCB; an electrical contact formed on the second outer layer of the PCB; a trace having a first portion disposed on the first outer layer, a second portion disposed on the inner layer, and a third portion disposed on the second outer layer, the trace having a first end coupled to a first pin of the plurality of pins and a second end coupled to the electrical contact; and an encapsulant disposed around a perimeter of the semiconductor package, the encapsulant covering the plurality of pins, the first portion of the sensor trace, the third portion of the sensor trace, wherein an upper surface of the semiconductor package remains exposed.

Abstract: Devices and method related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.

Abstract: An image display apparatus including a rollable display; a drive unit configured to roll up or roll down the rollable display; and a controller configured to in response to a first display command to display a first type of content, control the drive unit to roll up the rollable display to a first size based on the first type of the content, and in response to a second display command to display a second type of content, control the drive unit to roll up the rollable display to a second size based on the second type of the content.

Abstract: Systems and methods for fine pitch component placement on printed circuit boards are described. In one embodiment, a printed circuit board includes multiple vias and multiple of electrically conductive pads. The multiple vias include at least a first via and a second via. The multiple electrically conductive pads include a first pad and a second pad. The first pad and/or the second pad may include an electrically conductive material such as copper, silver, gold, or another conductive material. In some cases, the first pad and the second pad each have a reduced width portion positioned between and spaced apart from the first via and the second via.

Abstract: A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board has a signal conductor pattern and a resonance portion resonating with a plurality of resonance frequencies. The resonance portion has a plurality of conductor patterns aligned while separated each other to oppose to the ground conductor pattern through an insulating layer. The plurality of conductor patterns are arranged so as to oppose to the ground conductor pattern which is connected to a ground terminal of the semiconductor package. The resonance portion has a connecting conductor connecting the conductor patterns adjacent to each other. The resonance portion has a via conductor connecting the conductor pattern with the signal conductor pattern. The printed circuit board can reduce an exclusive region of the resonance portion interrupting a plurality of harmonic components, and can reduce EMI originating in a digital signal.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.

Abstract: A cooling system is provided with a plurality of layered assemblies for simultaneously cooling both a power module and a vehicle motor. A first layer, a second layer, and a third layer each define upper and lower opposing major surfaces, and are positioned in a stacked arrangement and configured to provide a flow of coolant fluid from a fluid inlet, defined in the third layer, through an inner region of the second layer, and to a heat sink feature disposed in the first layer. The coolant fluid is then directed back through an outer region of the second layer and to a fluid outlet defined in the third layer. The first layer is in thermal communication with one of the power module and the vehicle motor; the third layer is in thermal communication with the other of the power module and the vehicle motor.

Abstract: A circuit assembly for a power converter includes a substrate, power stage integrated circuit (IC) dies, and output inductors that connect switch nodes of the power stage IC dies to an output node of the power converter. The power stage IC dies are mounted on one side of the substrate and the output inductors are mounted on an opposing side of the substrate. Two output inductors go through a magnetic core. A heatsink is attached to surfaces of the power stage IC dies. A power stage IC die has a pair of switching transistors, and a switch node formed by the switching transistors is connected by an output inductor to the output node of the power converter.

Abstract: Disclosed herein is a rotor for a wound-rotor motor. The rotor for a wound-rotor motor includes: a rotor core including a hollow formed in a central portion thereof and coupled to a shaft; a teeth portion radially formed on an outer side surface of the rotor; and a pole shoe formed to extend from an end portion of the teeth portion in one direction and including a part of a cross section of an outer side surface formed in an arc shape of a first imaginary circle (C1) having a first radius (r1) which is a distance from a central point (CP1) of the hollow to an outermost position (P1) thereof.

Abstract: A display device according to an exemplary embodiment includes a display panel including a bending portion, and a folding unit supporting the display panel, the display device being capable of being in-folded and out-folded. The folding unit includes: a first supporting plate including a first supporting portion; a second supporting plate including a second supporting portion spaced apart from the first supporting portion; a first elastic member including a first wing portion protruded from the first supporting portion; and a second elastic member including a second wing portion protruded from the second supporting portion. The bending portion includes a first portion attached to the first wing portion and a second portion attached to the second wing portion.