Abstract: The present invention provides various embodiments for apparatuses, systems, and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices comprising a casing with a first and second surface and at least one side surface. A recess is formed in the first surface and extends into the casing. plurality of leads is partially encased by the casing, and one or more electronic devices are coupled with at least one of the plurality of leads and are at least partially exposed through the recess. A heat sink may be included for heat dissipation.

Abstract: The present disclosure provides a shutter system (150) for a cradle (100) of a rack out circuit breaker, which includes two rail assemblies (200, 300), a shutter (400) and a cam actuator (280). A first of the rail assemblies is configured to snap into an interior surface of one of the side walls (102, 104) of a cradle, and a second of the rail assemblies is configured to snap into an interi- or surface of an opposing side wall of the cradle. Each rail assembly includes a snap-in lock assembly and a slider movable between a front and back of the cradle along a corresponding side wall.

Abstract: A display apparatus includes a display panel, and a heat-radiating sheet located on a non-display surface of the display panel, wherein the heat-radiating sheet includes a first heat-radiating sheet in a central portion of the display panel, and a second heat-radiating sheet in edge portions of the display panel, and locations (heights) of the first heat-radiating sheet and the second heat-radiating sheet in a vertical direction are different from each other.

Abstract: The present invention discloses a fluid cooling assembly which facilitates turbulent flow inside the assembly so as to achieve better heat dissipating effect. The cooling assembly comprises an enclosed chamber with an inlet and an outlet for fluid to pass through; together with a heat spreader; a plurality of micropillars and a plurality of heat dissipating fins installed inside the assembly. When fluid flows through the chamber, these elements in combination are adapted to create an enhanced turbulent flow upon the fluid so as to effectively dissipate heat from said heat spreader through the fluid.

Abstract: Embodiments of the present invention are directed to providing a time delay to a shortened trace in a differential microstrip trace pair. By adding back metal to a ground plane associated with a DC blocking capacitor, a time delay can be added to the shortened trace. The cutout associated with the longer trace remains unaltered. In a further embodiment, both cutouts can be modified with the addition of metal, with the cutout associated with the shorter trace receiving more metal than the other cutout. In a further embodiment of the present invention, a cutout associated with a connector can be modified to add back metal in the cutout. The cutout associated with the shorter trace is modified while the other cutout is left unchanged.

Abstract: A protective cover for a portable computing device includes a first hardshell component, a second hardshell component, and a hinging element. The first hardshell component removably snaps onto a first portion of the portable computing device to protect the first portion of the portable computing device. The second hardshell component removably snaps onto a second portion of the portable computing device to protect the second portion of the portable computing device. The hinging element comprises a flexible material and is attached to the first hardshell component and the second hardshell component such that the hinging element of the protective cover aligns with the hinging structure of the portable computing device. The hinging element flexes to allow the second portion of the portable computing device to remain articulable relative to the first portion of the portable computing device when the protective cover is installed on the portable computing device.

Abstract: A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts. The loading member is operable to be secured to the board by moving the first securing member into engagement with the second base member and moving the second securing member into engagement with the first base member.

Abstract: An enclosed switchboard includes: a device containing board which contains main circuit devices such as circuit breakers; and a cable connection board which is arranged side by side adjacently to the device containing board, and contains cables that input and output electric power to/from the main circuit devices. In the enclosed switchboard, the cable connection board is configured by one housing; and the inside of the housing is divided into two by a partition plate to be comparted to a cable lead-in compartment which contains lead-in side cables and a cable lead-out compartment which contains lead-out side cables.

Abstract: An electronics module comprising a box including at least one pair of slideways to define a housing for receiving an electronics card, the slideways being fastened to two opposite faces of the box that are provided with ventilation means arranged to establish a flow of a total stream of air between the two faces. According to the invention, the electronics module includes at least one screen arranged in the housing between one of the slideways and the associated electronics card in order to define a passage for an individual stream of air in the housing.

Abstract: This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.

Abstract: A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device.

Abstract: Thermoelectric-enhanced, rack-level cooling of airflow entering an electronics rack is provided by a cooling apparatus, which includes: an air-to-liquid heat exchanger; a coolant loop coupled to the heat exchanger, the coolant loop including a first loop portion and a second loop portion, where the heat exchanger exhausts heated coolant to the first loop portion and receives cooled coolant from the second loop portion. The cooling apparatus further includes a heat rejection unit and a thermoelectric heat pump(s). The heat rejection unit is coupled to the coolant loop between the first and second loop portions, and provides partially-cooled coolant to the second loop portion. The thermoelectric heat pump is disposed with the first and second loop portions coupled to opposite sides to transfer heat from the partially-cooled coolant within the second loop portion to provide the cooled coolant before entering the air-to-liquid heat exchanger.

Abstract: A panel structure of a power apparatus is provided. The power apparatus includes a case. The front of the case is longitudinally provided with a panel. The panel is transversely formed with at least two parallel heat dissipation holes. The panel is formed with a connecting portion between the heat dissipation holes. A heat dissipation net is provided on the heat dissipation holes. The heat dissipation net is formed with a plurality of openings corresponding to the connecting portion. A reinforcement rib is provided on the connecting portion, preventing the panel from collapsing or deforming. The durability of the panel is increased, and the appearance of the panel is pleasing to the eye.

Abstract: A switch assembly and method of using same comprises a switch assembly for operating a power take off unit on a lawn tractor, the switch assembly further includes a housing supporting a selectively locatable activation knob facilitated by an actuation assembly and an internal switch arrangement coupled to a printed circuit board within the housing. The internal switch arrangement comprises a microcontroller and switch for determining the relative position of the selectively locatable activation knob and provides a digital output signal for enabling or disabling a power take off unit based on the digital output signal.

Abstract: A touch-safe bus connection device includes a bus extension (160, 260, 360), a non-conductive housing (110, 210, 310), a moveable electrical contact (150, 250, 350) and a moveable non-conductive cover (140, 240, 340). The contact is arranged in the housing, and is moved to connect or disconnect the extension and a stab of an electrical panel across a gap (192, 292, 392). The cover is concurrently and automatically moved to uncover or cover an opening (116, 216, 316) of the housing to allow or restrict, respectively, access to the extension. The contact and cover are concurrently and automatically moveable between a position at which the contact bridges the gap to connect the extension and the stab and the opening of the housing is covered by the cover, and another position at which the extension and the stab are disconnected across the gap and the opening of the housing is uncovered.

Abstract: A receptacle assembly includes a cage having an interior cavity that includes a port. The cage has a front end that is open to the port. The port is configured to receive a pluggable module therein through the front end of the cage. The cage includes a spring. A heat spreader includes a body having a cage segment that is configured to be mounted to the cage such that the cage segment extends over at least a portion of the cage with a module side of the cage segment facing the port. The body includes an extension segment that extends from the cage segment in a direction generally away from the cage. The extension segment is configured to be engaged in thermal communication with a heat exchanger. The spring is configured to engage the pluggable module when the pluggable module is received within the port such that the spring is configured to press the pluggable module in thermal communication with the module side of the cage segment of the heat spreader.

Abstract: According to various embodiments, a computer system may be provided. The computer system may include: a housing with a protrusion; a heat generating device; a heat exchanger; and a heat pipe configured to transfer heat from a first end of the heat pipe to a second end of the heat pipe. The first end of the heat pipe may be coupled to the heat generating device. The second end of the heat pipe may be coupled to the heat exchanger. The second end of the heat pipe may be arranged in the protrusion of the housing.

Abstract: Micro-hole vents for device ventilation systems are described herein that may be formed as a plurality of micro-holes that are invisible to unaided human eyes. The micro-holes are configured to blend into the housing for a computing device such that the holes are substantially concealed from users of the computing device. A micro-hole vent may be aligned with a blower for a ventilation system to enable air intake through the corresponding micro-holes for cooling of components within the housing. In addition or alternatively, one or more exhaust vents for the ventilation system may also be configured as micro-hole vents. Each micro-hole vent may have many, very small holes for sufficient air flow. For example, micro-holes having diameters of about fifty to two hundred microns may be arranged in a pattern with a coverage in a range of about twelve thousand to fifty thousand holes per square inch.

Abstract: An electronic circuit, comprising at least three circuit boards (2.1, 2.2, 2.3) fastened at a frame (1) and electrically connected via contact pins (7) arranged therein, and an electric connection (11), connected to a third of the circuit boards (2.1). The circuit shall show a low structural space and here be cost-effective in its production and assembly. The circuit boards (2.1, 2.2, 2.3) are arranged in levels parallel in reference to each other and are fastened at a predetermined mutual distance at the frame (1), with bases (4, 5, 6) being embodied at the faces of the frame (1), with the ends being parallel to the faces of at least two of the bases (4, 5, 6) in one level, arranged in groups, and with the embodiment of the frame (1) and the circuit boards (2.1, 2.2, 2.3) being adjusted to each other.

Abstract: A wiring board includes a heat dissipation plate, a heat-conductive adhesive layer, an insulating layer, a thermal via, a heat dissipation metal terminal, and electrodes. The heat-conductive adhesive layer is disposed on the heat dissipation plate. The insulating layer is disposed on the heat-conductive adhesive layer. The insulating layer is formed with an opening portion. The thermal via is disposed in the opening portion of the insulating layer. The heat dissipation metal terminal is disposed on the thermal via and electrically connected to the heat dissipation plate. The electrodes are disposed on the insulating layer. The electrodes are to be connected to an electronic component.