Patents Examined by Zachary M. Pape
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Patent number: 9655271Abstract: A motor drive comprises a power sub-assembly and a control sub-assembly. The control sub-assembly includes components that may be accessed within the sub-assembly housing during installation and maintenance of the drive. A main circuit board is configured to define a high voltage region and a low voltage region. The high voltage region is isolated by an interior barrier of the housing so that the components can be conveniently accessed. An operator interface is provided in the control sub-assembly. An interface circuit board is also isolated by the barrier. Desired spacing between the interface circuit board and a surface of the interface is provided by integrally molded spring structures and plungers that interface with underlying switches.Type: GrantFiled: October 14, 2013Date of Patent: May 16, 2017
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Patent number: 9655288Abstract: An electronic device includes a heat-dissipating base, a first printed wiring board assembly, and a second printed wiring board assembly. The first printed wiring board assembly is disposed on the heat-dissipating base. The first printed wiring board assembly includes a first printed wiring board and at least one first electronic component. The first electronic component is disposed on the first printed wiring board, such that the first printed wiring board assembly has a raised portion and a concave portion relative to the raised portion. The second printed wiring board assembly is at least partially disposed in the concave portion.Type: GrantFiled: November 21, 2014Date of Patent: May 16, 2017Assignee: Delta Electronics (Shanghai) Co., Ltd.Inventors: Pei-Ai You, Xing-Xian Lu, Gang Liu, Jin-Fa Zhang
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Patent number: 9646942Abstract: The mechanisms for forming bumps on packaged dies and package substrates reduce variation of bump heights across the packaged dies and packaged substrates. Bumps are designed to have different widths to counter the higher plating current near edge(s) of dies or substrates. Bump sizes can be divided into different zones depending on the bump patterns and densities across the packaged die and/or substrates. Smaller bumps near edges reduce the thickness of plated film(s), which would have been thicker due to being near the edges. As a result, the bump heights across the packaged dies and/or substrates can be kept significantly constant and chip package can be properly formed.Type: GrantFiled: February 23, 2012Date of Patent: May 9, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jing-Cheng Lin, Po-Hao Tsai
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Patent number: 9648792Abstract: An arm assembly is provided. The arm assembly includes a heat exchanger assembly, a plurality of electrical components thermally coupled to the heat exchanger assembly, and a number of electrical buses. Each electrical component is coupled to, and in electrical communication with, one electrical bus. A sealing compound is then applied to each electrical bus and to a limited number of the electrical components.Type: GrantFiled: July 14, 2015Date of Patent: May 9, 2017Assignee: EATON CORPORATIONInventors: Jonathan Crouch, Wesley Byron Johnson, Irving Gibbs, Ron Schueneman
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Patent number: 9639127Abstract: A heat dissipating apparatus and an electronic device having the same are provided. The electronic device includes a body, an internal circuit board provided in the body and including at least one heat generating element, and a heat diffusion type heat dissipating module provided in the body and stacked on a surface of the internal circuit board, so as to diffuse heat generated by the heat generating element toward a low temperature region having a temperature lower than a temperature of the at least one heat generating unit. The heat diffusion type heat dissipating module has a sheet shape which extends from the heat generating element toward a circumference surface of an inside of the body so that the heat is transferred from the heat generating element to the low temperature region.Type: GrantFiled: March 24, 2015Date of Patent: May 2, 2017Assignee: Samsung Electronics Co., Ltd.Inventor: Hae-Soo Kim
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Patent number: 9634468Abstract: A switchgear cabinet comprising a cabinet frame, first and second current converter devices, and an electrical connection clamping device. The first current converter device has first DC voltage positive and negative potential connection elements. The second current converter device has second DC voltage positive and negative potential connection elements. The electrical connection clamping device has an electrically conductive first clamping element and an electrically conductive second clamping element which is electrically insulated from the electrically conductive first clamping element, and a pressure-generating device which generates a pressure that pushes the second clamping element towards the first clamping element. The first clamping element is mechanically connected to the cabinet frame by an electrically non-conductive insulation body such that the first clamping element is electrically insulated from the cabinet frame.Type: GrantFiled: August 22, 2015Date of Patent: April 25, 2017Assignee: Semikron Elekronik GmbH & Co., KGInventors: Aurélien Gaumon, Yann Lissilour, Sébastien Touzard
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Patent number: 9635781Abstract: A heat dissipating device for dissipating the heat produced by a heating element is disclosed. The heat dissipating device includes a fixing assembly, two moving assemblies and an elastic assembly. The fixing assembly has a thermal conductive member. Each moving assembly has a mass body and is relatively moveable with respect to the fixing assembly. The two moving assemblies are disposed on two opposite sides of the fixing assembly, respectively, and each moving assembly forms a moving space with respect to the fixing assembly. The elastic assembly connects the fixing assembly to the two moving assemblies.Type: GrantFiled: August 19, 2014Date of Patent: April 25, 2017Assignee: DELTA ELECTRONICS, INC.Inventors: Chao-Wen Lu, Chun-Chih Wang, Ding-Wei Chiu
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Patent number: 9629286Abstract: Thermoelectric-enhanced, rack-level cooling of airflow entering an electronics rack is provided by a cooling apparatus, which includes: an air-to-liquid heat exchanger; a coolant loop coupled to the heat exchanger, the coolant loop including a first loop portion and a second loop portion, where the heat exchanger exhausts heated coolant to the first loop portion and receives cooled coolant from the second loop portion. The cooling apparatus further includes a heat rejection unit and a thermoelectric heat pump(s). The heat rejection unit is coupled to the coolant loop between the first and second loop portions, and provides partially-cooled coolant to the second loop portion. The thermoelectric heat pump is disposed with the first and second loop portions coupled to opposite sides to transfer heat from the partially-cooled coolant within the second loop portion to provide the cooled coolant before entering the air-to-liquid heat exchanger.Type: GrantFiled: September 30, 2015Date of Patent: April 18, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons
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Patent number: 9628148Abstract: An electronic device with modulization parts includes a first main body, a first wireless transmission port having a first circuit board and a first induction pad, a second main body detachably coupled to the first main body, and a second wireless transmission port having a second circuit board, a second induction pad, an induction cap and an elastic conductive member electrically conducted to the second induction pad and the induction cap. The first circuit board is disposed on the first main body. The first induction pad is electrically connected to the first circuit board. The second circuit board is disposed on the second main body. The elastic conductive member physically supports the induction cap so that the first induction pad induces the second induction pad through the induction cap.Type: GrantFiled: September 21, 2015Date of Patent: April 18, 2017Assignee: QUANTA COMPUTER INC.Inventors: Sheng-An Tsai, Lu-Lung Tsao, Yu-Yen Lin
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Patent number: 9627865Abstract: The invention relates to a transmission station for feeding locally provided electrical energy, in particular provided by one or more wind power installations, into a grid. According to the invention, it is proposed for a housing of the transmission station to feature a first, accessible room and a second room that is connected to the outside world by means of an exhaust pipe, with such first room and second room being connected to each other by means of a joint recess, with such control unit closing the joint recess, and with one casing of the control unit being open in the area where the recess is closed and/or showing a predetermined breaking point that is adapted to fail if an electric arc occurs inside the control unit.Type: GrantFiled: November 19, 2013Date of Patent: April 18, 2017Assignee: Wobben Properties GmbHInventors: Holger van Dyk, Heinz Flessner
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Patent number: 9625748Abstract: Provided is a display device capable of reducing a bezel space. The display device includes: a display panel; a lower chassis receiving the display panel; and a metal line fixed to one edge of the display panel and the lower chassis.Type: GrantFiled: May 7, 2014Date of Patent: April 18, 2017Assignee: Samsung Display Co., Ltd.Inventors: Chung Hui Lee, Seung-Won Kuk, Jee Su Park
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Patent number: 9629232Abstract: Thermally actuated printed circuit board (PCB) retainer assemblies that utilize at least one thermally actuated element to secure a received PCB to a heat sink in accordance with embodiments of the invention are disclosed. In one embodiment, a thermally actuated PCB retainer assembly includes a heat sink having an elongated groove configured to receive a PCB and a PCB retainer that includes a pair of complementary elongated bodies each having a first elongated face and a second elongated face where the second elongated faces of the elongated bodies are disposed in a cooperative sliding relation and at least one thermally actuated element in contact with at least one of the elongated bodies such that the thermally actuated element applies a force on the at least one elongated body in response to temperature changes such that the elongated bodies move in the cooperative sliding relation.Type: GrantFiled: May 17, 2013Date of Patent: April 18, 2017Assignee: The Regents of the University of CaliforniaInventors: Sean Reilly, Jacob Supowit, Michael J. Stubblebine
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Patent number: 9627873Abstract: A customizable bus system includes a system module containing one or more accessory modules and is easily mounted along a surface in a workspace, such as the underside of a cabinet. The accessory modules provide conveniently located utility services and applications such as power, lighting or media connections, and may be interchanged within the bus system to provide particular services and applications where they are needed most. Additionally, the bus system may include a control center for controlling the operation of one or more of the accessory modules, such as manually or automatically. The bus system may also include multiple housings that are functionally linked. Additionally, the housings may be integrated with the applications and take the form of a modular stick, which can be easily installed to provide a service or application in an area, or removed and replaced by a modular stick having another desired service or application.Type: GrantFiled: January 3, 2014Date of Patent: April 18, 2017Assignee: The Wiremold CompanyInventors: Mark Makwinski, Phillip D. Prestigomo, Jennifer Linnane, Nicholas R. Partridge, Raymond Szekretar, Jan Schminke
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Patent number: 9620939Abstract: Hybrid gas circuit breakers comprising a main breaker tank having an interrupter assembly positioned therein, bushing support nozzles laterally extending from the breaker tank, disconnect switches coupled to and extending generally upwardly or vertically from the bushing support nozzles, and bushings assembled to the disconnect switches. In addition, bushing current transformers (BCTs) are assembled on the bushing support nozzles adjacent the breaker tank instead. The lateral positioning of components results in a low assembled height permitting shipping of a fully assembled and tested unit for voltage ratings up to and including 362 kV.Type: GrantFiled: June 15, 2015Date of Patent: April 11, 2017Assignee: MITSUBISHI ELECTRIC POWER PRODUCTS, INC.Inventors: Russell N. Yeckley, Dennis J. Matuszak
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Patent number: 9622386Abstract: A bracket for cooling a peripheral component interconnect card is disclosed. The bracket includes a plurality of heat transfer surfaces, mounting systems for a blower fan, fan shroud and liquid cooling system for cooling the peripheral component interconnect card.Type: GrantFiled: June 2, 2015Date of Patent: April 11, 2017Assignee: CORSAIR MEMORY, INC.Inventor: Robert Michael Kinstle, III
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Patent number: 9618968Abstract: Mobile computing devices that include an exterior housing and a port. The housing is configured to form a guide portion of the port. More particularly, the port includes a cavity formed in the housing. The cavity includes interior walls that extend inward from an exterior wall of the housing. The port further includes a connector that is positioned in the cavity. The connector is positioned such that the walls of the cavity form the guide of the connector. The port is further constructed to prevent the ingress of water and/or debris into an interior of the housing.Type: GrantFiled: October 31, 2013Date of Patent: April 11, 2017Assignees: Sony Corporation, Sony Mobile Communications Inc.Inventor: Olof Simonsson
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Patent number: 9620938Abstract: A switchboard applied with a bushing-type current transformer includes a terminal bushing inserted from a front direction, a switchboard terminal coupled to the terminal bushing, a metering current transformer bushing inserted from a front direction and inserted into the terminal bushing while wrapping the switchboard terminal, and a metering current transformer disposed outside the metering current transformer bushing and assembled or disassembled at a front surface through a circuit breaker chamber. Thus, the switchboard applied with a bushing-type current transformer has an advantage of having a high degree of internal space utilization or capable of being made to be compact.Type: GrantFiled: June 18, 2015Date of Patent: April 11, 2017Assignee: LSIS CO., LTD.Inventors: Seung Pil Yang, Kil Young Ahn, Dae Soo Han, Seung Hwan Mun, Jong Doo Kim
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Techniques and apparatus for controlling the temperature of a personal communication structure (PCS)
Patent number: 9622392Abstract: Techniques for operating a personal communication structure (PCS) are described. In particular, a temperature control system for controlling the temperature of a PCS is described. The temperature control system may include a ribbed heat sink and first and second air circulation controllers. The heat sink may be coupled to the PCS's frame, adjacent to the back surface of a housing for a display module. The first air circulation controller may be configured to recirculate air in a cavity within the display module's housing. The second air circulation controller may be configured to move ambient air across the heat sink.Type: GrantFiled: September 17, 2015Date of Patent: April 11, 2017Assignee: Civiq Smartscapes, LLCInventors: Kyle R. Bowers, Benjamin P. Lee, Parag N. Shah, Kenneth J. Gray, Benjamin M. Lawler -
Patent number: 9620940Abstract: A switchgear includes a circuit breaker housing defining a circuit breaker compartment. A bushing has first and second portions and extends through an opening in a rear wall of the housing so that the first portion is disposed in the circuit breaker compartment and the second portion is disposed beyond the exterior of the rear wall and external of the circuit breaker compartment. The bushing has a hollow primary contact. A current transformer is mounted on the second portion of the bushing. A fastener structure has a portion that extends through the hollow primary contact. The fastener structure couples the primary contact to a busbar in a removable manner. When the fastener structure is decoupled from the primary contact, the bushing and the at least one current transform can be accessed from the front of the housing and moved through the opening in the rear wall, for maintenance.Type: GrantFiled: January 5, 2015Date of Patent: April 11, 2017Assignee: ABB SCHWEIZ AGInventor: Stefano Motta
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Patent number: 9622383Abstract: A heat radiation structure for an electric device includes: at least one multi-layer substrate including a plurality of base parts made of insulation material and a conductor pattern, which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion in the base parts; the electric device having at least one of a first electric element built in the at least one multi-layer substrate and a second electric element, which is not built in the multi-layer substrate; and a low heat resistance element opposed to the electric device. The low heat resistance element has a heat resistance lower than the insulation material.Type: GrantFiled: January 29, 2014Date of Patent: April 11, 2017Assignee: DENSO CORPORATIONInventors: Takahiro Yamanaka, Yoshimichi Hara, Toshihisa Yamamoto, Kouji Kameyama, Yuuji Kobayashi