Abstract: An electrical receptacle connector provided to connect with an electrical plug connector. The electrical receptacle connector includes a metal shell, an insulation body and a the conductive contact members. The conductive contact members are disposed at the insulation body to connect with the metal shell. The electrical plug connector includes a metal shell and a tubular portion disposed at a front portion of the metal shell. When the electrical plug connector is plugged into the electrical receptacle connector, the surface of the tubular portion of the electrical plug connector is in contact with the conductive contact members.

Abstract: An electrical receptacle connector, provided to connect with an electrical plug connector, includes a metal shell, an insulation housing and a conductive piece. The conductive piece is disposed at a tongue portion of the insulation housing and includes a contact portion, two laterally soldering portions and an abutting portion. The contact portion is disposed at a rear contact region of the tongue portion, the two laterally soldering portions are respectively extending from two sides of the contact portion, and the abutting portion is extending from the contact portion to attach on a base portion of the insulation ho thus abutting against an inner wall of the metal shell.

Abstract: Methods and systems that include receiving a plurality of reflectivity measurements on a semiconductor wafer. A reflectivity map is generated based on the received plurality of reflectivity measurements. The generated reflectivity map is used to determine a process parameter of an epitaxial growth process using the reflectivity map. In an embodiment, the process parameter is a power setting (heating) of a lamp of a CVD epitaxy tool.

Abstract: A clock generator is provided. The clock generator includes a crystal oscillator, an inverter coupled to the crystal oscillator in parallel, a first circuit and a second circuit. The crystal oscillator has a first terminal and a second terminal. The inverter generates a first signal and a second signal at the first and second terminals of the crystal oscillator, respectively. The first circuit coupled to the first terminal of the crystal oscillator generates a first clock signal with a constant frequency according to the first signal. The second circuit coupled to the second terminal of the crystal oscillator generates a second clock signal with a variable frequency according to the second signal.

Abstract: An electrical connector plug has resilient contact terminals for electrical connection to an electrical connector socket. The electrical connector plug has an electrically conductive housing, and a dielectric shell and resilient contact terminals are mounted in the electrically conductive housing. The dielectric shell has a base portion and a front edge portion extending from the base portion. Two groups of resilient contact terminals are mounted on the dielectric shell and axially symmetrical to each other in the longitudinal direction, with each of the resilient contact terminals having a flat section and an upwardly protruding contact section. A metallic shield frame surrounds the front edge portion and is electrically connected to the electrically conductive housing, with the metallic shield frame having a front section and two lateral protective sections. The lateral protective sections have a height no less than that of the upwardly protruding contact sections.

Abstract: An electrical connector plug having resilient contact terminals electrically connects to an electrical connector socket with a casing and two groups of engaging terminals mounted on or in the casing. The electrical connector plug has an electrically conductive housing. A coupling device extends in a longitudinal direction and has a base portion. Two groups of resilient contact terminals are mounted in the coupling device axially symmetrically arranged with each other in the longitudinal direction, each of which has a flat section and an upwardly protruding contact section. A metallic shield frame is electrically connected to and secured to the electrically conductive housing, having a frame section, a front section, and two lateral protective sections. An electrically conductive section extends from the frame section towards the front section for electrical connection to the casing of the electrical connector socket.

Abstract: A method of fabricating a high voltage device includes the step of forming a patterned photoresist layer on a conductive layer and a dielectric below the conductive. The conductive layer and the dielectric layer are patterned by taking the patterned photoresist layer as a mask. Subsequently the patterned photoresist layer is shrunk. The conductive layer and the dielectric layer are then patterned by taking the shrunk photoresist layer as a mask.

Abstract: An electrical connector assembly includes an electrical receptacle connector and an electrical plug connector. The electrical receptacle connector includes a first insulation housing, upper-row plate terminals, and lower-row plate terminals. The first insulation housing includes a first base portion and a tongue portion extending from one side of the base portion. The upper-row plate terminals and the lower-row plate terminals are at an upper surface and a lower surface of the tongue portion, respectively. The electrical plug connector includes a second insulation housing, upper-row elastic terminals, and lower-row elastic terminals. The second insulation housing includes a second base portion, an upper member, a lower member, and a mating room between the upper member and the lower member for receiving the tongue portion. The upper-row elastic terminals and the lower-row elastic terminals are respectively above and below the mating room.

Abstract: An epitaxial structure of light emitting diode with a current modulation layer, and more specifically, a high-resistivity material is injected to change the current conduction path, and implementation of the main structure is to grow a high-resistivity material (e.g., InxAlyGa1-x-yN) over the N-type conductive layer or the P-type conductive layer till part of current conduction path is exposed through high-temperature H2 in-situ etching in the reacting furnace and to grow the N-type or the P-type conductive layer for coverage. This design for forming a current modulation layer without second epitaxial growth provides the injected current with a better spreading path in the N-type conductive layer and the P-type conductive layer, which more effectively and uniformly injects the current to the active layer and improves luminous efficiency.

Abstract: An electrical receptacle connector includes a metal shell, an insulation housing, upper-row plate terminals, and lower-row plate terminals. The metal shell defines a receptacle cavity to receive the insulation housing. The insulation housing includes a base portion and a tongue portion extending from one side of the base portion. The tongue portion includes an upper surface and a lower surface. The upper-row plate terminals are held on the base portion and tongue portion and include upper-row contact segments at the upper surface for transmitting first signals. The lower-row plate terminals are held on the base portion and tongue portion and include lower-row contact segments at the lower surface for transmitting second signals. The upper-row plate terminals and the lower-row plate terminals are point-symmetrical with a central point of the receptacle cavity as the symmetrical center.

Abstract: An electrical plug connector includes a metal shell, an insulation housing, upper-row elastic terminals, and lower-row elastic terminals. The metal shell defines a receiving cavity to receive the insulation housing. The insulation housing includes an upper member, a lower member, and a mating room between the upper member and the lower member. The upper-row elastic terminals are held on a lower surface of the upper member and include upper-row elastic contact segments extending toward the mating room for transmitting first signals. The lower-row elastic terminals are held on an upper surface of the lower member and include lower-row elastic contact segments extending toward the mating room for transmitting second signals.

Abstract: A stress memorization process including the following step is provided. A gate is formed on a substrate. A low-k dielectric layer with a dielectric constant lower than 3 is formed to entirely cover the gate and the substrate. A stress layer is formed to entirely cover the low-k dielectric layer. The stress layer and the low-k dielectric layer are removed. Moreover, a semiconductor structure including a contact etch stop layer is provided. A gate is disposed on a substrate. A porous layer entirely covers the gate and the substrate. A contact etch stop layer entirely covers the porous layer, wherein the thickness of the porous layer is thinner than the thickness of the contact etch stop layer.

Abstract: The invention provides an ultrasonic nebulizer comprising a circuit unit, a nebulization module, and a frequency sweeping unit. The invention utilizes the technique of maintaining constant electric power in the nebulization module of the ultrasonic nebulizer by automatic compensation of electric power consumption and/or current consumption. Using such a technique, the invention allows a fixed current consumption and electric power consumption of a nebulization module of an ultrasonic nebulizer by auto compensation, thereby improving nebulization performance.

Abstract: A semiconductor optoelectronic structure with increased light extraction efficiency, includes a substrate; a buffer layer is formed on the substrate and includes a pattern having plural grooves formed adjacent to the substrate; a semiconductor layer is formed on the buffer layer and includes an n-type conductive layer formed on the buffer layer, an active layer formed on the n-type conductive layer, and a p-type conductive layer formed on the active layer; a transparent electrically conductive layer is formed on the semiconductor layer; a p-type electrode is formed on the transparent electrically conductive layer; and an n-type electrode is formed on the n-type conductive layer.

Abstract: An apparatus comprises a plasma flood gun for neutralizing a positive charge buildup on a semiconductor wafer during a process of ion implantation using an ion beam. The plasma flood gun comprises more than two arc chambers, wherein each arc chamber is configured to generate and release electrons into the ion beam in a respective zone adjacent to the semiconductor wafer.

Abstract: An accessory suitable for an electronic device is provided. The electronic device has a display area. The accessory includes a coupling portion and a cover portion. The coupling portion is suitable to be coupled to the electronic device. The cover portion is connected to the coupling portion and is suitable for covering the display area of the electronic device. The cover portion has a plurality of light-transmitting areas, and the light-transmitting areas are arranged on the display area in an array. An image generated by the display area is projected out of the cover portion through the light-transmitting areas. Moreover, an electronic assembly containing the electronic device and the accessory is also provided. Furthermore, a controlling method is also provided for controlling the electronic assembly.

Abstract: A method for preparing a precursor used to label hepatocyte receptors is revealed. The precursor contains a bifunctional structure including trisaccharide and DTPA ligand. During synthesis processes of the precursor, silica gel columns and Reverse phase-18 (RP-18) columns are used for purification. Thus both the purification times and cost of each purification are reduced. Moreover, use diethyl ether to facilitate precipitation of products and remove a part of coupling reagent. Removing the coupling reagent helps purification of products. Furthermore, N?,N?-bis(carboxymethyl)-L-lysine hydrate and benzyl chloroformate are coupled to form a trisaccharide skeleton so as to ensure the yield rate of trisaccharide structure.

Abstract: A dispensing method is disclosed that includes the following steps: a cleaning sleeve is provided to surround a spray member. A first fluid is previously dispensed from a first fluid outlet of the spray member. A second fluid is sprayed from a second fluid outlet of the cleaning sleeve to clean the spray member. The cleaning sleeve is opened or slid away from the spray member, such that the first fluid outlet of the spray member is exposed to a substrate. The first fluid is dispensed from the first fluid outlet of the spray member to the substrate.

Abstract: An integrated system operation method is disclosed that includes the following steps: the film of a substrate is measured by a metrology apparatus to obtain a film information. The substrate is moved from the metrology apparatus to a process apparatus adjacent to the transfer apparatus. The film information is sent to the process apparatus. A film treatment is applied to the substrate in accordance with the film information.

Abstract: A data distributing and accessing method for sharing a file via a network system includes steps of: dividing the file into a plurality of blocks; distributing the blocks in a plurality of data hosts interconnected via the network system; one of the data hosts receiving a file-reading request from a user host and issuing collecting requests to other data hosts to collect the blocks from the data hosts; and transferring the collected blocks from the data hosts to the user host to be combined into the file.