Patents by Inventor Abdul Aziz
Abdul Aziz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11680329Abstract: A method for making an electrocatalyst containing manganese oxide nanoparticles present on carbon obtained from Albizia procera (MnOxNPs-C) for electrochemical water oxidation. The method includes a thermal decomposition and forms a product with specific morphological variations, including crystalline structure, elemental composition, and chemical compatibility. The manganese oxide nanoparticles are well dispersed over the carbon. The amount of manganese oxide nanoparticles increases by increasing the amount of precursor. Single-phase formation of the Mn3O4, and Mn3O4 along with MnO phase occurs at low and high amount of the precursor materials, respectively. The electrocatalyst can be used for the purpose electrolytic water splitting.Type: GrantFiled: October 1, 2019Date of Patent: June 20, 2023Assignee: KING FAHD UNIVERSITY OF PETROLEUM AND MINERALSInventors: Md. Abdul Aziz, Syed Shaheen Shah, Zain Hassan Yamani
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Patent number: 11682574Abstract: Aspects of the present disclosure relate to one or more implementations of a substrate support for a processing chamber. In one implementation, a substrate support includes a body having a center, and a support surface on the body configured to at least partially support a substrate. The substrate support includes a first angled wall that extends upward and radially outward from the support surface, and a first upper surface disposed above the support surface. The substrate support also includes a second angled wall that extends upward and radially outward from the first upper surface, the first upper surface extending between the first angled wall and the second angled wall. The substrate support also includes a second upper surface extending from the second angled wall. The second upper surface is disposed above the first upper surface.Type: GrantFiled: November 7, 2019Date of Patent: June 20, 2023Assignee: Applied Materials, Inc.Inventors: Abdul Aziz Khaja, Venkata Sharat Chandra Parimi, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Vinay K. Prabhakar
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Patent number: 11674222Abstract: The present disclosure relates to a method for in situ seasoning of process chamber components, such as electrodes. The method includes depositing a silicon oxide film over the process chamber component and converting the silicon oxide film to a silicon-carbon-containing film. The silicon-carbon-containing film forms a protective film over the process chamber components and is resistant to plasma processing and/or dry etch cleaning. The coatings has high density, good emissivity control, and reduces risk of device property drift.Type: GrantFiled: September 29, 2020Date of Patent: June 13, 2023Assignee: Applied Materials, Inc.Inventors: Sarah Michelle Bobek, Abdul Aziz Khaja, Ratsamee Limdulpaiboon, Kwangduk Douglas Lee
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Patent number: 11670492Abstract: Exemplary processing methods may include forming a plasma of a cleaning precursor in a remote region of a semiconductor processing chamber. The methods may include flowing plasma effluents of the cleaning precursor into a processing region of the semiconductor processing chamber. The methods may include contacting a substrate support with the plasma effluents for a first period of time. The methods may include lowering the substrate support from a first position to a second position while continuing to flow plasma effluents of the cleaning precursor. The methods may include cleaning the processing region of the semiconductor processing chamber for a second period of time.Type: GrantFiled: October 15, 2020Date of Patent: June 6, 2023Assignee: Applied Materials, Inc.Inventors: Fei Wu, Abdul Aziz Khaja, Sungwon Ha, Ganesh Balasubramanian, Vinay Prabhakar
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Publication number: 20230170190Abstract: Embodiments of the present disclosure generally relate to substrate supports for process chambers and RF grounding configurations for use therewith. Methods of grounding RF current are also described. A chamber body at least partially defines a process volume therein. A first electrode is disposed in the process volume. A pedestal is disposed opposite the first electrode. A second electrode is disposed in the pedestal. An RF filter is coupled to the second electrode through a conductive rod. The RF filter includes a first capacitor coupled to the conductive rod and to ground. The RF filter also includes a first inductor coupled to a feedthrough box. The feedthrough box includes a second capacitor and a second inductor coupled in series. A direct current (DC) power supply for the second electrode is coupled between the second capacitor and the second inductor.Type: ApplicationFiled: January 26, 2023Publication date: June 1, 2023Inventors: Satya THOKACHICHU, Edward P. HAMMOND, IV, Viren KALSEKAR, Zheng John YE, Abdul Aziz KHAJA, Vinay K. PRABHAKAR
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Publication number: 20230151487Abstract: The present disclosure relates to systems and methods for reducing the formation of hardware residue and minimizing secondary plasma formation during substrate processing in a process chamber. The process chamber may include a gas distribution member configured to flow a first gas into a process volume and generate a plasma therefrom. A second gas is supplied into a lower region of the process volume. Further, an exhaust port is disposed in the lower region to remove excess gases or by-products from the process volume during or after processing.Type: ApplicationFiled: January 20, 2023Publication date: May 18, 2023Inventors: Liangfa HU, Prashant Kumar KULSHRESHTHA, Anjana M. PATEL, Abdul Aziz KHAJA, Viren KALSEKAR, Vinay K. PRABHAKAR, Satya Teja Babu THOKACHICHU, Byung Seok KWON, Ratsamee LIMDULPAIBOON, Kwangduk Douglas LEE, Ganesh BALASUBRAMANIAN
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Patent number: 11639866Abstract: A pump control system for a wet test meter (WTM) is disclosed. The pump control system includes a WTM that contains packing fluid, a control module that has a DC power supply and is configured to detect a level of the packing fluid in the WTM, a pump that is configured to be controlled by the control module and is activated when the packing fluid in the WTM falls below a predetermined level, and a level sensor/detector that is located outside of the WTM, wired to the control module, and configured to monitor the packing fluid level within the WTM. When the packing fluid falls below the predetermined level as detected by the control module, the WTM is automatically filled by pumping packing fluid from a storage tank using the pump, until the packing fluid level reaches above the predetermined level.Type: GrantFiled: February 19, 2021Date of Patent: May 2, 2023Assignee: SAUDI ARABIAN OIL COMPANYInventors: Youshan Ma, Nicholas J. Pengilly, Zied Soua, Abdul Aziz R Alkhaldi
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Patent number: 11636352Abstract: Systems and methods include a method for providing an integrated advanced visualization tool for geosteering underbalanced coiled tubing drilling (UBCTD) operations. Drilling operation data is received from different sources in real time during a drilling operation. The drilling operation data includes geological formation information recorded during the drilling operation, micropalaeontological test results of the drilling operation, drilling parameters being used during the drilling operation, cumulative productivity index calculations, and reservoir pressure information of reservoirs encountered during the drilling operation. The drilling operation data is analyzed to correlate elements of the drilling operation data by time and cumulative depth. A graph is generated in real time that includes multiple plots correlated as a function of cumulative depth over time.Type: GrantFiled: May 13, 2020Date of Patent: April 25, 2023Assignee: Saudi Arabian Oil CompanyInventors: Ferney Geovany Moreno Sierra, Ahmad Azly Bin Abdul Aziz
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Publication number: 20230120710Abstract: Exemplary processing chambers may include a body having sidewalls and a bottom plate. The bottom plate may define an exhaust opening and a gas inlet. The chambers may include a faceplate seated atop the body. The chambers may include a purge ring seated atop the bottom plate. The purge ring may include a ring body having an outer edge and an inner edge defining an open interior. The ring body may have a surface disposed against the bottom plate. The ring body may define an opening aligned with the exhaust opening. The surface may define a fluid port aligned and coupled with the gas inlet. The surface may define arcuate grooves extending into the fluid port. The arcuate grooves may be parallel with the inner and outer edges. The surface may define radial grooves extending from the open interior to an arcuate groove.Type: ApplicationFiled: October 15, 2021Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: Zaoyuan Ge, Yin Xiong, Sungwon Ha, Abdul Aziz Khaja, Amit Bansal, Prasath Poomani, Ajit Laxman Kulkarni, Sarah Michelle Bobek, Badri N. Ramamurthi
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Patent number: 11626350Abstract: A method includes forming a leadframe assembly to have a pair of opposing sides, and having semiconductor die receiving portions extending between the opposing sides. The method also includes placing semiconductor dies on the leadframe assembly in the die receiving portions. Each die has a row of leads on each of two opposing sides of the die and a longitudinal axis parallel to the rows of leads. The longitudinal axis of each die is orthogonal to the opposing sides of the leadframe assembly. The method further includes applying mold compound to the semiconductor dies. The method includes punching through the leadframe assembly between the opposing sides using a first tool having a first tool longitudinal axis parallel to longitudinal axes of the dies.Type: GrantFiled: April 3, 2020Date of Patent: April 11, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chong Han Lim, Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim, Siew Kee Lee
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Patent number: 11627440Abstract: A method and device for improved audio intelligibility in a converged land mobile radio (LMR)/broadband (BB) communications system is provided. A converged portable radio operating as part of a talkgroup in the LMR/BB system checks for predetermined triggers during standby that could cause receive radios of the talkgroup to receive degraded audio. If such a trigger is detected then the converged portable radio switches from the LMR system to the BB system and transmits a notification including a change system message to the other converged portable radios of the talkgroup. The notification is transmitted prior to any push-to-talk audio being transmitted from the originating radio. The converged portable radio can transmit, via a push-to-talk switch, narrowband (NB) audio and wideband (WB) audio in parallel over the BB system to the talkgroup subsequent to the detection of triggers and the sending of the notification.Type: GrantFiled: February 28, 2022Date of Patent: April 11, 2023Assignee: MOTOROLA SOLUTIONS, INC.Inventors: Mohd Syazani Abdul Aziz, Lisajane M Romer, Cesar D Aguilar, Harvey D Chambers, Dajun Chen
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Publication number: 20230105952Abstract: A glove assembled from plurality of flat parts, at least one part being a thumb-crotch part that is configured to span an area from the base of the index finger on the side facing the thumb to the base of the thumb on the side facing the index finger so as to cover the ridged webbing of soft tissue between those fingers.Type: ApplicationFiled: October 6, 2021Publication date: April 6, 2023Inventors: Abdul Aziz, Muhammad Ali
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Patent number: 11613808Abstract: Exemplary semiconductor processing methods may include forming a seasoning film on a heater of a processing chamber by a first deposition process. The method may include performing a hardmask deposition process in the processing chamber. The method may include cleaning the processing chamber by a first cleaning process. The method may include monitoring a gas produced during the first cleaning process. The method may include cleaning the processing chamber using a second cleaning process different from the first cleaning process. The method may also include monitoring the gas produced during the second cleaning process.Type: GrantFiled: October 22, 2020Date of Patent: March 28, 2023Assignee: Applied Materials, Inc.Inventors: Jiheng Zhao, Abdul Aziz Khaja, Prashant Kumar Kulshreshtha, Fang Ruan
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Publication number: 20230061249Abstract: Exemplary methods of semiconductor processing may include forming a plasma of a carbon-containing precursor in a processing region of a semiconductor processing chamber. The methods may include depositing a carbon-containing material on a substrate housed in the processing region of the semiconductor processing chamber. The methods may include halting a flow of the carbon-containing precursor into the processing region of the semiconductor processing chamber. The methods may include contacting the carbon-containing material with plasma effluents of an oxidizing material. The methods may include forming volatile materials from a surface of the carbon-containing material.Type: ApplicationFiled: August 26, 2021Publication date: March 2, 2023Applicant: Applied Materials, Inc.Inventors: Sudha S. Rathi, Ganesh Balasubramanian, Nagarajan Rajagopalan, Abdul Aziz Khaja, Prashanthi Para, Hiral D. Tailor
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Patent number: 11569152Abstract: An electronic device, a lead frame, and a method, including providing a lead frame with a Y-shaped feature having branch portions connected to a dam bar in a prospective gap in an equally spaced repeating lead pitch pattern, and a set of first leads extending parallel to one another along a first direction and spaced apart from one another along a second direction in lead locations of the repeating lead pitch pattern, attaching a semiconductor die to a die attach pad of the lead frame, attaching bond wires between bond pads of the semiconductor die, and the first leads, enclosing first portions of the first leads, the die attach pad, and a portion of the semiconductor die in a package structure, and performing a dam bar cut process that cuts through portions of the dam bar between the lead locations of the repeating lead pitch pattern.Type: GrantFiled: January 23, 2019Date of Patent: January 31, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Anis Fauzi Bin Abdul Aziz, Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim, Siew Kee Lee
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Patent number: 11569154Abstract: An electronic device includes a package structure, a first lead and a second lead. The first lead has a first portion extending outward from a side of the package structure and downward, and a second portion extending outward from the first portion away from the package side. The second lead has a first portion extending outward from the package side and downward, and a second portion extending inward from the first portion toward the package side, and a distal end of the second lead is spaced from the package side.Type: GrantFiled: May 27, 2021Date of Patent: January 31, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Mohammad Waseem Hussain, Anis Fauzi Bin Abdul Aziz
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Patent number: 11569072Abstract: Embodiments of the present disclosure generally relate to substrate supports for process chambers and RF grounding configurations for use therewith. Methods of grounding RF current are also described. A chamber body at least partially defines a process volume therein. A first electrode is disposed in the process volume. A pedestal is disposed opposite the first electrode. A second electrode is disposed in the pedestal. An RF filter is coupled to the second electrode through a conductive rod. The RF filter includes a first capacitor coupled to the conductive rod and to ground. The RF filter also includes a first inductor coupled to a feedthrough box. The feedthrough box includes a second capacitor and a second inductor coupled in series. A direct current (DC) power supply for the second electrode is coupled between the second capacitor and the second inductor.Type: GrantFiled: April 23, 2019Date of Patent: January 31, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Satya Thokachichu, Edward P. Hammond, IV, Viren Kalsekar, Zheng John Ye, Abdul Aziz Khaja, Vinay K. Prabhakar
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Publication number: 20230023764Abstract: Methods and apparatus for surface profiling and texturing of chamber components for use in a process chamber, such surface-profiled or textured chamber components, and method of use of same are provided herein. In some embodiments, a method includes measuring a parameter of a reference substrate or a heated pedestal using one or more sensors and modifying a surface of a chamber component physically based on the measured parameter.Type: ApplicationFiled: December 15, 2020Publication date: January 26, 2023Inventors: David W. GROECHEL, Michael R. RICE, Gang Grant PENG, Rui CHENG, Zubin HUANG, Han WANG, Karthik JANAKIRAMAN, Diwakar KEDLAYA, Paul L. BRILLHART, Abdul Aziz KHAJA
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Patent number: 11560623Abstract: The present disclosure relates to systems and methods for reducing the formation of hardware residue and minimizing secondary plasma formation during substrate processing in a process chamber. The process chamber may include a gas distribution member configured to flow a first gas into a process volume and generate a plasma therefrom. A second gas is supplied into a lower region of the process volume. Further, an exhaust port is disposed in the lower region to remove excess gases or by-products from the process volume during or after processing.Type: GrantFiled: April 24, 2020Date of Patent: January 24, 2023Assignee: Applied Materials, Inc.Inventors: Liangfa Hu, Prashant Kumar Kulshreshtha, Anjana M. Patel, Abdul Aziz Khaja, Viren Kalsekar, Vinay K. Prabhakar, Satya Teja Babu Thokachichu, Byung Seok Kwon, Ratsamee Limdulpaiboon, Kwangduk Douglas Lee, Ganesh Balasubramanian
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Patent number: 11552416Abstract: A memory module testing system operating in a vibratory environment can retain a memory module in place in a memory socket using both socket latches and a retainer clip. The retainer clip can attach to a module support tower of the memory socket. The retainer clip can have a flexible multi-spring structure forming a three-axis vibration dampening system that can prevent the socket latches from opening while testing in the test environment. The retainer clip can secure the socket latches using an upper flange and a lower flange to prevent unintended motion of the socket latches. The retainer clip can be secured to the module support towers at the ends of the memory socket using clip arms and clip arm tips to attach to the module support towers.Type: GrantFiled: February 13, 2020Date of Patent: January 10, 2023Assignee: SMART MODULAR TECHNOLOGIES SDN. BHD.Inventors: Kwang Jin Gooi, Muhammad Annuar Bin Johani, Ali Akbar Bin Abdul Aziz