Abstract: A liquid fuel cell system is disclosed. The liquid fuel cell system includes a liquid fuel cell unit and a liquid fuel cartridge that can be connected to the liquid fuel cell unit. The liquid fuel cell unit and the liquid fuel cartridge each include a valve unit. The liquid fuel cartridge is connected to the liquid fuel cell unit so as to pour and supply liquid fuel that is a methanol solution from the liquid fuel cartridge to the liquid fuel cell unit. Using the supplied liquid fuel, the liquid fuel cell unit generates power to charge a battery. After the charging, both of the valve units are opened to return the liquid fuel remaining in the liquid fuel cell unit back to the liquid fuel cartridge, and thus, the liquid fuel cell unit is emptied.

Abstract: A metal wire for inspection and an electrode for inspection are formed on a region of a semiconductor substrate where a metal wire and an electrode for external connection are not formed. The metal wire for inspection and the electrode for inspection electrically detect an open failure, a short-circuit failure and a leakage failure of the metal wire and a connection failure between an element electrode and the metal wire. A semiconductor wafer is subjected to an electrical test, so that it is possible to detect the aforementioned failures with good accuracy during a manufacturing process.

Abstract: A light emitting device wafer having a light emitting layer section 24 having an AlGaInP-base double heterostructure, and a GaP light extraction layer 20 disposed on the light emitting layer section so as to allow a first main surface thereof to compose a first main surface of the wafer is fabricated so that the first main surface of the GaP light extraction layer appears as the (100) surface. The first main surface of the GaP light extraction layer 20 composed of the (100) surface is etched using an etching solution for surface roughening to thereby form surface roughening projections 40f. Accordingly, there can be provided a method of fabricating a light emitting device having the GaP light extraction layer agreed with the (100) main surface, capable of readily subjecting the (100) main surface to surface roughening.

Abstract: The present invention provides a pin milling cutter formed by combining a cutter and an adapter to prevent errors in attaching a cutter to the adapter even when the cutter is similar but of a different type and even if the engagement section between the cutter and the adapter are the same. A mounting error prevention mechanism is provided on a main cutter unit and an adapter to prevent an erroneous combination of a cutter and adapter from fitting together normally. The mounting error prevention mechanism includes: a projection and a cavity corresponding to the main cutter unit and the adapter and providing a tapered fit; and a projection and a corresponding groove. The projection can be inserted into the groove only when the cutter and the adapter are combined correctly.

Abstract: A movable console device having a rack-mount configuration. The movable console device is provided with a console section including a keyboard and a display, a mount section for mounting the console section onto a rack structure in a manner movable between a retracted position and a drawn-out position, and a drive section for automatically moving the console section with respect to the rack structure between the retracted and drawn-out positions. The console section includes a display support mechanism for supporting the display in a manner displaceable between a non-operating position and an operating position, and a second drive section is provided for automatically displacing the display between the non-operating and operating positions.

Abstract: An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member.

Abstract: According to this invention, a semiconductor package includes: a plurality of semiconductor chips, each having through electrodes; and a semiconductor interposer, on which the plurality of semiconductor chips are mounted. Each of the semiconductor chips includes: a semiconductor substrate; a wiring layer formed on the semiconductor substrate; an opaque resin layer sealing the wiring layer and a side surface of the semiconductor chip; and conductive bumps to be connected to the through electrodes.

Abstract: An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member. Also, there is provided a manufacturing method of the acceleration sensing device.

Abstract: A coordinates input device includes an operation unit that receives an operation input, a vibration generator that applies a vibration to the operation unit, and a vibration control unit that controls the vibration generator to apply the vibration to the operation unit when the operation input is received by the operation unit. The vibration generator includes a power feed unit provided to the operation unit, and a magnetic-field applying unit having sub-units. Each of the sub-units has first and second magnets spaced apart from each other with a given gap. The magnetic flux produced by the first and second magnets crosses a current flowing in the power feed unit.

Abstract: A fuel cell device is disclosed that is capable of being made compact when being transported and in storage. The fuel cell device includes a fuel cell unit including a number of fuel cells arranged sequentially in a case. The case includes a holder frame for holding the fuel cells, a first hemi-case, and a second hemi-case. The width of the case is adjustable in the direction in which the fuel cells are arranged in a line. When the fuel cell device is being transported or in storage, the first hemi-case and the second hemi-case are pushed to approach each other, making the size of the case small. When the fuel cell device is used to generate electrical power, the first hemi-case and the second hemi-case are pulled apart from each other and, accordingly, the fuel cells are separated from each other by a springy plate.

Abstract: A semiconductor device includes a die pad section having a surface and a back surface, a first semiconductor chip having a surface on which a first electrode section is formed, and a back surface fixed to the surface of the die pad section, a second semiconductor chip having a surface on which a second electrode section is formed, and a back surface fixed to the surface of the first semiconductor chip, lead terminal sections respectively electrically connected to the first and second electrode sections, and a resin encapsulating body that seals the die pad section and the first and second semiconductor chips. An edge portion of the second semiconductor chip protrudes from an edge portion of the first semiconductor chip. An edge portion of the die pad section protrudes from an edge portion of the first semiconductor chip.

Abstract: A light emitting device wafer having a light emitting layer section 24 having an AlGaInP-base double heterostructure, and a GaP light extraction layer 20 disposed on the light emitting layer section so as to allow a first main surface thereof to compose a first main surface of the wafer is fabricated so that the first main surface of the GaP light extraction layer appears as the (100) surface. The first main surface of the GaP light extraction layer 20 composed of the (100) surface is etched using an etching solution for surface roughening to thereby form surface roughening projections 40f. Accordingly, there can be provided a method of fabricating a light emitting device having the GaP light extraction layer agreed with the (100) main surface, capable of readily subjecting the (100) main surface to surface roughening.

Abstract: In an inputting apparatus which is manipulated with a finger placed on a manipulating section included in the inputting apparatus, the manipulating section is configured to stimulate the tactile sense of the finger used in the manipulating, enabling to confirm the inputting.

Abstract: An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member. Also, there is provided a manufacturing method of the acceleration sensing device.

Abstract: The present invention provides an organic EL element on which a protective film, which can be thickened and has a high barrier property, can be formed with high productivity, and a method of manufacturing the same. An organic electroluminescence element having a substrate 1, a first electrode 2 provided thereon, an organic luminescent layer 3, a second electrode 4, and a protective film 5 in this order, wherein the protective film 5 is formed with carbon-containing silicon nitride (SiNxCy), and the carbon content in the protective film 5 is continuously altered. The protective film of the element is formed by using an organic silicon compound, and nitrogen and hydrogen as a source gas, with a plasma CVD method while altering the voltage.

Abstract: To provide a method for color-matching a paint having brilliant feeling whose reference blend is already known and which contains a brilliant material, comprising (1) a step of obtaining the liquid color measurement data for an enamel paint not containing a brilliant material in accordance with a paint blend excluding the brilliant material and if necessary, a paint additive from a reference paint blend of a paint having brilliant feeling whose reference paint blend is already known, (2) a step of obtaining a toned enamel paint adjusted to the liquid color measurement data for the enamel paint by blending and toning a paint material such as an elementary color paint excluding a brilliant material and if necessary, a paint additive on the basis of the liquid color measurement data for the enamel paint, and (3) a step of color-matching a paint having brilliant feeling by adding a brilliant material and if necessary, a paint additive to the toned enamel paint.

Abstract: A light emitting device chip is obtained by dicing a light emitting device wafer having a light emitting layer section 24 based on a double heterostructure in which a first-conductivity-type cladding layer 6, an active layer 5 and an second-conductivity-type cladding layer 4, each of which being composed of a compound semiconductor having a composition allowing lattice matching with GaAs, out of compound semiconductors expressed by formula (AlxGa1-x)yIn1-yP (where, 0?x?1, 0?y?1), are stacked in this order, and having the (100) surface appeared on the main surface thereof, and GaP transparent semiconductor layers 20, 90 stacked on the light emitting layer section 24 as being agreed with the crystal orientation thereof, so that the {100} surfaces appear on the side faces of the GaP transparent semiconductor layer.