Abstract: A semiconductor acceleration sensor in which a reduction in size can be achieved when electrodes are formed in a chip main body and acceleration can be measured with good sensitivity. The semiconductor acceleration sensor comprises a weight section, flexible sections which support the weight section and have measurement elements P, and a chip main body which has a front surface having chip electrodes electrically connected with the measurement elements, and support the flexible sections, wherein an additional weight, which has an inclined face which surrounds a bonding section and decreases its size toward the bonding section, is bonded on the front surface of the weight section.

Abstract: What is invented is a semiconductor device (10) comprising a pellet (12) having a ground electrode (18), an outside signal terminal (15) connected to the pellet (12), so as to receive signal which is likely to include noise. Therein, said outside signal terminal (15) is surrounded with a ground terminal (17) connected to said ground electrode (18) in at least a half periphery.

Abstract: An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member. Also, there is provided a manufacturing method of the acceleration sensing device.

Abstract: A tactile panel includes a vibration panel, a yoke provided to face the vibration panel, drive coils secured on a circumference of the vibration panel, and a set of permanent magnets arranged between the vibration panel and the yoke. The vibration panel is held by panel holding members, into which both sides of the vibration panel are inserted in a direction substantially perpendicular to a vibration direction of the vibration panel.

Abstract: A semiconductor device comprises a semiconductor IC chip provided with bond pads on its first surface, a wiring substrate provided with a through hole extending between the opposite surfaces thereof, conductive members electrically connecting the bond pads of the semiconductor IC chip to the conductive lines formed on the wiring substrate respectively, and a sealing resin coating coating the first surface of the semiconductor IC chip and the conductive members, and bonding the side surface of the semiconductor IC chip to the side surface of the through hole of the wiring substrate.

Abstract: What is invented is a semiconductor device (10) comprising a pellet (12) having a ground electrode (18), an outside signal terminal (15) connected to the pellet (12), so as to receive signal which is likely to include noise. Therein, said outside signal terminal (15) is surrounded with a ground terminal (17) connected to said ground electrode (18) in at least a half periphery.

Abstract: A high-frequency relay comprises a body containing a contact unit having at least one contact terminal protruding from a bottom surface of the body, contact states switched according to energization of a coil and a base covering at least a bottom surface of the body. The contact unit is connected with at least one contact terminal. The base has a grounding function and includes a conductive layer.

Abstract: A plane plate vibration device includes a plane plate, a coil portion having a first coil and a second coil, the first coil being wound on a circumference of the plane plate in parallel with the plane plate, the second coil being wound along inside of the first coil in parallel with the plane plate, and magnetic field generating mechanisms that are provided in parallel with the plane plate and generate magnetic fields in directions perpendicular to directions of currents respectively flowing through the first coil and the second coil. The currents flow through the first coil and the second coil in reverse directions, the directions of magnetic fields perpendicular to the currents respectively flowing through the first coil and the second coil give forces in the same direction, and the plane plate vibrates in a direction of thickness by adjusting the currents respectively flowing through the first coil and the second coil.

Abstract: A plane plate vibration device includes a plane plate, a coil portion having a first coil and a second coil, the first coil being wound on a circumference of the plane plate in parallel with the plane plate, the second coil being wound along inside of the first coil in parallel with the plane plate, and magnetic field generating mechanisms that are provided in parallel with the plane plate and generate magnetic fields in directions perpendicular to directions of currents respectively flowing through the first coil and the second coil. The currents flow through the first coil and the second coil in reverse directions, the directions of magnetic fields perpendicular to the currents respectively flowing through the first coil and the second coil give forces in the same direction, and the plane plate vibrates in a direction of thickness by adjusting the currents respectively flowing through the first coil and the second coil.

Abstract: An actuator includes: a magnetic field generator that has different magnetic poles alternately arranged in a plane, with a predetermined position being the center of the magnetic poles; a coil holder that holds a plurality of coils that are radially arranged and face the magnetic field generator, relative motion being caused between the magnetic field generator and the coil holder; and an electromagnetic conversion unit that detects the relative motion and is mounted on either the magnetic field generator or the coil holder.

Abstract: An actuator including magnets arranged on a plane on a plane, coils respectively arranged to face the magnets and move relatively with facing the magnets when a current is applied thereto, a moving member connected to either the magnets or coils, a guide member that guides the moving member to move in a given two-dimensional range; and a hit prevention mechanism to prevent the moving member from hitting a movable limit in the given two-dimensional range. The hit prevention mechanism is provided at the movable limit (edge) in the two-dimensional range. It is thus possible to prevent the moving member from hitting the movable limit. This can prevent damage or any hitting sound. The actuator can be used in a comfortable manner and stably for a long period.

Abstract: A liquid fuel cell system is disclosed. The liquid fuel cell system includes a liquid fuel cell unit and a liquid fuel cartridge that can be connected to the liquid fuel cell unit. The liquid fuel cell unit and the liquid fuel cartridge each include a valve unit. The liquid fuel cartridge is connected to the liquid fuel cell unit so as to pour and supply liquid fuel that is a methanol solution from the liquid fuel cartridge to the liquid fuel cell unit. Using the supplied liquid fuel, the liquid fuel cell unit generates power to charge a battery. After the charging, both of the valve units are opened to return the liquid fuel remaining in the liquid fuel cell unit back to the liquid fuel cartridge, and thus, the liquid fuel cell unit is emptied.

Abstract: The present invention provides a semiconductor device which comprises a die pad section (200) having a surface (201) and a back surface (202), a first semiconductor chip (4) having a surface (41) on which a first electrode section (47) is formed, and a back surface (42) fixed to the surface of the die pad section (200), a second semiconductor chip (5) having a surface (51) on which a second electrode section (57) is formed, and a back surface (52) fixed to the surface (41) of the first semiconductor chip (4), lead terminal sections (210 and 220) respectively electrically connected to the first and second electrode sections (47 and 57), and a resin encapsulating body (10) that seals the die pad section (200) and the first and second semiconductor chips (4 and 5). An edge portion (54) of the second semiconductor chip (5) protrudes from an edge portion (44) of the first semiconductor chip (4).

Abstract: An air intake device for use with an internal combustion engine has an air cleaner case adapted to be mounted on the engine to extend longitudinally along an upper wall of the engine. An opening is formed in a longitudinal end portion of a bottom wall of the air cleaner case. An air cleaner body has an open end that is connected to the opening of the bottom wall of the air cleaner case thereby to communicate an interior of the air cleaner body with that of the air cleaner case. An air cleaner element is put between the air cleaner body and the air cleaner case in a manner to extend across the opening of the bottom wall of the air cleaner case.

Abstract: This invention provides a resin-sealed type semiconductor device capable of decreasing a generation of a simultaneous switching noise even in using a further highly integrated semiconductor LSI. More specifically, this invention provides a resin-type semiconductor device wherein a signal lead frame 105, a power supply lead frame 104 and a grand lead frame 103 are accumulated via an electric insulating layer between layers. The power supply lead frame 104 and the grand lead frame 103 have a mesh shape with a plurality of openings in a plane electric conductor.

Abstract: A coordinates input device includes an operation unit that receives an operation input, a vibration generator that applies a vibration to the operation unit, and a vibration control unit that controls the vibration generator to apply the vibration to the operation unit when the operation input is received by the operation unit. The vibration generator includes a power feed unit provided to the operation unit, and a magnetic-field applying unit having sub-units. Each of the sub-units has first and second magnets spaced apart from each other with a given gap. The magnetic flux produced by the first and second magnets crosses a current flowing in the power feed unit.

Abstract: In an inputting apparatus which is manipulated with a finger placed on a manipulating section included in the inputting apparatus, the manipulating section is configured to stimulate the tactile sense of the finger used in the manipulating, enabling to confirm the inputting.

Abstract: To provide a method for color-matching a paint having brilliant feeling whose reference blend is already known and which contains a brilliant material, comprising (1) a step of obtaining the liquid color measurement data for an enamel paint not containing a brilliant material in accordance with a paint blend excluding the brilliant material and if necessary, a paint additive from a reference paint blend of a paint having brilliant feeling whose reference paint blend is already known, (2) a step of obtaining a toned enamel paint adjusted to the liquid color measurement data for the enamel paint by blending and toning a paint material such as an elementary color paint excluding a brilliant material and if necessary, a paint additive on the basis of the liquid color measurement data for the enamel paint, and (3) a step of color-matching a paint having brilliant feeling by adding a brilliant material and if necessary, a paint additive to the toned enamel paint.

Abstract: A semiconductor device having electrodes formed along a peripheral part thereof in a staggered arrangement of lines including inside-line, central-line and outside-line electrodes. The inside-line electrodes are octagonal shaped with hypotenuses on the central-line electrode and the pellet sides thereof. The central-line electrodes are octagonal shaped with hypotenuses on the inside-line and outside-line electrode sides thereof. The maximum width of outside-line electrode wires between the hypotenuses of adjacent inside-line and central-line electrodes depends on the distance between centers of the inside-line and central-line electrodes, minimum lengths of the inside-line and central-line electrodes and electrode protective film, and the necessary minimum conductor interval between the central-line and inside-line electrodes. The position and form of the central-line and inside-line electrodes are determinable based on the given relationship and the necessary value of current.

Abstract: A cross substrate and a method of mounting a semiconductor element are provided in which semiconductor elements can be mounted at a high density. Element side electrodes of a circuit forming surface of a semiconductor element and conductive filaments of a cross substrate are connected in a one-to-one correspondence by solder bumps. Thereafter, sealing is carried out by using a molten epoxy-based resin. In this way, a circuit forming surface side of the semiconductor element is sealed with sealing resin of the cross substrate, with the element side electrodes of the mounted semiconductor element electrically connected to conductive filaments which are wires of a cross substrate.