Patents by Inventor Akio Nakamura

Akio Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070224714
    Abstract: A light emitting device chip is obtained by dicing a light emitting device wafer having a light emitting layer section 24 based on a double heterostructure in which a first-conductivity-type cladding layer 6, an active layer 5 and an second-conductivity-type cladding layer 4, each of which being composed of a compound semiconductor having a composition allowing lattice matching with GaAs, out of compound semiconductors expressed by formula (AlxGa1-x)yIn1-yP (where, 0?x?1, 0?y?1), are stacked in this order, and having the (100) surface appeared on the main surface thereof, and GaP transparent semiconductor layers 20, 90 stacked on the light emitting layer section 24 as being agreed with the crystal orientation thereof, so that the {100} surfaces appear on the side faces of the GaP transparent semiconductor layer.
    Type: Application
    Filed: April 13, 2005
    Publication date: September 27, 2007
    Applicant: Shin-Etsu Handotai Co., Ltd.
    Inventors: Hitoshi Ikeda, Kingo Suzuki, Akio Nakamura
  • Publication number: 20070216001
    Abstract: According to this invention, a semiconductor package includes: a plurality of semiconductor chips, each having through electrodes; and a semiconductor interposer, on which the plurality of semiconductor chips are mounted. Each of the semiconductor chips includes: a semiconductor substrate; a wiring layer formed on the semiconductor substrate; an opaque resin layer sealing the wiring layer and a side surface of the semiconductor chip; and conductive bumps to be connected to the through electrodes.
    Type: Application
    Filed: November 27, 2006
    Publication date: September 20, 2007
    Applicant: OKI ELECTRIC INDUSTRY CO., LTD.
    Inventor: Akio Nakamura
  • Publication number: 20070210327
    Abstract: Aiming at providing a method of fabricating a light emitting device having an AlGaInP light emitting section, less causative of crack by cleavage, on the edge portions on the back surface of the device chip in process of dicing or breaking, a light emitting device wafer is diced along a dicing line inclined at an angle of 15° to 30°, both ends inclusive, away from a dicing line angle reference direction defined as the <110> direction on the (100) main surface.
    Type: Application
    Filed: March 2, 2007
    Publication date: September 13, 2007
    Applicant: Shin-Etsu Handotai Co., Ltd.
    Inventors: Hitoshi Ikeda, Akio Nakamura
  • Publication number: 20070210702
    Abstract: An organic EL panel is provided which enables transparent sealing accompanied by low moisture permeability, and can be used also for sealing a top emission panel without deterioration for a long period of time even in the case of a panel having a narrow frame area. In an organic EL panel produced by covering the face of a supporting substrate 1, which is provided with an organic EL element 101, via an adhesive layer 8 by a sealing substrate 9 to permit sealing, a first partition 4 that protrudes toward the sealing substrate 9 is formed on one face of the supporting substrate 1 so as to surround the circumference of the organic EL element 101, and further, a second partition 10 that protrudes toward the supporting substrate 1 is formed on the face of the sealing substrate 9 opposing to the one face of the supporting substrate 1 so as to surround the circumference of the organic EL element 101.
    Type: Application
    Filed: January 24, 2007
    Publication date: September 13, 2007
    Inventor: Akio Nakamura
  • Patent number: 7267007
    Abstract: An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member. Also, there is provided a manufacturing method of the acceleration sensing device.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: September 11, 2007
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Akio Nakamura
  • Patent number: 7268422
    Abstract: What is invented is a semiconductor device (10) comprising a pellet (12) having a ground electrode (18), an outside signal terminal (15) connected to the pellet (12), so as to receive signal which is likely to include noise. Therein, said outside signal terminal (15) is surrounded with a ground terminal (17) connected to said ground electrode (18) in at least a half periphery.
    Type: Grant
    Filed: October 14, 2005
    Date of Patent: September 11, 2007
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Akio Nakamura
  • Patent number: 7249510
    Abstract: A semiconductor acceleration sensor in which a reduction in size can be achieved when electrodes are formed in a chip main body and acceleration can be measured with good sensitivity. The semiconductor acceleration sensor comprises a weight section, flexible sections which support the weight section and have measurement elements P, and a chip main body which has a front surface having chip electrodes electrically connected with the measurement elements, and support the flexible sections, wherein an additional weight, which has an inclined face which surrounds a bonding section and decreases its size toward the bonding section, is bonded on the front surface of the weight section.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: July 31, 2007
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Akio Nakamura
  • Publication number: 20070173461
    Abstract: An object of the present invention is to provide a therapeutic agent for ulcerative colitis which allows 5-aminosalicylic acid (5-ASA) useful as a therapeutic agent for ulcerative colitis to be efficiently delivered to the large intestine of the affected site almost without being absorbed or metabolized in the stomach or the upper part of the small intestine and is safe and can be administered over a long term. The present invention relates to 5-ASA into which D-galactose represented by the following general formula [1] has been introduced. The compound of the present invention can be efficiently delivered to the large intestine of the site of action, and is degraded by the intestinal bacterial flora, whereby 5-ASA as the active ingredient can be produced in the large intestine.
    Type: Application
    Filed: February 2, 2005
    Publication date: July 26, 2007
    Applicant: Nippon Shinyaku Co., Ltd.
    Inventor: Akio Nakamura
  • Publication number: 20070164666
    Abstract: One embodiment of an organic electroluminescent element of present invention includes a substrate, a first electrode on the substrate, an organic luminescent medium layer including an organic luminescent layer on the first electrode, a second electrode on the organic luminescent medium layer and barrier film formed on the second electrode. The organic luminescent medium layer is sandwiched between the first electrode and the second electrode. Film density of the barrier film changes in thickness direction.
    Type: Application
    Filed: November 22, 2006
    Publication date: July 19, 2007
    Inventors: Tetsuo Oosono, Akio Nakamura, Tsunenori Komori
  • Patent number: 7245048
    Abstract: A tactile panel includes a vibration panel, a yoke provided to face the vibration panel, drive coils secured on a circumference of the vibration panel, and a set of permanent magnets arranged between the vibration panel and the yoke. The vibration panel is held by panel holding members, into which both sides of the vibration panel are inserted in a direction substantially perpendicular to a vibration direction of the vibration panel.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: July 17, 2007
    Assignee: Fujitsu Component Limited
    Inventors: Noboru Fujii, Shinichiro Akieda, Junichi Akama, Akio Nakamura
  • Patent number: 7242395
    Abstract: An input device and a driving device able to be made thin and secure sufficiently large vibration amplitude are provided. The input device comprises an input panel, a current conducting element for conducting a driving current, and a magnetic field application unit for applying a magnetic field on the current conducting element. Both of the current conducting element and the magnetic field application unit are arranged in the peripheral region of the input panel. The magnetic field applied by the magnetic field application unit is parallel to the input panel and intersects the current conducting element. When the input panel is touched, a driving current is fed into the current conducting element, and a force is imposed on the current conducting element and the magnetic field application unit, making them move. This movement further drives the input panel to vibrate. Consequently, input operations can be recognized by feeling the vibration of the input panel.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: July 10, 2007
    Assignee: Fujitsu Component Limited
    Inventors: Shigemi Kurashima, Nobuyoshi Shimizu, Akio Nakamura, Yuriko Nishiyama, Shinichiro Akieda, Takashi Arita
  • Patent number: 7239008
    Abstract: A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around the semiconductor pellet and upper parts of the lead terminals. The plurality of lead terminals are shaped to be elongated strips and are arranged to extend out of the molding member toward the substrate.
    Type: Grant
    Filed: August 6, 2002
    Date of Patent: July 3, 2007
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Akio Nakamura
  • Publication number: 20070147966
    Abstract: The present invention provides a pin milling cutter formed by combining a cutter and an adapter to prevent errors in attaching a cutter to the adapter even when the cutter is similar but of a different type and even if the engagement section between the cutter and the adapter are the same. A mounting error prevention mechanism is provided on a main cutter unit and an adapter to prevent an erroneous combination of a cutter and adapter from fitting together normally. The mounting error prevention mechanism includes: a projection and a cavity corresponding to the main cutter unit and the adapter and providing a tapered fit; and a projection and a corresponding groove. The projection can be inserted into the groove only when the cutter and the adapter are combined correctly.
    Type: Application
    Filed: December 6, 2006
    Publication date: June 28, 2007
    Applicant: Sumitomo Electric Hardmetal, Corp.
    Inventors: Shigenori Emoto, Akio Nakamura
  • Publication number: 20070111320
    Abstract: An apparatus for measuring the optical characteristics of a colored liquid comprising a transparent plate (5) arranged horizontally, a sampling means (7) capable of collecting the colored liquid and dropping a collected colored liquid onto the transparent plate (5), and a measuring means (10) positioned beneath the transparent plate (5) for measuring the optical characteristics of the dropped colored liquid. This apparatus enables easy and accurate measurement of the optical characteristics of a colored liquid.
    Type: Application
    Filed: December 3, 2004
    Publication date: May 17, 2007
    Applicant: Kansai Paint Co., LTD
    Inventors: Akio Nakamura, Ikko Matsubara
  • Publication number: 20070066179
    Abstract: The present invention is related to a printed matter on which thin film is formed by a printing method. Functional organic thin film is formed in little process with highly precise on a substrate without water absorbing property sectioned by partition walls. According to the current invention, the printing that accuracy is preferable can be achieved only by alignment in only one direction. In addition, yield of manufacture of printed matter is preferable. In addition, configuration of partition wall is configuration that printing plate is easy to approach one part of partition wall. Therefore, ink is transferred surely from printing plate to a substrate. Even more particularly, problem such as disconnection of the functional layer or substrate on partition wall when the functional layer or substrate is laminated on a top face of printed matter can be prevented.
    Type: Application
    Filed: June 2, 2006
    Publication date: March 22, 2007
    Inventors: Akio Nakamura, Sen Ihan, Kouji Takeshita, Eiichi Kitazume
  • Publication number: 20070052106
    Abstract: A first mark formed simultaneously with the process step for forming a layer of metal interconnects is partly exposed at two parallel side surfaces of the separated semiconductor device or one side surface thereof to have a rectangular shape. This allows the identification of the orientation and product information of the semiconductor device in a small semiconductor device.
    Type: Application
    Filed: November 1, 2004
    Publication date: March 8, 2007
    Inventors: Kazumi Watase, Akio Nakamura, Minoru Fujisaku, Hiroki Naraoka, Takahiro Nakano
  • Patent number: 7183132
    Abstract: A semiconductor device provided with one or more semiconductor pellets arranged on the bottom surface of a recess produced along a surface of a semiconductor plate having wirings arranged on the surface thereof, wirings extending toward the surface of the recess, and the recess being buried with a layer of a resin which is inclined to inflate, while it is hardened, resultantly producing a stress in the resin layer to expand toward the side wall of the recess engraved in the semiconductor plate, resultantly preventing breakage from happening for an interface between the side wall of the recess engraved in the semiconductor plate and the surface of the resin layer contacting the side wall, and remarkably improving the thermal conductivity efficiency to reduce the magnitude of a temperature rise of the semiconductor device, resultantly preventing a delay from happening for the operation speed of the semiconductor device.
    Type: Grant
    Filed: February 3, 2003
    Date of Patent: February 27, 2007
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Akio Nakamura
  • Publication number: 20060286689
    Abstract: A metal wire for inspection and an electrode for inspection are formed on a region of a semiconductor substrate where a metal wire and an electrode for external connection are not formed. The metal wire for inspection and the electrode for inspection electrically detect an open failure, a short-circuit failure and a leakage failure of the metal wire and a connection failure between an element electrode and the metal wire. A semiconductor wafer is subjected to an electrical test, so that it is possible to detect the aforementioned failures with good accuracy during a manufacturing process.
    Type: Application
    Filed: June 16, 2006
    Publication date: December 21, 2006
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazumi Watase, Akio Nakamura, Katsumi Ootani
  • Publication number: 20060220505
    Abstract: A movable console device having a rack-mount configuration. The movable console device is provided with a console section including a keyboard and a display, a mount section for mounting the console section onto a rack structure in a manner movable between a retracted position and a drawn-out position, and a drive section for automatically moving the console section with respect to the rack structure between the retracted and drawn-out positions. The console section includes a display support mechanism for supporting the display in a manner displaceable between a non-operating position and an operating position, and a second drive section is provided for automatically displacing the display between the non-operating and operating positions.
    Type: Application
    Filed: March 31, 2006
    Publication date: October 5, 2006
    Applicant: FUJITSU COMPONENT LIMITED
    Inventors: Akio Nakamura, Fujio Seki, Katsuya Funakoshi, Keiji Miyatsu
  • Patent number: 7049706
    Abstract: A semiconductor device having electrodes formed along a peripheral part thereof in a staggered arrangement of lines including inside-line, central-line and outside-line electrodes. The inside-line electrodes are octagonal or hexagonal shaped with hypotenuses on the central-line electrode and the pellet sides thereof. The central-line electrodes are octagonal or correspondingly hexagonal shaped with hypotenuses on the inside-line and outside-line electrode sides thereof. The maximum width of outside-line electrode wires between the hypotenuses of adjacent inside-line and central-line electrodes depends on the distance between centers of the inside-line and central-line electrodes, minimum lengths of the inside-line and central-line electrodes and electrode protective film, and the necessary minimum conductor interval between the central-line and inside-line electrodes.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: May 23, 2006
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Akio Nakamura
  • Patent number: 5031408
    Abstract: A cryocrucible permits the introduction of ion clusters of a cryogen, like oxygen or nitrogen, to a vacuum chamber, and preferably comprises a liquid cryogen containment vessel connected to an expansion chamber through a solenoid-actuated valve, a cooling means for maintaining the cryogen as a liquid in the containment vessel, and a nozzle connecting the expansion chamber to the vacuum chamber. Liquid evaporates through the valve into the expansion chamber and, then, forms clusters when it expands further while passing through the nozzle into the vacuum chamber.
    Type: Grant
    Filed: September 11, 1989
    Date of Patent: July 16, 1991
    Assignee: The Boeing Company
    Inventors: William E. Horne, Arthur C. Day