Abstract: The present invention provides an organic EL element on which a protective film, which can be thickened and has a high barrier property, can be formed with high productivity, and a method of manufacturing the same. An organic electroluminescence element having a substrate 1, a first electrode 2 provided thereon, an organic luminescent layer 3, a second electrode 4, and a protective film 5 in this order, wherein the protective film 5 is formed with carbon-containing silicon nitride (SiNxCy), and the carbon content in the protective film 5 is continuously altered. The protective film of the element is formed by using an organic silicon compound, and nitrogen and hydrogen as a source gas, with a plasma CVD method while altering the voltage.

Abstract: To provide a method for color-matching a paint having brilliant feeling whose reference blend is already known and which contains a brilliant material, comprising (1) a step of obtaining the liquid color measurement data for an enamel paint not containing a brilliant material in accordance with a paint blend excluding the brilliant material and if necessary, a paint additive from a reference paint blend of a paint having brilliant feeling whose reference paint blend is already known, (2) a step of obtaining a toned enamel paint adjusted to the liquid color measurement data for the enamel paint by blending and toning a paint material such as an elementary color paint excluding a brilliant material and if necessary, a paint additive on the basis of the liquid color measurement data for the enamel paint, and (3) a step of color-matching a paint having brilliant feeling by adding a brilliant material and if necessary, a paint additive to the toned enamel paint.

Abstract: A light emitting device chip is obtained by dicing a light emitting device wafer having a light emitting layer section 24 based on a double heterostructure in which a first-conductivity-type cladding layer 6, an active layer 5 and an second-conductivity-type cladding layer 4, each of which being composed of a compound semiconductor having a composition allowing lattice matching with GaAs, out of compound semiconductors expressed by formula (AlxGa1-x)yIn1-yP (where, 0?x?1, 0?y?1), are stacked in this order, and having the (100) surface appeared on the main surface thereof, and GaP transparent semiconductor layers 20, 90 stacked on the light emitting layer section 24 as being agreed with the crystal orientation thereof, so that the {100} surfaces appear on the side faces of the GaP transparent semiconductor layer.

Abstract: According to this invention, a semiconductor package includes: a plurality of semiconductor chips, each having through electrodes; and a semiconductor interposer, on which the plurality of semiconductor chips are mounted. Each of the semiconductor chips includes: a semiconductor substrate; a wiring layer formed on the semiconductor substrate; an opaque resin layer sealing the wiring layer and a side surface of the semiconductor chip; and conductive bumps to be connected to the through electrodes.

Abstract: Aiming at providing a method of fabricating a light emitting device having an AlGaInP light emitting section, less causative of crack by cleavage, on the edge portions on the back surface of the device chip in process of dicing or breaking, a light emitting device wafer is diced along a dicing line inclined at an angle of 15° to 30°, both ends inclusive, away from a dicing line angle reference direction defined as the <110> direction on the (100) main surface.

Abstract: An organic EL panel is provided which enables transparent sealing accompanied by low moisture permeability, and can be used also for sealing a top emission panel without deterioration for a long period of time even in the case of a panel having a narrow frame area. In an organic EL panel produced by covering the face of a supporting substrate 1, which is provided with an organic EL element 101, via an adhesive layer 8 by a sealing substrate 9 to permit sealing, a first partition 4 that protrudes toward the sealing substrate 9 is formed on one face of the supporting substrate 1 so as to surround the circumference of the organic EL element 101, and further, a second partition 10 that protrudes toward the supporting substrate 1 is formed on the face of the sealing substrate 9 opposing to the one face of the supporting substrate 1 so as to surround the circumference of the organic EL element 101.

Abstract: An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member. Also, there is provided a manufacturing method of the acceleration sensing device.

Abstract: What is invented is a semiconductor device (10) comprising a pellet (12) having a ground electrode (18), an outside signal terminal (15) connected to the pellet (12), so as to receive signal which is likely to include noise. Therein, said outside signal terminal (15) is surrounded with a ground terminal (17) connected to said ground electrode (18) in at least a half periphery.

Abstract: A semiconductor acceleration sensor in which a reduction in size can be achieved when electrodes are formed in a chip main body and acceleration can be measured with good sensitivity. The semiconductor acceleration sensor comprises a weight section, flexible sections which support the weight section and have measurement elements P, and a chip main body which has a front surface having chip electrodes electrically connected with the measurement elements, and support the flexible sections, wherein an additional weight, which has an inclined face which surrounds a bonding section and decreases its size toward the bonding section, is bonded on the front surface of the weight section.

Abstract: An object of the present invention is to provide a therapeutic agent for ulcerative colitis which allows 5-aminosalicylic acid (5-ASA) useful as a therapeutic agent for ulcerative colitis to be efficiently delivered to the large intestine of the affected site almost without being absorbed or metabolized in the stomach or the upper part of the small intestine and is safe and can be administered over a long term. The present invention relates to 5-ASA into which D-galactose represented by the following general formula [1] has been introduced. The compound of the present invention can be efficiently delivered to the large intestine of the site of action, and is degraded by the intestinal bacterial flora, whereby 5-ASA as the active ingredient can be produced in the large intestine.

Abstract: One embodiment of an organic electroluminescent element of present invention includes a substrate, a first electrode on the substrate, an organic luminescent medium layer including an organic luminescent layer on the first electrode, a second electrode on the organic luminescent medium layer and barrier film formed on the second electrode. The organic luminescent medium layer is sandwiched between the first electrode and the second electrode. Film density of the barrier film changes in thickness direction.

Abstract: A tactile panel includes a vibration panel, a yoke provided to face the vibration panel, drive coils secured on a circumference of the vibration panel, and a set of permanent magnets arranged between the vibration panel and the yoke. The vibration panel is held by panel holding members, into which both sides of the vibration panel are inserted in a direction substantially perpendicular to a vibration direction of the vibration panel.

Abstract: An input device and a driving device able to be made thin and secure sufficiently large vibration amplitude are provided. The input device comprises an input panel, a current conducting element for conducting a driving current, and a magnetic field application unit for applying a magnetic field on the current conducting element. Both of the current conducting element and the magnetic field application unit are arranged in the peripheral region of the input panel. The magnetic field applied by the magnetic field application unit is parallel to the input panel and intersects the current conducting element. When the input panel is touched, a driving current is fed into the current conducting element, and a force is imposed on the current conducting element and the magnetic field application unit, making them move. This movement further drives the input panel to vibrate. Consequently, input operations can be recognized by feeling the vibration of the input panel.

Abstract: A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around the semiconductor pellet and upper parts of the lead terminals. The plurality of lead terminals are shaped to be elongated strips and are arranged to extend out of the molding member toward the substrate.

Abstract: The present invention provides a pin milling cutter formed by combining a cutter and an adapter to prevent errors in attaching a cutter to the adapter even when the cutter is similar but of a different type and even if the engagement section between the cutter and the adapter are the same. A mounting error prevention mechanism is provided on a main cutter unit and an adapter to prevent an erroneous combination of a cutter and adapter from fitting together normally. The mounting error prevention mechanism includes: a projection and a cavity corresponding to the main cutter unit and the adapter and providing a tapered fit; and a projection and a corresponding groove. The projection can be inserted into the groove only when the cutter and the adapter are combined correctly.

Abstract: An apparatus for measuring the optical characteristics of a colored liquid comprising a transparent plate (5) arranged horizontally, a sampling means (7) capable of collecting the colored liquid and dropping a collected colored liquid onto the transparent plate (5), and a measuring means (10) positioned beneath the transparent plate (5) for measuring the optical characteristics of the dropped colored liquid. This apparatus enables easy and accurate measurement of the optical characteristics of a colored liquid.

Abstract: The present invention is related to a printed matter on which thin film is formed by a printing method. Functional organic thin film is formed in little process with highly precise on a substrate without water absorbing property sectioned by partition walls. According to the current invention, the printing that accuracy is preferable can be achieved only by alignment in only one direction. In addition, yield of manufacture of printed matter is preferable. In addition, configuration of partition wall is configuration that printing plate is easy to approach one part of partition wall. Therefore, ink is transferred surely from printing plate to a substrate. Even more particularly, problem such as disconnection of the functional layer or substrate on partition wall when the functional layer or substrate is laminated on a top face of printed matter can be prevented.

Abstract: A first mark formed simultaneously with the process step for forming a layer of metal interconnects is partly exposed at two parallel side surfaces of the separated semiconductor device or one side surface thereof to have a rectangular shape. This allows the identification of the orientation and product information of the semiconductor device in a small semiconductor device.

Abstract: A semiconductor device provided with one or more semiconductor pellets arranged on the bottom surface of a recess produced along a surface of a semiconductor plate having wirings arranged on the surface thereof, wirings extending toward the surface of the recess, and the recess being buried with a layer of a resin which is inclined to inflate, while it is hardened, resultantly producing a stress in the resin layer to expand toward the side wall of the recess engraved in the semiconductor plate, resultantly preventing breakage from happening for an interface between the side wall of the recess engraved in the semiconductor plate and the surface of the resin layer contacting the side wall, and remarkably improving the thermal conductivity efficiency to reduce the magnitude of a temperature rise of the semiconductor device, resultantly preventing a delay from happening for the operation speed of the semiconductor device.

Abstract: A metal wire for inspection and an electrode for inspection are formed on a region of a semiconductor substrate where a metal wire and an electrode for external connection are not formed. The metal wire for inspection and the electrode for inspection electrically detect an open failure, a short-circuit failure and a leakage failure of the metal wire and a connection failure between an element electrode and the metal wire. A semiconductor wafer is subjected to an electrical test, so that it is possible to detect the aforementioned failures with good accuracy during a manufacturing process.

Abstract: A cryocrucible permits the introduction of ion clusters of a cryogen, like oxygen or nitrogen, to a vacuum chamber, and preferably comprises a liquid cryogen containment vessel connected to an expansion chamber through a solenoid-actuated valve, a cooling means for maintaining the cryogen as a liquid in the containment vessel, and a nozzle connecting the expansion chamber to the vacuum chamber. Liquid evaporates through the valve into the expansion chamber and, then, forms clusters when it expands further while passing through the nozzle into the vacuum chamber.