Abstract: The present disclosure relates generally to depot formulations of lurasidone and methods of making depot formulations of lurasidone. The depot formulations include a suspending agent and are highly syringeable.

Abstract: A method for producing a dental adaptive element for alleviating recession of gingiva around an alveolar socket of a patient includes: obtaining images of a tooth; creating a 3D model having a crown part and a root part based on the images; obtaining a boundary curve on the 3D model between the crown part and the root part; on the root part of the 3D virtual model, obtaining an imaginary surface that protrudes in a direction from the crown part toward the root part; extracting a sub-model from the 3D model by removing a portion of the root part that extends between the imaginary surface and an end of the root part; and producing a dental adaptive element according to the sub-model.

Abstract: A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, antenna elements and a first insulating film. The insulating encapsulant is encapsulating the at least one semiconductor die, the insulating encapsulant has a first surface and a second surface opposite to the first surface. The first redistribution layer is disposed on the first surface of the insulating encapsulant. The second redistribution layer is disposed on the second surface of the insulating encapsulant. The antenna elements are located over the second redistribution layer. The first insulating film is disposed in between the second redistribution layer and the antenna elements, wherein the first insulating film comprises a resin rich region and a filler rich region, the resin rich region is located in between the filler rich region and the second redistribution layer and separating the filler rich region from the second redistribution layer.

Abstract: An electronic device including a pixel array structure, a redistribution structure, and a plurality of conductive via structures is provided. The pixel array structure includes a plurality of signal lines. The redistribution structure overlaps the pixel array structure and includes a plurality of conductive lines. The conductive via structures electrically connect the signal lines of the pixel array structure and the conductive lines of the redistribution structure. At least one of the conductive via structures shares at least one conductive layer with the pixel array structure.

Abstract: A pixel array includes first signal lines, second signal lines, active components, pixel electrodes, and selection lines. The second signal lines are intersected with and electrically insulated to the first signal lines. Each active component is electrically connected to one of the first signal lines and one of the second signal lines. Each pixel electrode is electrically connected to one of the active components. The selection lines are intersected with the first signal lines to form a plurality of first intersections and second intersections. The selection lines are electrically connected to the first signal lines at the first intersections but electrically insulated to the first signal lines at second intersections. The selection lines are electrically insulated to the second signal lines. At least one of the second signal lines is disposed between each selection line and any one of the active components.

Abstract: Chemical liquid is injected into a tank. A concentration of a first gas dissolved in the chemical liquid is detected. Based on the detected concentration of the first gas, at least one of the first gas and a second gas is injected into the tank to sustain at least one of the concentration of the first gas and a concentration of the second gas in a range of a target value.

Abstract: A passive optical network device comprising a casing, printed circuit board, and fiber optic transceiver system is provided. The fiber optic transceiver system comprises a fiber optic components device, fiber optic transceiver, and RF connector. During operation, the fiber optic components device converts optical signals from the fiber optic transceiver to digital signals, and then transmits the converted digital signals to external electronic systems via the hot-pluggable transceiver connection interface. The fiber optic components device converts digital signals from the external electronic systems to optical signals, and then transmits the optical signals to other external electronic systems via the fiber optic transceiver. The RF connector transmits RF signals from additional external electronic systems to the external electronic systems via the hot-pluggable transceiver connection interface.

Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.

Abstract: The various implementations described herein include methods, devices, and systems for automatic audio equalization. In one aspect, a method is performed at an audio device having one or more processors, memory, and a plurality of device interface elements, including one or more speakers and a plurality of microphones. The method includes: (1) detecting a change in orientation of the audio device from a first orientation to a second orientation; and (2) in response to detecting the change in orientation, configuring operation of two or more of the plurality of device interface elements.

Abstract: A method for producing an adaptive element for dental implantation includes: obtaining images of a tooth and creating a 3D model based thereon; obtaining a boundary curve on the 3D model between crown and root parts thereof; defining a cutting line on the root part perpendicular to an axis of the 3D model and spaced apart from the boundary curve; extracting a sub-model from the 3D model with reference to the boundary curve and the cutting line; forming a tubular model from the sub-model by removing all that corresponds to the crown part and hollowing out the sub-model such that the tubular model has a predetermined thickness in radial directions transverse to the axis; and producing the adaptive element according to the tubular model.

Abstract: A shelf board is for being disposed on a cart including a plurality of column members and at least one decoration member. The shelf board includes a bottom board and a lateral wall. The lateral wall is connected to the bottom board to enclose a receiving space therebetween. The shelf board further has at least one engaging unit. The at least one engaging unit is adapted for connecting to a member for connecting. The member for connecting is one of the plurality of the column members or the at least one decoration member. A cart including the shelf board is also provided.

Abstract: A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, antenna elements and a first insulating film. The insulating encapsulant is encapsulating the at least one semiconductor die, the insulating encapsulant has a first surface and a second surface opposite to the first surface. The first redistribution layer is disposed on the first surface of the insulating encapsulant. The second redistribution layer is disposed on the second surface of the insulating encapsulant. The antenna elements are located over the second redistribution layer. The first insulating film is disposed in between the second redistribution layer and the antenna elements, wherein the first insulating film comprises a resin rich region and a filler rich region, the resin rich region is located in between the filler rich region and the second redistribution layer and separating the filler rich region from the second redistribution layer.

Abstract: A layer board is provided for being disposed on a cart, the cart includes a plurality of columns and a plurality of roller assemblies, the layer board has at least one assembly unit, and the assembly unit is a shared structure which can be engaged with one said column or one said roller assembly. The cart having the layer board is further provided.

Abstract: A method for scanning multiple barcodes is provided. A tag template, recording a predetermined number of barcode forms and relative configuration orientations of the predetermined number of barcode forms, is read. The tag is photographed to obtain a tag image of the tag, wherein a surface of the tag includes a plurality of barcodes. The tag image is analyzed to obtain barcode patterns of the barcodes in the tag image, and barcode types and relative coordinates of the barcode patterns. The barcode types of the barcode patterns and the relative coordinates of the barcode patterns are detected according to the tag template to identify from the barcode patterns a predetermined number of barcode patterns to be outputted matching the tag template. The barcode patterns to be outputted are decoded to obtain information respectively represented by the barcode patterns to be outputted, and the information obtained is outputted.

Abstract: A conductive structure includes a first wire, a second wire, and a conductive pillar. The second wire is disposed over the first wire and intersected with the first wire. The conductive pillar is disposed between the first wire and the second wire. A bottom surface area of the conductive pillar is greater than an area at which the first wire overlaps the conductive pillar.