Abstract: Provided herein are methods of making trinucleotides and tetranucleotides for use as 5? mRNA caps. The methods utilize a novel “top-down” strategy and provide for synthesis of oligonucleotides with higher yields and increased efficiency compared to traditional methods. A key step of the methods disclosed, herein can also be adapted to utilize a “one-pot” approach, resulting in an increase in the yield of the final oligonucleotide product.

Abstract: The present disclosure provides novel pladienolide compounds, pharmaceutical compositions containing such compounds, and methods for using the compounds as therapeutic agents. These compounds may be useful in the treatment of cancers, particularly cancers in which agents that target the spliceosome and mutations therein are known to be useful. Also provided herein are methods of treating cancers by administering at least one compound disclosed herein and at least one additional therapy.

Abstract: The present disclosure is related to providing a polyamic acid that can form a polyimide exhibiting a low dielectric property and high heat resistance and that has good film formability, and a polyamic acid composition, polyimide, polyimide film, and printed circuit board that are produced by using this polyamic acid. A polyamic acid that is a product obtained by polyaddition reaction between a tetracarboxylic dianhydride (A) and at least two diamines (B), wherein the at least two diamines (B) contain a diamine having a fluorene skeleton (B1) and a dimer diamine (B2).

Abstract: The present disclosure is related to providing a polyamic acid that can form a polyimide exhibiting a low dielectric property and a low hygroscopic property, and a polyamic acid composition, polyimide, polyimide film, and printed circuit board that are produced by using the polyamic acid. A polyamic acid that is a product obtained by polyaddition reaction between an ester-type acid dianhydride (A) and at least two diamines (B), wherein a dimer diamine (B1) is contained at a molar ratio of 0.3 or more relative to an entirety of the diamine component.

Abstract: An optical fiber connection structure according to the present invention includes a fiber support member configured to support an optical fiber to be optically connected to an optical waveguide device, a stopper configured to restrict movement in an axial direction of the optical fiber supported by the fiber support member, and a lens disposed on an optical axis between an end surface of the optical waveguide device and the optical fiber.

Abstract: A mobile device (10) is a mobile device (10) that operates in order to image a subject (5), the mobile device (10) including an imaging unit (13), a sensor (14) that recognizes a surrounding environment, and a light emitting unit (15) disposed on a housing (12) in a ring shape or on the entire surface of the housing (12). The operation of the mobile device (10) includes imaging, based on a set photographing plan, with the imaging unit (13), the subject (5) recognized by the sensor (14) as the mobile device (10) moves. The light emitting unit (15) performs a light emission expression corresponding to at least one of the photographing plan and the operation of the mobile device (10).

Abstract: An analysis apparatus includes a setting device configured to set information on a structure of an optical connection structure, a solution device configured to solve a partial differential equation having, as an unknown, an electromagnetic field distributed in the optical connection structure based on the information on the structure of the optical connection structure to determine a distribution of the electromagnetic field, a data extraction device configured to extract, from the distribution of the electromagnetic field determined by the solution device, a mode distribution in a plane at a predetermined position of the optical connection structure and a time response of an electromagnetic field at a predetermined position of the optical connection structure, and a characteristics analysis device configured to analyze optical characteristics of the optical connection structure based on the mode distribution and the time response of the electromagnetic field extracted by the data extraction device.

Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.

Abstract: The present disclosure provides novel pladienolide compounds, pharmaceutical compositions containing such compounds, and methods for using the compounds as therapeutic agents. These compounds may be useful in the treatment of cancers, particularly cancers in which agents that target the spliceosome and mutations therein are known to be useful. Also provided herein are methods of treating cancers by administering at least one compound disclosed herein and at least one additional therapy.

Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.

Abstract: A cooling device includes a container in which refrigerant is sealed. The container includes; a heat reception plate that forms part of the container and that receives heat from a heat generating element; an evaporator that causes the refrigerant in a liquid phase to evaporate with heat reception in the container; a condenser that causes the refrigerant in a gas phase to condense with heat dissipation in the container; and a plurality of recessed portions formed in a surface of the heat reception plate inside the container.

Abstract: A liquid cooling module includes a heat-receiver, an inlet-passage in which a flow-path through which the liquid-refrigerant flowed from an inlet flows is formed, a first flow-passage in which the flow-path continues from the inlet-passage, and that is formed as spreading in a fan-like shape as viewed in a normal-direction of a heat-receiving-surface, a second flow-passage in which the flow-path continues from the first flow-passage, and that is formed toward the heat-receiver in the normal-direction, a diffuser in which grooves that continue from the second flow-passage in the heat-receiver and diffuses the liquid-refrigerant along a surface on an opposite side of the heat-receiving-surface is formed, a third flow-passage in which the flow-path continues from the grooves, and that is formed in the normal-direction and a direction in which the flow-path is separating from the heat-receiver, and an outlet-passage in which the flow-path continues from the third flow-passage to an outlet.

Abstract: A heat sink comprises a bottom plate and a plurality of fins. The bottom plate is formed in a T-shape of a head portion and a body portion and includes a coupling region in which the body portion is thermally coupled to a heat generation element; and the plurality of fins that are erected at the head portion and the body portion of the bottom plate and extend in a direction from the head portion toward the body portion. With the plurality of fins, a pressure loss of first air which flows through a center portion of the head portion is smaller than a pressure loss of second air which flows through a side portion of the head portion in a case where air flows between the plurality of fins along the direction.

Abstract: A method for manufacturing a semiconductor device includes forming a support on a side surface of a stack that extends from a substrate. The stack includes a second sacrificial film, plural first sacrificial films and plural silicon (Si)-containing films, wherein one first sacrificial film of the plural sacrificial films is stacked upon the second sacrificial film and the plural sacrificial films and the plural Si-containing films are alternately stacked upon one another, and at least a side of the second sacrificial film is not covered by the support, the one first sacrificial film and the substrate. The method further includes removing the second sacrificial film from the stack to form a space between the substrate and the one first sacrificial film and adjacent to the support, and filling the space with a dielectric film.

Abstract: A method for manufacturing a semiconductor device includes supplying a silicon-containing gas to a substrate having a recess formed in a surface of the substrate to deposit a silicon film in the recess, supplying, to the substrate, a first etching gas having a first etching profile in which an amount of etching for an upper portion of the recess in a depth direction and an amount of etching for a lower portion of the recess in the depth direction are different from each other, to etch the silicon film in the recess, supplying, to the substrate, a second etching gas having a second etching profile that is different from the first etching profile of the first etching gas to etch the silicon film in the recess, and additionally depositing the silicon film on the already deposited silicon film etched by the second etching gas.

Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporation circuit that evaporates the refrigerant in a liquid phase inside the container by heat reception; a condensation circuit that condenses the refrigerant in a gas phase inside the container by heat radiation; a transport circuit that transports the refrigerant in the liquid phase inside the container to the evaporation circuit by a capillary phenomenon; a heat radiation member that includes fins, and includes a narrow portion that has a width in a direction orthogonal to a flow direction of cooling air that is narrow on a downstream side in the flow direction, and a wide portion that has the width that is wide on an upstream side in the flow direction; and an air guide member that is provided on the downstream side of the wide portion and on the upstream side of the narrow portion.

Abstract: A cleaning device includes a cleaning blade, a supporting portion, a housing, and a blade pressing spring. The blade pressing spring includes a first coil portion formed of a single wire material and provided between the supporting portion and the housing so as to capable of being expanded and contracted, a second coil portion provided between the supporting portion and the housing so as to be capable of being expanded and contracted, and a connecting portion connecting the first coil portion and the second coil portion. The first coil portion and the second coil portion are disposed side by side with respect to a direction crossing a center axis direction of the first coil portion.

Abstract: A cooling device includes: a downstream heat radiation member that includes a plurality of downstream fins; and an upstream heat radiation member that is arranged on an upstream side in a flow direction of cooling air with a gap from the downstream heat radiation member, includes a plurality of upstream fins, and is provided with a low pressure loss portion in which pressure loss is lower than pressure loss in another portion in one portion in a fin arrangement direction orthogonal to the flow direction.

Abstract: A cooling device including: a container in which a refrigerant is sealed; a plurality of evaporation structures that evaporate the refrigerant in a liquid phase inside the container by heat reception; a plurality of condensation structures each of which is provided in corresponding one of the plurality of evaporation units and which condenses the refrigerant in a gas phase inside the container by heat radiation; a transport structure that transports the refrigerant in the liquid phase from the condensation units to the evaporation units by surface tension; and a movement portion that communicates the plurality of condensation units such that the refrigerant in the liquid phase is movable between the plurality of condensation structures.

Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.