Abstract: A defect inspection method comprising: picking up an image of a subject under inspection to thereby acquire an inspection image; extracting multiple templates corresponding to multiple regions, respectively from design data of the subject under inspection; finding a first misregistration amount between the inspection image and the design data using a first template as any one template selected from among the plural templates; finding a second misregistration amount between the inspection image and the design data using a second template other than the first template, the second template being selected from among the plural templates, and the first misregistration-amount; and converting the design data, misregistration thereof being corrected using the first misregistration-amount, and the second misregistration-amount, into a design data image, and comparing the design data image with the inspection image to thereby detect a defect of the subject under inspection.

Abstract: It is possible to improve an image quality of an ultrasonographic device and improve visibility of a tissue structure and a lesion. According to a noise amount estimated for each of at least two resolution levels and reliability of the noise amount estimation, a corrected noise amount is calculated. An intensity conversion is performed on a decomposition coefficient obtained by a multi-resolution decomposition process using the corrected noise amount. Moreover, by performing intensity conversion of the respective decomposition coefficients according to a plurality of decomposition coefficients, it is possible to generate a high-quality image. Furthermore, by switching processing parameters in accordance with the imaging condition, the image type, and the imaging object, it is possible to simultaneously realize the processing time and the image quality appropriate for the purpose.

Abstract: A charged particle orbit control device (100) is used in a ring-shaped charged particle accelerator or a charged particle storage ring. The charged particle orbit control device (100) is configured to enable the orbit of a charged particle to return to the original orbit in multiple cycles. The charged particle orbit control device (100) includes multiple bending magnets (1) that bend the charged particle (3). In the charged particle orbit control device (100), the bending angle and relative position of each bending magnet (1) are prescribed such that every time the charged particle (3) passes through, the orbit of the charged particle (3) in each bending magnet (1) alternately switches between two orbits.

Abstract: A model based measurement method is capable of estimating a cross-sectional shape by matching various pre-created cross-sectional shapes with a library of SEM signal waveforms. The present invention provides a function for determining whether or not it is appropriate to create a model of a cross-sectional shape or a function for verifying the accuracy of estimation results to a conventional model based measurement method, wherein a solution space (expected solution space) is obtained by matching library waveforms and is displayed before measuring the real pattern by means of model based measurement. Moreover, after the real pattern is measured by means of model based measurement, the solution space (real solution space) is obtained by matching the real waveforms with the library waveforms and is displayed.

Abstract: An apparatus for medical diagnostic imaging assistance includes memory that stores first feature information representing the feature of a lesion mask or non-lesion mask, a sampling unit that acquires a plurality of samples by making sampling form the memory based on the first feature information, a machine-learning unit that generates a first discrimination condition corresponding to each of samples by carrying out a machine-learning step on the multiple samples, and a statistical processing unit that generates a second discrimination condition by carrying out a statistical processing step under the first discrimination condition, in which a detection function determines whether a lesion candidate mask is an actual lesion by referring to second feature information representing the feature of a lesion candidate mask under a second discrimination condition.

Abstract: A robot apparatus includes an output unit that displays an image including an object on a screen, an input unit that receives an operation performed by a user for specifying information relating to an approximate range including the object in the image, an object extraction unit that extracts information regarding a two-dimensional contour of the object on the basis of the specification received by the input unit, and a position and attitude estimation unit that estimates information regarding a three-dimensional position and attitude of the object on the basis of the information regarding the two-dimensional contour.

Abstract: In order to provide a technique for performing global alignment (detecting position shift and rotation of a wafer) stably and automatically using an optical microscope, as a pattern for global alignment, multiple alignment pattern candidates are calculated (107), multiple data for matching are created for each alignment pattern (108), matching is performed with respect to the data for matching for each alignment pattern in descending order of appropriateness as an alignment pattern with an image (113) based on an image signal from the optical microscope (114), and the amount of position shift and the amount of rotation of the wafer are calculated (116) on the basis of the results of matching (115).

Abstract: A controller of a cellular phone acquires data of a date and a time when an object is captured from a clock part, in addition to image data of the object captured in an image capture mode by a camera part, and stores those data as image capture date data and image capture time data in a storage part in association with the image data in addition to the image data. Furthermore, when image capture date data of the image data stored in the storage part match date data outputted from the clock part in a standby mode, then the controller reads the image data and the image capture date and the image capture time corresponding to the image data from the storage part and controls a display part to display the image data with superimposing the image capture date and the image capture time thereon. The image data is displayed on the display part while the image capture date and the image capture time corresponding to the image data are superimposed on the image data.

Abstract: To enable SEM-based management of a cross-sectional shape or manufacturing process parameters of a semiconductor device pattern to be measured, the association between the shape or parameters and SEM image characteristic quantities effective for estimating the shape or parameters is saved as learning data. The image characteristic quantities are collated with learning data to estimate the shape or to monitor the process parameters. Accuracy and reliability is achievable by calculating three kinds of reliability (reliability of the image characteristic quantities, reliability of estimation engines, and reliability of estimating results) based on the distribution of the image characteristic quantities and then judging whether additional learning is necessary, or selecting and adjusting image characteristic quantities and estimation engine based on the reliability.

Abstract: The present invention is for providing a scanning electron microscope system adapted to output contour information fitting in with the real pattern edge end of a sample, and is arranged to generate a local projection waveform by projecting the scanning electron microscope image in the tangential direction with respect to the pattern edge at each point of the pattern edge of the scanning electron microscope image, estimate the cross-sectional shape of the pattern transferred on the sample by applying the local projection waveform generated at each point to a library, which has previously been created, correlating the cross-sectional shape with the electron beam signal waveform, obtain position coordinate of the edge end fitting in with the cross-sectional shape, and output the contour of the pattern as a range of position coordinates.

Abstract: In the case where a specimen is imaged by a scanning electron microscope, it is intended to acquire an image of a high quality having a noise component reduced, thereby to improve the precision of an image processing. The intensity distribution of a beam is calculated on the basis of an imaging condition or specimen information, and an image restoration is performed by using a resolving power deterioration factor other than the beam intensity distribution as a target of a deterioration mode, so that a high resolving power image can be acquired under various conditions. In the scanning electron microscope for semiconductor inspections and semiconductor measurements, the restored image is used for pattern size measurement, defect detections, defect classifications and so on, so that the measurements can be improved in precision and so that the defect detections and classifications can be made high precise.

Abstract: Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method.

Abstract: In order to acquire high resolution ultrasound images while maintaining an appropriate frame rate in ultrasound diagnostic devices, the disclosed method generates high resolution ultrasound images by performing image reconstruction on the basis of multiple ultrasound frame images captured along a time series and the magnitudes of positional shifts, or forms high resolution ultrasound images by performing image reconstruction on the basis of multiple ultrasound frame images acquired by controlling the ultrasound probe and varying scan orientation or scan focal length frame by frame.

Abstract: A lubricating device includes an lubricant impregnation member to coat a surface of a target member with lubricant, an lubricant supply member to supply lubricant to the lubricant impregnation member, a subsidiary roller to feed the lubricant impregnation member out, a main roller to reel in the lubricant impregnation member fed by the subsidiary roller, a drive motor to drive the main roller, an encoder disc provided at a rotational shaft of the subsidiary roller, an encoder sensor to detect a rotational state of the encoder disc, and a controller unit to calculate an outer diameter of the main roller and a portion of the lubricant impregnation member reeled by the main roller, based on a number of drive steps of the drive motor during a detection interval of the encoder disc.

Abstract: Conventional detergents for lithography which contain a surfactant as an active ingredient should have a reduced surfactant concentration because heightened surfactant concentrations result in dissolution of the resin component of a photoresist composition and hence in a dimensional change of a resist pattern. However, the conventional detergents have had a drawback that such a low concentration unavoidably reduces the ability to inhibit pattern falling and defect occurrence. A detergent for lithography is provided which is an aqueous solution containing (A) at least one member selected among nitrogenous cationic surfactants and nitrogenous ampholytic surfactants and (B) an anionic surfactant. This detergent retains a low surface tension even when it has a low concentration. It is effective in inhibiting pattern falling and defect occurrence. It can also inhibit resist patterns from fluctuating in dimension.

Abstract: A charged particle beam device enabling prevention of degradation of reproducibility of measurement caused by an increase of the beam diameter attributed to an image shift and having a function of dealing with device-to-device variation. The charged particle beam device is used for measuring the dimensions of a pattern on a specimen using a line profile obtained by detecting secondary charged particles emitted from the specimen when the specimen is scanned with a primary charged particle beam converged on the specimen. A lookup table in which the position of image shift and the variation of the beam diameter are associated is prepared in advance by actual measurement or calculation and registered. When the dimensions are measured, image processing is carried out so as to correct the line profile for the variation of the beam diameter while the lookup table is referenced, and thereby the situation where the beam diameter is effectively equal is produced irrespective of the position of the image shift.

Abstract: A method is provided for estimating a cross-sectional shape or for monitoring manufacturing process parameters of a semiconductor device pattern to be measured. In this method, in order to enable SEM-based management of the cross-sectional shape or manufacturing process parameters of the pattern to be measured, the association between the cross-sectional shape or process parameters of the pattern and SEM image characteristic quantities effective for estimating the cross-sectional shape or process parameters of the pattern, is saved as learning data, and then the image characteristic quantities that have been calculated from a SEM image of the pattern are collated with the learning data to estimate the cross-sectional shape or to monitor process parameters of the pattern.

Abstract: Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method.

Abstract: In a process of acquiring an image of semiconductor patterns by using a scanning electron microscope (SEM), this invention provides an image generating method and device that allows a high-resolution SEM image to be produced while suppressing damages caused by SEM imaging to a sample as a result of irradiation of an electron beam. A plurality of areas having similarly shaped patterns (similar areas) are extracted from a low-resolution SEM image which has been imaged while suppressing the irradiation energy of electron beam. From the image data of the extracted areas a single high resolution image of the patterns is generated by image restoration processing. Further, the method of this invention also uses design data in determining the similar areas and the SEM imaging position and imaging range for performing the image restoration processing.

Abstract: An apparatus and method for inspecting a defect of a circuit pattern formed on a semiconductor wafer includes a defect classifier have a comparison shape forming section for forming a plurality of comparison shapes corresponding to an SEM image of an inspection region by deforming the shape of the circuit pattern in accordance with a plurality of shape deformation rules using design data corresponding to the circuit pattern within the inspection region and a shape similar to the SEM image of the inspection region out of the plurality of comparison shapes formed and selected as the comparison shape, and a shape comparing and classifying section for classifying the SEM image using information of the comparison shape selected in the comparison shape forming section and the inspection shape of the circuit pattern of the SEM image of the inspection region.