Abstract: Provided is a robot apparatus including actuators for driving joint shafts and measuring at least one of a joint angle and a joint angle speed of each of the joint shafts, and a central control part for controlling each of the actuators, wherein the central control part performs a periodic communication at predetermined control periods and the periodic communication includes transmitting a desired control value from the central control part to each of the actuators and transmitting a measured value from each of the actuators to the central control part, the central control part stops the periodic communication in response to an occurrence of an actuator that has failed to receive the measured value during a given period of time, and each of the actuators performs a safety stop in response to an event where the actuator has not received the desired control value during a given period of time.

Abstract: The invention relates to a technique of improving a contrast of a lower-layer pattern in a multi layer by synthesizing detected signals from a plurality of detectors by using an appropriate allocation ratio in accordance with pattern arrangement. In a charged particle beam device capable of improving image quality by using detected images obtained from a plurality of detectors and in a method of improving the image quality, a method of generating one or more output images from detected images corresponding to respective outputs of the detectors that are arranged at different locations is controlled by using information of a pattern direction, an edge strength, or others calculated from a design data or the detected image.

Abstract: In the dimension measurement of a circuit pattern using a scanning electron microscope (SEM), in order to make it possible to automatically image desired evaluation points (EPs) on a sample, and automatically measure the circuit pattern formed at the evaluation points, according to the present invention, in the dimension measurement of a circuit pattern using a scanning electron microscope (SEM), it is arranged that coordinate data of the EP and design data of the circuit pattern including the EP are used as an input, creation of a dimension measurement cursor for measuring the pattern existing in the EP and selection or setting of the dimension measurement method are automatically performed based on the EP coordinate data and the design data to automatically create a recipe, and automatic imaging/measurement is performed using the recipe.

Abstract: There is provided a parallel computer system for performing barrier synchronization using a master node and a plurality of worker nodes based on the time to allow for an adaptive setting of the synchronization time. When a task process in a certain worker node has not been completed by a worker determination time, the particular worker node performs a communication to indicate that the process has not been completed, to a master node. When the communication has been received by a master determination time, the master node performs a communication to indicate that the process time is extended by a correction process time, in order to adjust and extend the synchronization time. In this way, it is possible to reduce the synchronization overhead associated with the execution of an application with a relatively large variation in the process time from a synchronization point to the next synchronization point.

Abstract: Design data and sample characteristic information corresponding to individual areas on the design data are used to perform an image quality improvement operation to make appropriate improvements on image quality according to sample characteristic corresponding to the individual areas on the image, allowing a high speed area division on the image. Further, the use of a database that stores image information associated with the design data allows for an image quality improvement operation that automatically emphasizes portions of the image that greatly differ from past images of the similar design data.

Abstract: (1) part or all of the number, coordinates and size/shape and imaging sequence of imaging points each for observation, the imaging position change method and imaging conditions can be calculated automatically from CAD data, (2) a combination of input information and output information for imaging recipe creation can be set arbitrarily, and (3) decision is made of imaging or processing at an arbitrary imaging point as to whether to be successful/unsuccessful and in case a failure is determined, a relief process can be conducted in which the imaging point or imaging sequence is changed.

Abstract: In the case where a specimen is imaged by a scanning electron microscope, it is intended to acquire an image of a high quality having a noise component reduced, thereby to improve the precision of an image processing. The intensity distribution of a beam is calculated on the basis of an imaging condition or specimen information, and an image restoration is performed by using a resolving power deterioration factor other than the beam intensity distribution as a target of a deterioration mode, so that a high resolving power image can be acquired under various conditions. In the scanning electron microscope for semiconductor inspections and semiconductor measurements, the restored image is used for pattern size measurement, defect detections, defect classifications and so on, so that the measurements can be improved in precision and so that the defect detections and classifications can be made high precise.

Abstract: The present invention is for providing a scanning electron microscope system adapted to output contour information fitting in with the real pattern edge end of a sample, and is arranged to generate a local projection waveform by projecting the scanning electron microscope image in the tangential direction with respect to the pattern edge at each point of the pattern edge of the scanning electron microscope image, estimate the cross-sectional shape of the pattern transferred on the sample by applying the local projection waveform generated at each point to a library, which has previously been created, correlating the cross-sectional shape with the electron beam signal waveform, obtain position coordinate of the edge end fitting in with the cross-sectional shape, and output the contour of the pattern as a range of position coordinates.

Abstract: A charged particle beam device enabling prevention of degradation of reproducibility of measurement caused by an increase of the beam diameter attributed to an image shift and having a function of dealing with device-to-device variation. The charged particle beam device is used for measuring the dimensions of a pattern on a specimen using a line profile obtained by detecting secondary charged particles emitted from the specimen when the specimen is scanned with a primary charged particle beam converged on the specimen. A lookup table in which the position of image shift and the variation of the beam diameter are associated is prepared in advance by actual measurement or calculation and registered. When the dimensions are measured, image processing is carried out so as to correct the line profile for the variation of the beam diameter while the lookup table is referenced, and thereby the situation where the beam diameter is effectively equal is produced irrespective of the position of the image shift.

Abstract: In a panoramic image construction technology of dividing a wide-range imaging area (EP) of semiconductor patterns into a plurality of imaging areas (SEP), and joining a group of images, which are obtained by imaging the SEPs using an SEM, through image processing, a fact that although a pattern serving as a key to joining is not contained in an overlap area between some of the SEPs, all the images can be joined in some cases is noted so that: although the number of patterns serving as keys to joining is small, SEPs whose images are all joined can be determined; or even if such SEPs cannot be determined, SEPs satisfying user's request items as many as possible can be determined. The cases are extracted by optimizing an SEP arrangement, whereby the number of cases in which SEPs whose images are all joined can be determined is increased.

Abstract: A high-performance image quality improvement process, capable of improving the image quality of low-definition areas (lower layer patterns in a multilayer, bottoms of holes in a hole pattern, etc.), is performed to a captured image. Definition enhancement intensity is calculated using height information included in design data or estimate values of sample height information calculated from the captured image, and the image quality improvement process is performed to the captured image using the definition enhancement intensity.

Abstract: (1) part or all of the number, coordinates and size/shape and imaging sequence of imaging points each for observation, the imaging position change method and imaging conditions can be calculated automatically from CAD data, (2) a combination of input information and output information for imaging recipe creation can be set arbitrarily, and (3) decision is made of imaging or processing at an arbitrary imaging point as to whether to be successful/unsuccessful and in case a failure is determined, a relief process can be conducted in which the imaging point or imaging sequence is changed.

Abstract: Provided is a torque detection apparatus including a base portion, a drive portion, and a detection portion. The drive portion includes a rotor having a main axis in a direction of a first axis, and a stator configured to rotate the rotor around the main axis. The detection portion includes a strain body and a detection element. The strain body includes a first end portion to be fixed to the base portion and a second end portion to be fixed to the rotor, and is arranged concentrically with the rotor. The detection element is provided to the strain body so as to detect a strain of the strain body around the first axis with respect to the base portion.

Abstract: In an ultrasonic diagnosis device, while a signal component is preserved, a factor of degrading image quality such as a flicker of a noise is suppressed. An input image is separated into a signal component image and a noise component image. After frame synthesis processing is performed on the noise component image, the signal component image is synthesized with the noise component image having undergone the frame synthesis. Thus, the noise is suppressed. Otherwise, after the input image is separated into the signal component image and noise component image, the frame synthesis processing is performed on the signal component image. The noise component image is then synthesized with the signal component image having undergone the frame synthesis. Thus, discernment of a signal can be improved.

Abstract: The present invention is for providing a scanning electron microscope system adapted to output contour information fitting in with the real pattern edge end of a sample, and is arranged to generate a local projection waveform by projecting the scanning electron microscope image in the tangential direction with respect to the pattern edge at each point of the pattern edge of the scanning electron microscope image, estimate the cross-sectional shape of the pattern transferred on the sample by applying the local projection waveform generated at each point to a library, which has previously been created, correlating the cross-sectional shape with the electron beam signal waveform, obtain position coordinate of the edge end fitting in with the cross-sectional shape, and output the contour of the pattern as a range of position coordinates.

Abstract: In order to obtain a quality image without deterioration owing to radiation noise in inspection using the optical video camera in high radiation environment, an inspection apparatus is formed of an image pick-up unit, an image obtaining unit which fetches a video image that contains a signal (noise) that is substantially independent of each frame obtained by the image pick-up unit, a local alignment unit which locally aligns frames with different time phases for forming the image fetched by the image obtaining unit, a frame synthesizing unit which synthesizes the plurality of frames aligned by the local alignment unit for generating a synthesis frame with an SN ratio higher than the SN ratio of the frame before frame synthesis, and an image output unit for displaying or recording the image formed of the synthesis frame generated by the frame synthesizing unit.

Abstract: In the case where a specimen is imaged by a scanning electron microscope, it is intended to acquire an image of a high quality having a noise component reduced, thereby to improve the precision of an image processing. The intensity distribution of a beam is calculated on the basis of an imaging condition or specimen information, and an image restoration is performed by using a resolving power deterioration factor other than the beam intensity distribution as a target of a deterioration mode, so that a high resolving power image can be acquired under various conditions. In the scanning electron microscope for semiconductor inspections and semiconductor measurements, the restored image is used for pattern size measurement, defect detections, defect classifications and so on, so that the measurements can be improved in precision and so that the defect detections and classifications can be made high precise.

Abstract: An apparatus and method for inspecting a defect of a circuit pattern formed on a semiconductor wafer includes a defect classifier have a comparison shape forming section for forming a plurality of comparison shapes corresponding to an SEM image of an inspection region by deforming the shape of the circuit pattern in accordance with a plurality of shape deformation rules using design data corresponding to the circuit pattern within the inspection region and a shape similar to the SEM image of the inspection region out of the plurality of comparison shapes formed and selected as the comparison shape, and a shape comparing and classifying section for classifying the SEM image using information of the comparison shape selected in the comparison shape forming section and the inspection shape of the circuit pattern of the SEM image of the inspection region.

Abstract: This invention relates to a SEM system constructed to create imaging recipes or/and measuring recipes automatically and at high speed, and improve inspection efficiency and an automation ratio, and to a method using the SEM system; a method for creation of imaging recipes and measuring recipes in the SEM system is adapted to include, in a recipe arithmetic unit, the steps of evaluating a tolerance for an imaging position error level at an evaluation point, evaluating a value predicted of the imaging position error level at the evaluation point when any region on circuit pattern design data is defined as an addressing point, and determining an imaging recipe and a measuring recipe on the basis of a relationship between the tolerance for the imaging position error level at the evaluation point and the predicted value of the imaging position error level at the evaluation point.

Abstract: An imaging region of a high-magnification reference image capable of being acquired in a low-magnification field without moving a stage from a position at which a defective region has been imaged at a low magnification is searched for and if the search is successful, an image of the imaging region itself is acquired and the high-magnification reference image is acquired. If the search is unsuccessful, the imaging scheme is switched to that in which the high-magnification reference image is acquired from a chip adjacent to the defective region.