Patents by Inventor C. Chu

C. Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7120392
    Abstract: A method for providing power control to a uplink signal, comprising an uplink station transmitting an uplink signal to a satellite. The satellite also transmits a loopback signal representing the received uplink signal back to the uplink station. The satellite also transmits a beacon signal to the uplink station. The uplink station adjusts the power of the uplink signal based on measurements of the beacon signal and the uplink signal.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: October 10, 2006
    Assignee: Glowlink Communications Technology, Inc.
    Inventors: Jeffrey C. Chu, Michael L. Downey
  • Patent number: 7117349
    Abstract: A method and system for managing a secure configuration of a server blade on a network. The server blade has a Remote Supervisor Adapter (RSA) card, which contains a list of trusted Dynamic Host Configuration Protocol (DHCP) servers. A remote manager, which communicates with the RSA card via a hyper-secure network, maintains the list of trusted DHCP servers on the RSA card. When the server blade broadcasts a request for configuration parameters to join the network, a response offer is returned from a DHCP server. If the responding DHCP server is not on the list of trusted DHCP servers contained in the RSA card, then the offer is refused, and another DHCP server's offer is evaluated.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: October 3, 2006
    Assignee: International Business Machines Corporation
    Inventors: Simon C. Chu, Richard A. Dayan, James L. Matlock, David B. Rhoades
  • Patent number: 7114068
    Abstract: A method and system for managing a secure network boot of a server blade. The server blade is part of a server blade chassis, which holds multiple server blades that communicate with outside devices via a Pre-boot eXecution Environment (PXE) enabled network interface card. When a server blade receives a response from a PXE boot server offering a boot program download, a Remote Supervisory Adapter (RSA) card, managed by a remote manager, compares the identity of the responding PXE boot server with a list of trusted PXE boot servers. Only if the responding PXE boot server is on the list of trusted PXE boot servers will the server blade be allowed to use a boot program provided by the responding PXE boot server.
    Type: Grant
    Filed: October 31, 2003
    Date of Patent: September 26, 2006
    Assignee: International Business Machines Corporation
    Inventors: Simon C. Chu, Richard A. Dayan, James L. Matlock, David B. Rhoades
  • Patent number: 7114065
    Abstract: A method and system for managing a secure network boot of a server blade. The server blade is part of a server blade chassis, which holds multiple server blades that communicate with outside devices via a Pre-boot eXecution Environment (PXE) enabled network interface card. When a server blade receives a response from a PXE boot server offering a boot program download, a Remote Supervisory Adapter (RSA) card, managed by a remote manager, compares the identity of the responding PXE boot server with a list of trusted PXE boot servers. Only if the responding PXE boot server is on the list of trusted PXE boot servers will the server blade be allowed to use a boot program provided by the responding PXE boot server.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: September 26, 2006
    Assignee: International Business Machines Corporation
    Inventors: Simon C. Chu, Richard A. Dayan, James L. Matlock, David B. Rhoades
  • Patent number: 7106590
    Abstract: A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof via the control valve through the heat exchanger. The second cooling loop provides cooled system coolant to the associated electronics rack, and expels heat in the heat exchanger from the electronics rack to the chilled facility coolant in the first cooling loop. The control valve allows regulation of the facility coolant flow through the heat exchanger, thereby allowing independent control of temperature of the system coolant in the second cooling loop. Various CCU and associated component redundancies of the cooling system are also provided.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: September 12, 2006
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons, Randy J. Zoodsma
  • Patent number: 7104081
    Abstract: System and method are provided for removing condensate from an air-to-liquid heat exchanger of a combined air/liquid enclosed apparatus for cooling rack-mounted electronic equipment. The condensate removal system includes a condensate collector for collecting liquid condensate from the air-to-liquid heat exchanger, and a vaporizing chamber in fluid communication with the condensate collector for receiving collected liquid therefrom. An actively controlled vaporizer vaporizes collected liquid within the vaporizing chamber and a vapor exhaust is in communication with the vaporizing chamber for venting vapor from the vaporizing chamber outside the cabinet containing the combined air/liquid cooling apparatus and rack-mounted electronic equipment.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: September 12, 2006
    Assignee: International Business Machines Corproation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons
  • Patent number: 7086247
    Abstract: A cooling approach is provided for cooling an electronics subsystem, such as an electronics rack. The cooling approach includes a coolant conditioning unit and a thermal capacitor unit. The coolant conditioning unit has a heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop receives facility coolant from a facility coolant source and passes at least a portion thereof to the heat exchanger. The second cooling loop provides system coolant to the electronics subsystem, and expels heat in the heat exchanger from the electronics subsystem to the facility coolant in the first cooling loop. The thermal capacitor unit is in fluid communication with the second cooling loop to maintain temperature of the system coolant within a defined range for a period of time upon shutdown or failure of the facility coolant in the first cooling loop, thereby allowing continued operation of the electronics subsystem.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: August 8, 2006
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K Iyengar, Roger R. Schmidt, Robert E. Simons
  • Patent number: 7088585
    Abstract: A cooling system is provided employing at least two modular cooling units (MCUs). Each MCU is capable of providing system coolant to multiple electronics subsystems to be cooled, and each includes a heat exchanger, a first cooling loop with at least one control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof through the heat exchanger, with the portion being controlled by the at least one control valve. The second cooling loop provides cooled system coolant to the multiple electronics subsystems, and expels heat in the heat exchanger from the multiple electronics subsystems to the chilled facility coolant in the first cooling loop. The at least one control valve allows regulation of facility coolant flow through the heat exchanger, thereby allowing control of temperature of system coolant in the second cooling loop.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: August 8, 2006
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons, Takeshi Tsukamoto
  • Patent number: 7085135
    Abstract: A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar materials with different coefficients of thermal expansion. The heat sink surface has a pattern of channels therein which define multiple heat sink substructures. Each heat sink substructure includes a portion of the heat sink surface. The portions of the heat sink surface are coplanar and provide a reduced distance to neutral point across the heat sink surface. When the portions of the heat sink surface are bonded to the electronic component surface, shear stress within the bond is reduced.
    Type: Grant
    Filed: June 21, 2004
    Date of Patent: August 1, 2006
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Egidio E. Marotta, Prabjit Singh
  • Patent number: 7059389
    Abstract: An integrated cooling unit configured to effect the removal of heat via a circulating liquid coolant includes a reservoir to contain the liquid coolant, a tubing arrangement disposed at an outer surface of the reservoir, a pump disposed within the reservoir, and a fan configured to provide a flow of air across the tubing arrangement to remove the heat. The tubing arrangement is fluidly communicable with a heat exchanging device, and the pump is configured to circulate the liquid coolant through the tubing arrangement to the heat exchanging device.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: June 13, 2006
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons
  • Patent number: 7051032
    Abstract: A method and architecture having components for performing a method comprising the steps of: forming a simple bi-directional communication link between each of the clients and a server; and, transmitting along the communication link at least one of two kinds of messages comprising a first message which is a synchronous query/response, and a second message which is an asynchronous subscription based event notification, to allow arbitrary data structures to be rendered into a standard communication format.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: May 23, 2006
    Assignee: International Business Machines Corporation
    Inventors: Mark C. Chu-Carroll, Michael Karasick, Samuel M. Weber
  • Patent number: 7027989
    Abstract: The invention provides a method and apparatus for transmitting real-time data in a multi-access system which eliminates clipping of the data while reducing transmission delays. The invention can be incorporated in any multi-access system where transmission resources are allocated when there is information to transmit. In a preferred embodiment, the invention is incorporated in a multi-access wireless system for the upstream transmission of voice from a mobile station to a base station. Each speech segment received at the mobile is shortened by appropriate editing and buffered until transmission. By editing and buffering speech segments as they are received, clipping can be eliminated while reducing transmission delays.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: April 11, 2006
    Assignee: Nortel Networks Limited
    Inventors: Indranil Bob Tapadar, Karl D. Mann, Chung-Cheung C. Chu, Pierre P. Gendron
  • Patent number: 7012807
    Abstract: A thermal dissipation assembly and method, and a cooled multi-drawer electronics rack are provided having a first cooling loop and a second cooling loop. The first cooling loop is disposed substantially within an electronics drawer and positioned to extract heat from an electronics module within the drawer. The first cooling loop further includes a first planar heat transfer surface. The second cooling loop is disposed substantially external to the electronics drawer and includes a second planar heat transfer surface. A biasing mechanism mechanically forces the first planar heat transfer surface and the second heat transfer surface coplanar when the electronics drawer is in a docked position in the electronics rack to facilitate the transfer of heat from the first cooling loop to the second cooling loop.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: March 14, 2006
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons
  • Patent number: D518983
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: April 18, 2006
    Inventor: Zooey C. Chu
  • Patent number: D525894
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: August 1, 2006
    Assignee: Longsun Technologies Co., Ltd.
    Inventors: Liang-Chieh Chiang, Pei-Chun Ko, Wan-Jung Wu, Wen-Shou Wang, Yu-Pin Kao, Jack C. Chu
  • Patent number: D529049
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: September 26, 2006
    Inventor: Henry C. Chu
  • Patent number: D529050
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: September 26, 2006
    Inventor: Henry C. Chu
  • Patent number: D529517
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: October 3, 2006
    Inventor: Henry C. Chu
  • Patent number: D529927
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: October 10, 2006
    Inventor: Henry C. Chu
  • Patent number: D529930
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: October 10, 2006
    Inventor: Henry C. Chu