Abstract: Method, system and program product are provided for monitoring coolant within a cooling system designed to provide system coolant to one or more electronics subsystems. The monitoring technique includes employing at least one pressure transducer to obtain multiple pressure measurements related to an amount of coolant within an expansion tank of the cooling system, and determining a rate of volume change of coolant within the expansion tank employing the multiple pressure measurements. Successive pressure measurements can be taken at a known time interval to determine the rate of volume change of coolant within the expansion tank. An automatic determination can also be made on the immediacy of action to be taken for service of the cooling system based on the rate of volume change of coolant within the expansion tank.

Abstract: A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.

Abstract: A cooling apparatus for electronic drawers utilizing a passive fluid cooling loop in conjunction with an air cooled drawer cover. The air cooled cover provides an increased surface area from which to transfer heat to cooling air flowing through the drawer. The increased cooling surface uses available space within the drawer, which may be other than immediately adjacent to a high power device within the drawer. The passive fluid cooling loop provides heat transfer from the high power device to the air cooled cover assembly, allowing placement of the air cooled cover assembly other than immediately adjacent to the high power device. The cooling apparatus is easily disengaged from the electronics drawer, providing access to devices within the drawer.

Abstract: A method of digitizing first and second signals in imperfect quadrature for obtaining characteristic parameters of the first signal comprises providing a first signal, the first signal comprising an inphase quasi-sinusoidal analog signal. The method comprises providing a second signal, the second signal comprising a quadrature signal. The method comprises digitizing the first signal at a sampling rate, thereby generating a first plurality of sets of digital signal waveform samples and digitizing the second signal at the sampling rate, thereby generating a second plurality of sets of digital signal waveform samples. The method comprises digitally processing successive first and second sets of digital signal waveform samples to generate continually updated digital characteristic parameters representing a characteristic behavior of the first signal.

Abstract: An electronic module, substrate assembly, and fabrication method, the assembly providing thermal conduction between an electronic device to be cooled and an aqueous coolant, while maintaining physical separation between the coolant and electronic device. The assembly includes a substrate, one or more electronic devices to be cooled, and a multilayer, impermeable barrier. The multilayer barrier includes a first layer, providing mechanical support for a second layer. The second, thinner layer provides an impermeable barrier, and a high effective thermal conductivity path between an electronic device and a cooling fluid in contact with an upper surface of the second barrier layer. Mechanical stresses are minimized by appropriate material selection for the first layer, and a thin second layer.

Abstract: An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow.

Abstract: A fixation clamp device includes a bracket having two flaps extended from a base plate which has a channel, and a block slidably coupled along the channel of the base plate with a fastener. The block includes a mouth and a port communicating with a bore, a fitting is engaged onto one of the flaps and coupled to the port of the block. A forcing device may force the block against the fitting. A gasket may be engaged between the port of the block and the fitting, and may include one end engaged into the port of the block. One or more further fittings may be selectively engaged onto the bracket, and coupled to the port of the block.

Abstract: One embodiment of a heat sink comprises a metal support member having a groove disposed at a surface thereof and a fin disposed at the groove. The fin comprises a graphite-based material having a metal-based coating disposed thereon, and the fin is retained at the groove via a soldered joint at the metal-based coating and the groove. Another exemplary embodiment of a heat sink comprises a plurality of fins alternatingly arranged with a plurality of spacers. A method of fabricating a heat sink comprises preparing a surface of a graphite-based substrate, removing particulate matter generated from the preparation of the surface of the substrate, applying a metal-based coating at the surface of the substrate, and arranging the substrate to form a heat sink structure.

Abstract: This invention is comprised of a data processing system containing at least one main processor connected to a system bus, a system memory connected to the system bus and accessible to each of the main processors, a tamper mechanism, and a local service processor. The tamper mechanism is configured to change state each time the system is inserted into a slot in a rack enclosure. The local service processor is connected to the tamper mechanism and configured to update an insertion log upon detecting a change in state of the tamper mechanism. The insertion log provides a count and a history of rack insertions to which the system has been subjected. The system may include a non-volatile storage element which is updated exclusively by the local service processor that contains the insertion log. The insertion log may include an insertion counter. In this embodiment, the local service processor is configured to increment the insertion counter upon each insertion.

Abstract: A method and system for load balancing switch modules in a server system and a computer system utilizing the same is disclosed. In a first aspect, the method comprises assigning each of a plurality of servers to a switch module of a plurality of switch modules, such that a number of servers assigned to each of the plurality of switch modules is substantially equal. In a second aspect, a computer system comprises a plurality of servers coupled to a plurality of switch modules, a management module, and a load balancing mechanism coupled to the management module, wherein the load balancing mechanism assigns each of the plurality of servers to a switch module of the plurality of switch modules, such that a number of servers assigned to each of the plurality of switch modules is substantially equal.

Abstract: A method and system for interlocking a plurality of servers to a server system is disclosed. In a first aspect, the method comprises assigning an identifier to each of the plurality of servers, wherein the identifier associates each of the plurality of servers to the server system, thereby defining a plurality of interlocked servers. In a second aspect, a computer system comprises a plurality of servers, a management module coupled to each of the plurality of servers, and an interlock mechanism coupled to the management module, wherein the interlock mechanism assigns to each of the plurality of servers an identifier that associates each of the plurality of servers to the server system, thereby defining a plurality of interlocked servers.

Abstract: A method and system for autonomously rebuilding a failed one of a plurality of servers and a computer system utilizing the same is disclosed. In a first aspect, the method comprises providing a bus for allowing a recovery mechanism to access each of the plurality of servers and utilizing the recovery mechanism to rebuild the failed server onto another server. In a second aspect, the computer system comprises a plurality of servers, a management module for monitoring and managing the plurality of servers, a recovery mechanism coupled to the management module, and a bus coupling the recovery mechanism to each of the plurality of servers, wherein the recovery mechanism rebuilds a failed server onto another of the plurality of servers.

Abstract: A cooling system and method, and a cooled electronics assembly are provided employing a thermal spreader having an inner chamber evacuated and partially filled with a liquid. A phase separator is disposed within the thermal spreader to at least partially divide the inner chamber into a boiling section and a condensing section, while allowing vapor and liquid to circulate between the sections. A heat extraction assembly is disposed at least partially within the inner chamber to extract heat therefrom. When the thermal spreader is coupled to a heat generating component with the boiling section disposed adjacent thereto, liquid within the thermal spreader boils in the boiling section, producing vapor which flows upward from the boiling section and causes liquid to flow into the boiling section from the condensing section, thereby providing circulatory flow between the sections and facilitating removal of heat from the heat generating component.

Abstract: A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.

Abstract: Augmenting air cooling of electronics systems using a cooling fluid to cool air entering the electronics system, and to remove a portion of the heat dissipated by the electronics. A cooled electronics system includes a frame, electronics drawers, fans or air moving devices, and an inlet heat exchanger. A cooling fluid such as chilled water is supplied to the inlet heat exchanger, to cool incoming air below ambient temperature. Fans cause ambient air to enter the system, flow through the inlet heat exchanger, through electronic devices, and exit the system. An optional exhaust heat exchanger further transfers heat dissipated by electronic devices to the cooling fluid. Heat exchangers are pivotally mounted, providing drawer access. Segmented heat exchangers provide access to individual drawers. Heat exchangers are integrated into cover assemblies. Airflow guides such as louvers are provided at inlets and outlets. Cover assemblies provide a degree of acoustic and electromagnetic shielding.

Abstract: A thermoelectric assembly is provided for an electronic device, having a surface with a non-uniform thermal distribution between at least one first region and at least one second region, with the at least one first region having a higher heat flux than the at least one second region. The assembly includes at least one first area of thermoelectric elements and at least one second area of thermoelectric elements, which are configured to align over the at least one first region of higher heat flux, and the at least one second region, respectively, when the assembly is coupled to the device. The at least one first area of thermoelectric elements includes a greater density of thermoelectric elements than the at least one second area of thermoelectric elements for handling the higher heat flux.