Abstract: A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.

Abstract: A method, system and computer program product for remotely booting devices. A deployment server may remotely transmit authentication parameter(s), e.g., public key, secret key, to a service unit configured to establish a private connection between server blades and the deployment server. The service unit may remotely install the authentication parameter(s) onto the server blade(s) to be booted by either the deployment server or another boot server. By the service unit remotely installing the authentication parameter(s) onto the server blade(s), the need to manually install them during each network boot operation may be alleviated. By remotely transmitting authentication parameter(s) instead of manually installing them on the devices to be booted during each network boot operation, the deployment server may be able to generate unique authentication parameter(s), e.g., public/private key pair, secret key, for each network boot operation thereby substantially reducing the exposure to replay attacks.

Abstract: A chair having adjustable height arms includes a rigid chair frame having first and second uprights. A back is attached to the chair frame and includes upper and lower ends. A seat is also attached to the chair frame and is adjacent the lower end of the back. Cantilevered to each of the first and second uprights is an arm assembly that projects outwardly therefrom adjacent opposite sides of the seat. Each arm assembly includes a coupling structure that is releasably engaged with a respective upright and is configured to release from the upright when the arm assembly is tilted upward relative to the respective upright to permit the elevational position of the arm assembly to be adjusted.

Abstract: A method and system for measuring noise and or interference in a communications signal without taking the signal out of service. In the present invention the communications signal is converted from an RF signal into an IF signal. The IF signal is then digitized and stored. The stored signal is processed to determine the interference signal. The interference signal is calculated from an error vector produced by a blind equalizer demodulator. The interference signal is extracted and presented to a user.

Abstract: A system and method for compensating non-linearity of the high-velocity type manifested in heterodyne interferometer position data includes receiving a plurality of groups of digital position values. A plurality of groups of digital phase values from a measurement channel are received. A first group of the digital position values and digital phase values are digitally processed to generate a plurality of block data values. The plurality of block data values are digitally processed to generate at least one quasi-static non-linearity parameter. A second group of the digital position values are compensated based on the at least one quasi-static non-linearity parameter.

Abstract: This invention is comprised of a data processing system containing at least one main processor connected to a system bus, a system memory connected to the system bus and accessible to each of the main processors, a tamper mechanism, and a local service processor. The tamper mechanism is configured to change state each time the system is inserted into a slot in a rack enclosure. The local service processor is connected to the tamper mechanism and configured to update an insertion log upon detecting a change in state of the tamper mechanism. The insertion log provides a count and a history of rack insertions to which the system has been subjected. The system may include a non-volatile storage element which is updated exclusively by the local service processor that contains the insertion log. The insertion log may include an insertion counter. In this embodiment, the local service processor is configured to increment the insertion counter upon each insertion.

Abstract: A backrest pad for chair having a backrest including two stiles and two openings each enclosed by stile and backrest is provided. The backrest pad comprises a transversely extended member having an arcuate projection filled with soft material facing front; two side catches; two channels each adjacent catch; and two elastic straps having one ends stitched to channels for permanently fastening In assembly place backrest pad onto the backrest with straps rearward passed through the openings, and wrap straps around the stiles to fasten at the catches. The backrest pad can be adjustably positioned relative to backrest by pulling backrest pad and straps vertically.

Abstract: An integrated heat sink system is provided for internal cooling of a closed electronics container. The heat sink system includes a cold plate and a fin assembly thermally coupled to and extending from the cold plate. The cold plate has a surface for thermally coupling to one or more components within the container, such as a processor module. The heat sink system further includes at least one coolant carrier channel thermally coupled to and passing through the fins of the fin assembly. When the heat sink system is operational within the closed container, the cold plate thermally couples to and removes heat from the one or more components, the plurality of fins remove heat from air circulating within the closed container, and coolant within the coolant carrying channel(s) removes heat from the plurality of fins and from the cold plate thermally coupled thereto.

Abstract: An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.

Abstract: The invention relates to a method and apparatus for controlling the transition of a bypass capable codec between operative modes, based on a certain characteristic of the audio data signal processed by the codec. The apparatus relies on a control signal to determine when the codec will switch from one mode to another. This control signal reflects a characteristic of the audio data signal received at the apparatus, such as the type of speech activity or the format of the audio data signal. When in the active (non-bypass) mode, the apparatus relies on an additional control signal to switch to the inactive (bypass) mode. This additional control signal is received from a control unit at a remote codec that indicates that the remote codec is also bypass capable, hence the decoder at the first codec and the encoder at the remote codec can switch to the inactive mode to pass between them the compressed data frames.

Abstract: An electronic module substrate assembly and fabrication method, the assembly providing good thermal conductivity between an electronic device and an aqueous coolant, while maintaining physical separation between the coolant and electronic device, and relieving mechanical stresses caused by mismatches in thermal coefficients of expansion of materials within the device assembly. The assembly includes a substrate, at least one electronic device, and a preformed, thermally conductive, impermeable barrier. The barrier is preformed into a plurality of regions, some of which are bonded to other structures. One barrier region preferably forms a fluid tight seal with the substrate perimeter. At least one other barrier region forms a low thermal resistance bond with the at least one electronic device.

Abstract: A cooling system and method of fabrication are provided for cooling one or more heat-generating electronic elements within a portable computer. The cooling system includes a cold plate assembly thermally coupled to a heat-generating electronic element, and a heat exchange structure disposed within the cover of the portable computer. The heat exchange structure includes a hollow channel and an expansion chamber in fluid communication with the channel. A conduit carries coolant between the cold plate assembly and the hollow channel in the heat exchange structure, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange structure in a manner to remove heat from the heat-generating electronic component. The expansion chamber integrated within the heat exchange structure provides a reservoir for the circulation pump from which to draw coolant for circulation through the cold plate assembly.

Abstract: A system and method for non-linearity compensating interferometer position data includes receiving a plurality of groups of digital position values. A first group of the digital position values are digitally processed to generate a plurality of data values. The plurality of data values are digitally processed to generate at least one quasi-static non-linearity parameter. A second group of the digital position values are compensated based on the at least one non-linearity parameter.

Abstract: An electronic module substrate assembly and fabrication method, the assembly providing good thermal conductivity between an electronic device and an aqueous coolant, while maintaining physical separation between the coolant and electronic device, and relieving mechanical stresses caused by mismatches in thermal coefficients of expansion of materials within the device assembly. The assembly includes a substrate, at least one electronic device, and a preformed, thermally conductive, impermeable barrier. The barrier is preformed into a plurality of regions, some of which are bonded to other structures. One barrier region preferably forms a fluid tight seal with the substrate perimeter. At least one other barrier region forms a low thermal resistance bond with the at least one electronic device.

Abstract: A universal accumulator device for an auto air conditioning system includes a housing having an inlet opening, one or more outlet openings, one or more inlet fittings selectively engaged with the inlet opening of the housing, and one or more outlet fittings selectively engaged with the outlet opening of the housing. The inlet and outlet fittings may include a metric or a British thread for coupling to the metric or British pipings or lock nuts. A tubing may be selectively secured to the fittings with one or more sealing rings and with an additional barrel.

Abstract: A heat exchanger using thermoelectric structures is provided for cooling a heat generating component of an electronic device. The heat exchanger includes a row of spaced passages, for example, formed by two or more separate tubes or a single coiled tube, for carrying a first cooling fluid. The heat exchanger further includes a thermoelectric structure disposed between adjacent spaced passages and exposed to a second cooling fluid. In one embodiment, the heat exchange also includes fins disposed between the same adjacent spaced passages so that the thermoelectric structure is disposed between the adjacent passages and the fins.

Abstract: An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.

Abstract: A method and apparatus for monitoring and controlling the operating point of a satellite transponder amplifier. In one aspect of the invention, a time domain signal received at a ground station is digitally sampled. Then, a histogram of the received signal is computed. To form the histogram, the digital samples are categorized according to which of a plurality of amplitude ranges each sample falls within. When plotted as a graph, the number of occurrences within each amplitude range forms the histogram. Under low compression levels, the histogram generally appears as an approximately bell-shaped curve. However, under higher compression levels, the bell-shaped curve becomes distorted. By correlating the acquired histogram to a template histogram, an amount of compression can be determined. This amount of compression indicates the operating point of the transponder amplifiers.

Abstract: A transpiration cooled heat sink, a self contained coolant supply and a method of using a transpiration cooled heat sink and a self contained coolant supply is provided and includes a heat sink base structure, the heat sink base structure having a coolant inlet for receiving a coolant and a coolant outlet for distributing a coolant, wherein the heat sink base structure defines at least one coolant channel disposed so as to be communicated with the coolant inlet and the coolant outlet and a coolant distribution structure, wherein the coolant distribution structure defines at least one distribution cavity and includes at least one distribution inlet communicated with the distribution cavity and wherein the coolant distribution structure is disposed relative to the heat sink base structure such that the distribution inlet is communicated with the coolant outlet.

Abstract: An integrated cooling unit configured to effect the removal of heat via a circulating liquid coolant includes a reservoir to contain the liquid coolant, a tubing arrangement disposed at an outer surface of the reservoir, a pump disposed within the reservoir, and a fan configured to provide a flow of air across the tubing arrangement to remove the heat. The tubing arrangement is fluidly communicable with a heat exchanging device, and the pump is configured to circulate the liquid coolant through the tubing arrangement to the heat exchanging device.