Abstract: A novel method for characterizing nucleic acids. A nucleic acid is combined with a double stranded nucleic acid-specific dye to form a detectable complex between the dye and one or more double stranded structures within the nucleic acid. The combination is then exposed to varying temperatures and the fluorescence emission of the dye is measured to determine the melting temperature(s) for the double stranded structures. In some embodiments that melting temperature profile is then compared to melting temperature profiles generated for other nucleic acid(s) to discern differences between the compared nucleic acids.

Abstract: A system for use in an online merchant system which includes a system for homogenizing the format of received commerce item information from at least two distinct online entities, an aggregate database for storing the homogenized commerce item information, and a user interface that accesses the aggregate database for query and retrieval of competitive commerce item information from the online entities and displays it within a user's Web browser window.

Abstract: RIE processing chambers includes arrangements of gas outlets which force gas-flow-shadow elimination. Means are provided to control and adjust the direction of gases to the outlet to modify and control the direction of plasma flow at the wafer surface during processing. Means are provided to either move the exhaust paths for exhaust gases or to open and close exhaust paths sequentially, in a controlled manner, to modify flow directions of ions in the etching plasma. A combination of rotation/oscillation of a magnetic field imposed on the RIE chamber can be employed by rotation of permanent magnetic dipoles about the periphery of the RIE chamber or by controlling current through a coil wrapped around the periphery of the RIE process chamber to enhance the removal of the residues attributable to gas-flow-shadows formed by linear ion paths in the plasma.

Abstract: A process for treating an electronic component wherein the electronic component is exposed to a heated solvent and subsequently exposed to an ozonated process fluid. The electronic component is optionally exposed to the heated solvent by exposing the electronic component to a passing layer of heated solvent. An apparatus for treating electronic components with a heated solvent and an ozonated process fluid is also provided.

Abstract: A novel cage for reptile and amphibian pets having a bottom wall, top wall, front wall, back wall, first and second side walls, wherein the walls are configured with selection from light-transmissive ventilating mesh screen, clear plastic, or clear glass plate with the requirement that at least three of the walls be configured with ventilating mesh screen, and wherein the bottom wall is removably connected to the cage, and wherein the top wall further has an access hatch, which can be configured with ventilating mesh screen, clear plastic, or clear glass plate, and the front has a door portion configured with light-transmissive ventilating mesh screen, clear plastic, or clear glass plate.

Abstract: A process for treating an electronic component wherein the electronic component is exposed to a heated solvent and subsequently exposed to an ozonated process fluid. The electronic component is optionally exposed to the heated solvent by exposing the electronic component to a passing layer of heated solvent. An apparatus for treating electronic components with a heated solvent and an ozonated process fluid is also provided.

Abstract: The present invention is a container for an IV aqueous solution of a Gram-positive oxazolidinone agent, such as linezolid a the compound of formula: 1

Abstract: Form a solder connector on a semiconductor device starting with a first step of forming at least one dielectric layer over a doped semiconductor substrate. Then form a hole through the dielectric layer down to the semiconductor substrate. Form a metal conductor in the hole. Form intermediate layers over the metal conductor and the dielectric layer. Then form a tapered opening down to the surface of the metal conductor. Form BLM layers including a titanium-tungsten (TiW) layer over the metal conductor and the dielectric layer with the remainder of the BLM layers being formed over the TiW layer. Form a mask over the top surface of the BLM layers with a patterning through hole located above the metal conductor exposing a portion of the surface of the BLM layers. Plate a C4 solder bump on the BLM layers in the patterning hole. Remove the mask. Wet etch away the BLM layers aside from the solder bump leaving a residual TiW layer over the dielectric layer.

Abstract: A technique including a method 300, 400 and apparatus 200 for repairing a color filter assembly 1 for a flat panel display using a high intensity light source means. The technique provides a color filter assembly having an anomaly. The technique uses a step of directing a high intensity light source 203 through an aperture opening at the anomaly to selectively ablate a portion of the anomaly. These features remove the portion of the anomaly while preventing a possibility of substantial damage to other portions of the color filter assembly surrounding the anomaly.

Abstract: A system and method that reduces the simultaneous switching noise of outputs and the processing delays caused by inductance by using an encoding scheme that results in a net signaling current of substantially zero at each cycle time for the fast parallel switching networks of digital integrated circuit chips and that provides multiple types of error detection.

Abstract: Methods and apparatus are provided for a single heavy-lift launch to place a complete, operational space station on-orbit. A payload including the space station takes the place of a Shuttle Orbiter using the launch vehicle of the Shuttle Orbiter. The payload includes a forward shroud, a core module, a propulsion module, and a transition module between the core module and the propulsion module. The essential subsystems are pre-integrated and verified on Earth. The core module provides means for attaching international modules with minimum impact to the overall design. The space station includes six control moment gyros for selectably operating in either LVLH (local-vertical local-horizontal) or SI (solar inertial) flight modes.

Abstract: The present invention is directed to methods and apparatus relating to design, construction, integration and assembly of a space station. The present invention uses pre-integrated open (unpressurized) truss segments for modular construction of the space station. Each segment includes a truss structure and utility subsystems which may be fully assembled and tested on Earth. The segments may be latched together on orbit using a remote latching system. Utility subsystems, such as solar panels and radiators, are pre-integrated into the appropriate truss segment, and are deployable from the respective truss segment on orbit. Rails run lengthwise along the assembled truss. The rails may be used with a mobile transporter for translating truss segments with respect to the spacecraft as part of the space station assembly process. The rails may also be used with a mobile transporter for carrying crew personnel, a robotic arm, and other equipment.

Abstract: A method and device for receiving data in a synchronous communication system. Data can be accurately transferred between two subsystems in a synchronous system even where the clock skew and propagation delay between the two subsystems is unlimited. The receiving subsystem is initialized to ensure synchronous data transfer over a theoretically infinite range. The transmitting subsystem transmits data and a forwarded clock to the receiving subsystem. Data is captured in three state devices arranged in parallel to eliminate minimum delay requirements and to expand data valid time. The captured data is then aligned to the clock of the receiving subsystem by controlling a multiplexer which selects the proper state device output to pass to another state device for alignment to the receiving subsystem's clock. The multiplexer is controlled by a circuit which monitors the capturing of the incoming data and determines the correct state device output to select for proper data alignment.

Abstract: An improved method for removing heat from electronic devices, such as computer modules, is described. A flow of gas, such as air, cools the components. The gas flow is sufficient to cool so called "hot" components to their maximum operating temperature, and to cool the other components to their normal operating range. A liquid cooling system is also provided to cool the "hot" components to their normal operating range.

Abstract: An apparatus and method of providing and administering medicants to persons who have little or no control over the muscles of their mouth or, for other reasons, cannot swallow pills. A generally rectangular prepackaged serving container has a concave recessed mixing chamber, a flat serving surface extending forwardly from the mixing chamber, and a handle portion extending rearwardly from the mixing chamber. The mixing chamber contains a measured amount of food product. A flat mixing spatula is removably received along the top surface of the serving container and has a head portion substantially covering the contents of the mixing chamber. A removable flexible cover is peelably attached to the top surfaces of the serving container and the spatula and forms an air tight seal for the serving container and its contents. In use, the cover is peeled off the serving container and the spatula is removed.

Abstract: The high-power, high-performance integrated circuit chip package comprises a chip constructed to contain top and bottom surfaces to which top and bottom metallization planes are fixed. Top and bottom heat sinks are fixedly mounted to the top metallization plane and bottom metallization plane, respectively. The metallization planes and heat sink combination functions as both a power lead and a heat dissipation means, allowing for the chip to contain signal connections which may be dedicated to input and output signal paths. The chip further comprises a plurality of contiguous top layers of thin dielectric material, at least one epitaxial layer on whichis mounted a plurality of transistors and associated circuitry, and at least one bottom layer of crystalline silicon material. The plurality of transistors and associated circuitry generates heat.

Abstract: An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A thermal transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. The assembly is particularly adapted to provide power to the chip of a TAB-type integrated circuit assembly which includes a flexible lead frame connected between the chip and the substrate.

Abstract: An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A thermal transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. The assembly is particularly adapted to provide power to the chip of a TAB-type integrated circuit assembly which includes a flexible lead frame connected between the chip and the substrate.

Abstract: An aesthetically enhanced carton having an opening in one wall through which the open top of a bag is laced or threaded enabling the bag to be supported and enclosed within the carton while communicating the interior of the bag and the exterior of the carton through a passage extending through the neck of the bag. When used with room fragrant potpourri, the scent of the potpourri is controllably released to the ambient.